KR100873084B1 - Organic light emitting display and making method teherof - Google Patents

Abstract

An organic electroluminescent display device and a method for manufacturing the same are provided to prevent the deterioration of the optical efficiency by preventing the light diffusion by directly contacting a reinforcement material with a second substrate. An organic electroluminescent display device includes a first substrate(10), a second substrate(20), and a reinforcing material(40). A thin film transistor is deposited on the first substrate. The second substrate is opposite to the first substrate. The second substrate seals the first substrate. The reinforcing material is formed between the first substrate and the second substrate.

Description

Organic light emitting display device and manufacturing method thereof {ORGANIC LIGHT EMITTING DISPLAY AND MAKING METHOD TEHEROF}

The present invention relates to an organic light emitting display device and a method of manufacturing the same, and more particularly, to an organic light emitting display device having a thin thickness and strong against impact and a manufacturing method thereof.

A flat panel display arranges a plurality of pixels in a matrix form on a substrate, connects scan lines and data lines to each pixel, and selectively applies a data signal to the pixels to display an image.

A flat panel display is used as a display device such as a personal information terminal such as a personal computer, a mobile phone, a PDA, or a monitor for various information devices. The flat panel display device is a liquid crystal panel (LCD), an organic light emitting display (OLED) using an organic light emitting diode, and a plasma panel. PDPs and the like are known, and in particular, an organic light emitting display device having excellent luminous efficiency, luminance, viewing angle, and fast response time has been attracting attention.

Since the organic light emitting display device uses a very thin organic film, the encapsulation technology for preventing the organic light emitting display is sensitive to oxygen and moisture plays a very important role.

The organic light emitting display device encapsulates a first substrate on which a thin film transistor, an organic film, and the like is formed, and a second substrate formed to face the first substrate with a sealing material to prevent oxygen and moisture from penetrating into the organic film. do.

In order to implement a thin organic light emitting display device, the thickness of the first substrate, the second substrate, and the like should be reduced. In this case, the thickness of the organic light emitting display device may be easily broken due to an external impact.

SUMMARY OF THE INVENTION An object of the present invention is to provide an organic light emitting display device having a thin thickness and having a structure resistant to impact, and a method of manufacturing the same.

In order to achieve the above object, a first aspect of the present invention is a first substrate on which a thin film transistor is deposited, a second substrate facing the first substrate and encapsulating the first substrate, and the first substrate and the second substrate. It is to provide an organic light emitting display device including a reinforcing material formed in the gap between the substrate.

In order to achieve the above object, a second aspect of the present invention includes preparing a first substrate on which a thin film transistor is deposited and a second substrate encapsulating the first substrate, between the first substrate and the second substrate. Forming a reinforcing material positioned so that the first substrate and the second substrate face each other, and forming a sealing member on the periphery of the first substrate and the second substrate to apply pressure to the first substrate and the second substrate; It provides a method of manufacturing an organic light emitting display device comprising the step of being bonded.

According to the organic light emitting display device and a method of manufacturing the same according to the present invention, a reinforcing material is formed between the first substrate and the second substrate so that it is not easily damaged by an impact. In addition, when forming and attaching the reinforcing material in the form of a film, air may escape through the through hole formed in the reinforcing material, so that the reinforcing material is more firmly fixed.

In addition, when sealing the first substrate and the second substrate, the internal pressure of the reinforcing material is dispersed through the space between the reinforcing material such as the through-hole so that the reinforcing material can be compressed more, so that the organic light emitting display device can be made thin. Since the second substrate is in direct contact with each other, light scattering does not occur so that the light efficiency does not decrease.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view illustrating an embodiment of an organic light emitting display device according to the present invention. 2A, 2B and 2C are perspective views showing the form of the reinforcing material shown in FIG. 1. Referring to FIGS. 1 and 2A to 2C, the organic light emitting display device includes a first substrate 10, a second substrate 20, a sealing material 30, and a reinforcing material 40.

The first substrate 10 is formed of a thin film transistor and transmits a signal to the semiconductor layer 11 and the organic layer 12 to receive light transmitted from the semiconductor layer 11 on the semiconductor layer 11 to emit light ).

The second substrate 20 faces the first substrate 10 to encapsulate the first substrate to protect the semiconductor layer 11 and the organic layer 12.

The encapsulant 30 is formed on the outer periphery of the first substrate 10 and the second substrate 20 to seal the first substrate 10 and the second substrate 20 so that oxygen and / or moisture from the organic layer is outside. Preventing damage to (12).

The reinforcing material 40 is formed of a transparent and elastic material and is formed in a space between the organic layer 12 and the second substrate 20 to improve the strength of the organic light emitting display device. The reinforcement 40 is formed in the form of a circular through hole 41 in a thin film as shown in FIG. 2A, and in the form of a plurality of thin films 42 as shown in FIG. 2B and in FIG. 2C. As illustrated in the drawing, a star-shaped through hole 43 is formed in a thin film.

And, the shape of the through-hole formed in the reinforcing material 40 is more preferable to the shape having a star shape as shown in Fig. 2c than the shape having a circular shape shown in Fig. 2a. Because, in the case of a circular shape, the pressure is evenly distributed to maintain a circular shape, but the angular shape like a star shape does not distribute the pressure evenly, so the propensity to maintain a shape is not stronger than a circular shape. Therefore, it is formed like a star and the internal pressure is better dispersed. Here, the through-hole having a star shape is illustrated in FIG. 2C, but the through-hole is not limited to a star shape and has an angular shape such as a rectangle, which is advantageous in dispersing internal pressure more than a circular through hole.

When the reinforcing material 40 has the through holes 41 and 43 or is formed in the form of a plurality of thin films 42, the thickness of the reinforcing material 40 is the space between the organic film layer 12 and the second substrate 20. Thicker than that. When the reinforcing material 40 is formed thicker, no space is formed between the reinforcing material 40 and the organic film layer 12 and the reinforcing material 40 and the second substrate 20, and thus, the reinforcing material 40 and the organic film layer 12 and Since the air layer cannot be formed between the reinforcing material 40 and the second substrate 20, light scattering by the air layer is prevented so that the light efficiency formed in the organic film layer 12 is not degraded, and the reinforcing material 40 is thickly formed. The intensity of the electroluminescent display is also increased.

In addition, the reinforcing material 40 has the through holes 41 and 43 or is formed in the form of a plurality of thin films 42 so that the reinforcing material 40 is pressed by the organic film layer 12 and the second substrate 20. When receiving the pressure is dispersed by the empty space of the reinforcing material 40 will not increase the internal pressure. Therefore, even when the reinforcing material 40 becomes thicker than the space between the organic film layer 12 and the second substrate 20, the adhesion between the first substrate 10 and the second substrate 20 does not fall.

In addition, the reinforcing material 40 is pasted on the organic layer 12 and / or the second substrate 20, the air is injected into the contact surface in the process of attaching, there is a fear that the adhesive force of the reinforcing material 40 is reduced, the reinforcing material When the through holes 41 and 43 are formed in the 40, the air injected through the through holes 41 and 43 may escape and the reinforcing material 40 is in the form of a plurality of thin films 42, respectively. The air can escape by the space between the thin film 42 of the. Therefore, the adhesion of the reinforcing material 40 is improved by reducing the influence of air.

3A, 3B, and 3C are diagrams illustrating a manufacturing process of the organic light emitting display device illustrated in FIG. 1. The semiconductor layer and the organic film formed on the first substrate 10 are not shown and have a cross section in the direction of III-III 'of FIG.

First, a reinforcing material 40 is formed on the first substrate 10 as shown in FIG. 3A. At this time, the reinforcing material 40 is formed with a through hole or a plurality of thin films. Therefore, an empty space in which the reinforcing material 40 is not formed is formed in the space between the first substrate 10 and the second substrate 20. Specifically, the method of forming the reinforcing material 40, the reinforcing material 40 is viscous on both sides of the reinforcing material 40, such as the face tape, and after the one side of the reinforcing material 40 in contact with the roller When the roller is in close contact with the second substrate 20 and then rolled on the second substrate 20, the reinforcing material 40 is attached to the second substrate 20. This method may proceed regardless of the shape of the stiffener 40.

As shown in FIG. 3B, the sealant 30 is applied to the first substrate 10 and the second substrate 20, and the first substrate 10 and the second substrate 20 face each other. .

Finally, as shown in FIG. 3C, pressure is applied between the first substrate 10 and the second substrate 20 and the first substrate 10 and the second substrate 20 are adhered by the sealant 30. do. The reinforcement 40 is pressed by the pressure applied to the first substrate 10 and the second substrate 20 so that the height of the reinforcement 40 is lowered and widened by the force (f) from side to side. At this time, the reinforcing material 40 has a thickness thicker than the space between the first substrate 10 and the second substrate 20, the internal pressure of the reinforcing material 40 is increased. However, the adhesive force of the sealant 30 is dispersed by the force f such that the internal pressure of the reinforcement 40 is widened from side to side by an empty space such as a through hole formed in the reinforcement 40. It is formed stronger than the internal pressure so that the first substrate 10 and the second substrate 20 do not fall.

While preferred embodiments of the present invention have been described using specific terms, such descriptions are for illustrative purposes only and it is understood that various changes and modifications may be made without departing from the spirit and scope of the following claims. You must lose.

1 is a perspective view illustrating an embodiment of an organic light emitting display device according to the present invention.

2A, 2B and 2C are perspective views showing the form of the reinforcing material shown in FIG. 1.

3A, 3B, and 3C are diagrams illustrating a manufacturing process of the organic light emitting display device illustrated in FIG. 1.

Claims (8)

A first substrate on which a thin film transistor is deposited; A second substrate facing the first substrate and encapsulating the first substrate; And An organic light emitting display device comprising a reinforcing material formed in a gap between the first substrate and the second substrate. The method of claim 1, The reinforcing material has at least one through hole and contacts only a portion of the first substrate and the second substrate. The method of claim 2, The through hole is an organic light emitting display device having an angular shape. The method of claim 1, And the reinforcing member is formed of a plurality of thin films on one plane formed at a distance between the first substrate and the second substrate so that only a portion of the reinforcing member contacts the first substrate and the second substrate. Preparing a first substrate on which a thin film transistor is deposited and a second substrate encapsulating the first substrate; Forming a reinforcing material positioned between the first substrate and the second substrate; And The first substrate and the second substrate facing each other and forming a sealing material on the outer periphery of the first substrate and the second substrate by applying pressure to the first substrate and the second substrate to adhere to the organic Method of manufacturing an electroluminescent display device. The method of claim 5, wherein And the reinforcing material comprises at least one through hole. The method of claim 6, The through hole has an angled shape manufacturing method of an organic light emitting display device. The method of claim 6, And the reinforcing member is formed in the form of a plurality of thin films on the same plane of the second substrate.

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