KR100873491B1 - Light emitting device - Google Patents

Abstract

A light emitting device is provided to enhance the luminous efficiency and the heat radiating capability due to the main heatproof body having the inclined side. A light emitting device comprises the body portion in which the accommodating groove in which the top is held is formed; the main board for the heat dissipation formed with the heat dissipation material; the plurality of insulation beads formed with the insulation materials; the plurality of lead pins installed through the insulation bead; the emitting device(110) having the light emitting diode chip electrically connected with the lead pin; the main heatproof body in which the first spiral wire is molded; the sub heatproof body(150) having prolongation more extended to downward in the second outer portion.

Description

Light emitting apparatus

1 is a perspective view showing a light emitting device according to a preferred embodiment of the present invention,

2 is an exploded perspective view of the light emitting device of FIG. 1;

3 is a cross-sectional view showing an extract of the combined portion of the main heat dissipation body and the sub heat dissipation body of FIG.

4 is a cross-sectional view of the light emitting device of FIG. 2.

<Description of Symbols for Major Parts of Drawings>

110: light emitting element 130: main heat dissipation body

150: sub heat dissipation body 200: support

The present invention relates to a light emitting device, and more particularly, to a light emitting device having a structure that is easy to assemble and easy to use for interior lighting.

Recently, as the light emitting diode (LED) is known to have a structure that emits white light by applying a phosphor, its application range has been extended to a lighting field that can replace a conventional light lamp in addition to a simple light emitting display function. . In addition, research on high power light emitting diodes suitable for lighting has been continuously conducted.

The light emitting diode, which is one of the semiconductor devices, decreases its lifespan and decreases the luminous efficiency when the temperature rises above the rated operating temperature. Therefore, in order to increase the output of the light emitting diodes, the light emitting diodes effectively emit heat generated from the light emitting diodes. Heat dissipation structure is required.

However, the conventional light emitting diode has a structure in which a lead pin on which a light emitting diode chip is mounted is molded with a plastic material. The light emitting diode having such a structure is difficult to be applied to a high output light emitting diode because the heat dissipation is low because the heat is radiated through the lead pins.

In order to improve such a problem, various packages having a structure capable of mounting a high output light emitting diode chip and improving heat dissipation efficiency have been proposed.

On the other hand, halogen lamps are widely used for indoor and outdoor interiors. By the way, halogen lamps have a rated power consumption of about 50 watts, resulting in high power consumption and high heat generation. In addition, the halogen lamp has a disadvantage that the range of use is limited because the merchandise is deteriorated by the heat generated when installed as a showcase lighting. In addition, the halogen lamp has a short lifespan of about 5,000 to 6,000 hours, so there are frequent disadvantages of replacement, and since the illumination light is a single color, there is a problem in that it cannot be used for lighting effects of various colors.

In order to improve such a problem, an interior light emitting device using a high power light emitting diode has been disclosed in Korean Laid-Open Patent No. 2004-0037523.

However, the light emitting device has a structure in which the light emitting diode assembly can be mounted on the upper part of the opening of the aluminum shade which is open at the top, and the process of drawing out the wire along the inner flow path that is to be extended to the lower portion of the aluminum shade is cumbersome, It is not a structure that can directly transfer heat from the diode to the aluminum shade has a disadvantage in that the heat dissipation efficiency is low.

The present invention has been made to improve the above problems, and an object of the present invention is to provide a light emitting device that is easy to assemble and disassemble a light emitting diode and to increase heat dissipation efficiency.

In order to achieve the above object, the light emitting device according to the present invention has a body portion having an upper receiving groove formed therein, and a lower portion of the body portion having ribs protruding outward from the body portion to extend the heat dissipation material. A plurality of insulating beads formed of a main substrate, an insulating material and inserted through the bottom surface of the receiving groove from the bottom of the main substrate for heat dissipation, a plurality of lead pins installed through the insulating beads, and the heat dissipation A light emitting element mounted in the receiving groove of the main substrate and having a light emitting diode chip electrically connected to the lead pin; A first inner passage formed of a heat dissipating material and having a first inner passage penetrating up and down, wherein the first inner passage blocks the entry of the rib and extends downward in a predetermined length to an inner diameter through which the body portion can be inserted; A second inner portion extending downwardly by a predetermined length to an inner diameter through which the rib can enter at a lower end of the first inner portion, and extending downward with an inner diameter greater than the second inner portion at the end of the second inner portion; A main heat dissipation body having a third inner portion, wherein a first screw line is formed on the third inner portion; A first inner portion having a second inner flow passage penetrating up and down so that the lead pin is accommodated therein, and an outer surface thereof enters the second inner portion and has an outer diameter capable of supporting the bottom of the light emitting device; A second outer portion having an outer diameter extended from the lower portion of the first outer portion at a lower end of the first outer portion, and further extending downward from the second outer portion, the second outer portion having a second screw thread capable of being screwed with the first screw line; And a sub heat dissipation body having an extension portion.

Preferably, the main heat dissipation body has a plurality of inlet grooves drawn along the outer circumferential surface of the main heat dissipation body to be spaced apart from each other in the vertical direction.

In addition, the first internal flow path of the main heat dissipation body is formed below a predetermined distance from the top of the main heat dissipation body, the inclined surface inclined to gradually narrow the inner diameter from the top of the main heat dissipation body to the first internal flow path It is further provided.

More preferably, a third screw line is formed in the second internal flow path of the sub heat dissipation body.

According to an aspect of the present invention, the support body which can be screwed with the third screw line; further comprising, the support is formed in a shape that can be supported on the bottom and having a inner space; A vertical rod extending a predetermined length from an upper portion of the stand portion and having a hollow communicating with the inner space; A rotating part having a fourth screw thread formed on an outer surface of the vertical rod and hinged to the vertical rod so as to be screwed with the third screw of the sub heat dissipation body and having a hollow therein; do.

Hereinafter, a light emitting device according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing a light emitting device according to a preferred embodiment of the present invention, Figure 2 is an exploded perspective view of the light emitting device of Figure 1, Figure 3 is an excerpt of the combined portion of the main heat dissipation body and the sub-heat radiation body of Figure 1 It is a cross-sectional view shown.

1 to 3, the light emitting device 100 includes a light emitting device 110, a main heat dissipation body 130, a sub heat dissipation body 150, and a support 200.

The light emitting device 110 is inserted under the main heat dissipation body 130 and is formed to be accommodated by being constrained by the sub heat dissipation body 150.

The light emitting device 110 will be described with reference to FIG. 4.

A heat dissipation main substrate 111, a lead pin 115, and a light emitting diode chip 117 are provided.

The heat dissipation main substrate 111 is formed with an accommodating groove 112 having an open top and formed of a heat dissipation material.

The main substrate 111 for heat dissipation has a body portion 111a formed in a cylindrical shape when viewed from an outer surface thereof, and a rib 111b having an outer diameter extending from the body portion 111a concentrically with respect to the body portion 111a. It has a structure having.

The outer diameter of the body portion 111a is formed to a size that can enter into the first inner portion 133 of the main heat dissipation body 130, which will be described later, the outer diameter of the rib 111b is the second diameter of the main heat dissipation body 130 The inner portion 134 is entered, but the entry into the first inner portion 133 is formed to a size that can be blocked. In this case, the heat dissipation main board 111 may be constrained to be accommodated between the first inner portion 133 and the second inner portion 134 when entering through the first inner flow passage 132 from the lower portion of the main heat dissipation body 130. Can be.

The light emitting diode chip 117 is mounted at the center of the bottom surface of the receiving groove 112, and is electrically connected by the lead pin 115 and the conductive wire 118. Unlike the illustrated example, the light emitting diode chip 117 may be mounted on the heat dissipation main substrate 111 through a sub-mount (not shown).

Although not shown, the phosphor may be filled to surround the light emitting diode chip 117 mounted in the receiving groove 112.

In this case, the phosphor may emit white light in response to light emitted from the light emitting diode chip 117. More preferably, the light emitting diode chip 117 may be applied with a blue light emitting diode chip, and the phosphor may be applied with a YAG phosphor. Can be.

Reference numeral 116 denotes a molding cap formed of various known resins such as a transparent epoxy resin so as to seal the inner space of the accommodation groove 112. Alternatively, a lens (not shown) that may be fitted to the stepped seating jaw at the top of the receiving groove 112 may be mounted to the heat dissipation main board 111.

The heat dissipation main board 111 is formed of a heat dissipation material having good thermal conductivity, for example, a metal material or a ceramic material.

As a material of the heat dissipation main substrate 111, copper or a copper alloy such as brass, tungsten / copper, molybdenum / copper alloy, AlN, SiC, or the like may be applied.

Preferably, the heat dissipation main board 111 is formed in the structure shown in the above-described heat dissipation material and then plated with nickel material to have corrosion resistance. More preferably, the heat dissipation main substrate 111 is second plated with silver or gold so as to increase reflection efficiency and wire bonding property on the nickel plating layer.

The insulating bead 113 penetrates the bottom surface of the receiving groove 112 at the bottom of the heat dissipation main substrate 111 and is formed on the heat dissipation main substrate 111.

The insulating bead 113 is formed of a material having high melting point and good adhesion between different materials when heated, for example, glass, epoxy material or ceramic material.

The lead pin 115 is surrounded by the insulating bead 113 so as to be insulated from the heat dissipation main board 111, and one end is exposed in the receiving groove 112 of the heat dissipation main board 111, and the other end is the heat dissipation main board 111. It protrudes outward from the bottom of 111. In the example shown, two lead pins 115 have been applied.

The main heat dissipation body 130 is formed of a heat dissipation material and has a first internal flow passage 132 penetrating up and down at the end of the inclined surface 131 inclined so that the inner diameter gradually narrows down from the top.

The inclined surface 131 functions as a reflector to focus light emitted laterally from the light emitting device 110.

The first inner flow passage 132 is formed below a predetermined distance from an upper end of the main heat dissipation body 130, and when divided into these, the first inner portion 133, the second inner portion 134 and the third inner portion ( 135).

The first inner portion 133 is smaller than the outer diameter of the rib 111b of the light emitting device 110 but extends downward in a predetermined length to an inner diameter into which the body 111a of the light emitting device 110 can be inserted. The extension length of the first inner portion 133 is preferably formed to have a length corresponding to the length of the body portion 111a.

The second inner portion 134 has an inner diameter extended than the first inner portion 133 so that the rib 111b can enter and extends downward from a lower end of the first inner portion 133. .

The third inner portion 135 has a larger inner diameter than the second inner portion 134 at the end of the second inner portion 134 and extends downward.

The first screw thread 136 for coupling the sub heat dissipation body 150 is formed on the third inner portion 135.

The main heat dissipation body 130 is formed in a cylindrical shape, but a plurality of inlet grooves 137 inserted in a horizontal direction to the outside are spaced apart from each other in the vertical direction. The inlet groove 137 is to increase the heat dissipation efficiency by increasing the contact area with the outside air.

The main heat dissipation body 130 is preferably formed of an aluminum material.

The sub heat dissipation body 150 is formed to be screwed into a predetermined portion in the main heat dissipation body 130.

The sub heat dissipation body 150 may have the lead fins 115 of the light emitting device 110 installed to be constrained between the first inner part 133 and the second inner part 134 of the main heat dissipation body 130. It has an inner diameter that can be accommodated and has a second inner flow passage 152 penetrating up and down.

In addition, a third screw line 159 is formed in the second internal flow path 152 of the sub heat dissipation body 150 from a lower end portion to a predetermined length portion.

The outer surface of the sub heat dissipation body 150 may be divided into a first outer part 153, a second outer part 154, and an extension part when the outer surface of the sub heat dissipation body 150 is divided along the lower direction.

The first outer portion 153 is formed to have a first outer diameter capable of entering the second inner portion 134 of the main heat dissipation body 130 to support the light emitting device 110 thereunder.

The second outer portion 154 has a second outer diameter extended from the lower end of the first outer portion 153 than the first outer diameter of the first outer portion 153, and the first screw line 136 of the main heat dissipation body 130. ) Is formed with a second threaded line 155 that can be screwed together.

The extension portion extends smaller than the outer diameter of the third outer portion 157 at the lower end of the second outer portion 154 and the third outer portion 157 extending downward and at the end of the third outer portion 157. And a fourth outer portion 158 having a defined outer diameter.

The third outer portion 157 is a portion that enters the main heat dissipation body 130 in an assembled state with the main heat dissipation body 130, and the fourth outer portion 158 further extends downwardly from the main heat dissipation body 130. Induces aesthetics and further expands the coupling space with the support 200, which will be described later, and functions as a handle for the paddle when combined with the main heat dissipation body 130.

On the fourth outer portion 158, a plurality of inlet grooves 160 spaced along the vertical direction in the same pattern as the inlet grooves 137 formed on the outer surface of the main heat dissipation body 130 are formed.

Of course, a screw thread (not shown) may be formed on the fourth outer portion 158 to screw the coupling object.

In this assembly structure, the lead pin 115 is connected to the coated wire 180 to be connected to the electrical coupling object through the first internal flow path 132 and the second internal flow path 152 of the sub heat dissipation body 150. It is desirable to extend outwardly.

The sub heat dissipation body 150 is formed of a heat dissipation material, for example, aluminum material.

The light emitting device 100 enters the light emitting device 110 along the first internal flow path 132 from the lower portion of the main heat dissipation member 130, and the main heat dissipation with the second screw line 155 of the sub heat dissipation member 150. When the first screw thread 136 of the member 130 is rotated to be screwed together, the assembly is completed, and when dismantling, the first screw line 136 is rotated in the opposite direction. In this assembly structure, the heat transferred from the light emitting diode chip 117 of the light emitting device 110 through the heat dissipation main board 111 is maintained in contact with the side and bottom of the heat dissipation main board 111, respectively. By being discharged through the 130 and the sub heat dissipation body 150, the heat dissipation efficiency can be increased, and the inclined surface 131 of the main heat dissipation body 130 provides an advantage of increasing the light focusing efficiency.

The combination of the main heat dissipation body 130, the light emitting element 110, and the sub heat dissipation body 150 may be used as a unit for illumination. That is, the light emitting device 100 has a screw thread that can be screwed with a screw thread formed on the sub heat dissipation body 150 to support the support, and is coupled to a support installed to supply power through a wire connected to the lead pin 115. Can be used.

In this embodiment, as an example, the stand type support 200 is illustrated.

The support 200 is formed to be screwed with the third screw line 159 of the sub heat dissipation body 150.

The support 200 includes a stand 210, a vertical rod 220, and a pivot 230.

The stand unit 210 is formed in a shape that can be supported on the floor, but has an internal space 212.

The stand portion 210 is formed in a bell shape, and a plurality of coupling holes are formed in the stepped jaw portion.

The outer surface of the stand portion 210 is formed with a vent hole 214 in communication with the internal space.

A driving circuit board (not shown) for driving the light emitting device 110 is embedded in the internal space of the stand unit 210. The driving circuit board may include an AC-DC converter (not shown) when using an external commercial AC power source. The driving circuit board installed in the internal space 212 of the stand part 210 may be mounted on a bracket (not shown) having a screw rod 217 that can enter through a coupling hole, and the screw rod 217 The nut may be fixed with a nut having an outer diameter larger than that of the coupling hole.

The vertical rod 220 has a hollow 222 extending a predetermined length from the top of the stand portion 210 and communicating with the internal space 212 of the stand portion 210.

The upper end of the vertical rod 220 is formed with a rotating guide groove 225 cut downward to allow the rotating body 230 to be rotated in a predetermined angle range.

Rotating member 230 is hinged rotatably with respect to the vertical bar 220 at the top of the vertical bar (220).

As a hinge coupling method to the vertical bar 220 of the rotating body 230, the rotating body 230 is accommodated by the interference fit inside the upper end of the vertical bar 220, but guides the rotation of the rotating body 230 An insertion groove formed to be inserted inwardly is formed, and one end of the rotating body 230 has a structure formed to be rotatable in a fitted state to the fitting groove.

The other end of the rotating body 230 has a fourth screw line 234 is formed on the outer surface to be screwed with the third screw line 159 of the sub heat dissipation body 150 and has a hollow 235 therein.

On the other hand, unlike the illustrated example can be used in combination with the sub heat dissipation body 150 to the support formed to be screwed with the third screw on the wall or other fixture.

As described above, according to the light emitting device according to the present invention, the light emitting device can be restrained from entering the lower portion of the main heat dissipation body, so that the assembly and disassembly is easy, and the surface contact of the light emitting device has a large surface area. It is emitted through the heat dissipation body, the main heat dissipation body having an inclined surface provides an advantage to increase the luminous efficiency and heat dissipation ability.

Claims (5)

A heat dissipation main board formed of a heat dissipation material having a body part having an upper receiving groove formed therein, a rib protruding outwardly of the body part from the lower part of the body part, and formed of an insulating material; A plurality of insulating beads inserted through the bottom surface of the receiving groove at the bottom of the plurality of leads, a plurality of lead pins installed through the insulating beads, and mounted in the receiving groove of the heat dissipation main substrate and electrically connected to the lead pins. A light emitting element having a light emitting diode chip connected by; A first inner passage formed of a heat dissipating material and having a first inner passage penetrating up and down, wherein the first inner passage blocks the entry of the rib and extends downward in a predetermined length to an inner diameter through which the body portion can be inserted; A second inner portion extending downwardly by a predetermined length to an inner diameter through which the rib can enter at a lower end of the first inner portion, and having a larger inner diameter than the second inner portion at the end of the second inner portion and extending downward; A main heat dissipation body having a third inner portion, wherein a first screw line is formed on the third inner portion; A first inner portion having a second inner flow passage penetrating up and down so that the lead pin is accommodated therein, and an outer surface thereof enters the second inner portion and has an outer diameter capable of supporting the bottom of the light emitting device; A second outer portion having an outer diameter extended from the lower portion of the first outer portion at a lower end of the first outer portion, and further extending downward from the second outer portion, the second outer portion having a second screw thread capable of being screwed with the first screw line; And a sub heat dissipation body having an extension portion. The method of claim 1, The main heat dissipation body is a light emitting device characterized in that a plurality of inlet grooves that are drawn along the outer peripheral surface on the outside are formed spaced apart from each other in the vertical direction. The method according to claim 1 or 2, The first internal flow path of the main heat dissipation body is formed below a predetermined distance from an upper end of the main heat dissipation body, and an inclined surface inclined to gradually narrow an inner diameter from the top of the main heat dissipation body to the first internal flow path; Light emitting device further comprising. The method of claim 3, And a third screw line is formed in the second internal passage of the sub heat dissipation body. The method of claim 4, wherein Further comprising: a support that can be screwed with the third screw thread, The support is Stand portion is formed in a shape that can be supported on the floor having an internal space; A vertical rod extending a predetermined length from an upper portion of the stand portion and having a hollow communicating with the inner space; A rotating part having a fourth screw thread formed on an outer surface of the vertical rod and hinged to the vertical rod so as to be screwed with the third screw of the sub heat dissipation body and having a hollow therein; Light emitting device characterized in that.

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