KR100901011B1 - 위상반전마스크 개선 방법 - Google Patents

위상반전마스크 개선 방법 Download PDF

Info

Publication number
KR100901011B1
KR100901011B1 KR1020047009144A KR20047009144A KR100901011B1 KR 100901011 B1 KR100901011 B1 KR 100901011B1 KR 1020047009144 A KR1020047009144 A KR 1020047009144A KR 20047009144 A KR20047009144 A KR 20047009144A KR 100901011 B1 KR100901011 B1 KR 100901011B1
Authority
KR
South Korea
Prior art keywords
phase
region
edge
boundary
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020047009144A
Other languages
English (en)
Korean (ko)
Other versions
KR20040065266A (ko
Inventor
루캉크토드피.
스펜스크리스토퍼에이.
Original Assignee
어드밴스드 마이크로 디바이시즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어드밴스드 마이크로 디바이시즈, 인코포레이티드 filed Critical 어드밴스드 마이크로 디바이시즈, 인코포레이티드
Publication of KR20040065266A publication Critical patent/KR20040065266A/ko
Application granted granted Critical
Publication of KR100901011B1 publication Critical patent/KR100901011B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/30Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/70Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020047009144A 2001-12-11 2002-12-09 위상반전마스크 개선 방법 Expired - Lifetime KR100901011B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/016,710 2001-12-11
US10/016,710 US6749971B2 (en) 2001-12-11 2001-12-11 Method of enhancing clear field phase shift masks with chrome border around phase 180 regions
PCT/US2002/039372 WO2003050616A1 (en) 2001-12-11 2002-12-09 Method of enhancing phase shift masks

Publications (2)

Publication Number Publication Date
KR20040065266A KR20040065266A (ko) 2004-07-21
KR100901011B1 true KR100901011B1 (ko) 2009-06-04

Family

ID=21778529

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020047009144A Expired - Lifetime KR100901011B1 (ko) 2001-12-11 2002-12-09 위상반전마스크 개선 방법

Country Status (9)

Country Link
US (1) US6749971B2 (https=)
EP (1) EP1454191B1 (https=)
JP (1) JP5349729B2 (https=)
KR (1) KR100901011B1 (https=)
CN (1) CN1278181C (https=)
AU (1) AU2002360533A1 (https=)
DE (1) DE60226772D1 (https=)
TW (1) TWI265370B (https=)
WO (1) WO2003050616A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1975567A (zh) * 2002-04-23 2007-06-06 株式会社液晶先端技术开发中心 移相掩模
KR100462887B1 (ko) * 2002-10-22 2004-12-17 삼성전자주식회사 필드 게이트 이미지의 폭을 보강하는 위상 에지 위상 변이마스크 및 제조방법
US7448012B1 (en) 2004-04-21 2008-11-04 Qi-De Qian Methods and system for improving integrated circuit layout
US7608503B2 (en) * 2004-11-22 2009-10-27 Macronix International Co., Ltd. Side wall active pin memory and manufacturing method
US8024889B2 (en) * 2008-06-25 2011-09-27 Brett Bunker Pest control method and apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5573890A (en) * 1994-07-18 1996-11-12 Advanced Micro Devices, Inc. Method of optical lithography using phase shift masking
US5783337A (en) * 1997-05-15 1998-07-21 Taiwan Semiconductor Manufacturing Company, Ltd. Process to fabricate a double layer attenuated phase shift mask (APSM) with chrome border
US5807649A (en) * 1996-10-31 1998-09-15 International Business Machines Corporation Lithographic patterning method and mask set therefor with light field trim mask
US6077633A (en) * 1998-12-14 2000-06-20 Taiwan Semiconductor Manufacturing Company Mask and method of forming a mask for avoiding side lobe problems in forming contact holes

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3153230B2 (ja) 1990-09-10 2001-04-03 株式会社日立製作所 パタン形成方法
JP3334911B2 (ja) 1992-07-31 2002-10-15 キヤノン株式会社 パターン形成方法
JP3078163B2 (ja) 1993-10-15 2000-08-21 キヤノン株式会社 リソグラフィ用反射型マスクおよび縮小投影露光装置
US5619059A (en) 1994-09-28 1997-04-08 National Research Council Of Canada Color deformable mirror device having optical thin film interference color coatings
US5521031A (en) 1994-10-20 1996-05-28 At&T Corp. Pattern delineating apparatus for use in the EUV spectrum
US6228539B1 (en) 1996-09-18 2001-05-08 Numerical Technologies, Inc. Phase shifting circuit manufacture method and apparatus
US5858580A (en) 1997-09-17 1999-01-12 Numerical Technologies, Inc. Phase shifting circuit manufacture method and apparatus
US5780187A (en) 1997-02-26 1998-07-14 Micron Technology, Inc. Repair of reflective photomask used in semiconductor process
US6057063A (en) * 1997-04-14 2000-05-02 International Business Machines Corporation Phase shifted mask design system, phase shifted mask and VLSI circuit devices manufactured therewith
US6013399A (en) 1998-12-04 2000-01-11 Advanced Micro Devices, Inc. Reworkable EUV mask materials
US6410193B1 (en) 1999-12-30 2002-06-25 Intel Corporation Method and apparatus for a reflective mask that is inspected at a first wavelength and exposed during semiconductor manufacturing at a second wavelength
US6534224B2 (en) 2001-01-30 2003-03-18 Advanced Micro Devices, Inc. Phase shift mask and system and method for making the same
US6749970B2 (en) * 2001-12-11 2004-06-15 Advanced Micro Devices, Inc. Method of enhancing clear field phase shift masks with border regions around phase 0 and phase 180 regions

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5573890A (en) * 1994-07-18 1996-11-12 Advanced Micro Devices, Inc. Method of optical lithography using phase shift masking
US5807649A (en) * 1996-10-31 1998-09-15 International Business Machines Corporation Lithographic patterning method and mask set therefor with light field trim mask
US5783337A (en) * 1997-05-15 1998-07-21 Taiwan Semiconductor Manufacturing Company, Ltd. Process to fabricate a double layer attenuated phase shift mask (APSM) with chrome border
US6077633A (en) * 1998-12-14 2000-06-20 Taiwan Semiconductor Manufacturing Company Mask and method of forming a mask for avoiding side lobe problems in forming contact holes

Also Published As

Publication number Publication date
EP1454191B1 (en) 2008-05-21
JP2005513518A (ja) 2005-05-12
EP1454191A1 (en) 2004-09-08
WO2003050616A1 (en) 2003-06-19
US20040023123A1 (en) 2004-02-05
CN1602449A (zh) 2005-03-30
DE60226772D1 (de) 2008-07-03
CN1278181C (zh) 2006-10-04
KR20040065266A (ko) 2004-07-21
TWI265370B (en) 2006-11-01
TW200300862A (en) 2003-06-16
AU2002360533A1 (en) 2003-06-23
US6749971B2 (en) 2004-06-15
JP5349729B2 (ja) 2013-11-20

Similar Documents

Publication Publication Date Title
US6623895B2 (en) Hybrid phase-shift mask
US5523186A (en) Split and cover technique for phase shifting photolithography
JP2009288818A (ja) 位相0領域及び位相180領域の周辺の境界領域を用いてポジ型(CF:clearfield)位相シフトマスク(不透明な開口を有する透明な位相シフトマスク)の向上を図る方法
US6818358B1 (en) Method of extending the areas of clear field phase shift generation
KR100549319B1 (ko) 반도체 소자 피처들을 제조하기 위한 무크롬 교번형 레티클
KR100901011B1 (ko) 위상반전마스크 개선 방법
KR100931707B1 (ko) 위상 0 영역에 평행한 라인을 추가한 클리어 필드위상반전마스크 개선 방법
US7033947B2 (en) Dual trench alternating phase shift mask fabrication
US6797438B1 (en) Method and enhancing clear field phase shift masks with border around edges of phase regions
KR100219548B1 (ko) 위상반전마스크 및 그 제조방법
JP3320062B2 (ja) マスク及びマスクを用いたパターン形成方法
JP2002236351A (ja) マスク及びマスクを用いたパターン形成方法
KR19980021216A (ko) 결함검사용 표준 마스크 및 그 제조방법
KR19980014176A (ko) 스핀 온 글래스톱형 교번 위상 반전마스크 제조 방법

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20130429

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20140508

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20150430

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20160427

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20170504

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20180427

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20190429

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PC1801 Expiration of term

St.27 status event code: N-4-6-H10-H14-oth-PC1801

Not in force date: 20221210

Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION