KR100902849B1 - Method of manufacturing conductive ball arranging mask - Google Patents

Abstract

A method for manufacturing a mask for arranging a conductive ball is provided to set a body unit in a base stably by forming a leg part of a body unit with the same thickness. A mask for arranging a conductive ball includes a body unit(20) with a planar shape and a leg forming layer(30). The body unit has a penetrating hole(23) for receiving a plurality of conductive balls. An opening(32) with a planar shape corresponding to a penetrating hole is formed in the penetrating hole for receiving the conductive ball. The leg forming layer is arranged in a side of a base of the body unit and is made of the copolymer of the vinyl acetate and vinyl alcohol.

Description

Mask manufacturing method for conductive ball placement {METHOD OF MANUFACTURING CONDUCTIVE BALL ARRANGING MASK}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mask manufacturing method for arranging conductive balls at a predetermined position of a base such as a semiconductor wafer or a package substrate.

In order to connect various electronic components (connection terminals thereof) to a plurality of electrodes provided on a base such as a semiconductor wafer or a package substrate, the following is performed, for example.

Solder balls (fine balls formed by solder) are respectively disposed with respect to the plurality of electrodes provided on the base, and the entirety of the base on which the solder balls (conductive balls) are placed is heated to melt each of the solder balls, thereby cooling them. By solidification, each solder ball is adhere | attached with respect to each electrode of a base.

Thus, the solder (solder ball) becomes a connection terminal in each electrode.

And various electronic components (connection terminals) are connected with each connection terminal.

As mentioned above, in order to arrange | position a solder ball with respect to each electrode of a base as part of the process at the time of forming a connection terminal with respect to each electrode of a base, it is a mask (solder ball arrangement | positioning) like patent document 1, for example. Mask) is used.

The mask has a flat plate shape and has a plurality of through holes (solder ball accommodating through holes). Each through hole is formed corresponding to each electrode provided in the base (substrate).

Then, the mask is set (superimposed) with respect to the base, and a plurality of solder balls are supplied on the mask, and the solder balls are accommodated in each through hole.

In this way, a solder ball is disposed for each electrode.

Flux (having adhesiveness) is attached to each electrode previously. Then, as described above, the solder balls are disposed on the electrodes, and the flux balls are temporarily bonded to the electrodes by the flux.

Subsequently, the mask is removed and the solder balls are heated together with the base by warm air. As a result, the solder balls are dissolved.

Thereafter, the solder (solder ball) is cooled together with the base to solidify the solder (solder ball).

As described above, the solder (solder ball) becomes a connection terminal in the electrode.

By the way, as mentioned above, when a mask is set with respect to a base, it is preferable that there exists a clearance gap between a base and a mask (preferably the main part in which the solder ball receiving through-hole was formed). In other words, it is preferable that the mask slightly float from the base. The reason for this is as follows.

BACKGROUND ART Electronic devices using semiconductors and the like have been increasingly miniaturized and densified in recent years to further shorten the distance between electrodes provided on the base.

This is because when the mask is set to the base and the mask is slightly shifted from the original position, the flux (having adhesiveness) previously attached to the electrode may adhere to the mask. In that case, various damages, such as a mask which cannot be set in a predetermined position or a through-hole become clogged, generate | occur | produce.

Accordingly, the leg may be provided in the mask. That is, the leg part is provided in a mask (parts other than the main part in which the solder ball receiving hole is formed), and the leg part (lower end part) is made to contact a base.

Conventionally, the leg part is formed as follows, for example.

As a 1st method, there exists a method in which the part which etched turns into a main body part by etching to the part which does not form a leg part in a metal mask, and a leg part is formed in the part which is not etched.

However, in this method, the thickness of the main body is not uniform, and furthermore, the precision of the size of the hole becomes poor when forming the hole by the laser.

As a 2nd method, there exists a method of adhering the leg part of synthetic resin or a metal with respect to the mask (main body part) which consists of metals.

However, this method has the following drawbacks.

As mentioned above, when flux adheres to the leg portion, it is necessary to remove it with an organic solvent. However, in the case where the leg portion is a synthetic resin, the leg portion is generally damaged by the organic solvent. In this way, the life of the leg portion is shortened and it cannot be used for a long time even as a mask for conductive ball placement.

On the other hand, in the case where the leg part is a metal, it is avoided that the leg part itself is damaged by an organic solvent, but when the leg part of the metal is adhered to the main body part by an adhesive (fixed through the adhesive layer), the adhesive layer This damages and further causes problems in the leg. When the leg portion is provided by welding with respect to the body portion, there is a fear that the precision of the body portion or the like deteriorates due to the high temperature at the time of welding.

And the thickness (height) of all the leg parts formed in the main body part needs to be the same.

This is because, if the thickness (height) of the leg portions is not the same, firstly, the main body portion (mask for conductive ball placement) is generally not set to the base stably.

[Patent Document 1] Japanese Unexamined Patent Publication No. 2004-327536

SUMMARY OF THE INVENTION An object of the present invention is to provide a mask for conductive ball placement and a method of manufacturing the same, which can be easily formed with appropriate and equal thickness (height) and can be used for a long time.

In order to solve the said subject, 1st invention is a mask which has an electroconductive ball accommodating through-hole, and a conductive ball is accommodated in the said electroconductive ball accommodating through-hole in the state superimposed with respect to a base, and the said electroconductive ball is arrange | positioned in the predetermined position of the said base. And a main body portion having a flat plate shape and having the plurality of conductive ball receiving through holes, and a through hole corresponding opening having a flat plate shape and corresponding to the conductive ball receiving through hole of the main body portion, wherein It has a leg part layer arrange | positioned at the side of a base, and this leg part layer is a mask for electroconductive ball arrangement | positioning formed with the synthetic resin which has a polymer of vinyl acetate as a main component.

In the mask for electroconductive ball arrangement of this invention, since the leg part forming layer (leg part) is formed by the synthetic resin which has the polymer of vinyl acetate as a main component, the following effect is acquired.

That is, when flux adheres to a leg part, it is necessary to remove it with the organic solvent, but since the leg part is the resin mentioned above, it is high in tolerance to an organic solvent. Accordingly, the leg portion is not damaged or hardly damaged by the organic solvent.

Thereby, the mask for conductive ball placement of the present invention can be used for a long time.

The second invention has a conductive ball accommodating through hole, and the conductive ball is accommodated in the conductive ball accommodating through hole in a state of being superimposed with respect to the base. A main body portion having the plurality of conductive ball receiving through holes, and a through hole corresponding opening corresponding to the conductive ball receiving through hole of the main body portion, having a flat plate shape, and disposed on the side of the base among the main body portions. It has a leg forming layer and the said leg forming layer is a mask for electroconductive ball arrangement | positioning formed from the synthetic resin which has a copolymer of vinyl acetate and a vinyl alcohol as a main component.

As a particularly preferable example of the "synthetic resin mainly containing a copolymer of vinyl acetate and vinyl alcohol", there are those in which the mass ratio of the vinyl acetate resin component and the vinyl alcohol resin component is 20:15 to 25:10.

This also applies to the fourth invention.

In the mask for conductive ball placement according to the present invention, since the leg forming layer (leg) is made of a synthetic resin mainly composed of a copolymer of vinyl acetate and vinyl alcohol, the following effect is obtained.

That is, when flux adheres to a leg part, it is necessary to remove it with the organic solvent, but since the leg part is the resin mentioned above, it is high in tolerance to an organic solvent. Accordingly, the leg portion is not damaged or hardly damaged by the organic solvent.

Thereby, the mask for conductive ball placement of the present invention can be used for a long time.

According to a third aspect of the present invention, in the leg portion formed in the flat body portion, the conductive ball is superposed on the base, and the conductive balls are accommodated in the plurality of conductive ball receiving through-holes formed in the main body portion so that the conductive balls are disposed at a predetermined position of the base. A method of manufacturing a mask for conductive ball placement, comprising: a photocurable resin material coating step of applying a photocurable resin material cured by receiving light to the body portion to form a photocurable resin layer on the body portion, and the legs A portion corresponding to the portion is a light transmitting portion that allows light to be transmitted, and a photomask in which a portion other than that is a light transmission blocking portion that blocks light is disposed with respect to the photocurable resin material layer to form a photomask arrangement. An arranging step and irradiating light to the photomask arrangement from the side of the photomask; A photoirradiation step of curing a portion corresponding to the light transmitting portion of the photocurable resin material layer, a photomask removal step of removing the photomask from the photomask arrangement to form a photomask remover, and the photomask It has a photocurable resin material layer uncured part removal step which removes an uncured part of the said photocurable resin material layer in a remover, The said photocurable resin material contains (poly) vinyl acetate as a main component, and receives acetic acid by receiving light. It is a mask manufacturing method for electroconductive ball placement which becomes the cured resin body which has a polymer of vinyl as a main component.

Here, "light" is not limited to visible light, but is a concept that includes ultraviolet rays and the like. This also applies to the fourth invention.

As a particularly preferable example of the "photocurable resin material containing (poly) vinyl acetate as a main component", the mass ratio of water and the (poly) vinyl acetate resin component is 60: 40-65: 35.

In the mask manufacturing method for conductive ball placement of this invention, the mask for conductive ball placement is manufactured as follows.

In the photocurable resin material applying step, the photocurable resin material which is cured by receiving light is applied to the main body portion, so that the photocurable resin material layer is formed on the main body portion.

Here, the photocurable resin material contains (poly) vinyl acetate as a main component and becomes a cured resin body containing a polymer of vinyl acetate as a main component by receiving light.

In the photomask arrangement step, a portion corresponding to the leg portion is a light transmitting portion that allows light transmission, and a photomask, which is a light transmission blocking portion for blocking other light transmission, is disposed with respect to the photocurable resin material layer. Sieve is formed.

In the light irradiation step, light is irradiated to the photomask arrangement from the photomask side, and a portion of the photocurable resin material layer corresponding to the light transmitting portion is cured. That is, it becomes the cured resin body which has a polymer of vinyl acetate as a main component.

In the photomask removing step, the photomask is removed from the photomask arrangement to form a photomask remover.

In the photocurable resin material layer uncured part removal step, the uncured part of the photocurable resin material layer in the photomask removal body is removed.

Thereby, the mask for electroconductive ball arrangement of 1st invention is manufactured easily.

According to a fourth aspect of the present invention, a conductive ball is stacked in a leg portion formed in a flat body portion, and the conductive ball is accommodated in a plurality of conductive ball receiving through-holes formed in the body portion, so that the conductive ball is disposed at a predetermined position of the base. A method of manufacturing a mask for conductive ball placement, comprising: a photocurable resin material coating step of applying a photocurable resin material cured by receiving light to the body portion to form a photocurable resin layer on the body portion, and the legs The part corresponding to the part is a light transmitting part which allows light transmission, and the other part is a photomask which arrange | positions the photomask which is the light transmission blocking part which blocks light transmission with respect to the said photocurable resin material layer, and forms a photomask arrangement | guide_body. An arranging step and irradiating light to the photomask arrangement from the side of the photomask; A photoirradiation step of curing a portion corresponding to the light transmitting portion of the photocurable resin material layer, a photomask removal step of removing the photomask from the photomask arrangement to form a photomask remover, and the photomask The photocurable resin material layer uncured part removal step which removes an uncured part of the said photocurable resin material layer in a remover, The said photocurable resin material contains (poly) vinyl acetate and (poly) vinyl alcohol as a main component It is a mask manufacturing method for electroconductive ball arrangement | positioning which becomes a cured resin body which has a copolymer of vinyl acetate and a vinyl alcohol as a main component by receiving light.

As a particularly preferred example of "a photocurable resin material containing (poly) vinyl acetate and (poly) vinyl alcohol as a main component", the mass ratio of water and the (poly) vinyl acetate resin component and (poly) vinyl alcohol is 60:40 to 65 There is something like: 35.

In the mask manufacturing method for conductive ball placement of this invention, the mask for conductive ball placement is manufactured as follows.

In the photocurable resin material applying step, the photocurable resin material which is cured by receiving light is applied to the main body portion, so that the photocurable resin material layer is formed on the main body portion.

Here, the photocurable resin material contains (poly) vinyl acetate and (poly) vinyl alcohol as a main component, and becomes a cured resin body mainly containing a copolymer of vinyl acetate and vinyl alcohol by receiving light,

In the photomask arrangement step, a portion corresponding to the leg portion is a light transmitting portion that allows light transmission, and a photomask, which is a light transmission blocking portion for blocking other light transmission, is disposed with respect to the photocurable resin material layer. Sieve is formed.

In the light irradiation step, light is irradiated to the photomask arrangement on the side of the photomask to harden a portion corresponding to the light transmitting portion in the photocurable resin material layer. That is, it becomes a cured resin body which has a copolymer of vinyl acetate and a vinyl alcohol as a main component.

In the photomask removing step, the photomask is removed from the photomask arrangement to form a photomask remover.

In the photocurable resin material layer uncured part removal step, the uncured part of the photocurable resin material layer in the photomask removal body is removed.

Thereby, the mask for electroconductive ball arrangement of 2nd invention is manufactured easily.

The fifth invention is a method for manufacturing the conductive ball placement mask of the third or fourth invention, wherein the photocurable resin material applying step is disposed on an upper surface which is a surface on which the photocurable resin material layer is disposed in the main body portion and spaced apart from each other in parallel. The photocurable resin material having fluidity is supplied between a pair of application guides extending in length and having the same height along the longitudinal direction, and a uniforming tool disposed between the upper surfaces of the both application guides is provided in the longitudinal direction of the both application guides. The photocurable resin material is a mask manufacturing method for conductive balls arrangement | positioning which is apply | coated to the said main-body part by uniform thickness by moving along.

In the method for manufacturing a mask for conductive ball placement according to the present invention, in addition to the effects for the method for manufacturing a mask for conductive ball placement according to the third or fourth invention, the following effects are obtained.

That is, in the photocurable resin material applying step, it is arranged on the upper surface (the surface where the photocurable resin material layer is arranged) among the main body portions, and is spaced apart from each other and extends in parallel to each other between a pair of coating guides having the same height along the longitudinal direction. The photocurable resin material which has fluidity is supplied, and the equalization tool arrange | positioned between the upper surface of both application guides is moved along the longitudinal direction of both application guides. As a result, the photocurable resin material is applied to the body portion with a uniform thickness, so that the photocurable resin material layer is formed with a uniform thickness.

Thereby, in the manufacturing method of the mask for electroconductive ball arrangement of this invention, the height of a leg part becomes uniform.

Next, 1st Embodiment of this invention is described based on drawing.

As shown in Fig. 1, this conductive ball placement mask is used for a base assembly 100, such as a semiconductor wafer and a package substrate. The base assembly 100 is finally divided into a plurality of bases 102. A plurality of electrodes 103 are provided in the base assembly 100 (parts of which are divided into respective bases 102).

As shown in Figs. 1 to 3, the mask for placing the conductive balls is formed by fixing the main body 20 and the leg forming layer 30 to the screen 10. This conductive ball arrangement mask is generally flat.

The screen 10 has a one-sided mesh of synthetic resin or metal. The screen 10 is attached to the frame 12 of the square shape.

The screen 10 is attached to the frame 12 in its two-dimensional, bidirectionally tensioned state. Accordingly, the screen 10 has a predetermined tension in both directions of the two-dimensional.

An opening (main unit corresponding opening 15) is formed in the screen 10.

The main body 20 has a flat plate made of metal.

The main body 20 is fixed to the screen 10. The main body 20 is adhered to the screen 10 by an adhesive in its peripheral portion. That is, the main body 20 is adhered to the screen 10 through the adhesive layer 28 in the peripheral portion thereof.

The opening part 15 (described above) corresponding to the main body part of the screen 10 is formed inside the main body part 20 (inside of the adhesive layer 28).

A plurality of conductive ball receiving through-hole assemblies 22 are formed in the main body 20. In this embodiment, four conductive ball accommodating through-hole assemblies 22 are formed.

Each conductive ball accommodating through-hole assembly 22 corresponds to each base 102 (parts divided into the bases 102 as described above) in the base assembly 100 (FIG. 1).

Each conductive ball accommodating through-hole assembly 22 is provided with a plurality of conductive ball accommodating through holes 23. Each conductive ball receiving through hole 23 corresponds to each electrode 103 in a portion corresponding to each base 102 in the base assembly 100 (FIG. 1).

The leg formation layer 30 has the flat plate shape which consists of synthetic resin which has a copolymer of vinyl acetate and a vinyl alcohol as a main component. Moreover, as another embodiment, it may consist of synthetic resin which has a polymer of vinyl acetate as a main component.

In any case, the leg forming layer 30 has a resistance to organic solvents due to its material. That is, it is of the material which is not damaged (or hard to damage) even if the organic solvent adheres. These are described in detail later.

The leg forming layer 30 is adhered to the main body 20.

The leg forming layer 30 has a flat plate shape slightly smaller than the main body portion 20, or a flat plate shape having substantially the same size as the main body portion 20 (the case where the size is almost the same in each angle is shown). .

A plurality of openings (opening holes corresponding openings 32) are formed in the leg forming layer 30. Each through hole corresponding opening 32 is formed corresponding to each of the conductive ball receiving through-hole assemblies 22 of the main body 20. Each of the through hole corresponding openings 32 is formed larger than each of the conductive ball receiving through hole assemblies 22.

As a result, portions of the leg forming layer 30 other than the through hole corresponding openings 32 become the leg portions 31 in the main body portion 20 (the mask for conductive ball placement).

Next, the manufacturing method of this mask for electroconductive ball placement is demonstrated based on FIG. 4 and FIG.

As shown in Fig. 4A, first, the screen 10 and the main body 20 are prepared, and the main body 20 is adhered to the screen 10 by an adhesive (adhesive layer 28). (Fixed)

Initially, the main body part corresponding opening part 15 (refer FIG. 3 etc.) is not formed in the screen 10. FIG. The screen 10 is attached to the frame 12 in its two-dimensional, bidirectionally tensioned state. Accordingly, the screen 10 has a predetermined tension in both directions of the two-dimensional.

Subsequently, as shown in FIG. 4A, a main body portion corresponding opening 15 is formed in the screen 10. That is, the part of the screen 10 corresponding to the inner side (exactly the inner side of the adhesive bond layer 28) of the main body part 20 is removed, and the main body part corresponding opening part 15 is formed in that part (FIG. 1). See also).

As a result, tension is generated in the main body 20 in both directions in two dimensions, and the main body 20 is in one plane.

In addition, the main body 20 may be formed with a conductive ball receiving through-hole 23 (conductive ball receiving through-hole assembly 22) in advance, and the main body 20 is attached to the screen 10 and the screen The conductive ball accommodating through hole 23 (conductive ball accommodating through-hole assembly 22) may be formed in the body part 20 after the main body part corresponding opening part 15 is formed in 10.

In addition, after the main body portion 20 is attached to the screen 10 and the main body portion corresponding opening portion 15 is formed in the screen 10, the conductive ball accommodation through-hole 23 (conductive ball) is formed in the main body portion 20. The main body 20 is attached to the screen 10, and the main body portion 20 is formed after the main body portion corresponding opening 15 is formed in the screen 10. FIG. The conductive ball receiving through-hole 23 (conductive ball receiving through-hole assembly 22) may be formed in the main body 20 before the leg forming layer 30 is formed. The conductive ball is accommodated in the main body 20 after being attached to the screen 10 and after the body portion corresponding opening 15 is formed in the screen 10 and the leg forming layer 30 is formed for the main body 20. The through hole 23 (conductive ball receiving through hole assembly 22) may be formed.

Subsequently, in the steps of Figs. 4A to 4E, the main body portion 20 (with the screen 10) and the various layers disposed thereon have a conductivity after completion (in use). It is in a state inverted up and down with the ball arrangement mask (FIGS. 1-3, 4F).

Subsequently, as shown in FIG. 4 (b), the photocurable resin material 45 in a state (paste form) having fluidity is applied to the upper surface (lower surface in use) of the main body 20 as follows. The photocurable resin material layer 40 is formed by drying it. This step is a photocurable resin material application step.

The photocurable resin material 45 contains water, (poly) vinyl acetate, and (poly) vinyl alcohol as a main component, and also contains the photosensitizer. Thereby, it has the property of copolymerizing and hardening | curing (namely, becoming a resin hardened | cured material) by irradiation with light (in this case, an ultraviolet-ray).

In a photocurable resin material 45, 60-65: 20-25: 10-15 are preferable examples of the component mix (mass) of water, a (poly) vinyl acetate, and a (poly) vinyl alcohol.

Moreover, as another embodiment, there exist also embodiment in which the photocurable resin material 45 contains water and a (poly) vinyl acetate as a main component, and also contains the photosensitizer. Also in this embodiment, it has the property of superposing | polymerizing and hardening | curing (namely, becoming a resin hardened | cured material) by receiving light (in this case, an ultraviolet-ray).

In this embodiment, as a preferable example of the component mix (mass) of water and a (poly) vinyl acetate in the photocurable resin material 45, there are 60-65: 35-40.

As shown in FIG. 5, a pair of application guides 48 and a homogenizing tool 49 are used for the application of the photocurable resin material 45.

Each application guide 48 has a large plate shape. Each application guide 48 is arranged in the vicinity of a pair of sides of the rectangular or square body portion 20 facing each other. Each application guide 48 is arranged in parallel so as to follow the edge part.

Both application guides 48 have the same height along the longitudinal direction. That is, each application guide 48 has the same height in any length position, and it is the same height in both application guides 48.

The homogenizing tool 49 has a rod shape having a length equal to or greater than the distance between the two application guides 48. The cross-sectional shape may be circular or rectangular.

The photocurable resin material 45 of the state which has fluidity | liquidity is supplied to the part between the both application guides 48 in the upper surface of the main-body part 20. As shown in FIG.

Then, the uniforming tool 49 is disposed between the upper surfaces of both the coating guides 48, and the uniforming tool 49 moves along the length direction from one end of the two coating guides 48 to the other end [ The photocurable resin material 45 is made uniform by sliding with respect to both the coating guides 48. That is, the photocurable resin material 45 is apply | coated to an equal thickness.

As a result, as shown in FIG. 4B, the photocurable resin material layer 40 having a uniform thickness is formed on the upper surface of the main body 20.

In addition, as described above, a sheet material (not shown) is temporarily attached to the lower surface of the main body 20 at any timing before the photocurable resin 45 is applied to the upper surface of the main body 20. [The sheet material is removed from the main body 20 at any timing after the photocurable resin material layer 40 is formed and before the photomask removing body is immersed in water, as described later.]

As a result, there is no place for the air from the conductive ball receiving through hole 23 to escape, and the photocurable resin material 45 is prevented from entering into the conductive ball receiving through hole 23. Further, even when the photocurable resin material 45 temporarily enters the conductive ball receiving through hole 23, as described later, the photocurable resin material 45 in the step where the photomask remover is immersed in water. Is removed.

Subsequently, as shown in FIG.4 (c), the photomask 50 is arrange | positioned on the photocurable resin material layer 40, and the photomask 50 disposition body (symbol abbreviation) is formed. This step is a step of arranging the photomask 50.

The photomask 50 is placed on the photocurable resin material layer 40 by laying it so as to be disposed between the top surfaces of both application guides 48 (FIG. 5).

As shown in Figs. 4 (c) to 4 (f), the leg portions 31 (Fig. 4 (f)) of the leg forming layer 30 in the photomask 50 (Fig. 4 (c)) are shown. The corresponding part is the light transmission part 51, and the other part is the light transmission blocking part 52. FIG. The light transmitting portion 51 allows the transmission of light (ultraviolet rays). The light transmission blocking unit 52 blocks transmission of light (ultraviolet rays).

In addition, a plurality of positioning marks (not shown) are provided at positions corresponding to each other among the main body 20 and the photomask 50, and the photomask 50 is arranged so that the positioning marks coincide with each other. Is disposed on the photocurable resin material layer 40.

Subsequently, as shown in FIG. 4C, light is irradiated from the side of the photomask 50 with respect to the photomask arrangement. This step is a light irradiation step.

As a result, light passes through the light transmitting portion 51 of the photomask 50, and light reaches a portion of the photocurable resin material layer 40 that corresponds to the light transmitting portion 51, as shown in FIG. 4 (d). As shown, the part is hardened and firmly fixed to the main body 20. Thus, the leg portion 31 is formed.

On the other hand, light does not reach the part of the photocurable resin material layer 40 corresponding to the light transmissive part 52, and the part is not hardened. This is called the uncured portion 42.

Subsequently, as shown in FIG. 4E, the photomask 50 is separated (removed) from the above-described photomask arrangement [FIG. 4D), and the main body portion 20 and the photocurable resin material layer A photomask remover (not shown) of 40 (leg portion 31 and uncured portion 42) is formed (Fig. 4 (e)). This step is a photomask removal step.

Subsequently, the photomask remover (FIG. 4E) is immersed in water.

Thereby, as shown in FIG.4 (f), the uncured part 42 of the photocurable resin material layer 40 is melt | dissolved, and the through hole corresponding opening part 32 is formed. This step is a step of removing the uncured portion of the photocurable resin material layer.

As a result, the leg forming layer 30 is formed.

The mask for electroconductive ball arrangement mentioned above is manufactured as mentioned above.

In addition, after the leg forming layer 30 is formed for the main body 20, the main body 20 may be attached to the screen 10, and the main body portion corresponding opening 15 may be formed in the screen 10.

Also at this time, even if the conductive ball receiving through hole 23 (conductive ball receiving through-hole assembly 22) is formed in the main body 20 before the leg forming layer 30 is formed in the main body 20. The conductive ball receiving through hole 23 (conductive ball receiving through hole assembly 22) may be formed in the main body 20 after the leg forming layer 30 is formed for the main body 20.

Next, the method of using this mask for electroconductive ball placement is demonstrated.

As shown in FIG. 1 and FIG. 2, this conductive ball arrangement mask is arranged and set in the leg portion 31 (FIG. 2) with respect to the base assembly 100 (base 102).

Accordingly, in the state where the mask for conductive ball placement is superimposed with respect to the base assembly 100 (base 102), the main part of the mask for conductive ball placement (that is, conductive ball accommodation through-hole assembly 22) is set. Where the portion is formed is not in contact with the base assembly 100 (base 102), and a gap is generated between them.

In this state, a plurality of solder balls B (conductive balls) are supplied to the upper surface of the mask for placing conductive balls. Then, the solder balls B are moved by a brush, a squeegee, or the like, so that the solder balls B are accommodated in the conductive ball receiving through-holes 23 to each electrode 103 provided in the base 102. The solder ball B is disposed. Flux (having adhesiveness) is affixed previously to each electrode 103, and the solder ball B is temporarily adhere | attached with respect to the electrode 103 by the flux.

Thereafter, the mask for placing the conductive balls is removed from the base assembly 100 (base 102), and the solder ball B is heated together with the base assembly 100 (base 102) by warm air. As a result, the solder balls B are dissolved.

Thereafter, the solder (solder ball B) is cooled together with the base assembly 100 (base 102) to solidify the solder (solder ball B).

As a result, the solder (solder ball B) becomes a connection terminal in the electrode 103.

Next, the effect of this mask for electroconductive ball arrangement is demonstrated.

In the mask for conductive ball placement, the leg portion 31 is formed by the leg portion forming layer 30 as described above with reference to FIGS. 2 and 3, but the leg portion forming layer 30 (leg portion ( 31)] is formed of a synthetic resin containing a copolymer of vinyl acetate and vinyl alcohol as a main component (or a synthetic resin containing a polymer of vinyl acetate as a main component) and has resistance to organic solvents.

Here, as mentioned above, when the flux previously attached to the electrode 103 adheres to the mask for conductive ball placement, it is necessary to remove it with an organic solvent.

However, as mentioned above, since the material of the leg part forming layer 30 (leg part 31) has the tolerance with respect to the organic solvent, this mask for electroconductive ball arrangement is obtained by using for a long time.

In addition, the leg part 31 (leg part forming layer 30) of this mask for electroconductive ball placement is manufactured as mentioned above.

That is, after the photosensitive resin material 45 of the fluidity | liquidity becomes uniform by the homogenization tool 49, a part of the photosensitive resin layer 40 is formed by receiving light (ultraviolet rays), and hardening | curing.

Thereby, the thickness of the leg part forming layer 30 of this mask for electroconductive ball placement is uniform, and all the leg parts 31 have the same height.

Thereby, this conductive ball arrangement | positioning mask is stably arrange | positioned (setting) in the base assembly 100 (base 102).

In addition, on the premise that the thickness of the main body 20 is uniform, the height of the mask for conductive ball placement becomes uniform.

Thereby, the solder ball B can be arrange | positioned smoothly in a predetermined position in this mask for a conductive ball arrangement | positioning.

It goes without saying that the above is only the first embodiment of the present invention, and the present invention can be implemented in the embodiment to which various changes are made based on the knowledge of those skilled in the art.

For example, there is also an embodiment in which one conductive ball receiving through-hole assembly 22 is formed in the main body 20. In that case, the mask for electroconductive ball arrangement | positioning is used with respect to the base which is not divided later.

BRIEF DESCRIPTION OF THE DRAWINGS The perspective view which showed the mask for electroconductive ball arrangement | positioning of the 1st Embodiment of this invention, and its use method.

It is a longitudinal cross-sectional view which shows the mask for electroconductive ball arrangement of 1st Embodiment of this invention.

It is an exploded perspective view which shows the mask for electroconductive ball arrangement of 1st Embodiment of this invention.

It is a longitudinal cross-sectional view which shows the manufacturing method of the mask for electroconductive ball placement of 1st Embodiment of this invention.

5 is a perspective view showing one step of the method of manufacturing a mask for conductive ball placement according to the first embodiment of the present invention.

[Description of the code]

20: main body 23: conductive ball receiving through hole

30: leg forming layer 31: leg

32 through hole corresponding opening 40 photocurable resin material layer

42: uncured portion 45: photo-curing resin material

48: application guide 49: homogenizing tool

50: photomask 51: light transmission unit

52: light transmission block 102: base

B: solder ball (conductive ball)

Claims (5)

delete delete Electroconductive ball arrangement | positioning which the said electroconductive ball is arrange | positioned in the predetermined position of the said base part by overlapping with respect to a base in the leg part formed in a flat-plate main-body part, and receiving a conductive ball in the some conductive ball accommodation through-hole formed in the said main body part. As a method of manufacturing the mask for use: A photocurable resin material coating step of applying a photocurable resin material cured by receiving light to the body portion to form a photocurable resin material layer on the body portion; A portion corresponding to the leg portion is a light transmitting portion that allows light transmission, and a portion of the other portion is a light transmission blocking portion that blocks light transmission, and is disposed with respect to the photocurable resin material layer to form a photomask arrangement. Photomask placement step, A light irradiation step of irradiating light on the photomask arrangement from the side of the photomask to cure a portion corresponding to the light transmitting portion of the photocurable resin material layer; A photomask removing step of removing the photomask from the photomask arrangement to form a photomask remover; It has a photocurable resin material layer uncured part removal step of removing the uncured part among the said photocurable resin material layers in the said photomask removal body, When the said photocurable resin material contains a (poly) vinyl acetate and receives light, it becomes a cured resin body containing the polymer of vinyl acetate, The photocurable resin material applying step is fluidity between a pair of coating guides disposed on an upper surface which is a surface on which the photocurable resin material layer is disposed and spaced apart from each other and extending in parallel and having the same height along the longitudinal direction thereof. The photocurable resin material having a film is supplied, and the uniforming tool disposed between the upper surfaces of the two application guides is moved along the longitudinal direction of the both application guides so that the photocurable resin material is applied to the main body with a uniform thickness. Method for manufacturing a mask for conductive ball placement, characterized in that. Electroconductive ball arrangement | positioning which the said electroconductive ball is arrange | positioned in the predetermined position of the said base part by overlapping with respect to a base in the leg part formed in a flat-plate main-body part, and receiving a conductive ball in the some conductive ball accommodation through-hole formed in the said main body part. As a method of manufacturing the mask for use: A photocurable resin material coating step of applying a photocurable resin material cured by receiving light to the body portion to form a photocurable resin material layer on the body portion; A portion corresponding to the leg portion is a light transmitting portion that allows light transmission, and a portion of the other portion is a light transmission blocking portion that blocks light transmission, and is disposed with respect to the photocurable resin material layer to form a photomask arrangement. Photomask placement step, A light irradiation step of irradiating light on the photomask arrangement from the side of the photomask to cure a portion corresponding to the light transmitting portion of the photocurable resin material layer; A photomask removing step of removing the photomask from the photomask arrangement to form a photomask remover; It has a photocurable resin material layer uncured part removal step of removing the uncured part among the said photocurable resin material layers in the said photomask removal body, The said photocurable resin material becomes a cured resin body containing the copolymer of vinyl acetate and a vinyl alcohol by containing (poly) vinyl acetate and (poly) vinyl alcohol, and receiving light, The photocurable resin material applying step is fluidity between a pair of coating guides disposed on an upper surface which is a surface on which the photocurable resin material layer is disposed and spaced apart from each other and extending in parallel and having the same height along the longitudinal direction thereof. The photocurable resin material having a film is supplied, and the uniforming tool disposed between the upper surfaces of the two application guides is moved along the longitudinal direction of the both application guides so that the photocurable resin material is applied to the main body with a uniform thickness. Method for manufacturing a mask for conductive ball placement, characterized in that. delete

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