KR101007913B1 - Radiator of helical type and LED lighting apparatus of bulb type using the same - Google Patents

Radiator of helical type and LED lighting apparatus of bulb type using the same Download PDF

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Publication number
KR101007913B1
KR101007913B1 KR1020080096647A KR20080096647A KR101007913B1 KR 101007913 B1 KR101007913 B1 KR 101007913B1 KR 1020080096647 A KR1020080096647 A KR 1020080096647A KR 20080096647 A KR20080096647 A KR 20080096647A KR 101007913 B1 KR101007913 B1 KR 101007913B1
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KR
South Korea
Prior art keywords
heat dissipation
body
led package
led lighting
led
Prior art date
Application number
KR1020080096647A
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Korean (ko)
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KR20100037354A (en
Inventor
이재영
임현철
정상동
Original Assignee
주식회사 아모럭스
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Priority to KR1020080096647A priority Critical patent/KR101007913B1/en
Publication of KR20100037354A publication Critical patent/KR20100037354A/en
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Publication of KR101007913B1 publication Critical patent/KR101007913B1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/78Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/02Globes; Bowls; Cover glasses characterised by the shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

The present invention relates to a heat dissipation device capable of maximizing a heat dissipation effect while mounting a plurality of LEDs on a substrate surface using a polygonal metal PCB and a bulb type LED lighting device using the same. The heat dissipation device according to the present invention comprises a body having a central passage and disposed between a plurality of LED integrated LED package and a screw cap for applying power to the LED package; And a heat dissipation fin formed integrally with the body and extending helically on the outer circumferential surface at equal intervals along the longitudinal direction of the body. The present invention provides an effect of high heat dissipation efficiency of heat transferred from the LED package despite mounting the plurality of LEDs.
LED, lighting, heat dissipation, heat sink, spiral

Description

Spiral heat dissipation device and bulb type LED lighting apparatus using same {Radiator of helical type and LED lighting apparatus of bulb type using the same}

The present invention relates to a heat dissipation device and a bulb type LED lighting device using the same, and in particular, a heat dissipation device that maximizes the light emission characteristics and lifetime of the LED by efficiently dissipating heat generated from the bulb type LED lighting device and the bulb type LED using the same It relates to a lighting device.

Generally, in order to use a light emitting diode (LED) as a white light source for lighting, red, green, and blue LEDs are produced in a single package to generate white light by three-element light (in this case, The voltage and current applied to each LED must be precisely adjusted so that the illumination of each light is uniform.), And the light emitted from the blue or yellow LED passes through the yellow or blue phosphor so that the short wavelength is light of various wavelengths. In this case, a pseudo white is obtained, or near ultraviolet rays pass through a phosphor, and a white color is produced like a fluorescent lamp.

Among them, a white light source combining a blue LED, an ultraviolet LED, and a fluorescent material is the mainstream.

The fluorescent material may be coated on a hemispherical cover of a lighting fixture, or a method of attaching a phosphor tape to the front surface, and in some cases, may be configured by coating a phosphor on the surface of the LED.

The white light source using the LED as described above has been spotlighted as a new illumination light source because of its excellent luminous efficiency, high luminous intensity, high speed response and long life.

That is, the illuminance of 40 to 60W incandescent light bulbs can be replaced with 5-10W power using about 80 LEDs, and the 100W incandescent light bulb can implement the same illuminance at about 13W power using 128 LEDs. As a result, much less power is consumed to achieve the same illuminance environment as compared to conventional "A" type (ie bulb type) incandescent bulbs as well as fluorescent lamps.

By the way, the lighting LED having the above characteristics is generated a lot of heat in the process of converting electrical energy into light, this heat not only lowers the light emitting characteristics of the LED, but also acts as a factor to shorten the life of the LED Have

Therefore, in order to use LED lighting efficiently, it is essential to have a temperature condition for LED to operate normally.

In order to solve the heat dissipation problem, there is also a method of reducing the amount of current supplied to the LED to emit light. However, since it directly lowers the brightness of the LED, it is a method of lowering utility as a light source.

In order to solve this problem, conventionally, as shown in Figures 1 and 2, LED (LED) luminaire 100 is a light source unit in which a plurality of LEDs 111 are installed on the PCB 113, and the PCB ( Comprising a heat dissipation means (130) bonded to the 113 and the housing 150 for receiving and supporting the light source and the heat dissipation means 130, a power connection for connecting the PCB 113 and the power to the housing 150 151, including.

The heat dissipation means 130 is formed in a vertical cylindrical shape around the housing 150 and the heat dissipation fins 133 for extending the heat dissipation area are protruded at a predetermined interval around the heat dissipation fins 133 and the heat dissipation fin gap space 131 is alternately arranged unevenly.

That is, the heat dissipation fin 133 and the clearance space 131 is arranged in a cylindrical shape at a predetermined interval around the heat dissipation means 130, this configuration is the surface area by the heat dissipation fin 133 in an environment where the ventilation is smoothly Due to expansion, heat dissipation is achieved.

However, in an environment in which ventilation is not naturally achieved, such as when the lighting device having such a structure is inserted into a buried hole formed in the ceiling, the lower point 133a adjacent to the PCB 113 and the PCB 113 are most The temperature difference between the distant upper point 133b is less than 10% (see FIG. 1), and the temperature difference between the heat dissipation fin 133 and the clearance gap 131 is less than 10% (see FIG. 2).

Heat dissipation for heat dissipation increases efficiency as the temperature difference between the heat dissipation fin 133 and the gap space 131 increases, but when the temperature difference is less than 10% as described above, heat dissipation is not performed properly.

This is because the air staying in the gap space 131 of the heat dissipation fin 113 is stagnant in the state of absorbing heat, so that most of the space except the outermost part of the heat dissipation fin 113 does not have proper heat dissipation. have.

In some cases, a fan is used to force air convection for efficient heat dissipation. However, the life of the fan is shorter than that of the LED. .

In order to solve the problems of the above-described technology, a fanless heat dissipation LED lighting device of Patent No. 10-0778235 is disclosed, which will be described with reference to FIG.

Referring to FIG. 3, the heat dissipation area is far from the luminaire body by attaching a heat dissipation plate 230 having a lamp structure on the side end of the PCB 200 on which the LED 210 is mounted and having an uneven portion 231 formed thereon. It is a technology that expands the convection space required for heat dissipation by expanding.

However, since the PCB 200 and the heat sink 230 are not integrated, the interface is formed on the heat transfer path, so that the heat transfer is poor due to the interface effect. In contrast, due to the limitations of heat transfer rate and heat dissipation area, there is an unsuitable problem.

In addition, the lighting fixture having a structure as shown in Figure 3 has a problem that can not be used as a fully embedded lighting fixture due to the structure of the heat sink 230, the LED is mounted on a flat structure PCB, but the direct portion is bright but side As it is relatively dark, the light distribution characteristics are bad, and in order to solve this problem, when a separate reflector is to be installed and used at the center, there is a problem in that the size of the lighting fixture is increased.

Meanwhile, there is an LED package having a structure in which a plurality of LEDs are mounted on a plurality of metal PCBs for high illumination and attached to a polygonal pipe serving as a heat sink, but this is the same as described above between the metal PCB and the pipes. The heat dissipation does not occur smoothly due to the transfer interface, there is a problem that is not suitable as a heat dissipation structure of the high illuminance (that is, high watt) LED lighting fixture.

Accordingly, an object of the present invention is to provide a spiral heat dissipation device and a bulb-type LED lighting device using the same while mounting a plurality of LEDs on the substrate surface using a polygonal metal PCB (maximum heat dissipation effect). There is.

Another object of the present invention by using a metal PCB made of a polygonal (metal PCB) by combining a plurality of LED-mounted LED package on the substrate surface with a heat dissipation device to implement a high-illuminance LED lighting fixture It is to provide an LED lighting device that can be easily utilized as a recessed lighting fixture by implementing the LED lighting fixture in a compact size.

Still another object of the present invention is to provide an LED lighting apparatus that can easily and easily manufacture an LED lighting apparatus having high light intensity and excellent light distribution characteristics, thereby increasing assembly and mass productivity and reducing manufacturing costs.

In order to achieve the above object, the spiral radiator for LED lighting device according to the present invention is a body having a central passage disposed between the LED package and a screw cap for applying power to the LED package and a plurality of LEDs; And a heat dissipation fin formed integrally with the body and extending helically on the outer circumferential surface at equal intervals along the longitudinal direction of the body.

Here, the heat radiation fin is preferably formed so that the conduction of heat and the flow of air continuously along the air inlet space from the lower side to the upper side thereof so that a blocking phenomenon does not occur.

The body has a plurality of convection holes for communicating the central passage and the outside, and forms a seating groove in the inner side of the central passage.

In addition, the body has a snap coupling portion that can be snapped to the outer upper end of the central passage.

According to a feature of the invention, the bulb type LED lighting device includes a LED package mounted with a plurality of LEDs on a metal substrate; A screw cap for applying power to the LED package; A heat dissipation device in which the LED package is mounted at one side and the screw cap is mounted at the other side; And a glove for casing the LED package, wherein the heat dissipation device comprises: a body having a central passage disposed between the LED package having a plurality of LEDs integrated therein and a screw cap for applying power to the LED package; And a heat dissipation fin formed integrally with the body and extending helically on the outer circumferential surface at equal intervals along the longitudinal direction of the body.

According to another feature of the invention, the bulb type LED lighting device includes a LED package mounted with a plurality of LEDs on a metal substrate; A screw cap for applying power to the LED package; The LED package is mounted on one side, and the screw cap is mounted on the other side, and a body and a body having a central passage are disposed between the LED package in which a plurality of LEDs are integrated and a screw cap for applying power to the LED package. A heat dissipation device having a heat dissipation fin formed integrally with an outer circumferential surface and extending in a spiral shape at equal intervals along the longitudinal direction of the body; And a cylindrical elongated hemispherical glove for casing the LED package.

 The body is provided with a seating groove in the inner side of the central passage, and is installed in the seating groove further includes an LED driving circuit for driving the LED package.

In addition, the body is snap-coupled with the screw cap to form a snap-coupled snap portion on the outer upper end of the central passage.

The body further includes a flange for screwing to form a threaded portion in the lower portion, the flange is snapped to the glove by forming a snapping portion on the outer peripheral surface.

The metal substrate is made of a polygonal surface including a lower surface, preferably consisting of a plurality of unit substrates or an integral single substrate bent into polygons.

As described above, in the present invention, the heat dissipation efficiency is improved through a heat dissipation device that can effectively dissipate heat transferred from the LED package despite mounting and mounting a plurality of LEDs on the surface of the substrate using a metal substrate made of a polygonal pipe. It can be increased to realize a high illumination LED lighting device.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration of the heat dissipation device and the bulb-type LED lighting device using the same according to an embodiment of the present invention.

Figure 4 is a perspective view of a bulb-type LED lighting apparatus according to an embodiment of the present invention.

Referring to FIG. 4, the bulb type LED lighting device 1 according to an embodiment of the present invention includes an LED package 10, a spiral heat sink 30, a cylindrical hemispherical globe 50, and a screw cap 70. ).

The LED package 10 includes a plurality of LEDs 13 mounted on an outer surface of a metal PCB 11 made of an octagonal pipe including a bottom surface. The LED package 10 is cased by the glove 50 to the outside. A heat dissipation device 30 for dissipating heat from the plurality of LEDs 13 is formed above the casing-treated LED package 10 by the glove 50. The heat dissipation device 30 is formed by winding a heat dissipation fin in a spiral shape so as to be spaced apart at equal intervals. The screw cap 70 is coupled to the upper portion of the heat dissipation device 30 to be inserted into a conventional socket.

Hereinafter, the bulb-type LED lighting apparatus according to an embodiment of the present invention will be described in more detail with reference to A-A 'cross-sectional view and an exploded cross-sectional view of the cross section.

5 is a cross-sectional view taken along line A-A 'of the bulb-type LED lighting device of FIG.

Referring to FIG. 5, the bulb type LED lighting device 1 includes an LED package 10 from below, a globe 50 casing the LED package 10, and an LED lighting device above the globe 50. 1) and a heat dissipation device (30) for dissipating heat transferred from, and a screw cap (70) for socket connection.

The LED package 10 includes a metal PCB 11 made of a polygonal (eg, octagonal) pipe including a bottom surface of a metal material, and a plurality of mounted on the outer surface of the metal substrate 11. LED 13 is provided.

The metal substrate 11 is preferably made of a plate of a material having excellent thermal conductivity (for example, aluminum, copper, iron, or an alloy thereof). For example, the metal substrate 11 corresponding to the side of the octagonal pipe is composed of eight rectangular unit boards or an integral single board bent in an octagon. A plurality of LEDs 13 are mounted on these unit substrates, for example, five LEDs 13 can be mounted in two rows. In addition, the LED 13 can be mounted on the metal substrate 11 of the octagonal lower surface. This is to improve the light distribution to the lower side as well as the side light distribution.

The metal substrate 11 forms a plurality of through holes (not shown) through which the screws (not shown) penetrate, and uses the screws (not shown) in the screw holes 37 formed in the LED mounting portion 33 to mount the LED mounting portions (not shown). 33). In addition, the LED mounting portion 33 includes a wiring hole 39 for connecting the wirings of the plurality of LEDs 13 to the upper portion of the lower passage 33a.

Such a preferable structure of the metal substrate 11 is that the direct mounting of a plurality of LEDs 13 on the surface of the metal substrate 11 eliminates the presence of an interface on the heat transfer path, thereby degrading the heat transferability by the interface effect. Can be prevented. However, it is also possible to mount a plurality of LEDs 13 on a plurality of plate-shaped metal substrates and fix them using a plurality of screws (not shown) on each side of the LED mounting part 33.

In the present invention, the metal substrate 11 is composed of an octagonal structure including a lower surface in the embodiment of Figure 4, it is possible to use a hexagonal, 10 or 12 polygonal pipe structure other than the octagon. In this case, since a plurality of LEDs 13 are mounted on the outer surface of the polygonal substrate and the lower surface of the polygonal substrate to form a three-dimensional lighting structure, a problem in which a large illuminance difference is generated between the direct portion and the side of the lighting device can be solved. Properties are greatly improved.

The flange 38 screwed by the screw coupling portion 38a to the upper portion of the LED package 10 described above serves to reflect light from the LED 13 and to the snap coupling portion 34 provided on the outside. Snaps the glove 50. In addition, the flange 38 screws the heat dissipation device 30 to the screw coupling portion 38b provided inside the groove thereof.

The heat dissipation device 30 is formed in a central body having a cylindrical shape having a hollow, which is an upper passageway 31b, and spirally formed on the outer circumferential surface of the body 31 and integrally formed with the body 31. The heat radiation fin 32 is provided.

In the case of having the helical heat dissipation fin 32, the heat dissipation area that can be in contact with the outside air is increased, as well as the conduction of heat conducted under the body 31 and convection by the external air occurs simultaneously. While circulating along the top, conduction and heat dissipation are made upward.

That is, the heat dissipation fins 32 are formed in one spiral shape, but the blocking phenomenon does not occur when heat conduction or air flow is continuously performed along the air inflow space S1 from the lower side to the upper side, but a plurality of the heat dissipation fins are spaced apart. In general, the laminated structure formed by sequentially stacking a plurality of heat dissipation fins is not contiguous, and thus, conduction of heat along a plurality of heat dissipation fins is not achieved, and the flow of air is cut off, causing a blocking phenomenon.

Therefore, the heat dissipation fin 32 structure of the present invention has higher heat dissipation efficiency than the conventional stacked heat dissipation fin structure.

The heat dissipation device 30 including the body 31 and the heat dissipation fins 32 transmits heat generated when the LED package 10 is driven to the upper side through the upper passage 31b to deteriorate the LED package 10. prevent.

The heat dissipation device 30 is made of a material having excellent thermal conductivity, for example, copper, aluminum or magnesium, or an alloy thereof, and the heat dissipation device 30 is copper, aluminum or magnesium, or the like. By adding a nano-size carbon nanotubes or carbon nanofibers as a pigment (pigment) to the alloy of may be reduced weight while improving the heat dissipation effect.

That is, the body 31 of the heat dissipation device 30 is copper, aluminum, magnesium, or the like, or heat transfer by including about 0.1 to 20 wt.% Of nanoscale carbon nanotubes or carbon nanofibers in these alloys. The weight can be reduced by about 20% while improving the properties to improve the heat dissipation effect. In particular, as the content of carbon nanotubes or carbon nanofibers increases, the melting point of the alloy increases. For example, the melting point of an aluminum alloy containing 10 wt.% Of carbon nanotubes or carbon nanofibers is 1000 ° C or higher. It has the characteristics of ultra light weight, super heat resistance and super strength that can withstand temperatures much higher than the melting point of 600 ~ 700 ℃ of aluminum that does not contain them.

The lower portion of the body 31 is provided with a convection hole 36 for convection of air and forms a seating groove 31a in the upper inner side of the body 31. The connection housing 71 of the screw cap 70 is seated in the seating recess 31a, and the inside of the connection housing 73 is seated with the insulator 73 seated with the LED driving circuit 12 inserted therein.

The LED driving circuit 12 is formed of a circuit for driving a plurality of LEDs 13 constituting the LED package 10 is separated from the LED package 10 and the seating groove inside the body 31 of the heat dissipation device 30. It is seated at 31a.

In addition, the connection housing 71 is seated in the seating groove 31a of the body 31 and at the same time, the connection housing 71 of the screw cap 70 is snapped by the upper snap coupling portion 35 of the heat dissipation device 30. Combined.

The screw cap 70 has a plurality of holes 72 formed in the connection housing 71, and forms a pair of electrical contacts 70a and 70b for insertion into a conventional socket.

The wires (not shown) drawn out from the LED package 10 are sequentially passed through the lower passage 33a and the upper passage 31b and connected to the LED driving circuit 12, and then the wires (not shown) from the LED driving circuit 12. C) is connected to a pair of electrical contacts 70a and 70b of the screw cap 70.

On the other hand, the glove 50 which is casing the LED package 10 is detachably coupled to the opening of the upper portion by the snap coupling portion 34 on the outside of the flange 38.

The glove 50 is made of a cylindrical or semi-spherical shape, one side of which is transparent or semitransparent.

In addition, the light emitted from the LED 13 is yellow or blue phosphor by treating the LED 13 of the LED package 10 to employ a blue or yellow LED and to coat or impregnate the yellow or blue phosphor on the globe 50. White light can be obtained while passing through.

6 is an exploded cross-sectional view of the cross-sectional view of FIG.

Referring to FIG. 6, a pair of electrical contacts 70a and 70b for connecting a socket are fastened to the connection housing 71. The connecting housing 71 is snap-coupled with the heat dissipation device 30 by the snap coupling part 35 while inserting the insulator 73 on which the LED driving circuit 12 is inserted. At the same time, the connecting housing 71 is seated in the mounting groove 31a of the heat dissipation device 30 with the insulator 73 inserted therein.

For reference, a front view and a plan view of the bulb-type LED lighting device 1 described above are shown.

7 is a front view of the bulb-type LED lighting apparatus according to an embodiment of the present invention.

Referring to FIG. 7, a spiral heat dissipation device 30 is shown in an upper portion of the glove 50, and two contact points 70a and 70 are connected to a connection housing 71 in which a hole 72 is formed in an upper portion of the heat dissipation device 30. The screw cap 70 with 70b) is shown.

8 is a plan view of the bulb-type LED lighting apparatus according to an embodiment of the present invention.

Referring to FIG. 8, the connection housing 71 in which the two contacts 70a and 70b and the hole 72 are formed is shown, and the heat dissipation fin 32 is shown.

As described above, in the present invention, even though a plurality of LEDs are densely mounted on the surface of the substrate using a metal substrate made of polygonal pipes, a spiral heat dissipation device provides more efficient heat dissipation characteristics to dissipate heat transferred from the LED package. It can have a high illumination LED lighting device can be implemented. This efficient heat dissipation allows more LEDs to be mounted compared to conventional LED lighting devices that consume the same power, and thus may have greater illuminance than conventional methods.

LED lighting apparatus according to the present invention can be applied to a new lighting device that can replace incandescent bulbs and fluorescent lamps.

1 is a front view showing the structure of a conventional LED lighting fixture.

2 is a cross-sectional view showing the structure of a conventional LED lighting fixture shown in FIG.

3 is a cross-sectional view showing the structure of another conventional LED lighting fixture.

Figure 4 is a perspective view of the bulb-type LED lighting apparatus according to an embodiment of the present invention,

5 is a cross-sectional view taken along line A-A 'of the bulb-type LED lighting device of FIG.

6 is an exploded cross-sectional view separating the cross-sectional view of FIG.

7 is a front view of the bulb-type LED lighting apparatus according to an embodiment of the present invention,

8 is a plan view of the bulb-type LED lighting apparatus according to an embodiment of the present invention.

* Description of Signs for Main Parts in Drawings *

10: LED package 11: metal substrate

13: LED 30: heat dissipation device

32: heat sink fin 33: LED mounting portion

50: glove 70: screw cap

Claims (22)

  1. A body having a plurality of LEDs integrated between the LED package and a screw cap for applying power to the LED package, and having a screw coupling portion formed therein and having a central passage therein;
    A flange screwed to the threaded portion of the body; And
    Spiral heat dissipation device for LED lighting device, characterized in that it comprises a heat dissipation fin formed integrally with the body and extending spirally at a predetermined interval along the longitudinal direction of the body on its outer peripheral surface.
  2. delete
  3. The spiral radiator of claim 1, wherein the body has a plurality of convection holes for communicating the central passage with the outside.
  4. The spiral heat dissipation device of claim 1, wherein the body forms a seating groove in the inner side of the central passage.
  5. According to claim 1, wherein the body is a spiral radiator for LED lighting device, characterized in that the snap coupling portion that can be snapped to the outer top of the central passage is formed.
  6. An LED package having a plurality of LEDs mounted on a metal substrate;
    A screw cap for applying power to the LED package;
    A heat dissipation device in which the LED package is mounted at one side and the screw cap is mounted at the other side; And
    A glove for casing the LED package;
    The heat dissipation device,
    A body having a plurality of LEDs integrated between the LED package and a screw cap for applying power to the LED package, and having a screw coupling portion formed therein and having a central passage therein;
    A flange screwed to the threaded portion of the body; And
    The bulb type LED lighting device including a heat dissipation fin formed integrally with the body and extending in a spiral shape at a predetermined interval along the longitudinal direction of the body on its outer circumferential surface.
  7. delete
  8. The bulb type LED lighting apparatus according to claim 6, wherein the body has a plurality of convection holes for communicating the central passage with the outside.
  9. The bulb type LED lighting apparatus of claim 6, wherein the body further comprises a mounting groove provided in the inner side of the central passage and installed in the mounting groove to drive the LED package.
  10. The bulb type LED lighting apparatus of claim 6, wherein the body snaps to the screw cap by forming a snap coupler that snaps to an outer upper end of the central passage.
  11. The bulb type LED lighting apparatus according to claim 6, wherein a snap coupling part for snap-fitting with the glove is provided on the upper outer circumferential surface of the flange.
  12. The bulb type LED lighting apparatus according to claim 6, wherein the metal substrate is formed of a polygonal surface including a bottom surface.
  13. The method of claim 6, wherein the metal substrate is a bulb type LED lighting device, characterized in that consisting of a plurality of unit boards or integral single substrate bent in a polygon.
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KR1020080096647A 2008-10-01 2008-10-01 Radiator of helical type and LED lighting apparatus of bulb type using the same KR101007913B1 (en)

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KR1020080096647A KR101007913B1 (en) 2008-10-01 2008-10-01 Radiator of helical type and LED lighting apparatus of bulb type using the same
PCT/KR2009/005599 WO2010038983A2 (en) 2008-10-01 2009-09-30 Spiral heat-sink device and bulb-shaped led lighting device using the same

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KR101896669B1 (en) * 2011-11-17 2018-09-07 엘지이노텍 주식회사 The light emitting system
CN102401263A (en) * 2011-11-30 2012-04-04 何军 Spiral lampshade type light emitting diode (LED) energy-saving lamp
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