KR100917793B1 - Alignment apparatus for prove pin - Google Patents

Abstract

The present invention relates to an alignment device for a probe pin, and more specifically, by integrating a guide for determining a position of a probe pin and a pad connecting the probe pin, an alignment error generated in the process of coupling the probe unit and the probe pin guide. A device for aligning a probe pin that can be reduced to increase the life of the probe pin.

An alignment apparatus for a probe pin of the present invention, comprising: an upper plate having an upper slit on one side for limiting movement of the probe pin and a groove on the other side for engaging with a lower plate; And a lower plate having a protrusion for coupling with the upper plate, a lower slit for inserting the probe pin, and a groove for connecting the driver IC.

Probe Unit, Aligner, Alignment Guide

Description

Alignment apparatus for prove pin}

The present invention relates to an alignment device for a probe pin, and more specifically, by integrating a guide for determining a position of a probe pin and a pad connecting the probe pin, an alignment error generated in the process of coupling the probe unit and the probe pin guide. A device for aligning a probe pin that can be reduced to increase the life of the probe pin.

In general, a display device is used to display various types of information to a user. Recently, due to the development of the electronics industry and the increase in the amount of information, research and development of large-screen display devices have been actively conducted, and power consumption is small and large screens can be implemented. Plasma display panels (hereinafter referred to as "PDP"), liquid crystal display panels such as LCD (Liquid Crystal Display, hereinafter referred to as "LCD"), or display panels such as organic EL (Organic EL). Developed.

Such a liquid crystal display panel is subjected to a shipment inspection process that inspects for the presence of defects (pixel defects-point defects, predecessors, stain defects, etc.) that may occur in the manufacturing process after completion of manufacture and before commercialization. In general, the inspection method is mainly a lighting test using a probe unit for disconnection inspection and color inspection of a liquid crystal display panel line, and a probe unit is used to check whether various display panels operate normally without pixel errors.

The probe unit is generally manufactured by making grooves through mechanical processing on ceramic materials and inserting thin pins therebetween to assemble them. When the electrode substrate and the slit are combined, the probe unit is aligned to the correct position. .

Liquid crystal display panels are becoming more and more high resolution and high pixel resolution, which means high density pixel display per unit area. To test this, high density contact media is connected between the LCD panel and the driver IC. The contact medium is called a probe block. In general, the contact medium has been composed of a probe block having a pitch of 60 μm. However, the medium and large probe blocks require products having an alignment pitch of 40 to 50 μm and a small size of 35 μm. The pitch array value below it is calculated | required.

As the liquid crystal display panel becomes higher in quality, the density of pixels is continuously increasing. As a result, the necessity of highly aligned probe blocks is flying and increasing.

However, in the prior art, as the pitch is reduced, breakage and error occur during mechanical processing of grooves corresponding to hundreds per probe unit, and thus there is a problem in that the yield decreases.

The present invention has been made in order to solve the problems of the prior art as described above integrating the guide to determine the position of the probe pin and the pad connecting the probe pin to reduce the alignment error caused in the process of fastening the probe unit and the probe pin guide It is an object of the present invention to provide an alignment device for the probe pin to be made.

In addition, the present invention is configured to have a self-aligned structure by the lower plate integrating the guide to determine the position of the probe pin and the pad connecting the probe pin and the upper plate to limit the movement of the probe pin at the contact area of the probe pin. Another goal is to reduce the alignment error caused by the coupling.

In addition, the present invention has another object to reduce the alignment error, thereby increasing the life of the probe pin, and improve the reliability of the probe unit.

The object of the present invention is the upper plate is formed with an upper slit of one side for limiting the movement of the probe pin and a groove of the other side for coupling with the lower plate; And a lower plate having a protrusion for engaging with the upper plate, a lower slit for inserting the probe pin, and a groove for connecting the driver IC.

In addition, the top plate of the present invention is preferably configured to deposit a parylene film in order to prevent breakage in the collision with the probe pin.

In addition, the lower plate of the present invention is preferably made of a pattern by depositing a metal.

Therefore, the alignment device for the probe pin of the present invention has the advantage that the alignment error is reduced compared to when the pad and guide are manufactured and combined by integrating the pad and the guide, thereby increasing the life of the probe pin. .

In addition, the present invention is configured to have a self-aligned structure on the upper plate that limits the movement of the lower plate and the probe pin integrated with the pad and the guide, there is another effect of reducing the alignment error when the lower plate and the upper plate is coupled.

The terms or words used in this specification and claims are not to be construed as being limited to their ordinary or dictionary meanings, and the inventors may appropriately define the concept of terms in order to best describe their invention. It should be interpreted as meaning and concept corresponding to the technical idea of the present invention based on the principle that the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a block diagram of a probe unit according to an embodiment of the present invention. Referring to FIG. 1, the housing block 110, the joint plate 120, the TCP block 130, the FPC block 140, the probe pin 150, the input terminal 160, and the output terminal 170 are configured.

The housing block 110 is in the form of a house having a lower opening, and the one or more probe pins 150 are fixed to the lower portion, and the fastening groove of the house corresponds to the coupling hole of the joint plate 120.

The Tape Carrier Package (TCP) block 130 has one end in contact with one or more probe pins 150 of the housing block 110, and the other end is a flexible printed circuit (FPC). Block 140 is formed, the body is formed to be fixed to one side of the fixing plate of the joint plate 120.

The probe pin 150 is composed of an input terminal 160 and an output terminal 170, and is arranged in at least one or more in the same aspect ratio to inspect precise pixel errors of the liquid crystal display panel.

In the probe unit, there should be a slit capable of guiding the probe pin 150 so that the probe pin 150 corresponds to the electrode position on the liquid crystal display panel, and a pad for connecting the driver IC and the probe pin 150.

2 is a process diagram of the top plate of the alignment device for the probe pin according to an embodiment of the present invention. Referring to FIG. 2, one side of the upper plate has an inclined groove, and the other side is composed of slits having the same aspect ratio.

Figure 2 (a) shows one side of the silicon substrate of the upper plate, one side of the silicon oxide film or silicon nitride film formed on the surface of the silicon using an oxidation process or chemical vapor deposition (CVD), etc. Afterwards, the silicon is partially exposed. Subsequently, when wet etching solutions such as KOH, EDP, and TMAH are used, silicon is etched to be inclined along the crystal direction to form protrusions on the surface.

In addition, in another embodiment of forming the groove, the inclination of the etching may be adjusted according to the dry etching process conditions (temperature, pressure, gas type and composition ratio, flow rate, power, bias voltage, etc.), and thus, without using a wet etching solution. Dry etching may also be used.

Figure 2 (b) shows the other side of the silicon substrate of the upper plate, the other side is formed through a photolithography process to form a mask film made of photoresist, silicon oxide film, metal thin film, etc. at the same pitch required for the probe pin After the silicon dry etching process, the slits are formed to have the same aspect ratio.

FIG. 2 (c) shows the silicon substrate of the upper plate, and removes all the films other than silicon from the silicon substrate, and insulates the surface by forming a silicon oxide film or a silicon nitride film using an oxidation process or chemical vapor deposition. In addition, by depositing a polymer thin film, such as a parylene (parylene) film and the like to prevent damage in the collision with the probe pin.

Figure 3 is a bottom plate process diagram of the alignment device for the probe pin according to an embodiment of the present invention. Referring to FIG. 3, the lower plate includes a groove of a portion coupled to the upper plate, a slit into which the probe pin is inserted, and a groove of a portion to which the driver IC is coupled.

3 (a) forms a silicon oxide film or a silicon nitride film on a silicon surface by using an oxidation process or chemical vapor deposition (CVD), and partially exposes silicon through a photolithography process. Subsequently, when wet etching solutions such as KOH, EDP, and TMAH are used, silicon is etched to be inclined along the crystal direction to form protrusions on the surface. The grooves of the upper plate and the protrusions of the lower plate are etched to correspond to each other, and reference numeral 310 is formed to insert the driver IC.

In addition, in another embodiment of forming the groove, the inclination of the etching may be adjusted according to the dry etching process conditions (temperature, pressure, gas type and composition ratio, flow rate, power, bias voltage, etc.), and thus, without using a wet etching solution. Dry etching may also be used.

FIG. 3 (b) shows a slot having the same aspect ratio by performing deep etching through the silicon dry etching process after the photolithography process after the process of FIG. 3 (a). The process of forming the slot proceeds only where the probe pin is inserted, and the portion of the bottom plate coupled to the top plate proceeds only to the process of forming the protrusion of FIG.

After the grooves are formed in this manner, deep etching may be used to more easily insert the probe pins into the lower plate, and isotropic etching is preferably performed to reduce surface roughness.

FIG. 3 (c) shows an insulating layer 320 such as a silicon oxide film or a silicon nitride film on the surface through the roughening process and the chemical vapor deposition process of FIG. 3 (b), and chemical vapor deposition, evaporation, sputtering, and the like. The metal thin film 330 is deposited through. The metal thin film may be formed of any one or more of Au, Ag, Cu, and Ni. In order to increase the adhesion between the metal thin film and the slit, a thin film of Ti, Ta, Cr, NiCr, etc. is formed before the metal thin film, and at least one of Au, Ag, Cu, and Ni is in the range of 0.1 to 50 μm on the substrate. One metal thin film after plating, but the plating process may be omitted.

FIG. 3 (d) shows that when the metal thin film 330 is scraped from the lower plate on which the insulating layer 320 and the metal thin film 330 are formed by mechanical and chemical methods, only the insulating layer 320 remains, and the slit as shown by reference numeral 340. The insulating layer 320 may be insulated from the slits, and the slits may include an insulating layer 320 and a metal thin film 330. The metal layers formed between the slits are insulated from each other, and each slit is connected to the groove into which the driver IC is inserted, and is electrically connected to the driver IC.

Figure 4 is a combined view of the top and bottom of the alignment device for the probe pin according to an embodiment of the present invention. Referring to Figure 4, Figure 4 (a) is an upper plate, Figure 4 (b) shows a lower plate of the portion coupled to the upper plate. Since the lower plate is a portion that is coupled to the upper plate, no slit is formed, only a protrusion is formed, and the upper plate and the lower plate are coupled to each other by using a mechanical device to adjust the angles and positions of the two plates and to approach each other. The groove of the upper plate and the protrusion of the lower plate are combined as shown in FIG.

This indicates that the upper plate and the lower plate may be coupled without adjusting the exact angle and position, and the groove of the upper plate does not need to be sharply etched at the end, and is preferably etched deeper than the height of the protrusion. In addition, the position of the groove and the protrusion may be changed.

5 is a view of the alignment device for the probe pin according to an embodiment of the present invention. Referring to FIG. 5, a lower plate 510, a lower slit 512, a driver IC groove 514, a lower plate protrusion 516, an upper plate 520, an upper slit 522, and an upper plate groove 524 may be formed.

Each lower slit 512 is electrically connected to the driver IC groove 514, and the portion where the upper plate 520 and the lower plate 510 are coupled is precisely positioned due to the lower plate protrusion 516 and the upper plate groove 524. Combination is possible without matching.

The upper slit 522 is used for fixing the probe pins, and the lower slit 512 is for inserting the probe pins.

In addition, the alignment device of the present invention, in arranging the probe pins, can be used by cutting the length according to the arrangement interval and the number that meets the corresponding standard, corresponding to the improved pixel of the liquid crystal display panel, and to check the pixel defects After arranging the aspect ratio of the same to form a housing block which is a component of the probe unit.

6 is a side view of the alignment device for the probe pin according to the embodiment of the present invention. Referring to FIG. 6, the probe pin is inserted into the alignment device. The top plate 620 moves sideways when the probe pin 630 moves up and down at a portion where the probe pin 630 is joined to the liquid crystal display panel. It does not limit the movement of the probe pin 630.

In addition, the height (H) of the top plate 620 is to be made differently depending on the height (h) to meet the large, medium, small or custom made standard of the probe pin 630.

The lower plate 610 is formed with a lower slit 615 to serve to secure the probe pin 630 and to connect with the driver IC using conductivity.

Although the present invention has been shown and described with reference to the preferred embodiments as described above, it is not limited to the above embodiments and those skilled in the art without departing from the spirit of the present invention. Various changes and modifications will be possible.

The present invention relates to an alignment device for integrating a pad connecting the probe pins and a guide for determining the position of the probe pins. The alignment device can be used as a part of the probe unit for a probe unit for inspecting a defect of a liquid crystal display panel. Do.

1 is a block diagram of a probe unit according to an embodiment of the present invention,

Figure 2 is a top plate process diagram of the alignment device for the probe pin according to an embodiment of the present invention,

Figure 3 is a bottom plate process diagram of the alignment device for the probe pin according to an embodiment of the present invention,

4 is a combined view of the upper and lower plates of the alignment device for the probe pin according to an embodiment of the present invention,

5 is a view of the alignment device for the probe pin according to an embodiment of the present invention,

6 is a side view of the alignment device for the probe pin according to the embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

110: housing block 120: joint plate

130: TCP block 140: FPC block

150: probe pin 160: input terminal

170: output stage

Claims (8)

In the alignment device for the probe pin, An upper plate having an upper slit on one side for limiting the movement of the probe pin and a groove on the other side for engaging with the lower plate; And A lower plate having a protrusion for connecting with the upper plate, a lower slit for inserting the probe pin, and a groove for connecting the driver IC Alignment device for a probe pin comprising a. The method of claim 1, The top plate is aligned with the probe pin for depositing a parylene film to prevent breakage in the collision with the probe pin. The method of claim 1, Wherein the upper slit is configured so that one or more slits have the same aspect ratio, and the surface of each slit is insulated. The method of claim 1, The lower slit is configured so that one or more slits have the same aspect ratio, the surface of each slit is insulated, and each of the slits is electrically connected to the driver IC. The method of claim 1, The lower plate is aligned with the probe pin for depositing a metal pattern. The method of claim 5, The metal is an alignment device for the probe pin made of any one or more of Au, Ag, Cu, Ni. The method of claim 5, And performing a plating process before depositing and patterning metal on the lower plate. The method of claim 7, wherein The plating process is an alignment device for the probe pin to form any one or more metals of Au, Ag, Cu, Ni to 0.1 to 50μm.

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