KR200404242Y1 - light emitting apparatus - Google Patents

light emitting apparatus Download PDF

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Publication number
KR200404242Y1
KR200404242Y1 KR20050025193U KR20050025193U KR200404242Y1 KR 200404242 Y1 KR200404242 Y1 KR 200404242Y1 KR 20050025193 U KR20050025193 U KR 20050025193U KR 20050025193 U KR20050025193 U KR 20050025193U KR 200404242 Y1 KR200404242 Y1 KR 200404242Y1
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KR
South Korea
Prior art keywords
heat dissipation
light emitting
emitting device
main
formed
Prior art date
Application number
KR20050025193U
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Korean (ko)
Inventor
황현배
김진홍
Original Assignee
바이오닉스(주)
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Priority to KR20050025193U priority Critical patent/KR200404242Y1/en
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Publication of KR200404242Y1 publication Critical patent/KR200404242Y1/en

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Abstract

The present invention relates to a high power and high brightness light emitting device, the first receiving groove of which the top is open, the heat dissipation main substrate formed of a heat dissipation material, and the first receiving groove at the bottom of the heat dissipation main substrate formed of an insulating material A plurality of insulating beads inserted through the bottom surface of the substrate, a plurality of lead pins installed through the insulating beads, and at least one light emitting element mounted in the first receiving groove of the heat dissipation main substrate and electrically connected to the lead pins. A light emitting device unit having a chip, and a lead pin through hole through which a lead pin can enter the inner space part is formed on the upper surface of the light emitting device unit, which is formed of a heat dissipating material and has an open inner space part of the lower part. Inside the main heat dissipation body with a built-in drive circuit board connected to the lead pin inserted through the lead pin through hole, and the main room to surround the light emitting device unit. It bonded at the lower portion of the light focusing member and the main body for focusing the radiation is coupled to the upper body and the light emitted from the light emitting device unit includes a bottom plate formed able to provide the passage of parts of the inner space of the main heat radiating body. According to such a light emitting device, it is possible to expand the heat dissipation ability through the main heat dissipation body and the light concentrating member while concentrating the light, thereby providing an advantage of improving luminous efficiency and heat dissipation ability.

Description

Light emitting apparatus

The present invention relates to a light emitting device, and more particularly, to a light emitting device having a heat dissipation and light focusing structure suitable for high output.

Recently, as the light emitting diode (LED) is known to have a structure that emits white light by applying a phosphor, its application range has been extended to a lighting field that can replace a conventional light lamp in addition to a simple light emitting display function. . In addition, research on high power light emitting diodes suitable for lighting has been continuously conducted.

The light emitting diode, which is one of the semiconductor devices, decreases its lifespan and decreases the luminous efficiency when the temperature rises above the rated operating temperature. Therefore, in order to increase the output of the light emitting diodes, the light emitting diodes effectively emit heat generated from the light emitting diodes. Heat dissipation structure is required.

However, the conventional light emitting diode has a structure in which a lead pin on which a light emitting diode chip is mounted is molded with a plastic material. The light emitting diode having such a structure is difficult to be applied to a high output light emitting diode because the heat dissipation is low because the heat is radiated through the lead pins.

In order to improve such a problem, research on a package having a structure capable of increasing a heat dissipation efficiency while mounting a plurality of light emitting diode chips has been continuously conducted.

The object of the present invention is to provide a light emitting device that is easy to manufacture while improving heat dissipation capacity and luminous efficiency, which was devised to improve the above problems.

In order to achieve the above object, the light emitting device according to the present invention includes a heat dissipation main substrate formed with a heat dissipation material and a first accommodating groove having an open upper portion, and an insulating material and a bottom of the heat dissipation main substrate. A plurality of insulating beads inserted through the bottom surface of the receiving groove, a plurality of lead pins installed through the insulating beads, and mounted in the first receiving groove of the heat dissipation main substrate and electrically connected to the lead pins. A light emitting element unit having at least one light emitting element chip connected thereto; A lead pin through hole is formed on the upper surface of the heat dissipation material and has an open inner space, and the lead pin is allowed to enter the inner space. A main heat dissipation body having a driving circuit board connected to the lead pin inserted through the lead pin through hole; A light concentrating member coupled to an upper portion of the main heat dissipating body to surround the light emitting device unit to focus light emitted from the light emitting device unit; And a lower plate coupled to a lower portion of the main heat dissipation body and configured to provide a passage to the inner space of the main heat dissipation body.

Preferably, the light condensing member has a first portion narrower than an outer diameter of the main heat dissipation body and having an inlet groove in which the light emitting device unit can be inserted, and which extends a predetermined height from the main heat dissipation body, and the first portion. A plurality of first vent holes for heat dissipation having a larger outer diameter than the portion and penetrated up and down are formed and have a second portion extending vertically from the first portion.

In addition, the main heat dissipation body is preferably formed with a plurality of grooves in which a predetermined depth in the horizontal direction is spaced apart from each other along the vertical direction.

More preferably, the driving circuit board has a pin insertion hole through which the lead pin extending into the inner space of the main heat dissipation body can be inserted, and is electrically connected to the lead pin inserted through the pin insertion hole. Are combined.

In addition, a plurality of second vents penetrating the inner space portion from the upper surface of the main heat dissipation body to allow air flow through the space between the inner space portion of the main heat dissipation body and the second portion of the light converging member. Holes are formed.

According to still another aspect of the present invention, a blowing fan is further provided between the driving circuit board and the lower plate.

In addition, the heat dissipation main board further includes a second accommodating groove formed at a center of a bottom surface of the first accommodating groove to be recessed to a predetermined depth for mounting the light emitting device chip.

In addition, the heat dissipation main substrate is formed with the same outer diameter from the top to a predetermined length below the fitting portion which is fitted to the light converging member; And a locking portion extending concentrically downwardly from the end of the fitting portion to a larger outer diameter than the fitting portion so as to engage the bottom of the light concentrating member.

Hereinafter, a light emitting device according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view illustrating a light emitting device according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view of the light emitting device of FIG. 1, and FIG. 3 is a cross-sectional view of the light emitting device. For reference, in order to avoid the complexity of the drawing, FIGS. 1 and 2 illustrate the LED chip not mounted.

1 to 3, the light emitting device 100 has a light emitting device unit 110, a main heat dissipation body 150, a light converging member 170, and a lower plate 180.

The light emitting device unit 110 includes a heat dissipation main substrate 111, a lead pin 115, and a light emitting diode chip 117.

The structure of the light emitting device unit 110 will be described with reference to FIG. 4.

The heat dissipation main board 111 is formed with a first accommodating groove 111c having an open top and formed of a heat dissipation material.

The main substrate 111 for heat dissipation has a structure having a fitting portion 111a and a locking portion 111b having an outer diameter extended concentrically with respect to the fitting portion 111a.

The outer diameter of the fitting portion 111a is formed to a size that can be inserted into the inlet groove 173 of the light converging member 170 to be described later, the outer diameter of the locking portion 111b is the inlet groove ( It is formed larger than the inner diameter of 173). In this case, the heat dissipation main substrate 111 may be constrained between the light focusing member 170 and the main heat dissipation body 150.

In addition, a lens coupling seating groove 111d is formed at an upper portion of the heat dissipation main substrate 111, and a bottom surface of the first accommodating groove 111c is recessed to mount a plurality of light emitting diode chips 117. The second accommodating grooves 111e are arranged to be spaced apart from each other in a lattice form. In the illustrated example, sixteen second accommodation grooves 111e are formed to mount sixteen light emitting diode chips 117.

Preferably, the heat dissipation main substrate 111 is formed to be inclined to gradually narrow the inner diameter as it proceeds downward from the inner edge of the lens coupling seating groove 111d.

The inclined portion may be formed to function as a reflector capable of focusing light by reflecting light emitted from the side from the mounted LED chip 117 upwards. In this case, the heat dissipation main substrate 111 may be formed of a material having heat dissipation and high reflectivity, or the entire surface or at least the surface of the inclined portion may be formed by coating at least one of silver, nickel, and aluminum.

The second accommodating groove 111e is formed in a structure having an inclined portion inclined so that its outer diameter gradually narrows as it progresses downward. It is formed of the material described above so that the inclined portion of the second accommodating groove 111e may also serve as a reflector capable of focusing light by reflecting light emitted from the side to the upper side from the light emitting diode chip 117. desirable.

The light emitting diode chip 117 is mounted on the bottom surface of the second accommodating groove 111e and is electrically connected by the lead pin 115 and the conductive wire 118. Unlike the illustrated example, the light emitting diode chip 117 may be mounted on the heat dissipation main substrate 111 through a sub-mount (not shown).

Although not shown, a phosphor may be filled in the second accommodating groove 111e or in the first accommodating groove 111c to surround the light emitting diode chip 117 mounted on the bottom surface of the second accommodating groove 111e. .

In this case, the phosphor may emit white light in response to light emitted from the light emitting diode chip 117. More preferably, the light emitting diode chip 117 may be applied with a blue light emitting diode chip, and the phosphor may be applied with a YAG phosphor. Alternatively, the light emitting diode chip 117 may be applied with an ultraviolet light emitting diode chip and the phosphor may be applied with an RGB phosphor. Can be.

In addition, although not shown, a molding cap may be formed of various resins, such as a transparent epoxy resin, to seal the inner space of the first accommodating groove 111c. Alternatively, a lens that can be fitted into the lens mounting groove 111d may be mounted to the heat dissipation main board 111.

The second accommodating groove 111e guides the mounting position of the light emitting diode chip 117 and provides an advantage that the coating layer is easily limited to the second accommodating groove 111e when the phosphor is applied.

The heat dissipation main board 111 is formed of a heat dissipation material having good thermal conductivity, for example, a metal material or a ceramic material.

As a material of the heat dissipation main substrate 111, copper or a copper alloy such as brass, tungsten / copper, molybdenum / copper alloy, AlN, SiC, or the like may be applied.

Preferably, the heat dissipation main board 111 is formed in the structure shown in the above-described heat dissipation material and then plated with nickel material to have corrosion resistance. More preferably, the heat dissipation main substrate 111 is second plated with silver or gold so as to increase reflection efficiency and wire bonding property on the nickel plating layer.

The insulating beads 113 penetrate the bottom surface of the first accommodating groove 111c at the bottom of the heat dissipating main substrate 111 and are formed on the heat dissipating main substrate 111.

The insulating bead 113 is formed of a material having high melting point and good adhesion between different materials when heated, for example, glass, epoxy material or ceramic material.

The lead pin 115 is surrounded by the insulating bead 113 so as to be insulated from the heat dissipation main board 111, and one end is exposed in the first receiving groove 111 c of the heat dissipation main board 111, and the other end is used for heat dissipation. It protrudes outward from the bottom of the main board 111. In the illustrated example, a total of eight lead pins 115 each of four sides are applied.

The lead pin 115 has a head 115a and a leg 115b.

The head 115a is formed to have a larger outer diameter than the leg 115b to provide easy wire bonding.

The main heat dissipation body 150 is formed of a heat dissipation material and has a structure having an inner space part 152 open at the bottom thereof.

In addition, a mounting groove 153 is formed on the upper surface of the main heat dissipation body 150 at a predetermined depth to allow the light emitting device unit 110 to be seated therein. A plurality of lead pin through holes 155 are formed to enter the 152.

In addition, a driving circuit board 160 electrically connected to the lead pin 115 inserted through the lead pin through hole 155 is embedded in the internal space 152.

The main heat dissipation body 150 is formed with a plurality of grooves 156 drawn in a predetermined depth to be spaced apart from each other vertically on the outside. The groove 156 is to increase the heat dissipation efficiency by increasing the contact area with the outside air.

In addition, the inner space portion 152 on the upper surface of the main heat dissipation body 150 through the separation space between the inner space portion 152 and the second portion 174 of the light converging member 170 is formed. A plurality of second vent holes 157 are formed therethrough.

Unlike the illustrated structure, the coupling piece 159 having the coupling hole 159a may be further extended to the upper surface of the main heat dissipation body 150 to be coupled to a separate frame. . Of course, the coupling piece 159 may be formed on the lower plate 180.

The driving circuit board 160 is electrically connected to the lead pins 115 to drive the light emitting diode chip 117 through the lead pins 115.

The driving circuit board 160 may include an AC-DC converter (not shown) when using an external power source.

Preferably, the driving circuit board 160 has a pin insertion hole 163 through which the lead pin 115 extending into the inner space 152 of the main heat dissipation body 150 can be inserted therein. The lead pins 115 and the corresponding terminals 165 inserted through the holes 163 are electrically coupled to each other, so that the lead pins 115 and the corresponding terminals 165 may be electrically coupled to each other. In this case, various methods, such as soldering and wire connection, may be applied to the connection between the lead pin 115 and the corresponding terminal 165 of the driving circuit board 160. Alternatively, a fitting terminal (not shown) to which the lead pin 115 may be fitted may be applied.

The light condensing member 170 is coupled to the upper portion of the main heat dissipation body 150 to surround the light emitting device unit 110 to condense the light emitted from the light emitting device unit 110.

The light focusing member 170 has a structure having a first portion 173 and a second portion 174 when divided vertically.

The first portion 173 is narrower than the outer diameter of the main heat dissipation body 150, but has a recessed groove 171 into which the light emitting device unit 110 can be inserted. In addition, the coupling hole 175 that can be coupled to each other in the inner space 152 of the main heat dissipation body 150 is formed in a predetermined depth from the bottom.

The second portion 174 has an outer diameter that is wider than that of the first portion 173, and a plurality of first heat dissipation holes 176 are vertically formed, and the second portion 174 extends vertically from the first portion 173.

In addition, the light focusing member 170 has a structure having a reflective portion 177 that is inclined narrower as it proceeds from the open top to the bottom.

The light focusing member 170 may be formed of a metal material having high reflectance and heat dissipation efficiency, or at least the reflective part 177 may be formed to be coated with a high reflectance material.

The lower plate 180 is formed in the shape of a disk having a third vent hole 183 coupled to the main heat dissipation body 150 at the bottom of the main heat dissipation body 150 to partially close the internal space 152. It is.

The lower plate 180 is preferably formed of a metal material having good heat dissipation efficiency such as aluminum.

In the illustrated example, four radially venting holes 183, which can be used for ventilation and drawing of an external driving wire, are radially formed such that the third vent hole 183 enters a predetermined depth from the outer circumferential surface thereof.

Reference numeral 185 denotes a coupling hole 185 for coupling to each other through the coupling hole 158 formed on the bottom surface of the main heat dissipation body 150.

In the light emitting device 100 having the above structure, the light emitting device unit 110 is seated in the mounting recess 153 of the main heat dissipation body 150, and then the driving circuit board 160 is coupled through the internal space 152. The light focusing member 170 is coupled to a coupling member such as a bolt through corresponding coupling holes 151 and 175. Thereafter, the lower plate 180 and the main heat dissipation body 150 may be coupled to each other by a coupling member through corresponding coupling holes 158 and 185.

In the light emitting device 100 having such a structure, heat generated from the light emitting diode chip 117 and the driving circuit board 160 is emitted through the main heat dissipation body 150, the light condensing member 170, and the lower plate 180. . In addition, an air flow path through the third vent hole 183 of the lower plate 180, the second vent hole 157 of the main heat dissipation body 150, and the first vent hole 176 of the light converging member 170. Is formed to further increase the heat dissipation efficiency.

On the other hand, the blowing fan 190 may be further provided as shown in FIG. 6 to further increase the heat dissipation efficiency unlike the illustrated example. In this case, the blowing fan 190 is preferably installed between the lower plate 280 and the driving circuit board 170 to allow the air to be blown upward.

In addition, when the blower fan 190 is applied, the vent hole of the lower plate 280 is preferably formed in a structure having a blower hole 281 in the center, unlike the example shown in the foregoing.

In the above description, the case where the light emitting diode chip is applied as the light emitting device has been described, and the light emitting diode chip can be applied to various known light emitting semiconductor chips such as a laser diode chip.

According to the light emitting device according to the present invention as described above, the main heat dissipation body and the light converging member can expand the heat dissipation capacity while being configured to focus light, thereby improving the luminous efficiency and heat dissipation ability. To provide.

1 is a perspective view showing a light emitting device according to a first embodiment of the present invention,

2 is an exploded perspective view of the light emitting device of FIG. 1;

3 is a cross-sectional view of FIG. 1,

4 is an enlarged cross-sectional view illustrating a coupling structure of a heat dissipation main board and a lead pin of FIG. 1;

5 is a cross-sectional view illustrating a light emitting device according to a second embodiment of the present invention.

<Description of Symbols for Major Parts of Drawings>

110: light emitting device unit 150: main heat dissipation body

170: light focusing member 180: lower plate

Claims (8)

  1. A plurality of insulations having a first receiving groove having an open upper portion formed therein and a heat dissipating main substrate formed of a heat dissipating material, and an insulating material and inserted into a bottom surface of the first receiving groove at a bottom of the heat dissipating main substrate. A light emitting device unit having a bead, a plurality of lead pins installed through the insulating bead, and at least one light emitting device chip mounted in the first receiving groove of the heat dissipation main substrate and electrically connected to the lead pins; ;
    A lead pin through hole is formed on the upper surface of the heat dissipation material and has an open inner space, and the lead pin is allowed to enter the inner space. A main heat dissipation body having a driving circuit board connected to the lead pin inserted through the lead pin through hole;
    A light concentrating member coupled to an upper portion of the main heat dissipating body to surround the light emitting device unit to focus light emitted from the light emitting device unit; And
    And a lower plate coupled to a lower portion of the main heat dissipation body and configured to provide a passage to the inner space of the main heat dissipation body.
  2. According to claim 1, wherein the light converging member is narrower than the outer diameter of the main heat dissipation body, the first groove which is formed in the center and the predetermined height from the main heat dissipation body is formed in the center, the light emitting element unit can be inserted, And a plurality of first heat dissipation holes penetrating up and down and having a larger outer diameter than the first portion, and having a second portion extending vertically from the first portion.
  3. The light emitting device according to claim 2, wherein the main heat dissipation body is formed with a plurality of grooves recessed in a horizontal direction on the outside so as to be spaced apart from each other in the vertical direction.
  4. 4. The driving circuit board of claim 3, wherein the driving circuit board has a pin insertion hole through which the lead pin extending into the inner space of the main heat dissipation body can be inserted, and the lead pin inserted through the pin insertion hole. Light emitting device, characterized in that electrically coupled with.
  5. According to claim 4, A plurality of through the inner space on the upper surface of the main heat dissipation body to allow air flow through the space between the inner space of the main heat dissipation body and the second portion of the light converging member Light emitting device, characterized in that the second vent hole is formed.
  6. The light emitting device of claim 1, further comprising a blower fan between the driving circuit board and the lower plate.
  7. The light emitting device according to claim 1, wherein the heat dissipation main substrate further includes a second accommodating groove formed at a center of a bottom surface of the first accommodating groove so as to be recessed to a predetermined depth for mounting the light emitting device chip.
  8. The heat dissipation main board of claim 7, wherein the heat dissipation main board is formed with the same outer diameter from a top to a predetermined length downward to be fitted to the light converging member;
    And a locking portion extending concentrically downwardly from the end of the fitting portion to a larger outer diameter than the fitting portion so as to engage the bottom of the light concentrating member.
KR20050025193U 2005-08-31 2005-08-31 light emitting apparatus KR200404242Y1 (en)

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KR20050025193U KR200404242Y1 (en) 2005-08-31 2005-08-31 light emitting apparatus

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KR20050080965A Division KR100705011B1 (en) 2005-08-31 2005-08-31 light emitting apparatus

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100754405B1 (en) * 2006-06-01 2007-08-31 삼성전자주식회사 Lighting device
KR100873491B1 (en) * 2007-05-25 2008-12-15 (주)싸이럭스 Light emitting device
KR100901180B1 (en) * 2008-10-13 2009-06-04 현대통신 주식회사 Heat emittimg member having variable heat emitting path and led lighting flood lamp using said it
US7891843B2 (en) 2008-11-10 2011-02-22 Hyundai Telecommunication Co., Ltd. LED lighting device
KR101021245B1 (en) 2008-08-07 2011-03-11 이동규 Led device
US7950826B2 (en) 2008-10-24 2011-05-31 Hyundai Telecommunication Co., Ltd. Circle type LED lighting flood lamp using nano spreader
KR20140110354A (en) * 2013-03-07 2014-09-17 삼성전자주식회사 Lighting device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100754405B1 (en) * 2006-06-01 2007-08-31 삼성전자주식회사 Lighting device
KR100873491B1 (en) * 2007-05-25 2008-12-15 (주)싸이럭스 Light emitting device
KR101021245B1 (en) 2008-08-07 2011-03-11 이동규 Led device
KR100901180B1 (en) * 2008-10-13 2009-06-04 현대통신 주식회사 Heat emittimg member having variable heat emitting path and led lighting flood lamp using said it
US7950826B2 (en) 2008-10-24 2011-05-31 Hyundai Telecommunication Co., Ltd. Circle type LED lighting flood lamp using nano spreader
US7891843B2 (en) 2008-11-10 2011-02-22 Hyundai Telecommunication Co., Ltd. LED lighting device
KR20140110354A (en) * 2013-03-07 2014-09-17 삼성전자주식회사 Lighting device
KR102077232B1 (en) 2013-03-07 2020-02-13 삼성전자주식회사 Lighting device

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