CN1434481A - Substrate treating device and method thereof - Google Patents
Substrate treating device and method thereof Download PDFInfo
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- CN1434481A CN1434481A CN03106486A CN03106486A CN1434481A CN 1434481 A CN1434481 A CN 1434481A CN 03106486 A CN03106486 A CN 03106486A CN 03106486 A CN03106486 A CN 03106486A CN 1434481 A CN1434481 A CN 1434481A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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Abstract
A solvent nozzle is reciprocated by a moving mechanism 94 along each edge of a substrate, for instance, twice or three times for each edge while a thinner is discharged from the solvent nozzle, whereby a resist film is removed from only the periphery of the substrate, and a treatment film which is formed through an HMDS gas when an adhesion treatment is carried out is exposed. Then, an optical fiber is reciprocated along each edge of the substrate, for instance, twice or three times for each edge as the optical fiber irradiates the substrate with ultraviolet rays, whereby the treatment film 80 exposed only on the periphery of the substrate is removed. By this setup, no amine gas occurs from the treatment film exposed on the periphery of the substrate, so that exposure lenses, mirrors, and other apparatuses can be prevented from getting cloudy.
Description
Technical field
The present invention relates to remove the lining processor and the Method of processing a substrate of processing film of being formed on the glass substrate that is used in liquid crystal indicator etc. etc.
Background technology
In the manufacturing process of LCD (that is, liquid crystal display) etc., for (that is, indium tin oxide) film and electrode pattern utilize the lithography technology the same with the manufacturing that is used for semiconductor device being used for forming ITO on the handled object glass substrate of LCD.In lithography technology, on glass substrate, apply photoresist, exposure is developed again.
In addition, apply and the front and back of exposure and each operation of developing, carry out predetermined heating and handle and cooling processing, particularly, in the operation before the coating processing of photoresist, carry out adhesion process at these photoresists.This adhesion process improves in order to make glass substrate and photoresist film compactness, makes the gas (usually, using HMDS gas) of ammonia system be vaporous, is coated on the glass substrate.
Then, apply the photoresist film after this adhesion process, but in order to prevent to produce thereafter particulate, after the photoresist film coating processing, (for example remove the unnecessary photoresist film be coated on the glass substrate periphery with the diluent equal solvent, Japanese discloses communique, puts down into 6-333819 communique ((0019) section, Fig. 5)).
But after the photoresist that has carried out this periphery was removed processing, glass substrate was moved to exposure device and carries out exposure-processed, but at this moment just produced the dirty problem of exposure lenses and speculum white.Consider that its reason is after the photoresist film of removing substrate perimeter portion, expose the film that is coated in the HMDS gas below the photoresist film at this periphery, produce the gas of the amine system that constitutes HMDS gas from this part, ammonium sulfide for example, the gas of this generation is attached on the lens of exposure device and speculum etc.According to such problem, for example just take place can not be in accordance with regulations exposure exposure etc. do not conform to the situation that is suitable for exposure-processed.
Summary of the invention
In order to achieve the above object, the lining processor that the present invention relates to is characterised in that, comprise:, remove the coat film removal device of the coat film of this periphery to having formed the substrate perimeter portion discharge solvent of handling film and being coated in the substrate of the coat film on this processing film; The processing film removal device of the above-mentioned processing film that removal is exposed in the removed substrate perimeter of above-mentioned coat film portion.
According to such structure, after coat film removal device removal coat film, remove the processing film that exposes by handling the film removal device.Like this, can eliminate the dirty reasons of white such as exposure lenses and speculum, for example,, therefore can not produce bad influence ground and remove the coat film of substrate perimeter portion exposure device owing to can remove the processing film that forms by adhesion process.
As the coat film processing unit,, remove coat film Yi Bian can consider that utilization is moved solvent nozzle one edge substrate perimeter portion and discharged solvent.In addition,, optical fiber is moved from the optical fiber exposure light along substrate perimeter portion, remove and handle film, in addition, also can consider to utilize to handling film ozone supply water to remove this processing film while can consider to utilize as handling the film removal device.
According to an embodiment of the invention, the light of optical fiber preferably uses the light of the exposure light wavelength composition that comprises the above-mentioned coat film that is used to expose.
In addition, also can be included in the heater that the removal coat film heats the processing film that exposes afterwards.Like this, utilized before photoirradiation heat treated film in advance, can promote the effect of peeling off with the processing film of photoirradiation.
According to an embodiment of the invention, above-mentioned coat film removal device is characterised in that, comprising: the holding member that keeps the solvent nozzle of the above-mentioned solvent of discharge; Make above-mentioned holding member along the perisphere travel mechanism that the periphery of above-mentioned substrate moves, by above-mentioned perisphere travel mechanism above-mentioned holding member moved on one side, discharge above-mentioned solvent on one side.According to such structure,, therefore can remove coat film expeditiously and handle film while discharge solvent because holding member is moved.In addition, under the situation of fixed fiber on the holding member, while, therefore can remove the processing film expeditiously owing to make holding member move exposure light.
The projection surface of this optical fiber preferably constitutes the length with a limit and the roughly the same rectangle of width of the above-mentioned processing film that exposes.Like this, for example, utilize the process that only moves 1 substrate perimeter portion by holding member, just can remove expeditiously and handle the zone that film exposes.In addition, also can carry out the photoirradiation of optical fiber from the back side one side of the substrate surface that applied above-mentioned coat film.For example, be under the situation of glass substrate at substrate, even from the back side one side exposure light, also can make transmittance in the surface of glass substrate one side.
According to an embodiment of the invention, it is characterized in that the moving direction almost parallel ground configuration of above-mentioned optical fiber and solvent nozzle and above-mentioned holding member.Under this situation, be preferably on the holding member be provided with make it with the direction of above-mentioned moving direction quadrature on the quadrature travel mechanism that moves.Like this, holding member is moved on above-mentioned orthogonal direction, solvent nozzle and optical fiber are positioned at handle on the film, on the Width of this processing film, move.Thereby, utilize solvent nozzle and optical fiber to remove the scope of handling film and broaden, just can remove the processing film definitely.
According to an embodiment of the invention, it is characterized in that above-mentioned optical fiber is configured in than above-mentioned solvent nozzle more on the position in the outside of substrate.According to such structure, only carry out holding member along the moving of substrate perimeter portion, can prevent after the coat film of having removed substrate perimeter portion, by the expose situation of remaining coat film of the photoirradiation of optical fiber.
According to an embodiment of the invention, it is characterized in that, also comprise make above-mentioned holding member with the direction of above-mentioned moving direction quadrature on the orthogonal direction travel mechanism that moves, utilize above-mentioned perisphere travel mechanism and orthogonal direction travel mechanism that holding member is alternately moved, in the coat film of removing above-mentioned periphery, remove the processing film that exposes successively.Like this,, therefore remove the scope of handling film and broaden, just can remove the processing film definitely by optical fiber because optical fiber chases solvent to remove the processing film that exposes successively after discharging, can be effectively and promptly remove coat film and processing film.
According to an embodiment of the invention, it is characterized in that, also comprise towards the washer jet of the projection surface ejection cleaning solution of above-mentioned optical fiber.Consider on the projection surface of processing film that gasifies by photoirradiation, make the projection surface of optical fiber produce the white dirt attached to optical fiber, and, because of not obtaining the possibility of certain photoirradiation on its attachment substrate on the projection surface of optical fiber.Among the present invention, utilize white dirt, just can avoid relevant situation with cleaning solution clean fiber optic projection surface.In addition, washer jet of the present invention also can be assemblied on the holding member, moves integratedly with holding member.
According to an embodiment of the invention, it is characterized in that, also be included in and discharge from the device of the gas of this processings film generation when removing above-mentioned processing film.According to such structure, can discharge the processing film that has gasified by photoirradiation.Like this, can prevent that the white of above-mentioned optical fiber projection surface is dirty, in addition, can prevent the contamination of locking apparatus and machine class.In addition,, therefore can when discharging coat film that removes and the gas of handling film and producing etc., discharge the cleaning solution that when this cleaning, splashes, in addition, also can make optical fiber projection surface drying from this processing film because this discharger is set.
According to an embodiment of the invention, it is characterized in that above-mentioned optical fiber is a plurality of to be installed on the direction different with the moving direction of the above-mentioned holding member that utilizes perisphere travel mechanism side by side.Like this, can on 1 process of holding member, remove and handle film, when removing the processing film more accurately, can boost productivity.
According to an embodiment of the invention, it is characterized in that, in the above-mentioned solvent nozzle of folder substrate ground assembling more than 2 on the holding member.Therefore, can not only be in the surface of substrate one side, and can change to advance the back side one side and remove the coat film that adheres to.
The Method of processing a substrate that the present invention relates to is characterised in that, comprises following operation: to having formed the substrate perimeter portion discharge solvent of handling film and being coated in the substrate of the coat film on this processing film, remove the operation of the coat film of this periphery; The operation of the above-mentioned processing film that removal is exposed in the removed substrate perimeter of above-mentioned coat film portion.
Description of drawings
Fig. 1 is the plane graph that the general construction of the coating developing system that an embodiment of the invention relate to is shown.
Fig. 2 is the front view of the coating developing system shown in Fig. 1.
Fig. 3 is the rearview of the coating developing system shown in Fig. 1.
Fig. 4 is the plane graph of the photoresist processing block that relates to of first execution mode.
Fig. 5 is the end view of the photoresist processing block shown in Fig. 4.
Fig. 6 is the edge striping device that relates to of the first execution mode of the present invention (brief strabismus map of リ system-バ).
Fig. 7 is the profile that the striping device head that first execution mode relates to is shown.
Fig. 8 is the plane graph of the striping device head shown in Fig. 7.
Fig. 9 is the front view of the striping device head shown in Fig. 7.
Figure 10 (a) is the photoresist film removal effect that substrate perimeter portion is shown, and (b) is the profile that the removal effect of the processing film that adhesion process relates to is shown.
Figure 11 is the end view that is illustrated in the state of assembling air cylinder on the striping device head.
Figure 12 (a) is the plane graph that the position relation of solvent nozzle and optical fiber is shown, and is that the end view that it handles the removal effect of film is shown (b).
Figure 13 illustrates to make the plane graph of substrate perimeter portion by the state of striping device head scanning.
Figure 14 is the profile that is provided with the striping device head of washer jet.
Figure 15 is the brief strabismus map of the edge striping device that relates to of another execution mode.
Figure 16 is the profile of the frame parts shown in Figure 15.
Figure 17 is the oblique view that illustrates the substrate perimeter portion heat effect of heater.
Fig. 18 is expansion oblique views that the fiber section of other execution modes is shown.
Figure 19 is the profile of the striping device head that relates to of other execution mode.
Figure 20 is the plane graph of the striping device head that relates to of other execution mode.
Figure 21 is the profile of the striping device head that relates to of other execution mode.
Embodiment
Below, based on accompanying drawing embodiments of the present invention are described.
Fig. 1 is the plane graph that the coating developing system of the suitable LCD substrate of Handling device of the present invention is shown, and Fig. 2 is its front view, and in addition, Fig. 3 is its rearview.
This coating developing system 1 comprises: mounting is accommodated the film magazine operating desk 2 of the film magazine C of a plurality of glass substrate G; Comprise being used on substrate G, implementing and comprise that photoresist applies and the handling part 3 of a plurality of processing units of a series of processing of development; Be used for and 32 of the exposure devices interface portion 4 of carrying out the handing-over of substrate G, dispose film magazine operating desk 2 and interface portion 4 respectively at the two ends of handling part 3.
Film magazine operating desk 2 comprises the carrying mechanism 10 that is used for carrying out the carrying of LCD substrate between film magazine C and handling part 3.Then, the moving into of film magazine C of carrying out in the film magazine operating desk 2 taken out of.In addition, carrying mechanism 10 comprises the carrying arm 11 that moves on the carrying road 12 that can be provided with in the orientation along film magazine, utilizes this carrying arm 11 to carry out the carrying of substrate G between film magazine C and handling part 3.
Be provided with on the handling part 3: the main trucking department 3a that on the direction (directions X) vertical, extends with the orientation (Y direction) of film magazine C in the film magazine operating desk 2; Be set up in parallel the 3b of upper reaches portion of the each processing unit that comprises photoresist coating processing unit (CT) along this main trucking department 3a; Be set up in parallel dirty 3c of the each processing unit that comprises development treatment unit (DEV) 18.
The carrying road 31 that is arranged on the directions X is set on main trucking department 3a and can carries the carrying shuttle 23 of on directions X, carrying glass substrate G that move on road 31 along this.This carrying shuttle 23 can keep substrate G to carry by for example steady arm.In addition, be arranged on the vertical carrying unit 7 that carries out the handing-over of substrate G between handling part 3 and the interface portion 4 on the end of interface portion 4 those sides of main trucking department 3a.
Among the 3b of upper reaches portion, in the end of film magazine operating desk 2 those sides the washer clean unit (SCR) 20 of substrate G being implemented clean is set, the epimere in this washer clean unit (SCR) 20 sets the organic ultraviolet excimer processing unit (e-UV) 19 that is used to remove on the substrate G.
Dispose the heat treatment system piece 24 and 25 of the unit that multistage accumulation heat-treats glass substrate G in the next door of washer clean unit (SCR) 20.The vertical carrying of configuration unit 5 between these heat treatment system pieces 24 and 25, because carrying arm 5a can move on Z direction and horizontal direction, and can on the θ direction, rotate, therefore just can each the heat treatment system unit in two pieces 24 and 25 on access, carry out the carrying of substrate G.Moreover, also have the structure identical for the vertical carrying unit 7 in the above-mentioned handling part 3 with should be vertical carrying unit 5.
As shown in Figure 2, on heat treatment system piece 24, stack gradually 2 sections coherent unit (AD) of on substrate G, implementing the baking unit (BAKE) of the heat treated before photoresist applies and implementing the draining processing by HMDS gas from bottom to top.On the other hand, on heat treatment system piece 25, stack gradually 2 sections cooling unit (COL) and coherent unit (AD) of substrate G being implemented cooling processing from bottom to top.
With heat treatment system piece 25 adjacency, on directions X, extend photoresist processing block 15.This photoresist processing block 15 integrated setting following apparatus and constituting: the photoresist coating processing unit (CT) 49 that on substrate G, applies photoresist; Utilize decompression to make the drying under reduced pressure unit (VD) 40 of the photoresist drying of above-mentioned coating; The edge striping device (ER) 48 of the photoresist of the removal substrate G periphery that the present invention relates to.On this photoresist processing block 15 auxiliary arm that does not illustrate among the figure is set, this auxiliary arm moves to edge striping device (ER) 48 from photoresist coating processing unit (CT) 49, just can carry substrate G in photoresist processing block 15 by this auxiliary arm.
With photoresist processing block 15 adjacency, set the heat treatment system piece 26 of multistage formation.In stacked 3 sections prebake unit (PREBAKE) that carrying out the heat treated after photoresist applies on the substrate G on this heat treatment system piece 26.
Among dirty the 3c, as shown in Figure 3, in the end of interface portion 4 those sides heat treatment system piece 29 is set, the end that stacks gradually cooling unit (COL) and 2 sections preceding heat treated of back development treatment of exposing thereon from bottom to top exposes baking unit (PEBAKE).
With heat treatment system piece 29 adjacency, on directions X, extend the development treatment unit (DEV) 18 that carries out development treatment.At the next door of this development treatment unit (DEV) 18 configuration heat treatment system piece 28 and 27, between these heat treatment system pieces 28 and 27, be provided with and have the structure identical, vertical carrying unit 6 that can access on two pieces 28 each heat treatment system piece in 27 with above-mentioned vertical carrying unit.In addition, on 18 ends, development treatment unit (DEV), i line processing unit (i-UV) 33 is set.
On heat treatment system piece 28, stack gradually the end baking unit (POBAKE) of cooling unit (COL) and 2 sections heat treated after developing on the substrate G from bottom to top.On the other hand, heat treatment system piece 27 stacks gradually cooling unit (COL) and 2 sections end baking unit (POBAKE) too from bottom to top.
On interface portion 4; in a positive side seal protection and peripheral exposing unit (Titler/EE) 22 are set; expand cooling unit (EXTCOL) 35 with vertical carrying unit 7 in abutting connection with configuration; in addition; a side disposes surge chamber 34 overleaf; the unit 8 of the vertical carrying of configuration simultaneously, this vertically carry unit 8 these seal protections and peripheral exposing unit (Titler/EE) 22 reaches with expansion cooling unit (EXTCOL) 35 and the exposure device 32 of surge chamber 34 adjacency between carry out the handing-over of substrate G.Should vertical carrying unit 8 also have the structure identical with above-mentioned vertical carrying unit 5.
In the treatment process of the coating developing system 1 that constitutes as mentioned above, at first, the substrate G in the film magazine C is moved to the 3b of upper reaches portion in the handling part 3.In the 3b of upper reaches portion, carry out surperficial reformation organic matter removal by ultraviolet excimer processing unit (e-UV) 19 and handle, secondly, in the washer clean unit (SCR) 20, on one side approximate horizontal ground carrying substrate G, carry out clean and dried on one side.Then, hypomere portion at heat treatment system piece 24, take out substrate G by the carrying arm 5a in the vertical carrying unit, baking unit (BAKE) with same heat treatment system piece 24 carries out heat treated, improving the compactness of glass substrate G and photoresist film, carry out the spray processing of HMDS gas to substrate G with coherent unit (AD).Afterwards, the cooling unit (COL) by heat treatment system piece 25 carries out cooling processing.
Secondly, substrate G is handed off on the carrying shuttle 23 from carrying arm 5a.Then, be moved to photoresist coating processing unit (CT), after the coating processing of having carried out photoresist, use drying under reduced pressure that drying under reduced pressure processing unit (VD) carries out to handle successively and the photoresist of the substrate perisphere that carries out with edge striping device (ER) 48 is removed processing.
Secondly, substrate G is handed off on the carrying arm of vertical carrying unit 7 from carrying shuttle 23, carries out after the heat treated with the prebake unit (PREBAK) in the heat treatment system piece 26, and (COL) carries out cooling processing with the cooling unit in the heat treatment system piece 29.Then, when carrying out cooling processing substrate G, carry out exposure-processed with exposure device with expansion cooling unit (EXTCOL) 35.
Secondly, the end that the carrying arm of substrate G by vertical carrying unit 8 and 7 is moved to heat treatment system piece 29 exposes baking unit (PEBAKE), and after this carried out heat treated, (COL) carried out cooling processing with cooling unit.Then, substrate G passes through the carrying arm of vertical carrying unit 7, in development treatment unit (DEV) 18, carry to approximate horizontal substrate G on one side, carry out development treatment and flushing processing and dried on one side.
Secondly, substrate G is by the carrying arm 6a of the vertical carrying unit 6 hypomere handing-over from heat treatment system piece 28, and toasting unit (POBAKE) with the end in heat treatment system piece 28 or 27 carries out heat treated, and (COL) carries out cooling processing with cooling unit.Then, substrate G is handed off on the carrying mechanism 10, is housed among the film magazine C.
Fig. 4 and Fig. 5 are general view and the summary side elevations that photoresist processing block 15 is shown, these photoresist coating units (CT) 49 and drying under reduced pressure unit (VD) 40 and edge striping device (ER) 48 as shown like that integratedly and be listed on the same objective table.
Drying under reduced pressure unit (VD) 40 comprises bottom camera bellows 61 and covers the top camera bellows 62 in the processing space of keeping its inside airtightly that is provided with on it.Be provided for the objective table 63 of mounting substrate G in bottom camera bellows 61, in each bight of bottom camera bellows 61 4 exhaust outlets 64 be set, the exhaust pump (diagram summary) of the blast pipe 65 that is communicated with this exhaust outlet 64 and turbo-molecular exhaust pump etc. is connected.Then, under bottom camera bellows 61 and top camera bellows 62 tight state of contact, utilize general's processing space exhaust wherein, the specified vacuum that reduces pressure degree and constituting.
In addition, dispose the columnar cup 71 at the end on the position of the substantial middle of photoresist coating unit (CT) 49, configuration is used for fixing the holding member substrate absorptive table 58 of maintenance substrate G cup 71 in.
The carrying of the substrate G that these photoresist coating units (CT) 49 and drying under reduced pressure unit (VD) 40 and edge striping device (ER) are 48 is just undertaken by trailing arm 41 and 42.
Below, the edge striping device (ER) 48 that an embodiment of the invention are related to describes.As shown in Figure 6, be provided for the objective table 91 of mounting glass substrate G.In mounting on this objective table 91 under the state of glass substrate G, on four limits of the periphery of glass substrate G, 4 striping device heads 93 are set respectively, these 4 striping device heads 93 can move along four limits of substrate G, are used for from the unnecessary photoresist of edge removal of the periphery of glass substrate G.Utilize travel mechanism 94 to carry out along the moving of this four limit, this travel mechanism 94 comprises the holding components 36 of supporting each striping device head 93 and the leather belt driving mechanism that this holding components 36 is not illustrated among the parallel mobile for example figure on four limits of substrate G.
Fig. 7 and Fig. 8 and Fig. 9 are profile and the plane graph and the front views of above-mentioned striping device head 93.As shown in Figure 7, striping device head 93 comprises upper head member 93a and lower head member 93b, and their above-below directions is opposed, forms to comprise that the section of handling space S is roughly the shape of " コ " font.In addition, this striping device head 93 has the attraction mouth 92 that connects with that side of the point of this striping device head 93, just the gas in the processing space S that is connected such as the vacuum pump that does not illustrate among attraction and the figure on this attractions mouth 92.
On upper head member 93a, when making in the processing space S of periphery between upper head member 93a and lower head member 93b of substrate G, be used to discharge the solvent nozzle 95 of solvent towards the partial fixing of removing photoresist film 70 not.On solvent nozzle 95,,, carry donor solvent, for example pressure feed diluent in accordance with regulations by the pressure that utilizes nitrogen etc. by service pipe 21 from the solvent supply source 96 of for example fuel tank that comprises other setting etc.Like this, move on each limit of each striping device head 93 energy one edge substrate G, discharges diluent, remove attached to unnecessary photoresist film 70 edge on substrate G four limits on one side.
In addition, on upper head member 93a, fixed fiber makes optical fiber projection surface 81a towards that side of substrate G, is connected with the light source that does not illustrate among the figure.This optical fiber 81 concerns for example as shown in Figure 8 with the position of solvent nozzle 95, with one side almost parallel of substrate G.The purpose that this optical fiber 81 is set is the processing film 80 of removal in the substrate perimeter portion of lower floor's formation of photoresist film 70, utilize each striping device head 93 to move along each limit of substrate G, by for example optical fiber 81 irradiation ultraviolet rays, remove attached to the unnecessary processing film 80 on the periphery on four limits of substrate G on one side on one side.Ultraviolet ray for example, preferably is included in the light of the exposure wavelength composition that uses in the exposure-processed of above-mentioned exposure device 32 as used herein.Moreover, the moving of each striping device head 93, from the supply of the diluent of solvent nozzle 95 and stop, the ultraviolet irradiation of optical fiber 81 and work such as stop and just controlling by the control part that does not illustrate among the figure.
Below, the effect of the edge striping device (ER) 48 of formation like this is described.
The glass substrate G that has formed photoresist film is positioned on the objective table 91 in the edge striping device (ER).Then, each striping device head 93 is configured in respectively on the assigned position in bight of substrate G, shown in Figure 10 (a), utilization is discharged diluent from solvent nozzle 95 on one side by travel mechanism 94, each limit of one edge substrate G for example move 2 back and forth or 3 back and forth, remove the photoresist film 70 of the only periphery of substrate G, expose and handle film 80.At this moment, the photoresist film of removal is attracted to discharge by attraction mouth 92 with the diluent that is used for the photoresist dissolving simultaneously.This processing film 80 is the processing films that form when carrying out above-mentioned adhesion process by HMDS gas.
Secondly, shown in Figure 10 (b), utilize on one side by optical fiber 81 irradiation ultraviolet rays, each limit of an edge substrate G for example move 2 back and forth or 3 back and forth, only remove the processing film 80 that the periphery at substrate G exposes.When removing processing film 80 in this wise, produce gases from handling film 80, but this gas is discharged in the attraction of energy origin self-gravitation mouth 92.Utilize 1 such attraction mouthful 92 two kinds of gases that can eject effectively from photoresist film and processing film.
According to present embodiment, even in follow-up operation, carry substrate G to exposure device 32, as prior art, because the processing film 80 that exposes from substrate perimeter portion does not produce amine-based gas, therefore can prevent to make exposure lens and speculum white in the exposure device 32 dirty, can avoid bad influence exposure device 32.In addition, not to exposure device 32, but can avoid at once the device of the prebake unit (PREBAKE) that just carries out after the photoresist coating processing and the development treatment unit (DEV) after the exposure-processed etc. and the bad influence of machine.
In addition, in the present embodiment, as shown in figure 11, also can on the holding components 36 that moves by travel mechanism 94, assemble for example air cylinder 30.Then, according to the illustrated base end part side of assembling striping device head 93 on the piston 30a of this air cylinder 30 like that, striping device head 93 is moved on orthogonal direction, and this orthogonal direction is the direction with the moving direction quadrature of the holding components 36 that utilizes travel mechanism 94 to move along substrate perimeter portion.
According to such structure, for example, at first shown in Figure 10 (a), utilize make striping device head 93 along substrate perimeter portion for example move 2 back and forth or 3 remove the photoresist film 70 of the only periphery of substrate G back and forth, expose and handle film 80.Then, for example making by air cylinder 30, striping device head 93 upward moves the distance of stipulating in the direction of leaving substrate G (directions X shown in Figure 11).Then, utilize on one side by optical fiber 81 irradiation ultraviolet rays, each limit of an edge substrate G move 2 back and forth or 3 back and forth, only remove the processing film 80 that the periphery at substrate G exposes.
Like this, for example can prevent by solvent nozzle 95 discharge diluents with by the ultraviolet operation of optical fiber 81 irradiation with along carrying out on the identical straight line of the moving direction of substrate perimeter portion.That is, can prevent to remove the marginal situation about partly being exposed that photoresist films remain in periphery photoresist film in addition afterwards by solvent nozzle 95 because of optical fiber 81 irradiation are ultraviolet.
In addition, replace being provided with such air cylinder 30, the solvent nozzle 95 and the position of optical fiber 81 are concerned as Figure 12 (a) with (b), even optical fiber 81 is configured in than solvent nozzle 95 more on the outside of substrate G, also preferably only carry out the moving of Y direction of striping device head 93, can prevent the situation that the aforesaid marginal part 70a that remains in the photoresist film beyond the periphery is exposed by the ultraviolet ray of optical fiber 81 irradiation.
In addition, mode shown in combination Figure 11 and Figure 12, as shown in figure 13, carry out simultaneously on one side by solvent nozzle 95 discharge diluents with by optical fiber 81 irradiation ultraviolet rays, make on one side striping device head 93 from the bight A of glass substrate G successively in the direction of arrows B → C → D → E → ¨ ¨ move in this wise, also can remove photoresist film 70 and handle film 80.Under this kind situation, when the initial striping device head 93 that moves to position B from position A mobile, only carry out discharging diluent by solvent nozzle 95, remove photoresist film, move to later the moving of position D from position B, carry out simultaneously by solvent nozzle 95 discharge diluents with by optical fiber 81 irradiation ultraviolet rays, optical fiber 81 chases the discharge of diluent to remove the processing film 80 that exposes successively afterwards.In addition, under this situation, by driving mechanism 94 controls moving, by air cylinder 30 controls moving from position B to position C with from position D to position E from position A to position B with from position C to position D.
Utilize the removal of carrying out such photoresist film 70 simultaneously and the removal of handling film 80, shorten the processing time, can obtain the raising of productivity ratio.Moreover, under this situation, utilize to make striping device head 93 lower than the speed of common striping device head 93 along the speed that substrate perimeter portion moves, can remove photoresist film 70 exactly, in addition, also can remove exactly and handle film 80.
Below, with reference to Figure 14, another embodiment of the invention is described.Moreover among Figure 14, the device note prosign to identical with the structural element of Fig. 7 and Fig. 8 and Fig. 9 omits its explanation.
With reference to Figure 14, assembling is towards the washer jet 66 of the projection surface 81a ejection cleaning solution of optical fiber 81 on the lower head member 93b of striping device head 93.This washer jet 66 is connected with cleaning solution feed flow source 68 by cleaning solution feed pipe 67, therefore, just cleaning solution can be supplied to nozzle 66.In addition, as cleaning solution, use for example pure water etc.
Like this, even on the projection surface 81a of gas that when processing film 80 is removed in the irradiation ultraviolet ray, produces attached to optical fiber 81, it is dirty that projection surface 81a produces white, stain, also can be after the removal processing of for example handling film 80 be over, on the substrate of each substrate or each regulation number, to utilize by washer jet 66 to spray cleaning solution towards projection surface 81a, the white of removing this projection surface 81a is dirty.Therefore, can avoid situation about reducing because of the attachment of projection surface 81a from for example ultraviolet intensity of optical fiber 81 irradiation.
In addition, be used to the attraction of the attraction mouth 92 of setting on striping device head 93, the cleaning solution that splashes in the time of can will clean and the photoresist film of removal 70 and handle film 80 and discharges simultaneously from the gas of these processing film 80 generations are very big from the effect of the attraction of this attraction mouth 92.
Moreover washer jet 66 also can not necessarily be fixed on the striping device head 93, particularly, the fixture of other purposes such as fixedly trailing arm that do not illustrate among the figure etc. can be set also.
Figure 15 is the brief strabismus map that the edge striping device (ER) 48 that other execution mode relates to is shown.In the present embodiment, comprise the heater 75 of other interpolation in the edge striping device (ER) shown in Fig. 6.This heater 75 comprises: will make the frame parts 88 of hollow with the rectangular framework of the big or small roughly the same size of for example glass substrate G; Support the support sector 73 of this frame parts 88; Be used to make the motor 72 of frame parts 88 liftings.
Figure 16 is the profile of frame parts 88.Frame parts 88 comprises: the air supply opening 74 of the air supply source input gas that does not illustrate from figure; The gas heated chamber 76 of the gas of heating input; Be used for the puff prot 85 that processing film 80 on glass substrate G sprays the gas that has heated.In addition, as the device of heated air, for example in gas heated chamber 76, has nichrome wire 78.
In the present embodiment, identical with above-mentioned execution mode, at first, discharge diluents from solvent nozzle 95, after the photoresist film of not wanting of removing glass substrate G periphery, striping device head 93 leaves from glass substrate G, once decorporates.The operation of leaving from this glass substrate G of striping device head 93 as mentioned above, can be undertaken by 30 grades of the air cylinder shown in Figure 11.
Secondly, heater 75 utilizes motor 72 to descend from the top of substrate G, and G is approaching with glass substrate.Then, as shown in figure 17, from heater 75 warm wind of ejection or hot blasts, the processing film by the adhesion process generation of the periphery of heating cover glass substrate G.
Secondly, fully heated if handle film 80, heater 75 just utilizes motor 72 to rise, away from glass substrate G.Then, striping device head 93 is close to the assigned position of the periphery of glass substrate G again, the removal of the processing film 80 after the ultraviolet ray that utilization is penetrated from optical fiber 81 is heated.
Like this, utilize before carrying out ultraviolet irradiation heat treated film 80 in advance, can promote the effect of peeling off of the processing film 80 that undertaken by ultraviolet irradiation.
Figure 18 illustrates other execution modes of fiber section.For example bundling is provided with many optical fiber on cylinder part 82, forms the 82a of fenestra portion that is used to penetrate of optical fiber on the projection surface of this cylinder part 82.Identical or the rectangle below this of the width in the zone that is shown in broken lines 39 that the width that the 82a of this fenestra portion forms an one limit and the photoresist film reprocessing film of removing glass substrate G periphery expose.According to the shape of such 82a of fenestra portion, for example, because by 1 process of the only mobile substrate perimeter of striping device head portion, therefore, can remove the zone 39 that the processing film that produced by adhesion process exposes expeditiously.Therefore, also can realize the minimizing in processing time and the raising of productivity ratio.
Among Figure 19, optical fiber 81 is assembled on the lower head member 93b of striping device head 93, and its projection surface 81a is disposed towards upper head member 93a.Under this situation, therefore substrate G can make the back side Ga transmission of ultraviolet ray from glass substrate G by this optical fiber 81 owing to be glass substrate, and irradiation is on the processing film 80 that forms on the surface of substrate G.Therefore, can prevent from make the projection surface 81a of optical fiber 81 produce the bad influence of white dirt etc. to for example handling gas that film 80 irradiation when ultraviolet ray produce.
The invention is not restricted to the execution mode of above explanation, can be various distortion.
For example, in the respective embodiments described above,, enumerate optical fiber 81, remove it to this processing film ozone supply water but for example also can utilize as an example as the device of removing the processing film that produces by adhesion process.
In addition, among above-mentioned Figure 15～Figure 17, as the method for heat treated film, can use warm wind or hot blast, but be not limited thereto, for example also can utilizing, infrared ray etc. heats.
In addition, a limit that is used to remove moving of the optical fiber 81 of handling film 80 and is not substrate G also can be 1 process that only moves back and forth.In addition, if it is pre-set to be used to remove the mobile number of times of striping device head 93 of photoresist film, then optical fiber 81 is configured in the rear side that striping device head 93 moves to the direct of travel of the removal that is used for photoresist film at last for solvent nozzle 95, also can be last when mobile at this of striping device head 93, simultaneously by optical fiber 81 irradiation ultraviolet rays.Therefore, can further reduce the processing time, boost productivity.
In the respective embodiments described above, preferably the light wavelength of optical fiber 81 is bigger than 250nm.Make wavelength ratio 250nm big, can prevent resist exposure.
In the above-mentioned execution mode, when removing photoresist film 70 and remove two kinds of gases when handling film 80 and carry out from the exhaust that attracts mouthfuls 92.But, also can only remove the exhaust when handling film 80, only discharge the HMDS gas that produces.
In addition, when removing photoresist film 70 and remove two kinds of gases when handling film 80 and carry out under the situation that attracts mouthfuls 92 exhaust, the increase that also can make the air displacement of removing the gas when handling film 80 when removing photoresist film 70.
In the respective embodiments described above, also can in handling space S, near the lens section that does not illustrate among the figure of this scavenge oil pump sun press polish fibre 81, be recovered in the gas of removing generation when handling film 80 attracting to set up scavenge oil pump on the mouth 92.Also the scavenge oil pump under this situation can be configured in these lens near.
Figure 20 and Figure 21 illustrate the striping device head that other execution mode relates to.
The a plurality of optical fiber 81 of assembling on the striping device head 93 shown in Figure 20.In the present embodiment, install for example 3 optical fiber 81 obliquely side by side between directions X in the drawings and Y direction, also can be installed on the directions X side by side.Symbol 95 is solvent nozzle.According to such structure, utilize the moving of 1 process of striping device head 93, handle film 80 exposed portions serve and all receive light from a plurality of optical fiber 81.Therefore, when removing processing film 80 more accurately, can boost productivity.
Assemble solvent nozzle 95 respectively on upper head member 93a in the striping device head 93 shown in Figure 21 and the lower head member 93b.Utilize and to press from both sides substrate G assembling solvent nozzle 95 in this wise, can not only be in the surface of substrate G one side, and can change and advance the photoresist film 70 that the back side one side removal is adhered to.In this execution mode, also can on more holding member 93, assemble 2 solvent nozzle 95 than it, in addition, because lacking of photoresist film specific surface one side that should remove of substrate back one side, therefore, the quantity that is assemblied in the optical fiber 81 on the lower head member 93b is lacked than the quantity that is assemblied on the upper head member 93a.
As described above,, machine white dirts such as the exposure lens of exposure device and speculum etc. can be prevented to make, bad influence can be prevented exposure device according to the present invention.
Claims (24)
1. a lining processor is characterized in that, comprising:
To having formed the substrate perimeter portion discharge solvent of handling film and being coated in the substrate of the coat film on this processing film, remove the coat film removal device of the coat film of this periphery;
The processing film removal device of the above-mentioned processing film that removal is exposed in the removed substrate perimeter of above-mentioned coat film portion.
2. lining processor as claimed in claim 1 is characterized in that, above-mentioned processing film is formed by adhesion process.
3. lining processor as claimed in claim 1 is characterized in that, above-mentioned processing film removal device comprises the device of light that comprises the exposure light wavelength composition of the above-mentioned coat film that is used to expose to the above-mentioned processing film irradiation that exposes.
4. lining processor as claimed in claim 3 is characterized in that, above-mentioned coat film removal device comprises:
The holding member that keeps the solvent nozzle of the above-mentioned solvent of discharge;
Make above-mentioned holding member along the perisphere travel mechanism that the periphery of substrate moves,
On one side above-mentioned holding member is moved, Yi Bian discharge above-mentioned solvent by above-mentioned perisphere travel mechanism.
5. lining processor as claimed in claim 4 is characterized in that,
On above-mentioned holding member, assemble above-mentioned solvent nozzle integratedly, comprise the optical fiber of the above-mentioned light of irradiation,
Above-mentioned processing film removal device moves above-mentioned holding member by above-mentioned perisphere travel mechanism on one side, on one side exposure light.
6. lining processor as claimed in claim 5 is characterized in that, the moving direction almost parallel ground configuration of above-mentioned optical fiber and solvent nozzle and above-mentioned holding member.
7. lining processor as claimed in claim 6 is characterized in that, also comprises:
Make above-mentioned holding member with the direction of above-mentioned moving direction quadrature on the orthogonal direction travel mechanism that moves;
After the coat film of having removed above-mentioned periphery, by above-mentioned orthogonal direction mechanism above-mentioned holding member is moved, remove the device of the processing film of this periphery.
8. lining processor as claimed in claim 5 is characterized in that, above-mentioned optical fiber is configured in than above-mentioned solvent nozzle more on the position in the outside of substrate.
9. lining processor as claimed in claim 8 is characterized in that,
Also comprise make above-mentioned holding member with the direction of above-mentioned moving direction quadrature on the orthogonal direction travel mechanism that moves,
Utilize above-mentioned perisphere travel mechanism and orthogonal direction travel mechanism that holding member is alternately moved, in the coat film of removing above-mentioned periphery, remove the processing film that exposes successively.
10. lining processor as claimed in claim 5 is characterized in that, also comprises towards the washer jet of the projection surface ejection cleaning solution of above-mentioned optical fiber.
11. lining processor as claimed in claim 10 is characterized in that, above-mentioned washer jet is assemblied on the above-mentioned holding member.
12. lining processor as claimed in claim 5 is characterized in that, also is included in to discharge from the device of the gas of this processings film generation when removing above-mentioned processing film.
13. lining processor as claimed in claim 12 is characterized in that, above-mentioned exhaust apparatus comprises the device that makes by the optical fiber projection surface drying after the above-mentioned washer jet cleaning.
14. lining processor as claimed in claim 5 is characterized in that, above-mentioned optical fiber projection surface formation has the length on a limit and the roughly the same rectangle of width of the above-mentioned processing film that exposes.
15. lining processor as claimed in claim 5 is characterized in that, carries out photoirradiation by above-mentioned optical fiber from the back side one side of the substrate surface that applied above-mentioned coat film.
16. lining processor as claimed in claim 1 is characterized in that, also comprises the device of the processing film of the above-mentioned substrate perimeter of heating portion.
17. lining processor as claimed in claim 1 is characterized in that, above-mentioned processing film removal device comprises the device to the above-mentioned processing film ozone supply water that exposes.
18. lining processor as claimed in claim 5 is characterized in that, above-mentioned optical fiber is a plurality of to be installed on the direction different with the moving direction of the above-mentioned holding member that utilizes perisphere travel mechanism side by side.
19. lining processor as claimed in claim 5 is characterized in that, in the above-mentioned solvent nozzle of folder substrate ground assembling more than 2 on the holding member.
20. a Method of processing a substrate is characterized in that, comprises following operation:
To having formed the substrate perimeter portion discharge solvent of handling film and being coated in the substrate of the coat film on this processing film, remove the operation of the coat film of this periphery;
The operation of the above-mentioned processing film that removal is exposed in the removed substrate perimeter of above-mentioned coat film portion.
21. Method of processing a substrate as claimed in claim 20 is characterized in that, above-mentioned processing film is formed by adhesion process.
22. Method of processing a substrate as claimed in claim 20 is characterized in that, the removal operation of above-mentioned processing film was carried out before the exposure-processed of substrate.
23. Method of processing a substrate as claimed in claim 20 is characterized in that, the removal operation of above-mentioned processing film comprises the operation that comprises the light of the exposure light wavelength composition in the above-mentioned exposure-processed to the above-mentioned processing film irradiation that exposes.
24. Method of processing a substrate as claimed in claim 20 is characterized in that, also is included in to discharge from the operation of the gas of this processings film generation when removing above-mentioned processing film.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13236/2002 | 2002-01-22 | ||
| JP13236/02 | 2002-01-22 | ||
| JP2002013236A JP3959612B2 (en) | 2002-01-22 | 2002-01-22 | Substrate processing apparatus and substrate processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1434481A true CN1434481A (en) | 2003-08-06 |
| CN1279580C CN1279580C (en) | 2006-10-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031064868A Expired - Fee Related CN1279580C (en) | 2002-01-22 | 2003-01-22 | Substrate treating device and method thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3959612B2 (en) |
| KR (1) | KR100917728B1 (en) |
| CN (1) | CN1279580C (en) |
| TW (1) | TWI254193B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4481698B2 (en) | 2004-03-29 | 2010-06-16 | キヤノン株式会社 | Processing equipment |
| JP4994074B2 (en) * | 2006-04-20 | 2012-08-08 | 東京エレクトロン株式会社 | Substrate cleaning apparatus, substrate cleaning method, substrate processing apparatus |
| JP4983565B2 (en) * | 2006-12-20 | 2012-07-25 | 東京エレクトロン株式会社 | Substrate cleaning apparatus, substrate cleaning method, and storage medium |
| CN101230466B (en) * | 2007-01-24 | 2010-09-01 | 沈阳工业大学 | Degumming liquid |
| JP6418932B2 (en) * | 2014-12-15 | 2018-11-07 | 東京応化工業株式会社 | Ultraviolet irradiation apparatus, ultraviolet irradiation method, substrate processing apparatus, and manufacturing method of substrate processing apparatus |
| KR102156895B1 (en) * | 2018-11-06 | 2020-09-17 | 세메스 주식회사 | Apparatus for treating substrate |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100264006B1 (en) | 1993-11-29 | 2000-08-16 | 이형도 | Manufacturing method for high-temperature superconductor josephson device |
| TW394980B (en) * | 1998-02-05 | 2000-06-21 | Samsung Electronics Co Ltd | Semiconductor device fabrication system and method of forming semiconductor device pattern using the same |
| JP3752420B2 (en) | 1999-11-11 | 2006-03-08 | 東京エレクトロン株式会社 | Thin film removal equipment |
| JP2001297962A (en) | 2000-04-12 | 2001-10-26 | Toppan Printing Co Ltd | Device for removing residue on substrate outer edge |
-
2002
- 2002-01-22 JP JP2002013236A patent/JP3959612B2/en not_active Expired - Fee Related
-
2003
- 2003-01-13 TW TW092100629A patent/TWI254193B/en not_active IP Right Cessation
- 2003-01-21 KR KR1020030003925A patent/KR100917728B1/en not_active IP Right Cessation
- 2003-01-22 CN CNB031064868A patent/CN1279580C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP3959612B2 (en) | 2007-08-15 |
| CN1279580C (en) | 2006-10-11 |
| JP2003218007A (en) | 2003-07-31 |
| KR100917728B1 (en) | 2009-09-15 |
| KR20030063219A (en) | 2003-07-28 |
| TW200302404A (en) | 2003-08-01 |
| TWI254193B (en) | 2006-05-01 |
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