KR100917728B1 - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

When the thin film is discharged from the solvent nozzle by the moving mechanism and moved, for example, about two or three reciprocations around each of the substrates, the resist film of only the circumferential edge of the substrate is removed to form an adjuvant treatment. The treatment film by HMDS gas is exposed. Next, the optical fiber is irradiated with ultraviolet rays to move, for example, two round trips or three round trips around each of the substrates, thereby removing the treatment film exposed only at the periphery of the substrate. As a result, since the amine gas is not generated from the treatment film exposed at the edge of the substrate, it is possible to prevent clouding of the exposure lens, the mirror, and other devices in the exposure apparatus.

Description

Substrate Processing Apparatus and Substrate Processing Method {SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD}

1 is a plan view showing the overall configuration of a coating and developing treatment system according to one embodiment of the present invention;

FIG. 2 is a front view of the coating and developing treatment system shown in FIG. 1;

3 is a rear view of the coating and developing treatment system shown in FIG. 1;

4 is a plan view showing a resist processing block according to one embodiment;

5 is a side view of the resist processing block shown in FIG. 4;

6 is a schematic perspective view of an edge remover according to one embodiment of the present invention;

7 is a cross-sectional view showing a remover head according to one embodiment;

8 is a plan view of the remover head shown in FIG. 7;

9 is a front view of the remover head shown in FIG. 7;

10 (a) is a cross sectional view showing a resist film removing action at the edge of the substrate;

11 is a side view showing a state in which an air cylinder is attached to the remover head;

12 (a) is a plan view showing the positional relationship between the solvent nozzle and the optical fiber, (b) is a side view showing the removal action of the treated film;                 

13 is a plan view showing a state in which the edge portion of the substrate is scanned by the remover head;

14 is a cross-sectional view of the remover head provided with a cleaning nozzle;

15 is a schematic perspective view of an edge remover according to another embodiment;

16 is a cross-sectional view of the frame member shown in FIG. 15;

17 is a perspective view showing a heating action on the edge portion of the substrate of the heater;

18 is an enlarged perspective view of a portion of an optical fiber showing another embodiment;

19 is a sectional view of a remover head according to another embodiment;

20 is a plan view of a remover head according to another embodiment;

21 is a cross-sectional view of the remover head according to yet another embodiment.

<Description of the symbols for the main parts of the drawings>

G: Glass substrate S: Processing space

A, B, C, D, E: Position Ga: Backside

48: edge remover 66: cleaning nozzle

70 resist film 70a edge portion

75 heater 80 treated film

81: optical fiber 81a: light transmitting surface

82a: window portion 92: suction port

93: remover head 93a: upper head component

93b: lower head member 94: moving mechanism                 

95: solvent nozzle

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus and substrate processing method for removing a processing film or the like formed on a glass substrate used in a liquid crystal display device or the like.

In a manufacturing process such as an LCD (Liquid Crystal Display: LCD), a photo such as that used in the manufacture of a semiconductor device in order to form a thin film of ITO (Indium Tin Oxide) or an electrode pattern on a glass substrate for an LCD to be processed. Lithography techniques are used. In photolithography, a photoresist is applied to a glass substrate, which is then exposed and further developed.

In addition, before and after each process of resist coating, exposure, and development, predetermined heat treatment or cooling treatment is performed, and in particular, in the pre-process of the resist coating treatment, an adjuvant treatment is performed. In this adjuvant treatment, in order to improve the adhesion between the glass substrate and the resist film, an ammonia-based gas (generally HMDS gas is used) is applied to the glass substrate in a vapor form.

The resist film is applied after this adjuvant treatment. However, in order to prevent the generation of particles later, an extra resist film applied to the peripheral edge of the glass substrate after the resist film application is removed with a solvent such as thinner.

  However, after the resist removal treatment of the peripheral edge portion is performed, the glass substrate is conveyed to the exposure apparatus for exposure processing, but a problem arises in that the exposure lens, the mirror or the like in the exposure apparatus becomes cloudy. This is because the film by the HMDS gas applied under the resist film removes the resist film around the edge of the substrate, and then is exposed to the periphery, whereby the amine gas constituting the HMDS gas, for example, ammonium sulfide, is generated. It is considered that the cause is that the generated gas adheres to the lens or mirror of the exposure apparatus. Due to such a problem, for example, a defect occurs in the exposure treatment, for example, the exposure cannot be performed at a predetermined exposure amount.

In view of the above circumstances, an object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of removing a resist film at the edge of a substrate without adversely affecting the exposure apparatus.

In order to achieve the above object, the substrate processing apparatus according to the present invention discharges a solvent to a substrate peripheral edge of a substrate on which a processing film and a coating film coated on the processing film are formed to remove the coating film for removing the coating film on the peripheral edge. Means, and processing film removing means for removing the processing film exposed to the edge portion of the substrate from which the coating film has been removed.

According to this structure, after the coating film is removed by the coating film removing means, the exposed treatment film is removed by the processing film removing means. This causes whitening of the exposure lens, the mirror, and the like in the exposure apparatus. For example, since the treatment film formed by the adjuvant treatment can be removed, the coated film around the substrate can be removed without adversely affecting the exposure apparatus. Can be removed

As the coating film treatment means, it is conceivable to remove the coating film by discharging the solvent while moving the solvent nozzle along the edge portion of the substrate. In addition, as the process film removing means, it is conceivable to remove the process film by irradiating light from the optical fiber while moving the optical fiber along the edge of the substrate, for example, and by supplying ozone water to the process film, It is also conceivable to remove the treatment film.

According to one aspect of the present invention, it is preferable to use light including the wavelength component of exposure light for exposing the coating film to light by the optical fiber.

Moreover, you may have the heating means which heats the process film exposed after removing a coating film. In this way, the peeling action of the treated film by light irradiation can be promoted by heating the treated film before the irradiation of light.

According to one aspect of the present invention, the coating film removing means includes a holding member for holding a solvent nozzle for discharging the solvent, and a circumferential edge moving mechanism for moving the holding member along the periphery of the substrate, And discharging the solvent while moving the holding member by the circumferential edge movement mechanism. According to such a structure, since a solvent can be discharged, moving a holding member, a coating film and a process film can be removed efficiently. In addition, when the optical fiber is fixed to the holding member, since the light can be irradiated while the holding member is moved, the processed film can be removed efficiently.                         

It is preferable that the light-transmitting surface of this optical fiber becomes a rectangle whose length is substantially the same as the width of the exposed process film. Thereby, for example, the area | region exposed by the process film can be removed efficiently by only the movement of the edge part of the board | substrate edge by a holding member. In addition, you may irradiate light with an optical fiber from the back surface side of the board | substrate surface to which the said coating film was apply | coated. For example, when the substrate is a glass substrate, light can be transmitted to the surface side of the glass substrate even if light is irradiated from the back surface side.

According to one aspect of the present invention, the optical fiber and the solvent nozzle are arranged in substantially parallel to the moving direction of the holding member. In this case, it is preferable to provide an orthogonal moving mechanism for moving the holding member in a direction orthogonal to the moving direction. As a result, the holding member can be moved in the orthogonal direction so that the solvent nozzle and the optical fiber can be moved in the width direction of the processing film on the processing film. Accordingly, the range in which the treatment film is removed by the solvent nozzle and the optical fiber is widened, and the treatment film is accurately removed.

According to one aspect of the present invention, the optical fiber is disposed outside the substrate than the solvent nozzle. According to this structure, only the movement along the edge of the substrate of the holding member can be performed, and the remaining coating film after the removal of the coating film on the edge of the substrate can be prevented from being exposed by light irradiation with an optical fiber.

According to one aspect of the present invention, there is further provided an orthogonal direction moving mechanism for moving the holding member in a direction orthogonal to the moving direction, such that the holding member is alternately moved by the circumferential edge moving mechanism and the orthogonal direction moving mechanism. While removing the coating film of the circumferential edge portion, the treatment film which is sequentially exposed is removed. In this way, by removing the processing film which is subsequently exposed by the solvent discharging, the optical fiber is widened so that the processing film is removed by the optical fiber, so that the processing film can be removed accurately, and the coating film and the processing film are efficiently removed. It can also be quickly removed.

According to one aspect of the present invention, there is further provided a cleaning nozzle for ejecting the cleaning liquid toward the light transmitting surface of the optical fiber. If the gasified treatment film adheres to the light-transmitting surface of the optical fiber and makes the light-transmitting surface of the optical fiber cloudy, it is conceivable that a constant light irradiation cannot be obtained on the substrate by the attachment of the light-emitting surface of the optical fiber. have. In this invention, such a situation can be avoided by wash | cleaning the turbidity of the light transmission surface of an optical fiber with a washing | cleaning liquid. In addition, the cleaning nozzle of the present invention may be attached to the holding member so as to move integrally with the holding member.

According to one aspect of the present invention, there is further provided a means for discharging the gas generated from the treatment film when the treatment film is removed. According to such a structure, the process film | membrane vaporized by light irradiation can be exhausted. As a result, the clouding of the light-transmitting surface of the optical fiber described above can be prevented, and contamination of devices and devices can be prevented. In addition, by providing this discharging means, the cleaning liquid scattered at the time of the washing can be discharged simultaneously with the generated gas from the processing film and the removed coating film and the processing film, and the light transmitting surface of the optical fiber can also be dried. have.

According to one aspect of the present invention, a plurality of optical fibers are arranged in a direction different from the moving direction of the holding member by a peripheral edge moving mechanism. As a result, the processing film can be removed in one path of the holding member, and the processing film can be removed more reliably, and the throughput can be improved.

According to one aspect of the present invention, two or more solvent nozzles are attached to the holding member so as to sandwich the substrate. Thereby, it can remove not only the surface side of a board | substrate but the back coating side, and the coating film which affixed.

The substrate processing method according to the present invention is a step of discharging a solvent in a peripheral portion of a substrate on which a processing film and a coating film coated on the processing film are formed, removing the coating film of the peripheral edge portion, and the substrate on which the coating film is removed. And removing the treatment film exposed to the peripheral portion.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing.

1 is a plan view showing a coating and developing processing system for an LCD substrate to which the conveying apparatus of the present invention is applied, FIG. 2 is a front view thereof, and FIG. 3 is a rear view thereof.

This coating and developing processing system 1 performs a series of processing including a cassette station 2 on which a cassette C containing a plurality of glass substrates G is placed, and a resist coating and development on the substrate G. And an interface unit 4 for exchanging the substrate G between the processing unit 3 having a plurality of processing units for exposing it, and the exposure apparatus 32, and both ends of the processing unit 3. At each stage, the cassette station 2 and the interface unit 4 are arranged.

The cassette station 2 is provided with a conveyance mechanism 10 for conveying the LCD substrate between the cassette C and the processing unit 3. Then, the cassette C is loaded and unloaded in the cassette station 2. Moreover, the conveyance mechanism 10 is equipped with the conveyance arm 11 which can move on the conveyance path 12 provided along the arrangement direction of a cassette, and this conveyance arm 11 has the cassette C and the process part 3 The conveyance of the board | substrate G is performed between and.

In the processing section 3, a main transport section 3a provided in the vertical direction (X direction) extending in the arrangement direction (Y direction) of the cassette C in the cassette station 2, and the main transport section 3a. According to this, an upstream part 3b in which each processing unit including a resist coating process unit CT is provided in parallel and a downstream part 3c in which each processing unit including a developing process unit DEV 18 are installed in parallel are provided. .

The main conveying part 3a has a conveying path 31 extending in the X direction and a conveying shuttle 23 configured to be movable along the conveying path 31 to convey the glass substrate G in the X direction. Is installed. This transfer shuttle 23 is for holding and conveying the board | substrate G with a support pin, for example. In addition, a vertical transfer unit 7 is provided at the interface portion 4 side end of the main transfer portion 3a to exchange the substrate G between the processing portion 3 and the interface portion 4.

In the upstream section 3b, a scrubber cleaning processing unit (SCR) 20 for cleaning the substrate G is provided at the cassette station 2 side end, and the scrubber cleaning processing unit (SCR) 20 is provided. An excimer UV treatment unit (e-UV) 19 for disposing organic matter on the substrate G is disposed at the top of the.

In the neighborhood of the scrubber cleaning processing unit (SCR) 20, heat treatment system blocks 24 and 25 in which units for thermal processing on the glass substrate G are stacked in multiple stages are arranged. Between these heat treatment system blocks 24 and 25, the vertical conveyance unit 5 is arrange | positioned, and the conveyance arm 5a is movable in a Z direction and a horizontal direction, and is rotatable in a (theta) direction. The substrate G is transported by accessing each of the heat treatment system units in both blocks 24 and 25. The vertical transfer unit 7 in the processing section 3 also has the same configuration as the vertical transfer unit 5.

As shown in Fig. 2, in the heat treatment system block 24, an advice unit in which a backing unit BAKE, which heat-treats the resist coating on the substrate G, is subjected to two stages and hydrophobized by HMDS gas, is applied. (AD) is laminated sequentially from the bottom. On the other hand, in the heat treatment system block 25, the cooling unit COL which cools the board | substrate G is laminated | stacked in 2 steps, and theadhesion unit AD is laminated | stacked sequentially from the bottom.

The resist processing block 15 extends in the X direction adjacent to the heat treatment block 25. The resist processing block 15 includes a resist coating unit (CT) 49 for applying a resist to the substrate G, a reduced pressure drying unit (VD) 40 for drying the applied resist under reduced pressure, The edge remover (ER) 48 which removes the resist of the peripheral part of the board | substrate G which concerns on this invention is comprised integrally, and is comprised. The resist processing block 15 is provided with a sub arm (not shown) which moves from the resist coating process unit (CT) 49 to the edge remover (ER) 48. The sub arm is provided with a resist processing block. The board | substrate G is conveyed in (15).

A multi-stage heat treatment system block 26 is disposed adjacent to the resist processing block 15, and the heat treatment block 26 is a pre-baking unit PREBAKE which heat-treats the resist after coating the substrate G. Is stacked in three stages.

In the downstream part 3c, as shown in FIG. 3, the heat processing system block 29 is provided in the interface part 4 side end part, and it heat-processes before a cooling unit COL and post-exposure image development process. Post-exposure baking units (PEBAKE) are stacked in two stages, one after the other.

A developing treatment unit (DEV) 18 which is developed adjacent to the heat treatment block 29 is provided extending in the X direction. Heat treatment system blocks 28 and 27 are disposed adjacent to the development processing unit (DEV) 18, and have the same configuration as the vertical transfer unit 5 between the heat treatment system blocks 28 and 27. The vertical transfer unit 6 accessible to each heat treatment system unit in both blocks 28 and 27 is provided. In addition, an i-line processing unit (i-UV) 33 is provided on the end portion of the development processing unit (DEV) 18.

In the heat treatment block 28, a cooling unit COL and a post-baking unit POBAKE for performing post-development heat treatment on the substrate G are stacked in two stages sequentially. On the other hand, the heat treatment system block 27 is similarly laminated with the cooling unit COL and the post-baking unit POBAKE in two stages and sequentially from below.                     

The interface unit 4 is provided with a titler and a peripheral exposure unit (Titler / EE) 22 on the front side, and an extension cooling unit (EXTCOL) 35 on the rear side adjacent to the vertical transfer unit 7. A buffer cassette 34 is disposed, between the titler and the peripheral exposure unit (Titler / EE) 22, the extension cooling unit (EXTCOL) 35, and the buffer cassette 34 and the adjacent exposure apparatus 32. The vertical transfer unit 8 is arranged to exchange the substrate G with each other. This vertical transfer unit 8 also has the same structure as the vertical transfer unit 5.

About the process of the coating and developing processing system 1 configured as described above, first, the substrate G in the cassette C is conveyed to the upstream portion 3b of the processing portion 3. In the upstream portion 3b, the surface modification and the organic matter removal treatment are performed in the excimer UV treatment unit (e-UV) 19, and then in the scrubber cleaning treatment unit (SCR) 20, the substrate (G). The cleaning treatment and the drying treatment are performed while being transported about horizontally. Subsequently, the substrate G is taken out by the transfer arm 5a in the vertical transfer unit at the lowermost end of the heat treatment system block 24, and the substrate G is subjected to heat treatment and addition by a baking unit BAKE of the same heat treatment system block 24. As the heat unit AD, a process of spraying the HMDS gas on the substrate G is performed in order to improve the adhesion between the glass substrate G and the resist film. Thereafter, cooling treatment by the cooling unit COL of the heat treatment system block 25 is performed.

Next, the board | substrate G is exchanged with the conveyance shuttle 23 by the conveyance arm 5a. After the substrate is conveyed to the resist coating unit CT and subjected to the resist coating process, the reduced pressure drying unit VD is used for the reduced pressure drying process, and the edge remover ER 48 removes the resist around the edges of the substrate. Is performed sequentially.

Subsequently, the substrate G is exchanged from the transfer shuttle 23 to the transfer arm of the vertical transfer unit 7 and subjected to heat treatment by a pre-baking unit PREBAKE in the heat treatment system block 26. The cooling treatment is performed by the cooling unit COL in the heat treatment system block 29. Subsequently, the substrate G is cooled by an extension cooling unit EXTCOL 35 and exposed by an exposure apparatus.

Subsequently, the substrate G is conveyed to the post-exposure baking unit PEBAKE of the heat treatment system block 29 through the conveyance arms of the vertical conveying units 8 and 7, where after the heat treatment is performed, the cooling unit Cooling treatment is performed by COL. Subsequently, the substrate G is conveyed about horizontally in the developing unit DEV 18 through the conveyance arm of the vertical conveyance unit 7, while the development process, the rinse process and the dry process are performed. Lose.

Subsequently, the substrate G is transmitted and received by the transfer arm 6a of the vertical transfer unit 6 from the lowest end in the heat treatment system block 28, and post-baking in the heat treatment system block 28 or 27. The heat treatment is performed by the unit POBAKE, and the cooling treatment is performed by the cooling unit COL. And the board | substrate G is exchanged with the conveyance mechanism 10, and is accommodated in the cassette C. As shown in FIG.

4 and 5 are schematic and schematic side views showing the resist processing block 15. These resist coating units (CT) 49, the reduced pressure drying unit (VD) 40, and the edge remover 48 are integrally parallel to the same stage, as shown.

The reduced pressure drying unit (VD) 40 is provided to cover the lower chamber 61 and the upper chamber 62, and has an upper chamber 62 to keep the processing space therein tight. The lower chamber 61 is set with a stage 63 for mounting the substrate G. Four exhaust ports 64 are provided at a part of each corner of the lower chamber 61 to communicate with the exhaust ports 64. The exhaust pipe 65 is connected to an exhaust pump (not shown) such as a turbomolecular exhaust pump. Then, the lower chamber 61 and the upper chamber 62 are in close contact with each other to exhaust the processing space therein, so that the pressure is reduced to a predetermined degree of vacuum.

In addition, a user cylindrical cup 71 is disposed almost at the center of the resist coating unit CT, and the substrate adsorption table serving as a holding member for holding and holding the glass substrate G in the cup 71. 58) is arranged.

The transfer of the substrate G between these resist coating units (CT) 49, the reduced pressure drying unit (VD) 40, and the edge remover (ER) 48 is performed by the arms 41 and 42. It is supposed to be.

Next, an edge remover (ER) 48 according to one embodiment of the present invention will be described. As shown in Fig. 6, a stage 91 for mounting the glass substrate G is provided. In the state where the glass substrate G is placed on the stage 91, four sides for removing excess resist from the edges of the peripheral portion of the glass substrate G are provided on all sides of the peripheral portion of the glass substrate G. The remover head 93 is provided to be movable along the board | substrate G in all directions. The movement is performed by the movement mechanism 94 in this direction, and this movement mechanism 94 supports the support member 36 which supports each remover head 93, and this support member 36 is a board | substrate. For example, it has a belt drive mechanism not shown in the figure which moves parallel to all directions of (G).

7, 8, and 9 are a cross-sectional view, a plan view, and a front view of the remover head 93. As shown in FIG. 7, the remover head 93 has an upper head component 93a and a lower head component 93b, and is formed in a cross-sectional shape having a treatment space S so as to face each other in the vertical direction to have a C shape. It is. The remover head 93 has a suction port 92 through the base end side of the remover head 93. The remover head 93 is connected to a vacuum pump or the like not shown in the drawing, and the processing space S is provided. The atmosphere inside is sucked in.

In the upper head structural member 93a, an unnecessary resist film 70 is placed when the peripheral edge of the substrate G is placed in the processing space S between the upper head structural member 93a and the lower head structural member 93b. The solvent nozzle 95 for discharging the solvent toward the part to be removed is fixed. The solvent nozzle 95 is supplied at a predetermined pressure by a solvent, for example, thinner, from another solvent, for example, from a solvent supply source 96 having a tank or the like through a supply pipe 21 by pressure of nitrogen gas or the like. It is supposed to be. Thereby, each remover head 93 can remove the excess resist film 70 adhering to the four edges of the board | substrate G, moving along each angle of the board | substrate G, and discharging a thinner. .

The solvent nozzle 95 has a hollow structure in which a distribution part (not shown) having the same diameter as the discharge port is formed in the thin wire. For example, the diameter of the discharge port of the solvent nozzle 95 used generally is about 260 micrometers. The pressure of the nitrogen gas applied to the tank 96 is about 1 kg / cm ² , whereby a solvent of about 40 ml per minute is discharged with respect to the periphery of the front and back surfaces of the substrate G, thereby unnecessary resist film ( 70) is dissolved and removed on the substrate (G). In this embodiment, for example, as shown in FIG. 8, the resist film can be removed from the end of the substrate G in the range of 0.5 mm to 10 mm. In addition, the discharged solvent and the dissolved resist liquid are sucked from the suction port 92 and discharged to the outside.

Moreover, the optical fiber 81 is fixed to the upper head structural material 93a toward the board | substrate G side, and the optical fiber 81 is fixed to it, and is connected to the light source which is not shown in figure. The positional relationship between the optical fiber 81 and the solvent nozzle 95 is, for example, substantially parallel to one side of the substrate G as shown in FIG. 8. The optical fiber 81 is provided for the purpose of removing the processing film 80 of the edge portion of the substrate formed in the lower layer of the resist film 70, so that each remover head 93 moves along the vicinity of the substrate G. As shown in FIG. For example, the extra processing film 80 adhering to the circumferential edge portions of the substrate G is removed while irradiating ultraviolet rays with the optical fiber 81. It is preferable to use the light containing the exposure wavelength component used for the exposure process of the said exposure apparatus 32 as the ultraviolet-ray used here, for example. Moreover, the movement of each remover head 93, the supply and stop of the thinner from the solvent nozzle 95, the irradiation of the ultraviolet ray by the optical fiber 81, and the like are controlled by the control part which is not shown in figure.

Next, the operation of the edge remover ER 48 configured as described above will be described.

The glass substrate G on which the resist film was formed is placed on the stage 91 in the edge remover ER 48. And each remover head 93 is arrange | positioned at the predetermined position of each part of the board | substrate G, respectively, and as shown in FIG.10 (a), the solvent nozzle 95 is carried out by the moving mechanism 94. FIG. ), While moving the thinner from the substrate G to each of the two round trips or three round trips along the vicinity of the substrate G, the resist film 70 only at the circumferential edge of the substrate G is removed. 80). At this time, the removed resist film is sucked and discharged by the suction port 92 at the same time as the thinner used for resist dissolution. This processing film 80 is a processing film by HMDS gas formed when the adjuvant treatment is performed.

Next, as shown in FIG. 10 (b), the substrate G is moved by, for example, two round trips or three round trips along the vicinity of the substrate G while irradiating ultraviolet rays with the optical fiber 81. The processing film 80 exposed only at the circumferential edge of is removed. In this way, gas is generated from the processing film 80 when the processing film 80 is removed. However, this gas can be exhausted by suction from the suction port 92. By this one suction port 92, both the gas from the resist film and the process film can be discharged efficiently.

According to this embodiment, even if the substrate G is conveyed to the exposure apparatus 32 in a subsequent step, the amine gas is not generated from the processing film 80 exposed to the edge portion of the substrate as in the prior art. Therefore, clouding of the exposure lens, the mirror, and other devices in the exposure apparatus 32 can be prevented, and adverse effects on the exposure apparatus 32 can be avoided. In addition, adverse effects on the apparatus and apparatus, such as the pre-baking unit PREBAKE immediately after the resist coating process and the development processing unit DEV after the exposure process, can be avoided instead of the exposure apparatus 32.                     

In addition, in this embodiment, as shown in FIG. 11, you may make it attach the air cylinder 30 to the support member 36 which moves by the moving mechanism 94, for example. Then, by attaching the base end side of the remover head 93 to the piston 30a of the air cylinder 30 as shown, the movement of the support member 36 along the edge of the substrate by the moving mechanism 94 is performed. The remover head 93 can be moved in the direction orthogonal to the direction.

By making such a configuration, for example, first, as shown in Fig. 10A, the remover head 93 is moved by two or three reciprocations, for example, along the edge of the substrate, so that the substrate G is moved. The resist film 70 of only the periphery is removed to expose the processing film 80. Next, the air cylinder 30 moves only a predetermined distance in the direction (X direction shown in FIG. 11), for example, in which the remover head 93 is separated from the substrate G. As shown in FIG. The processing film 80 exposed only to the circumferential edge portion of the substrate G is moved by, for example, two round trips or three round trips around each of the substrates G while irradiating ultraviolet rays with the optical fiber 81. Remove it.

Thereby, for example, the thinner discharge by the solvent nozzle 95 and the ultraviolet irradiation by the optical fiber 81 can be prevented from being performed in the same moving linear shape as the moving direction along the edge of the substrate. In other words, it is possible to prevent the edge portion of the resist film remaining outside the peripheral edge portion after the resist film is removed by the solvent nozzle 95 from being exposed by ultraviolet irradiation with the optical fiber 81.

Instead of providing such an air cylinder 30, as shown in Figs. 12A and 12B, the positional relationship between the solvent nozzle 95 and the optical fiber 81 is used as the solvent. It is only necessary to move the remover head 93 in the Y direction by shifting the displacer out of the substrate G than the nozzle 95, and the edge portion 70a of the resist film remaining outside the peripheral edge as described above. Can be prevented from being exposed by ultraviolet irradiation with the optical fiber 81.

Further, in combination with the forms shown in FIGS. 11 and 12, as shown in FIG. 13, the glass substrate G is simultaneously discharged by the solvent nozzle 95 and irradiated with ultraviolet rays by the optical fiber 81. The remover head 93 may be moved from the respective corner portions A in the arrow direction in the arrow direction as B → C → D → E → ... to remove the resist film 70 and the processing film 80. In this case, when the first remover head 93 is moved from position A to position B, only the thinner is discharged by the solvent nozzle 95, the resist film is removed, and the movement after the movement of position D from position B is performed. In this case, by simultaneously discharging the thinner by the solvent nozzle 95 and irradiating ultraviolet rays by the optical fiber 81, the processing film 80 gradually exposed by the thinner discharge is removed by following the optical fiber 81. I can go. In this case, the movement from the position A to the position B and the position C to the position D is performed by the moving mechanism 94, and the movement from the position B to the position C and the position D to the position E is carried out by the air cylinder 30. Control).

By simultaneously removing such a resist film 70 and removing the processing film 80, processing time can be shortened and throughput can be improved. In this case, the resist film 70 is reliably removed and reliably processed by lowering the moving speed along the edge of the substrate of the remover head 93 than that of the normal remover head 93. Membrane 80 can also be removed.

Next, another embodiment of the present invention will be described with reference to FIG. 14. In addition, in FIG. 14, the same code | symbol is attached | subjected about the same thing as the component in FIG. 7, FIG. 8, and FIG. 9, and the description is abbreviate | omitted.

With reference to FIG. 14, the cleaning nozzle 66 which sprays a cleaning liquid toward the light transmission surface 81a of the optical fiber 81 is attached to the lower head structure material 93b of the remover head 93. As shown in FIG. The cleaning nozzle 66 is connected to the cleaning supply source 68 via the cleaning solution supply pipe 67, whereby the cleaning solution can be supplied to the nozzle 66. As shown in FIG. As the cleaning liquid, pure water or the like is used, for example.

Thus, even if the gas generated when irradiating ultraviolet rays to remove the processing film 80 adheres to the light transmitting surface 81a of the optical fiber 81 and the light transmitting surface 81a becomes cloudy and contaminated, for example, the processing film After the removal process of 80 is finished, the cleaning liquid is ejected toward the light-transmitting surface 81a by the cleaning nozzle 66 for each substrate or every predetermined number of substrates, thereby causing the clouding of the light-transmitting surface 81a to be cloudy. Can be removed. Thereby, for example, it can avoid that the intensity | strength of the ultraviolet-ray irradiated from the optical fiber 81 decreases by the deposit of the light transmission surface 81a.

Moreover, the resist film 70, the process film 80, and this process film 80 which remove | eliminate the washing | cleaning liquid scattered at the time of the said washing | cleaning by suction from the suction port 92 provided in the remover head 93 are carried out. The gas can be discharged at the same time as the generated gas and the like, and the effect of the suction from the suction port 92 is large.

In addition, the cleaning nozzle 66 may not necessarily be fixed to the remover head 93, and a means for separately fixing an arm such as an arm not shown may be provided.

15 is a schematic perspective view showing an edge remover (ER) 48 according to another embodiment. In this embodiment, the heater 75 is further provided in addition to the edge remover ER 48 shown in FIG. 6. The heater 75 includes, for example, a hollow frame member 88 that forms a rectangular frame of substantially the same size as the size of the glass substrate G, and a support portion for supporting the frame member 88 ( 73 and a motor 72 for elevating the frame member 88 up and down.

16 is a cross-sectional view of the frame member 88. The rim member 88 is provided with a gas supply port 74 for receiving gas from a gas supply source (not shown), a gas heating chamber 76 for heating the gas received, and a heated gas on the glass substrate G. It has a gas outlet (85) for blowing out the membrane (80). Moreover, as a means for heating a gas, the nichrome wire 78 is provided in the gas heating chamber 76, for example.

In the present embodiment, as in the above embodiment, thinner is first discharged from the solvent nozzle 95, and the resist film unnecessary for the peripheral edge of the glass substrate G is removed, and then the remover head 93 is formed of the glass substrate G. Spaced apart), and once removed. The separation in the glass substrate G of the remover head 93 can be performed by the air cylinder 30 shown in FIG. 11 etc. as mentioned above.

Next, the heater 75 descends by the motor 72 from the upper side of the glass substrate G, and approaches the glass substrate G. As shown in FIG. As shown in FIG. 17, warm air or hot air is blown out from the heater 75 to heat the treatment film by the adsorbing treatment covering the circumferential edge of the glass substrate G. As shown in FIG.

Next, when the processing film 80 is sufficiently heated, the heater 75 is raised by the motor 72 to move away from the glass substrate G. Then, the remover head 93 approaches the predetermined position of the edge portion of the glass substrate G, and the processing film 80 heated by the ultraviolet light emitted from the optical fiber 81 is removed.

In this manner, the treatment film 80 is heated in advance before the ultraviolet irradiation, so that the peeling action of the treatment film 80 by the ultraviolet irradiation can be promoted.

18 shows another embodiment of a portion of an optical fiber. For example, the cylindrical member 82 is provided with many optical fibers bundled together, and the window part 82a for ejecting the optical fiber is formed in the light transmission surface of this cylindrical member 82. As shown in FIG. One side of the window portion 82a is formed into a rectangle having a width equal to or less than the width of the region 39 indicated by the broken line exposed by the resist film removed from the edge of the glass substrate G. By the shape of the window portion 82a, for example, only the movement of the substrate peripheral edge portion by the remover head to the first path allows the region 39 exposed by the treatment film to be removed efficiently. have. As a result, processing time can be reduced, and throughput can be improved.

In FIG. 19, the optical piper 81 is attached to the lower head structural member 93b of the remover head 93, and the light transmitting surface 81a is disposed facing the upper head structural member 93a. In this case, since the substrate G is a glass substrate, the optical fiber 81 transmits ultraviolet rays from the back surface Ga side of the glass substrate G to form the treatment film 80 formed on the surface of the substrate G. You can check). As a result, for example, adverse effects such as clouding of the light transmitting surface 81a of the optical fiber 81 by the gas generated when the ultraviolet ray is irradiated to the processing film 80 can be prevented.

This invention is not limited to embodiment described above, A various deformation | transformation is possible.

For example, in each of the above embodiments, the optical fiber 81 is taken as an example as a means for removing the treatment film by the adjuvant treatment, but for example, these can be removed by supplying ozone water to the treatment film. .

In addition, although the warm air or hot air is used as a means for heating a process film | membrane in the said FIGS. 15-17, you may heat with infrared rays etc. without being limited to this.

In addition, the movement of the optical fiber 81 for removing the processing film 80 may be only the movement to one path, not the reciprocation of one side of the board | substrate G. In addition, if the number of movements of the remover head 93 for removing the resist film is determined in advance, the remover head 93 is moved last to remove the resist film from the optical fiber 81 with respect to the solvent nozzle 95. The rear side of the traveling direction may be disposed so that the optical fiber 81 can be irradiated with ultraviolet rays at the same time as the remover head 93 is moved last. This can further reduce processing time and improve throughput.                     

In each of the above embodiments, the wavelength of light of the optical fiber 81 is preferably greater than 250 nm. By making the wavelength larger than 250 nm, it is possible to prevent the resist from being exposed.

In the above embodiment, the discharge from the suction port 92 is discharged both when the resist film 70 is removed and when the processing film 80 is removed. However, only the HMDS gas generated by exhausting may be exhausted only when the processing film 80 is removed.

In addition, when the resist film 70 is removed and the process film 80 is discharged from the suction port 92 by both, the gas at the time of removing the process film 80 is removed. The exhaust amount of may be increased than when the resist film 70 is removed.

In each of the above embodiments, the suction port 92 which recovers the gas generated when the processing film 80 is removed with the positive portion of the optical fiber 81 near the lens portion (not shown) in the processing space S as a positive pressure. You may install in addition to). In this case, the recovery portion may be provided near the lens.

20 and 21 show a remover head according to another embodiment.

A plurality of optical fibers 81 are attached to the remover head 93 shown in FIG. 20. In the present embodiment, for example, three optical fibers 81 are arranged in an inclined direction between the X direction and the Y direction in the drawing, but may be arranged in the X direction. Reference numeral 95 is a solvent nozzle. By such a configuration, the entire portion exposed by the processing film 80 receives light from the plurality of optical fibers 81 by the movement of the remover head 93 to one path. As a result, the processing film 80 can be reliably removed, and throughput can be improved.

A solvent nozzle 95 is attached to the upper head structural member 93a and the lower head structural member 93b in the remover head 93 shown in FIG. 21, respectively. Thus, by attaching the solvent nozzle 95 so that the board | substrate G can be interposed, the resist film 70 which returned and adhered not only to the front surface side but also the back surface side of the board | substrate G can be removed. In this embodiment, two or more solvent nozzles 95 may be attached to the holding member 93 more than that. In addition, since the resist film to be removed on the lower surface side of the substrate is smaller than on the surface side, the number of adhered to the lower head structural members 93b is less than that of the optical fibers 81 attached to the upper head structural members 93a. You may also

As described above, according to the present invention, adverse effects on the exposure apparatus can be prevented, for example, it is possible to prevent whitening of devices such as exposure lenses and mirrors of the exposure apparatus.

Claims (24)

A resist film removal means for discharging a solvent in the edge portion of the substrate of the substrate on which the film made of the HMDS gas and the resist film coated on the film made of the HMDS gas are formed, to remove the resist film of the peripheral edge portion; And a film removing means by HMDS gas for removing the film by the HMDS gas exposed to the edge portion of the substrate where the resist film is removed. The substrate processing apparatus according to claim 1, wherein the film formed by the HMDS gas is formed by an adjuvant treatment. 2. The film removing means according to claim 1, wherein the film removing means using the HMDS gas includes a means for irradiating light including a wavelength component of exposure light for exposing the resist film to the exposed film of the HMDS gas. Substrate processing apparatus. 4. The resist film removing unit according to claim 3, wherein the resist film removing unit includes a holding member for holding a solvent nozzle for discharging the solvent, and a circumferential edge moving mechanism for moving the holding member along the periphery of the substrate, And discharging the solvent while moving the holding member by the circumferential edge movement mechanism. The optical fiber of claim 4, further comprising an optical fiber attached to the holding member integrally with the solvent nozzle and irradiating the light. And said film removing means by said HMDS gas irradiates light while moving said holding member by said circumferential edge movement mechanism. 6. A substrate processing apparatus according to claim 5, wherein the optical fiber and the solvent nozzle are disposed substantially parallel to the moving direction of the holding member. 7. An orthogonal direction moving mechanism according to claim 6, further comprising: an orthogonal direction moving mechanism for moving the holding member in a direction orthogonal to the moving direction; And removing the resist film of the circumferential edge portion, and then moving the holding member by the orthogonal direction mechanism to remove the film by the HMDS gas of the circumferential edge portion. 6. The substrate processing apparatus of claim 5, wherein the optical fiber is disposed outside the substrate than the solvent nozzle. 9. The apparatus of claim 8, further comprising an orthogonal direction moving mechanism for moving the holding member in a direction orthogonal to the moving direction, A substrate processing apparatus characterized by removing the resist film of the HMDS gas which is sequentially exposed while removing the resist film of the circumferential edge while the holding member is alternately moved by the circumferential edge movement mechanism and the orthogonal direction movement mechanism. The substrate processing apparatus according to claim 5, further comprising a cleaning nozzle for ejecting the cleaning liquid toward the light transmitting surface of the optical fiber. 11. The substrate treating apparatus of claim 10, wherein the cleaning nozzle is attached to the holding member. The substrate processing apparatus according to claim 5, further comprising means for exhausting a gas generated from the film formed by the HMDS gas when the film formed by the HMDS gas is removed. 13. The substrate treating apparatus according to claim 12, wherein the exhausting means comprises means for drying the light transmitting surface of the optical fiber after cleaning by the cleaning nozzle. 6. The substrate processing apparatus according to claim 5, wherein the light-transmitting surface of the optical fiber has a rectangular shape having one side almost equal to the width of the film by the exposed HMDS gas. The substrate processing apparatus according to claim 5, wherein the irradiation of light by the optical fiber is performed from the back surface side of the substrate surface on which the resist film is applied. The substrate processing apparatus according to claim 1, further comprising means for heating a film by HMDS gas at the edge portion of the substrate. 2. The substrate treating apparatus according to claim 1, wherein the film removing means by the HMDS gas comprises means for supplying ozone water to the exposed film of HMDS gas. 6. The substrate processing apparatus according to claim 5, wherein the optical fibers are arranged in plural in a direction different from a moving direction of the holding member by a peripheral edge moving mechanism. 6. A substrate processing apparatus according to claim 5, wherein said holding member is attached to said holding member so as to sandwich said substrate with at least two solvent nozzles. Dissolving a solvent in the periphery of the substrate of the substrate on which the film made of the HMDS gas and the resist film coated on the film made of the HMDS gas are formed, thereby removing the resist film of the periphery; And removing the film by the HMDS gas exposed to the edge portion of the substrate from which the resist film has been removed. The substrate processing method according to claim 20, wherein the film by the HMDS gas is formed by an adjuvant treatment.  21. The substrate processing method according to claim 20, wherein the step of removing the film by the HMDS gas is performed before the exposure treatment of the substrate. 21. The method of claim 20, wherein the removing of the film by the HMDS gas includes irradiating light including the wavelength component of the exposure light in the exposure treatment to the exposed film of the HMDS gas. Substrate processing method. 21. The substrate processing method according to claim 20, further comprising the step of evacuating the gas generated from the film formed by the HMDS gas when the film formed by the HMDS gas is removed.

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