KR100875219B1 - 전기전도성 패턴 형성용 물질 및 전기전도성 패턴 형성 방법 - Google Patents
전기전도성 패턴 형성용 물질 및 전기전도성 패턴 형성 방법 Download PDFInfo
- Publication number
- KR100875219B1 KR100875219B1 KR1020037016713A KR20037016713A KR100875219B1 KR 100875219 B1 KR100875219 B1 KR 100875219B1 KR 1020037016713 A KR1020037016713 A KR 1020037016713A KR 20037016713 A KR20037016713 A KR 20037016713A KR 100875219 B1 KR100875219 B1 KR 100875219B1
- Authority
- KR
- South Korea
- Prior art keywords
- outermost layer
- exposure
- conductive pattern
- layer
- conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/016—Diazonium salts or compounds
- G03F7/021—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/124—Intrinsically conductive polymers
- H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
- C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
- C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
- C08G61/126—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds with a five-membered ring containing one sulfur atom in the ring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Electric Cables (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP01202423.8 | 2001-06-22 | ||
| EP01202423 | 2001-06-22 | ||
| PCT/EP2002/006744 WO2003001537A1 (en) | 2001-06-22 | 2002-06-18 | Material and method for making an electroconductive pattern |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20040030696A KR20040030696A (ko) | 2004-04-09 |
| KR100875219B1 true KR100875219B1 (ko) | 2008-12-19 |
Family
ID=8180530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020037016713A Expired - Fee Related KR100875219B1 (ko) | 2001-06-22 | 2002-06-18 | 전기전도성 패턴 형성용 물질 및 전기전도성 패턴 형성 방법 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1402543B1 (enExample) |
| JP (1) | JP4077405B2 (enExample) |
| KR (1) | KR100875219B1 (enExample) |
| CN (1) | CN1518745A (enExample) |
| DE (1) | DE60216460T2 (enExample) |
| TW (1) | TW574714B (enExample) |
| WO (1) | WO2003001537A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2704980T3 (es) | 2006-08-21 | 2019-03-21 | Agfa Gevaert | Composición fotopolimerizable por radiación UV para la fabricación de capas, patrones o impresiones conductores |
| DE102008023008A1 (de) | 2008-05-09 | 2009-11-12 | H.C. Starck Gmbh | Neuartige Polythiophene-Polyanion-Komplexe in unpolaren organischen Lösungsmitteln |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5427841A (en) | 1993-03-09 | 1995-06-27 | U.S. Philips Corporation | Laminated structure of a metal layer on a conductive polymer layer and method of manufacturing such a structure |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE228545T1 (de) * | 1994-05-06 | 2002-12-15 | Bayer Ag | Leitfähige beschichtungen |
| EP1079397A1 (en) * | 1999-08-23 | 2001-02-28 | Agfa-Gevaert N.V. | Method of making an electroconductive pattern on a support |
| DE60033012T2 (de) * | 1999-09-10 | 2007-09-13 | Koninklijke Philips Electronics N.V. | Leitende struktur basierend auf poly-3,4-alkendioxythiophen (pedot) und polystyrolsulfonsäure (pss) |
-
2002
- 2002-06-18 CN CNA028125312A patent/CN1518745A/zh active Pending
- 2002-06-18 WO PCT/EP2002/006744 patent/WO2003001537A1/en not_active Ceased
- 2002-06-18 DE DE60216460T patent/DE60216460T2/de not_active Expired - Lifetime
- 2002-06-18 JP JP2003507833A patent/JP4077405B2/ja not_active Expired - Fee Related
- 2002-06-18 EP EP02751043A patent/EP1402543B1/en not_active Expired - Lifetime
- 2002-06-18 KR KR1020037016713A patent/KR100875219B1/ko not_active Expired - Fee Related
- 2002-06-21 TW TW91113550A patent/TW574714B/zh not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5427841A (en) | 1993-03-09 | 1995-06-27 | U.S. Philips Corporation | Laminated structure of a metal layer on a conductive polymer layer and method of manufacturing such a structure |
Also Published As
| Publication number | Publication date |
|---|---|
| DE60216460D1 (de) | 2007-01-11 |
| JP2005500650A (ja) | 2005-01-06 |
| EP1402543B1 (en) | 2006-11-29 |
| KR20040030696A (ko) | 2004-04-09 |
| JP4077405B2 (ja) | 2008-04-16 |
| WO2003001537A1 (en) | 2003-01-03 |
| DE60216460T2 (de) | 2007-09-27 |
| TW574714B (en) | 2004-02-01 |
| EP1402543A1 (en) | 2004-03-31 |
| CN1518745A (zh) | 2004-08-04 |
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St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| LAPS | Lapse due to unpaid annual fee | ||
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