KR20090045782A - Led illumination lamp - Google Patents

Led illumination lamp Download PDF

Info

Publication number
KR20090045782A
KR20090045782A KR1020070111771A KR20070111771A KR20090045782A KR 20090045782 A KR20090045782 A KR 20090045782A KR 1020070111771 A KR1020070111771 A KR 1020070111771A KR 20070111771 A KR20070111771 A KR 20070111771A KR 20090045782 A KR20090045782 A KR 20090045782A
Authority
KR
South Korea
Prior art keywords
heat
heat dissipation
led
mounting enclosure
wing
Prior art date
Application number
KR1020070111771A
Other languages
Korean (ko)
Inventor
양찬영
Original Assignee
주식회사 정진멀티테크놀로지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 정진멀티테크놀로지 filed Critical 주식회사 정진멀티테크놀로지
Priority to KR1020070111771A priority Critical patent/KR20090045782A/en
Publication of KR20090045782A publication Critical patent/KR20090045782A/en

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

The present invention relates to an LED lamp that maximizes heat dissipation efficiency even without installing a fan for heat dissipation. The LED lamp according to the present invention is formed in a ring shape and the heat dissipation wing mounted enclosure coupled with a heat dissipation wing along its circumference. ; A heat conductive substrate on which at least one LED is mounted; A heat conducting substrate mounting enclosure for mounting the heat conducting substrate on which the LED is mounted, corresponding to and coupled to an inner circumferential surface of the heat dissipation wing mounting enclosure, and having a plurality of heat dissipation fins and blocks for heat conduction; It comprises a socket coupled to an external power supply.

LED light, heat dissipation, wing,

Description

LED lighting lamp {LED Illumination Lamp}

The present invention relates to an LED lamp, and more particularly, to an LED lamp that significantly improved heat dissipation efficiency.

In general, various types of lamps are used to provide light or illuminate an object at night or indoors. Such lamps are powered by converting electrical energy into light energy to provide light or irradiate an object, and generally use an incandescent lamp or a fluorescent lamp.

Recently, a lamp type light emitting diode is a semiconductor device that converts electrical energy into optical radiation, and according to the purpose or form of use, a top surface of a printed circuit board or a lead terminal in which a chip light emitting diode is selectively formed After mounting on the chip, the chip and the board or the lead terminal are electrically connected to each other, and the mold molded part is formed by using an epoxy or the like thereon. At this time, it is well known that the structure, growth method, and material of the chip vary according to the color emitted from the light emitting diode. Light bulbs can be manufactured using such lamp type light emitting diodes.

However, in recent years, there is an attempt to manufacture a light bulb using a high power white light emitting diode as a light source for a durable light bulb that can reduce power consumption, increase illumination, and can be used for a long time. The high power white light emitting diode bulb manufactured by using the same has low power consumption, has a power saving effect, and is durable because it can be used semi-permanently due to the characteristics of the LED. In addition, when illuminating the light of the plurality of high power white light emitting diodes, the illumination intensity may be variously adjusted by adjusting the number of installation of the high power white light emitting diode and the supply current. Therefore, the merchandise and reliability of the product itself can be greatly improved. However, such a light bulb generates a lot of heat due to a high current, high brightness chip called a high power white light emitting diode. Therefore, there is a need to release the internal heat of high power white light emitting diodes and the substrates on which they are mounted.

Accordingly, in recent years, various researches for dissipating heat of LED lighting have been made, and the main direction thereof is a method of installing a separate heat dissipation fan.

Representatively, in Korean Utility Model Registration No. 20-0336197, a heat dissipation fin which is integrated with the central portion and becomes a circumferential bulkhead, a cooling fan that circulates air by being stored in the circumferential bulkhead of the heat dissipation fin, and rectifies AC power with DC. And a printed circuit board attached to the rear end of the heat dissipation fin, a socket electrically connected to the receptacle for the incandescent lamp, and a plurality of LEDs arranged on the upper surface of the central portion of the heat dissipation fin. Each LED is also covered with a transparent cover.

According to such a configuration, the front irradiation lamp for LED of Utility Model Registration No. 20-0336197 can obtain high illuminance even with low energy, and provides a structure in which the LED can be integrated only on the front surface to limit the irradiation direction. Appropriate illuminance can be obtained according to the requirement, and the cooling efficiency by the fan is excellent, so that sufficient performance can be achieved even in continuous use and the life can be extended.

However, such a method of separately mounting the heat dissipation fan has a complicated configuration, and the manufacturing cost increases due to the heat dissipation fan.

In addition, a problem occurs that additional heat is generated in the heat dissipation fan while power for the heat dissipation fan is consumed.

Accordingly, it is an object of the present invention to provide a LED lamp that maximizes the heat dissipation efficiency by solving the problems derived from the prior art described above.

LED lighting lamp according to the present invention is made in the form of a ring to achieve the above object and the heat dissipation wing mounting housing coupled to the heat dissipation wing along the circumference; A heat conductive substrate on which at least one LED is mounted; A heat conducting substrate mounting enclosure for mounting the heat conducting substrate on which the LED is mounted, corresponding to and coupled to an inner circumferential surface of the heat dissipation wing mounting enclosure, and having a plurality of heat dissipation fins and blocks for heat conduction; It comprises a socket coupled to an external power supply.

The heat dissipation wing mounting enclosure has a heat dissipation wing insertion groove in a form in which a hole penetrated in the thickness direction is connected to a circumferential surface of the heat dissipation wing mounting enclosure, and the heat dissipation wing is inserted into the insertion groove.

Preferably, the heat dissipation blade includes an insertion hole formed in a shape corresponding to the heat dissipation wing insertion groove and a wing portion extending from the insertion hole.

A close contact member may be inserted into an inner space of the circumferential surface of the heat dissipation blade to enhance the adhesion between the heat dissipation blade and the heat dissipation wing mounting enclosure, and the contact member may be a bush or a spring pin.

It is preferable that the heat conductive substrate mounting housing includes a heat conductive substrate mounting groove for mounting the heat conductive substrate on which the LED is mounted on a surface of the heat dissipation fin and the heat conducting block in the opposite direction.

The heat dissipation fins may be formed in a narrower shape as the heat dissipation fins move away from the heat dissipation substrate mounting enclosure, and the heat dissipation fins may further include protrusions formed at a part farthest from the heat dissipation substrate mounting enclosure.

The heat conduction block is formed in a form that the diameter becomes smaller as the distance from the heat conducting substrate mounting enclosure becomes smaller, and the ratio of the diameter of the heat conduction block is smaller than that far away from the heat conducting substrate mounting enclosure. desirable.

A bolt fastener penetrating the heat conductive board mounting enclosure is formed at the center of the block for heat conduction, a bolt coupled to the bolt fastener, and a nut coupled to an end of the bolt, between the nut and the block for heat conduction. It may further include a combined heat sink.

Interposed between the heat sink and the nut may further include a washer to enhance the adhesion of the heat sink and the block for heat conduction, the washer may be made of copper (Cu) or copper alloy (Cu alloy).

The heat dissipation wing mounting enclosure and the heat transfer board mounting enclosure may be integrated.

LED lighting according to the present invention has a structure that is maximized to the conduction and convection of heat acting as an important element in heat dissipation can maximize the effect of heat dissipation and can reduce power consumption as well as a separate fan It has a unique structure that can reduce the possibility of mechanical and electrical defects because of its simple structure without installation.

Other features and operations of the present invention in addition to the above objects will become apparent from the detailed description of the embodiments with reference to the accompanying drawings.

The detailed description set forth below in connection with the appended drawings is made with the intention of describing preferred embodiments of the invention, and does not represent the only forms in which the invention may be practiced. It should be noted that the same or equivalent functions included in the spirit or scope of the present invention may be achieved by other embodiments.

Certain features disclosed in the drawings are enlarged for ease of description, and the drawings and their components are not necessarily drawn to scale. However, those skilled in the art will readily understand these details.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view for explaining an LED lighting lamp according to an embodiment of the present invention, Figure 2 is a view showing the components coupled to the heat dissipation wing mounting enclosure and the heat-resistant substrate mounting enclosure of the LED lighting lamp according to an embodiment of the present invention. 3 is an exploded perspective view, FIG. 3 is an assembled perspective view of FIG. 2, FIG. 4 is a plan view of FIG. 3, and FIG. 5 is for explaining heat dissipation of an LED lighting lamp according to an embodiment of the present invention. One drawing.

First, the LED lamp 1 according to an embodiment of the present invention is to maximize the heat radiation efficiency.

1 to 5, the LED lamp (1) according to an embodiment of the present invention is a heat dissipation wing mounting enclosure 100, a plurality of heat dissipation fins 220 and thermoelectric coupled to the heat dissipation wing 120 The thermally conductive substrate mounting enclosure 200 having the stealing block 230 formed thereon, a thermally conductive substrate (HTB) for mounting a light emitting diode (hereinafter referred to as "LED"), and the thermally conductive substrate mounting via the thermally conductive block 230. A heat sink 260 coupled to the enclosure 200, a printed circuit board 280 (PCB) electrically connected to the heat transfer substrate HTB, and a socket 300 electrically connected to the outside is provided.

It will be described below in more detail.

First, the heat dissipation wing mounting enclosure 100 is formed in a circular ring shape having a predetermined thickness, and although not shown in the drawing, a thread or a screw bone may be formed on the inner circumferential surface of the ring. In this case, the heat dissipation wing mounting enclosure 100 is made of aluminum (Al) or aluminum alloy (Al alloy) or other metal having excellent thermal conductivity, and the heat dissipation wing insertion groove 110 is formed on the circumference thereof.

The heat dissipation wing insertion groove 110 has a shape in which a hole penetrating the thickness direction of the heat dissipation wing mounting enclosure 100 is connected to a circumferential surface of the heat dissipation wing mounting enclosure 100.

The heat dissipation blade is inserted into the heat dissipation blade insertion groove 110. The heat dissipation wing 120 is composed of an insertion hole 121 having a substantially ring shape corresponding to the shape of the heat dissipation wing insertion groove 110 and a wing portion 122 extended from the insertion hole 121.

When the heat dissipation wing 120 is inserted into the heat dissipation wing insertion groove 110, in order to improve the adhesive force with the heat dissipation wing mounting enclosure 100, in the circumferential surface inner space of the ring-shaped insertion hole 121 is approximately fin-shaped Of the close contact member 130 is inserted into the heat dissipation blade insertion groove 110 is inserted.

As the contact member 130, a bush or a spring pin may be used. In addition, the close contact member 130 is to allow the insertion opening 121 of the heat dissipation blade to be in close contact with the heat dissipation wing mounting enclosure 100, because heat conduction affects the adhesion strength. When heat is conducted through two different media, more heat is conducted in areas where the adhesion strength is large. Therefore, the adhesion strength of the heat dissipation wing 120 and the heat dissipation wing mounting enclosure 100 is increased by the adhesion member 130, so that the heat of the heat dissipation wing mounting enclosure 100 is more smoothly. Can be reversed.

On the other hand, the LED is mounted on a disc-shaped heat transfer substrate (HTB). At this time, the method of mounting the LED on the heat transfer substrate (HTB) is various, and in general, the LED is mounted on the heat transfer substrate (HTB) by a soldering method. In addition, as LEDs that can be used in the present invention, LEDs of various outputs and colors may be used.

The heat conductive substrate (HTB) on which the LED is mounted is one surface of the heat conductive substrate mounting enclosure 200 made of a material having excellent thermal conductivity such as aluminum or an aluminum alloy, for example, a socket for a lighting lamp according to an embodiment of the present invention. When 300 is installed on the ceiling, it is seated on a lower surface corresponding to the ground.

In this case, the heat transfer board mounting enclosure 200 may be made of the same material as the heat dissipation wing mounting enclosure 100. In addition, the heat conductive substrate mounting housing 200 may be formed in a substantially disk shape, and the heat conductive substrate mounting groove 210 may be provided on a lower surface of the heat conductive substrate mounting housing 200 so as to mount the disc heat conductive substrate (HTB). The recessive substrate HTB is allowed to rest.

In addition, a plurality of heat dissipation fins 220 for discharging heat generated during the use of the LED lamp 1 of the present invention to the outside is formed on the upper surface of the heat transfer substrate mounting enclosure 200, and a disc In the center of the heat conduction block 230 is formed.

As described above, the heat dissipation fin 220 is formed to protrude from the top surface of the heat conductive substrate mounting enclosure 200, and the width of the heat dissipation fin 220 becomes narrower from the top surface of the heat conductive substrate mounting enclosure 200. The protrusion 221 is formed at a portion farthest from the heat-transfer substrate mounting enclosure 200. This is to maximize the area that the heat dissipation fin 220 is in contact with the air as much as possible, so that the air rising by the heat released can be smoothly escaped without being disturbed by the flow.

The heat conduction block 230 is for conducting the heat conducted from the heat conductive substrate mounting enclosure 200 upwards, and has a shape of a rotating body such as a truncated cone. At this time, the heat conduction block 230 is preferably formed in the form that the diameter gradually decreases toward the top in order not to interfere with the movement of the heat, that is, the movement of the heated air by one of the movement of the heat, More preferably, the ratio of the heat conduction block 230 is smaller than that of the portion close to the heat conductive substrate mounting enclosure 200 than the portion far away. This is to prevent the thermally conductive block 230 from disturbing the flow of air. In addition, the heat conduction block 230 has a bolt fastener 231 through which the bolt 240 can be fastened through the heat conductive substrate mounting enclosure 200 at the center thereof. The bolt 240 is coupled through the bolt fastener 231 from the lower surface direction to the upper surface direction of the heat conductive substrate mounting enclosure 200, and the nut 250 is coupled to the rear direction. At this time, the bolt 240 has a through hole 241 formed in the longitudinal direction thereof.

In addition, a substantially hemispherical heat sink 260 is coupled between the nut 250 and the heat conduction block 230. The heat sink 260 is coupled to the bolt 240 through a hole 261 formed in the bottom surface of the hemisphere, and is fixed through the nut 250 to be coupled to the heat conduction block 230. The heat sink 260 is for dissipating heat conducted through the heat conduction block 230 to the outside, and is formed in a hemispherical shape to maximize the contact area with air.

In addition, a washer 270 is disposed between the nut 250 and the heat dissipation plate 260 so that the heat dissipation plate 260 is in close contact with the heat conduction block 230 so as to smoothly conduct heat conduction.

The washer 270 is, of course, preferably made of copper (Cu) or copper alloy (Cu alloy) excellent in thermal conductivity.

Then, a printed circuit board (PCB) 280 is disposed to be electrically connected to the heat conductive substrate HTB through an electrical wiring (not shown) through the through hole 241 of the bolt 240.

On the other hand, a screw bone or a screw thread may be formed on the circumferential surface of the heat transfer board mounting enclosure 200.

As described above, the heat transfer board mounting enclosure 200 to which the heat dissipation plate 260 is coupled is coupled to the inner circumferential surface of the heat dissipation wing mounting enclosure 100. At this time, the coupling method is not shown in the figure, it may take a screw coupling method. This is to ensure that the heat dissipation wing mounting enclosure 100 and the heat conductive substrate mounting enclosure 200 are closely coupled.

The combined heat dissipation wing mounting enclosure 100 and the heat conductive substrate mounting enclosure 200 are coupled to the socket 300.

At least one socket air hole 310 for dissipating heat to the outside by convection is formed in a portion of the socket 300.

In addition, a cover 320 may be further installed on the upper portion of the socket 300, that is, the ceiling direction, to prevent rain from penetrating into the interior of the LED lamp 1.

Hereinafter, the heat radiation mechanism of the LED lamp 1 according to the embodiment of the present invention as described above.

First, when power is supplied to the LED lamp 1 according to an embodiment of the present invention, the LED lamp 1 emits light.

Generally, about 20% of the power supplied to the LED lamp 1 is consumed as light energy, and the rest of the LED lamp 1 is consumed as heat energy by acting as a resistance on an electric circuit.

That is, when the LED lamp 1 starts to operate, heat is generated together with the light.

The heat thus generated is released as shown in FIG. 5.

In more detail, first, heat generated in the LED lamp 1 is conducted to the heat transfer substrate HTB.

The heat conducted to the heat transfer substrate (HTB) is conducted to the upper surface direction of the heat transfer substrate mounting enclosure 200 and the heat dissipation wing mounting enclosure 100 through the heat transfer substrate mounting enclosure 200.

First, the release of heat conducted to the heat dissipation wing mounting enclosure 100 will be described. The heat conducted to the heat dissipation wing mounting enclosure 100 is conducted to the heat dissipation wing 120 and is discharged to the outside from the heat dissipation wing.

At this time, the LED lamp (1) of the present invention by inserting the close contact member 130 in the circumferential surface of the insertion hole 121 of the heat dissipation wing 120, the adhesion between the heat dissipation wing 120 and the heat dissipation wing mounting enclosure 100. Strengthened. Therefore, heat may be more smoothly conducted from the heat dissipation wing mounting enclosure 100 to the heat dissipation wing 120.

On the other hand, the path of the heat conducted in the upper surface direction of the heat transfer substrate mounting enclosure 200 can be largely divided into three types.

In more detail, it is divided into heat conducted by the heat dissipation fin 220, heat conducted by the heat conduction block 230, and heat conducted by the bolt 240.

Heat conducted to the heat dissipation fin 220 is discharged to the top at the top of the heat dissipation fin 220, that is, near the protrusion.

The heat conducted to the heat conduction block 230 is conducted to the heat dissipation plate 260 in close contact with and coupled to the heat conduction block 230 by the bolt 240 and the nut 250, and is discharged through the heat dissipation plate 260. do. In this case, the heat dissipation plate 260 may be in close contact with the heat conduction block 230 through the washer 270, and heat may be more smoothly conducted through the heat conduction block 230.

In addition, the heat conducted through the bolt 240 is discharged to the outside through the heat dissipation plate 260 coupled with the heat conducting block 230.

And some of the heat is released into the air before the heat conduction of the heat transfer substrate mounting enclosure 200 is moved by the air rising along the inner space.

As described above, the heat discharged through the heat transfer substrate mounting enclosure 200 is transferred to the air inside the socket 300.

When the air inside the socket 300 receives heat and rises in temperature, convection occurs.

When convection occurs, it is emitted to the outside of the LED lamp 1 according to an embodiment of the present invention through the air hole 310 formed in the socket 300.

On the other hand, the LED lamp (1) according to an embodiment of the present invention as described above is made of the heat dissipation wing mounting enclosure 100 and the heat transfer board mounting enclosure 200 is separated, the degree of heat dissipation desired by the user Accordingly, the size and shape of the heat dissipation wing 120 can be freely selected. That is, when the degree of heat dissipation desired by the user is large, the number of heat dissipation wings 120 may be increased, or a larger heat dissipation wing mounting enclosure 100 may be combined to enable a large heat dissipation wing 120 to be coupled thereto. If the place used is a narrow place, such as to combine the small size of the heat dissipation wing mounting enclosure 100, it is possible to freely separate the various heat dissipation wing mounting enclosure 100 according to the user's choice. Do.

6 is a cross-sectional view for explaining an LED lamp according to another embodiment of the present invention, Figure 7 is an assembled perspective view of the housing portion of the LED lamp according to another embodiment of the present invention.

6 and 7, an LED lamp 2 according to another embodiment of the present invention is structurally similar to the embodiment of the present invention shown in FIGS. 1 to 5.

However, only the structure in which the heat dissipation wing mounting enclosure 100 and the heat transfer substrate mounting enclosure 200 of the LED lighting lamp according to the embodiment of the present invention are integrally formed is different. That is, the heat dissipation wing 120, the heat dissipation fin 220 and the block for heat conduction 230 is configured in one housing (Body).

In more detail, the LED lamp 2 according to another embodiment of the present invention is formed with a heat-transfer substrate mounting groove 210 for mounting the heat-transfer substrate (HTB) on the lower surface of the disc (Body), the enclosure The heat dissipation blade insertion groove 110 is formed in the outer portion along the circumference of the body, and the heat dissipation wing 120 is inserted therein. At this time, the heat dissipation wing 120 is in close contact with the body (Body) through the contact member 130 is enhanced.

In addition, a plurality of heat dissipation fins 220 are provided on the upper surface of the enclosure as in the embodiment, and a block for thermal conduction 230 is formed in the center portion.

Since the following configuration is the same as the embodiment of the present invention will be omitted.

LED lighting (2) according to another embodiment of the present invention as described above is increased the heat emission effect through the heat dissipation wing 120 compared to the LED lighting (1) according to an embodiment of the present invention.

This is because the enclosure according to an embodiment of the present invention is divided into a heat dissipation wing mounting enclosure 100 and a heat transfer board mounting enclosure 200, the heat dissipation wing mounting enclosure (200) in the heat transfer board mounting enclosure (200). In the process of conducting heat to 100), the interface acts as a resistance to heat conduction. Thus, heat is conducted less than it is conducted in one medium.

As described above, since the LED lamp 2 according to another embodiment of the present invention is made of an integrated body, the heat conducted to the heat dissipation wing 120 is the LED lamp according to the embodiment of the present invention. Greater than (1)

1 is a cross-sectional view for explaining an LED lamp according to an embodiment of the present invention.

Figure 2 is an exploded perspective view showing the components coupled to the heat dissipation wing mounting enclosure and the heat-resistant substrate mounting enclosure of the LED lamp according to an embodiment of the present invention.

3 is an assembled perspective view of FIG. 2.

4 is a plan view of FIG.

Figure 5 is for explaining the heat radiation of the LED lamp according to an embodiment of the present invention, a view showing that the heat is discharged.

6 is a cross-sectional view for explaining an LED lamp according to another embodiment of the present invention.

Figure 7 is an assembled perspective view of the housing portion of the LED lamp according to another embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

1: LED lamp 100; Heat dissipation wing mount enclosure

110; Heat dissipation blade insertion groove 120; Heat dissipation

130; Contact member 200; Heat-resistant Board Mount Enclosure

210; Heat-sensitive substrate mounting groove 220; Heat dissipation fin

230; Thermally conductive block 240; volt

250; Nut 260; Heatsink

270; Washer 280; PCB

300; Socket 310; Air hole

320; cover

Body; Enclosure HTB; An electrically conductive substrate

Claims (14)

A heat dissipation wing mounting enclosure having a ring shape and having a heat dissipation wing coupled along its circumference; A heat conductive substrate on which at least one LED is mounted; A heat conducting substrate mounting enclosure for mounting the heat conducting substrate on which the LED is mounted, corresponding to and coupled to an inner circumferential surface of the heat dissipation wing mounting enclosure, and having a plurality of heat dissipation fins and blocks for heat conduction; LED lighting lamp having a socket coupled to an external power supply. The method of claim 1, The heat dissipation blade mounting housing includes a heat dissipation wing insertion groove in which a hole penetrated in the thickness direction is connected to a circumferential surface of the heat dissipation wing mounting enclosure, LED lamp, characterized in that the heat dissipation wing is inserted into the insertion groove. The method of claim 2, The heat dissipation wing is an LED lamp, characterized in that it has an insertion hole formed in a shape corresponding to the heat dissipation wing insertion groove and a wing portion formed in the shape extending from the insertion hole. The method of claim 3, wherein LED lighting lamp, characterized in that the close contact member for strengthening the adhesion between the heat dissipation wing and the heat dissipation wing mounting enclosure. The method of claim 4, wherein The close contact member is an LED lamp, characterized in that the bush or spring pin. The method of claim 1, The heat conducting substrate mounting housing is characterized in that the heat-resistant substrate mounting groove for mounting the heat-sensitive substrate on which the LED is mounted on the surface of the heat dissipation fin and the block for the heat conduction. The method of claim 1, The heat dissipation fin is LED lamp, characterized in that the width becomes narrower away from the heat-resistant substrate mounting enclosure. The method of claim 7, wherein The heat dissipation fin further comprises a projection formed in the furthest portion of the heat-resistant substrate mounting housing. The method of claim 1, The heat conduction block is an LED lamp, characterized in that the rotating body of the shape becomes smaller as the distance away from the heat-sensitive substrate mounting enclosure. The method of claim 9, The ratio of the diameter of the thermally conductive block is small is the LED lamp, characterized in that the portion close to the heat conductive substrate mounting enclosure is larger than the distant portion. The method of claim 1, A bolt fastener penetrating the heat conductive substrate mounting housing is formed at the center of the heat conducting block. The bolt is coupled to the bolt fastener, the nut is coupled to the end of the bolt, LED lighting lamp further comprises a heat sink coupled between the nut and the block for heat conduction. The method of claim 11, Interposed between the heat sink and the nut LED lighting lamp further comprises a washer to enhance the adhesion of the heat sink and the block for heat conduction. The method of claim 12, LED washer, characterized in that the washer is made of copper (Cu) or copper alloy (Cu alloy). The method of claim 1, LED lamp, characterized in that the heat dissipation wing mounting enclosure and the heat-resistant substrate mounting enclosure is integrated.
KR1020070111771A 2007-11-02 2007-11-02 Led illumination lamp KR20090045782A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070111771A KR20090045782A (en) 2007-11-02 2007-11-02 Led illumination lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070111771A KR20090045782A (en) 2007-11-02 2007-11-02 Led illumination lamp

Publications (1)

Publication Number Publication Date
KR20090045782A true KR20090045782A (en) 2009-05-08

Family

ID=40855829

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070111771A KR20090045782A (en) 2007-11-02 2007-11-02 Led illumination lamp

Country Status (1)

Country Link
KR (1) KR20090045782A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101012474B1 (en) * 2009-05-29 2011-02-08 주식회사 에이팩 Heat Sink for LED Lighting
KR20200040381A (en) * 2018-10-10 2020-04-20 (주)와이드윙스 Lamp apparatus for plant

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101012474B1 (en) * 2009-05-29 2011-02-08 주식회사 에이팩 Heat Sink for LED Lighting
KR20200040381A (en) * 2018-10-10 2020-04-20 (주)와이드윙스 Lamp apparatus for plant

Similar Documents

Publication Publication Date Title
US8414160B2 (en) LED lamp and method of making the same
KR101039073B1 (en) Radiator and Bulb Type LED Lighting Apparatus Using the Same
KR100932192B1 (en) A led light apparatus having the advanced radiation of heat
US7513653B1 (en) LED lamp having heat sink
US7847471B2 (en) LED lamp
US7810960B1 (en) Light fixture assembly having improved heat dissipation capabilities
KR101032415B1 (en) Radial type radiator and LED lighting apparatus of bulb type using the same
US20080024067A1 (en) LED lighting device
US8833977B2 (en) Lighting apparatus
KR101007913B1 (en) Radiator of helical type and LED lighting apparatus of bulb type using the same
JP3116108U (en) Light emitting diode set
JP5557105B2 (en) Lamp with lamp and lighting equipment
JP2008186758A (en) Self-ballasted lighting led lamp
KR100899977B1 (en) Heat sink device of light emitting diode lamp
KR100910917B1 (en) Heat sink device of light emitting diode module for lighting equipment
US20110298352A1 (en) Led lamp and methods of manufacturing the same
US8740422B2 (en) Bulb and luminaire
KR101231658B1 (en) LED lamp provided an improved capability of discharging heat
KR100864585B1 (en) Lamp structure utilizing a light emitting diode
KR20090045782A (en) Led illumination lamp
TW201043851A (en) LED lamp with heat dissipating structure
TWI435028B (en) Lighting bulbs
US20130099668A1 (en) Led lamp with an air-permeable shell for heat dissipation
CN103765096A (en) Lighting lamp
KR20110024214A (en) Led illuminating having enhanced intensity

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
NORF Unpaid initial registration fee