KR100645646B1 - Method for manufacturing printed circuit board using imprinting process - Google Patents

Abstract

The present invention is a printed circuit using an imprint method for applying a curing accelerator release agent to a mold, and then transfer the mold to the semi-cured resin to facilitate the release between the mold and the semi-cured resin, and to promote the curing of the semi-cured resin It relates to a method for manufacturing a substrate.

Printed circuit board, imprint, mold release, hardening promotion, mold

Description

Method for manufacturing printed circuit board using imprinting process

1A to 1E are cross-sectional views illustrating a flow of a method of manufacturing a printed circuit board using a conventional imprint method.

2A to 2E are cross-sectional views illustrating a flow of a method of manufacturing a printed circuit board using another conventional imprint method.

3 is a flowchart illustrating a method of manufacturing a printed circuit board using an imprint method according to an embodiment of the present invention.

4 is a cross-sectional view illustrating a flow of a method of manufacturing a printed circuit board using an imprint method according to an embodiment of the present invention.

FIG. 5 is a partially enlarged view of the portion B indicated by the dotted dotted line in FIG. 4C.

The present invention relates to a method for manufacturing a printed circuit board, and more particularly, by applying a curing accelerator release agent to a mold, and then transferring the mold to a semi-cured resin, thereby facilitating release between the mold and the semi-cured resin and semi-curing. It relates to a method for manufacturing a printed circuit board using an imprint method for promoting the curing of the resin.

As a technology to cope with high density of semiconductor chips and high signal transmission speed, a technology for directly mounting a semiconductor chip on a printed circuit board instead of CSP (Chip-Sized Package) or wire bonding is described. The demand is growing. In order to directly mount a semiconductor chip on a printed circuit board, it is necessary to develop a high density and high reliability printed circuit board capable of coping with a higher density of semiconductors.

The requirements for high density and high reliability printed circuit boards are closely related to the specifications of semiconductor chips, and there are many problems such as miniaturization of circuits, high electrical characteristics, high speed signal transmission structure, high reliability, and high functionality. There is a need for a printed circuit board technology capable of forming a fine circuit pattern and a micro via hole corresponding to the requirements.

In general, a method of manufacturing a printed circuit board uses a photo-lithography process having advantages of high productivity and low manufacturing cost. Photolithography is a process of applying photoresist on a substrate to a certain thickness, exposing and developing a specific portion, filling a conductive material through a plating process, and exfoliating residual photoresist. A microcircuit pattern was formed on the printed circuit board through a process and a process of removing the electroless plated conductive material by using an etching process.

However, the conventional method of manufacturing a printed circuit board using the photolithography method has two serious problems when manufacturing L / S (Line / Space), which is a width of a circuit pattern and an interval between circuit patterns, to 10 μm / 10 μm or less. Occurred.

First, the conventional method of manufacturing a printed circuit board using the photolithography method has a problem in that the adhesion force is generated at the interface between the photoresist and the substrate in the process of manufacturing L / S to 10 μm / 10 μm or less.

Second, in the conventional method of manufacturing a printed circuit board using photolithography, an undercut of the circuit pattern portion occurs in the process of removing the electroless plated conductive material, so that the formed fine circuit pattern is disconnected or depressed. There was a problem of lamination.

In order to overcome this problem, a method of manufacturing a printed circuit board using an imprint method has been proposed, and a method of manufacturing a printed circuit board using an imprint method includes a hot embossing method using a thermosetting material and a photocurable material. UV (Ultra Violet) to be used.

1A to 1E are cross-sectional views illustrating a flow of a method of manufacturing a printed circuit board using a conventional imprint method, and a method of manufacturing a printed circuit board using an imprint method using a hot embossing method.

As shown in FIG. 1A, the mold 11 having a fine circuit pattern formed in a negative shape and the substrate 13 coated with the thermosetting material 12 are aligned.

As shown in FIG. 1B, the mold 11 is transferred to the thermosetting material 12 of the substrate 13, and at the same time, heat is applied to cure the thermosetting material 12.

As shown in FIG. 1C, the groove 11 of the circuit pattern is formed in the thermosetting material 12 by separating the mold 11 from the thermosetting material 12.

As shown in FIG. 1D, a copper plating process is performed to form the copper plating layer 14 in the thermosetting material 12 and the groove a of the circuit pattern.

As shown in FIG. 1E, the printed circuit board 10 having the circuit pattern 15 is manufactured by polishing the surface on which the copper plating layer 14 is formed until the thermosetting material 12 is exposed.

2A to 2E are cross-sectional views illustrating a flow of a method of manufacturing a printed circuit board using another conventional imprint method, and a method of manufacturing a printed circuit board using an UV imprint method.

As shown in FIG. 2A, the transparent mold 21 having the fine circuit pattern formed in a negative shape and the substrate 23 coated with the photocurable material 22 are aligned.

As shown in FIG. 2B, the transparent mold 21 is transferred to the photocurable material 22 of the substrate 23, and the photocurable material 22 is cured by irradiating ultraviolet rays 24.

As shown in FIG. 2C, the transparent mold 21 is separated from the photocurable material 22, thereby forming the groove b of the circuit pattern in the photocurable material 22.

As shown in FIG. 2D, a copper plating process is performed to form the copper plating layer 25 in the photocurable material 22 and the groove b of the circuit pattern.

As shown in FIG. 2E, the printed circuit board 20 having the circuit pattern 26 is manufactured by polishing the surface on which the copper plating layer 25 is formed until the photocurable material 22 is exposed.

All of the manufacturing methods of the printed circuit board using the conventional hot embossing method or the UV method imprint method described above can produce a printed circuit board having a L / S of 10 μm / 10 μm using a mold having a circuit pattern formed in a negative shape. Could.

However, in the conventional method of manufacturing a printed circuit board using an imprint method, the molds 11 and 21 and the thermosetting material 22 or the sight in the release process of separating the molds 11 and 21 shown in FIG. 1C or 2C are performed. Since the adhesive phenomenon occurs between the fire materials 23, the grooves a and b of the circuit pattern transferred to the thermosetting material 22 or the photocurable material 23 are easily damaged, and the designed fine circuit patterns 15, 26) there was a problem that is difficult to form.

SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a method of manufacturing a printed circuit board using an imprint method for preventing adhesion between a mold and a thermosetting material or a photocuring material in a releasing process.

Another technical problem of the present invention is to provide a method of manufacturing a printed circuit board using an imprint method for promoting curing of semi-cured resin such as thermosetting material or photocuring material to shorten the curing time.

In order to solve the above technical problem, the method of manufacturing a printed circuit board using the imprinting method according to the present invention (A) a pattern corresponding to the circuit pattern is formed and a curing accelerator releasing agent comprising a release agent and a curing accelerator is applied Aligning the mold with the base substrate to which the semi-cured resin is applied; (B) transferring the mold to the semi-cured resin and curing the semi-cured resin; (C) forming a groove of a circuit pattern in the resin by separating the mold from the resin cured in the step (B); (D) forming an electroless plating layer in the groove of the resin and the circuit pattern; (E) forming an electrolytic plating layer on the electroless plating layer; And (F) polishing the electroless plating layer and the electrolytic plating layer until the resin is exposed.

Preferably, the step of transferring the semi-cured resin of step (B) of the step (B) of the method of manufacturing a printed circuit board using the imprint method according to the present invention and the curing of the semi-cured resin is carried out at the same time. Do.

Preferably, the step of curing the semi-cured resin of the step (B) of the method of manufacturing a printed circuit board using the imprinting method according to the present invention is the curing accelerator of the curing accelerator releasing agent applied to the mold It is preferable to include the process of promoting hardening of the said semi-hardened resin by diffusing into resin.

Preferably, the release agent of the method of manufacturing a printed circuit board using the imprint method according to the present invention is preferably a material selected from the group consisting of a teflon-based material and a silicon-based material.

Preferably, the curing accelerator of the method of manufacturing a printed circuit board using the imprinting method according to the present invention, a phenol-based material, cyanate ester-based material, amine-based material and imidazole It is preferable that the material is selected from the group consisting of) -based materials.

Hereinafter, a manufacturing method of a printed circuit board using the imprint method according to the present invention will be described in detail with reference to the drawings.

3 is a flowchart of a method of manufacturing a printed circuit board using the imprint method according to an embodiment of the present invention, and FIG. 4 is a flow chart illustrating a method of manufacturing a printed circuit board using the imprint method according to an embodiment of the present invention. 5 is a partially enlarged view of a portion B indicated by a circular dotted line in FIG. 4C. Here, with respect to each drawing, one side of the printed circuit board is shown, but may be substantially performed on both sides of the printed circuit board.

As shown in FIG. 3, the method of manufacturing a printed circuit board using the imprinting method according to the present invention includes applying a curing accelerator release agent to a tool foil (S110), arranging a mold and a base substrate (S120), and a base substrate. Mold transfer and semi-cured resin curing step (S130), mold separation step (S140), electroless copper plating layer forming step (S150), electrolytic copper plating layer forming step (S160) and surface polishing step (S170) It is made to include.

In more detail, as shown in FIG. 4A, the curing accelerator release agent 120 in which a release agent 121 and a curing accelerator 122 are mixed in a predetermined ratio in a mold 110 in which a negative circuit pattern is formed. Is applied using spin coating, dip coating, spray, or the like (S110).

The mold 110 may be a mold 110 of a transparent material such as SiO ₂ , quartz, glass, or polymer, and may be a mold of an opaque material such as a semiconductor material, a ceramic, a metal, or a polymer. 110 can also be used.

In the method of manufacturing the mold 110, one surface of a material in the form of a plate may be processed to produce a negative circuit pattern. Here, a method of processing one surface of a material in the form of a plate may be used, such as electron beam lithography, photo-lithography, dicing, laser, reactive ion etching (RIE), or the like.

Alternatively, the manufacturing method of the mold 110 may manufacture a separate circuit patterns, respectively, attached to the material of the plate shape to produce a negative circuit pattern.

Meanwhile, the release agent 121 of the curing accelerator releasing agent 120 may use a teflon-based material or a silicone-based material, and the curing accelerator 122 of the curing accelerator releasing agent 120 may be a phenol-based compound. A substance, a cyanate ester substance, an amine substance, or an imidazole substance may be used.

As shown in FIG. 4B, the mold 110 to which the curing accelerator release agent 120 is applied is aligned with the base substrate 130 to which the semi-cured resin 140 is applied (S120).

The base substrate 130 may be a support member for supporting the semi-cured resin 140 to be applied, or may be a substrate on which a predetermined circuit pattern is formed on the surface to which the semi-cured resin 140 is applied.

In addition, the semi-cured resin 140 may be a thermoplastic resin, a monomer, a polymer, or the like that is cured by heat or light (eg, ultraviolet rays).

As shown in FIGS. 4C and 5, the mold 110 having the negative circuit pattern formed on the semi-cured resin 140 of the base substrate 130 is transferred, and the material of the mold 110 and the semi-cured resin 140 is transferred. In accordance with the heat or light 150 (for example, ultraviolet light) is applied to cure the semi-cured resin 140 (S130).

Here, since the curing accelerator 122 of the curing accelerator releasing agent 120 applied to the mold 110 is diffused into the semi-cured resin 140 to promote curing of the semi-cured resin 140, the semi-cured resin 140 It will shorten the curing time.

In an embodiment, when heat is applied to cure the semi-cured resin 140, the mold 110 may be heated to thermally cure the semi-cured resin 140, and the mold 110 and the semi-cured resin 140 may be The semi-cured resin 140 may be thermally cured by heating all of the coated base substrates 130.

On the other hand, when curing the semi-cured resin 140 by irradiating light, by irradiating ultraviolet rays and the like through a mold 110 of a transparent material such as SiO ₂ , quartz, glass, polymer, or the base substrate 130 of a transparent material The semi-cured resin 140 can be photocured.

As shown in FIG. 4D, by separating the mold 110 from the cured resin 140 of the base substrate 130, the groove A of the circuit pattern is formed in the cured resin 140 (S140).

Here, since the release agent 121 of the curing accelerator releasing agent 120 applied to the mold 110 prevents adhesion between the cured resin 140 and the mold 110, the cured resin 140 and the mold 110 are formed. Easy separation of the liver. Therefore, the groove A of the circuit pattern formed in the cured resin 140 of the base substrate 130 is not damaged.

As shown in FIG. 4E, in order to form a circuit pattern, an electroless copper plating layer 160 is formed in the cured resin 140 and the groove A of the circuit pattern (S150).

The process of forming the electroless copper plating layer 160 may include a degreasing process, a soft etching process, a pre-catalyst process, a catalyst treatment process, an activation process, an electroless copper plating process, and the like. A catalyst precipitation method including an antioxidant treatment process can be used.

Alternatively, the process of forming the electroless copper plating layer 160 impinges the ion particles (eg, Ar ⁺ ) of the gas generated by the plasma or the like on the copper target, thereby forming the grooves A in the circuit pattern. A sputtering method of forming the electroless copper plating layer 160 may be used.

As shown in FIG. 4F, in order to fill the conductive material in the groove A of the circuit pattern, an electrolytic copper plating layer 170 is formed on the entire surface of the electroless copper plating layer 160 (S160).

Here, in the method of forming the electrolytic copper plating layer 170, the substrate is eroded into the copper plating working container and then electrolytic copper plating is performed using a DC rectifier. The electrolytic copper plating is preferably used to calculate the area to be plated to deposit a suitable current in the DC rectifier.

In the electrolytic copper plating process, the physical properties of the copper plating layer are superior to the electroless copper plating layer 160, and there is an advantage of easily forming a thick copper plating layer.

The copper plating lead wire for forming the electrolytic copper plating layer 170 may be used a copper plating lead wire formed separately, in a preferred embodiment according to the present invention, the copper plating lead wire for forming the electrolytic copper plating layer 170 is an electroless copper plating layer ( Preference is given to using 160).

As shown in Figure 4g, to remove the unnecessary copper plating layer, by polishing the surface of the copper plating layer consisting of the electroless copper plating layer 160 and the electrolytic copper plating layer 170 until the cured resin 140 is exposed, by copper plating Filled circuit patterns 161 and 171 are formed (S170).

Here, the surface polishing process may use a chemical-mechanical polishing process for polishing the surface through chemical reaction and mechanical polishing. This chemical-mechanical polishing process supplies a polishing slurry while keeping the substrate in contact with the surface of the polishing pad, thereby chemically reacting the surface of the substrate and simultaneously fixing the substrate with the polishing pad to which the polishing pad is attached. The relative movement of the polishing head physically flattens the substrate surface.

Thereafter, a semi-cured resin coating process, a mold transfer and a semi-cured resin curing process, a mold separation process, an electroless copper plating layer forming process, an electrolytic copper plating layer forming process, and a surface polishing process are repeatedly performed on the semi-cured resin as many times as necessary. . Next, when the solder resist forming process, the nickel / gold plating process and the outer forming process are performed, the printed circuit board 100 according to the present invention is manufactured.

On the other hand, in the manufacturing method of the printed circuit board 100 using the imprint method according to the present invention, the copper plating layer is not limited to the pure copper plating layer, it means a plating layer containing copper as a main component. This can be confirmed by analyzing the chemical composition through an analytical device such as Energy Dispersive Analysis of X-rays (EDAX).

In addition, in the manufacturing method of the printed circuit board 100 using the imprint method according to the present invention, the plating layer is not limited to copper (Cu), depending on the purpose or use of gold (Au), nickel (Ni), A plating layer containing a conductive material such as tin (Sn) as a main component may be formed.

Although the present invention has been described above, this is only one embodiment, and it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the present invention. . However, it will be confirmed through the claims that such changes and modifications fall within the scope of the present invention.

As described above, in the method of manufacturing a printed circuit board using the imprinting method according to the present invention, since a release agent is applied to a mold to prevent adhesion between the resin and the mold during the release process, separation between the resin and the mold is easy. have.

In addition, the method of manufacturing a printed circuit board using the imprinting method according to the present invention does not cause adhesion between the resin and the mold during the releasing process, so that the pattern of the resin is not damaged, thereby providing a circuit pattern of excellent quality. have.

In addition, in the method of manufacturing a printed circuit board using the imprinting method according to the present invention, since a curing accelerator is applied to a mold to promote curing of the semi-cured resin during the curing process, the curing time of the semi-cured resin can also be shortened. have.

In addition, the method of manufacturing a printed circuit board using the imprinting method according to the present invention transfers the mold to the semi-cured resin and simultaneously cures the semi-cured resin, thereby reducing the total number of processes and reducing the process time and manufacturing cost. .

Claims (5)

(A) aligning a mold having a pattern corresponding to the circuit pattern and applying a curing accelerator releasing agent including a release agent and a curing accelerator, and a base substrate coated with a semi-cured resin; (B) transferring the mold to the semi-cured resin and curing the semi-cured resin; (C) forming a groove of a circuit pattern in the resin by separating the mold from the resin cured in the step (B); (D) forming an electroless plating layer in the groove of the resin and the circuit pattern; (E) forming an electrolytic plating layer on the electroless plating layer; And (F) A method of manufacturing a printed circuit board using an imprint method, comprising polishing the electroless plating layer and the electrolytic plating layer until the resin is exposed. The method of claim 1, The process of transferring the semi-cured resin of the step (B) to the mold and the process of curing the semi-cured resin is carried out at the same time. The method according to claim 1 or 2, Curing the semi-cured resin of the step (B) comprises the step of promoting the curing of the semi-cured resin by the diffusion of the curing accelerator of the curing accelerator release agent applied to the mold to the semi-cured resin A method of manufacturing a printed circuit board using an imprint method characterized in that. The method of claim 1, The release agent is a method of manufacturing a printed circuit board using an imprint method, characterized in that the material selected from the group consisting of a teflon-based material and a silicon-based material. The method of claim 1, The curing accelerator is a phenol (phenol) -based material, cyanate ester (cyanate ester) material, amine (amine) material and imidazole (imidazole) is a material selected from the group consisting of materials using imprint method Method of manufacturing a printed circuit board.

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