KR100871343B1 - Nozzle for rinsing substrate with two fluid mixture - Google Patents

Abstract

The present invention relates to a nozzle for cleaning a substrate by a two-fluid mixture that can remove the contaminants attached to the substrate in a non-contact manner with a high cleaning power, and can maintain a uniform slit width at all times. In the substrate cleaning nozzle according to the present invention, a mixed buffer in which an air buffer space into which air supplied from an air source flows is formed at an upper portion, and in which air in the air buffer space flows in and pure water supplied from a pure water supply flows in and is mixed. A nozzle body having a space formed at a lower portion thereof, the nozzle body having a slit formed at a bottom thereof for injecting the mixed fluid mixed in the mixing buffer space to the outside; And a rectifying portion that separates the two spaces between the air buffer space and the mixing buffer space and rectifies the air moving from the air buffer space into the mixing buffer space in a laminar flow.

Substrate, Cleaning, Laminar Flow, Turbulence, Nozzle

Description

Nozzle for rinsing substrate with two fluid mixture

1 is a view schematically showing a cleaning apparatus in which a nozzle for cleaning a substrate by a two-fluid mixture according to the present invention is used.

Figure 2 schematically shows a nozzle for cleaning a substrate by a two-fluid mixture according to the present invention.

3 is a sectional view of a substrate cleaning nozzle for showing turbulent and laminar flows of pure water;

4 is a view showing an example of a rectifier provided in the nozzle according to the present invention.

5 is a view showing another example of the rectifier provided in the nozzle according to the present invention.

Figure 6 shows another example of the rectifier provided in the nozzle according to the present invention.

7 is a view showing another embodiment of the present invention having a bolt for adjusting the gap of the rectifier.

<Explanation of symbols for main parts of the drawings>

1: nozzle 2: pure water supply port

3: air supply port 4: air buffer space

5: mixed buffer space 6: rectification plate                 

7: sub buffer space 8: slit

9: adjusting bolt 10: driving motor

11 conveying roller 12 substrate

13: pure water source 14: air source

16: cleaning chamber 17, 18: line

The present invention is a non-contact substrate cleaning apparatus, which quickly removes contaminants on the surface of a substrate, exhibits maximum cleaning effect by using a minimum amount of fluid, and cleans the substrate by a two-fluid mixture that satisfies low cost through a simplified instrument. Relates to a device.

In general, in the manufacture of semiconductors, liquid crystal displays and plasma display panels, high-pressure water jet cleaning and bubble jet (droplet jet cleaning using a two-fluid jet nozzle) as a cleaning method for removing contaminants generated after each process, Cavitation jets, ultra-fast nozzles, and the like.

However, the high-pressure water jet cleaning method has a disadvantage in that the washing power is low and the small particles cannot be sufficiently removed.

Bubble jet and cavitation jet, which are two-fluid injection methods, have a problem in that the structure is complicated and occupies a large installation space as a plurality of nozzles are arranged to obtain an even cleaning effect across the substrate.

In addition, the ultra-high speed nozzle method requires a high pressure pump by supplying only pure water (DI) at high pressure and converting pure water from turbulent flow into laminar flow inside the nozzle, which may cause damage to the substrate by high pressure pure water.

In addition, the slit type injection mechanism using only pure water is used in the cleaning process, and can exert a rinsing effect over a large area in a short time. However, the use range is limited because the cleaning power is greatly reduced. In particular, in the slit-type injection mechanism, the injection nozzle is formed in a slit shape so that the slit adjusting bolt is provided near the slit, which is the final injection part, in order to maintain uniformity of the injection fluid. Therefore, when the fluid is injected, the flow of the fluid is interrupted by the bolts, and thus pure water is injected in the form of a sine wave, and thus there is a problem that uniform injection cannot be achieved.

Accordingly, an object of the present invention is to solve the problems of the prior art, such as low cleaning power, complicated structure, simplification of the application process, non-uniformity, etc., to remove the contaminants attached to the substrate with high cleaning power in a non-contact manner, and to reduce the slit width. The present invention provides a nozzle for cleaning a substrate by a two-fluid mixture that can be kept constant at all times to maintain uniformity of cleaning.

As described above, an air buffer space into which air supplied from an air source is introduced is formed in an upper portion, and a mixed buffer space in which air from the air buffer space is introduced and pure water supplied from a pure water supply is introduced and mixed. A nozzle body formed at a lower side thereof and having a slit formed at a bottom thereof for injecting the mixed fluid mixed in the mixing buffer space to the outside; And a rectifying portion for partitioning the two spaces between the air buffer space and the mixing buffer space and rectifying the air moving from the air buffer space to the mixing buffer space in a laminar flow. Achieved by a cleaning nozzle.

The rectifier has an upper rectifying plate having a large porosity and a lower rectifying plate having a lower porosity than the upper rectifying plate. Preferably, one or more mesh bodies with fine holes may be located between the upper and lower rectifying plates. Alternatively, the rectifying part may consist of a porous body.

Preferably, the nozzle according to the present invention may be formed in the sub-buffer space to temporarily store the pure water supplied from the pure water source on one side of the nozzle body to supply the mixed buffer space through the pure water supply passage. This mixed buffer space allows for a more even distribution of pure water by adjusting the ratio of inlet and outlet areas. More preferably, the pure water supply passage is formed to be inclined at a predetermined angle.

In addition, the nozzle according to the present invention may further include a plurality of adjusting bolts for adjusting the gap spacing of the rectifying part by being fastened to the nozzle body.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.                     

As shown in FIG. 1, the substrate 12 is moved in the cleaning chamber 16 along the conveying roller 11 driven by the drive motor 10 to be positioned at the cleaning position. When the substrate 12 is positioned in the cleaning position in the cleaning chamber 16, the substrate 12 is cleaned by the cleaning liquid (pure) sprayed from the substrate cleaning nozzle 1 by the two-fluid mixture according to the present invention. do.

Pure water sprayed from the nozzle 1 is compressed and sprayed according to the structure of the nozzle 1. As shown in FIGS. 2 and 3, the nozzle 1 is formed with a plurality of pure water supply ports 2 for supplying pure water, and an air supply port 3 for supplying air to one side or the top. Is provided. Although a plurality of pure water supply ports are shown formed in the front in the figure, these multiple pure water supply ports may be configured to be connected to a pure water supply passage extending from one side of the nozzle, such as an air supply port.

 The pure water supply ports 2 and the air supply ports 3 formed in the nozzle 1 are connected to the pure water source 13 and the air supply 14 through lines 17 and 18, respectively, as shown in FIG. do. In these sources 13, 14 pure water and air are compressed at high pressure. The nozzle 1 has a cross-sectional structure as shown in FIG. 3 and has an upper air buffer space 4 and a lower mixing buffer space 5.

In the pure water supply port 2, a sub-buffer space 7 is formed which allows pure water to be uniformly distributed throughout, and the sub-buffer space 7 is a mixed buffer space 5 provided in the nozzle 1 for pure water. It communicates with the mixing buffer space 5 through the pure water supply passage 7a provided at a constant pitch to supply. Preferably, the pure water supply passage 7a is inclined at a predetermined angle. Accordingly, when pure water is supplied from the pure water source 13 through the sub buffer space 7 in the pure water supply port 2 to the mixed buffer space 5, the pure water collides with the bottom surface of the mixed buffer space 5 so that the flow rate is reduced. Not only can loss be prevented, but it can also be distributed uniformly.

In addition, a rectifying part 6 having a multiple structure is provided between the air buffer space 4 and the mixing buffer space 5. The air supplied from the air supply port 3 to the mixing buffer space 5 can be converted from turbulence to laminar flow while passing through the rectifying portion 6 and at the same time the pressure is distributed uniformly throughout.

As shown in FIG. 4, the rectifying unit 6 may include an upper rectifying plate 6a having a large porosity and a lower rectifying plate 6b having a relatively small porosity. The rectifying plates 6a and 6b may be made of a material such as resin, metal or ceramic metal. The air supplied to the air buffer space 4 is turbulent in the air buffer space 4 and is uniformly distributed while being converted into laminar flow while passing from the upper rectifying plate 6a to the lower rectifying plate 6a.

As shown in FIG. 5, a plurality of mesh bodies 6c having fine holes may be interposed between the upper rectifying plate 6a and the lower rectifying plate 6b. As another embodiment, the rectifying unit 6 may be made of a porous body having a predetermined thickness, as shown in FIG. 6, for example, a porous ceramic body.

 Accordingly, in the present invention, compressed air is supplied to the air buffer space 4 through the air supply port 3 as shown in the cross-sectional view of FIG. 3, and pure water is supplied to the mixed buffer space 5 through the pure water supply port 2. do. The air supplied to the upper air buffer space 4 is compressed and accelerated while passing through the rectifying part 6 so that the flow is converted from turbulent flow to laminar flow. The pure water supplied to the lower mixed buffer space 5 is supplied more quickly to the mixed buffer space 5 by the Venturi effect while passing through the pure water supply passage 7a from the sub buffer space 7.

Here, since the supplied air is a compressive fluid, the air is compressed and accelerated while passing through the rectifying section 6, and is converted into laminar flow to pressurize the pure water relatively evenly to exert the syringe effect. Accordingly, pure water is injected at high speed through the slit 8, which is the final jet port, in a state accelerated by air.

On the other hand, Figure 7 shows a nozzle according to another embodiment of the present invention. According to the embodiment of FIG. 7, a gap adjusting adjustment bolt 9 is provided between the pair of rectifier plates of the rectifier 6. The flow of fluid injected through the slit 8 is thus not hindered by the adjusting bolt 9.

According to the nozzle for cleaning the substrate by the two-fluid mixture according to the present invention having the structure as described above, there is an advantage that can remove the contaminants attached to the substrate with a high cleaning power while using a non-contact method. Moreover, since the adjusting bolt is provided on the rectifying side, the flow of fluid injected through the slit is not hindered by the adjusting bolt, so that the cleaning force can be maintained uniformly over the entire length of the slit. In addition, since it can be sprayed uniformly as a laminar flow through the pressure control in addition to the high-pressure injection, it is also possible to exert a liquid coating and rinsing effect on the substrate.

In the above, the present invention has been illustrated and described with respect to certain preferred embodiments. However, the present invention is not limited only to the above-described embodiments, and those skilled in the art to which the present invention pertains can vary as many without departing from the spirit of the technical idea of the present invention described in the claims below. It is obvious that it can be changed.

Claims (7)

To clean the substrate by mixing air and pure water and spraying the substrate, An air buffer space into which air supplied from an air source is introduced is formed in an upper portion, and a mixing buffer space in which air supplied from the air buffer space is introduced and pure water supplied from a pure water supply is introduced and mixed is formed in a lower portion of the mixture. A nozzle body having a slit formed on the bottom thereof for injecting the mixed fluid mixed in the buffer space to the outside; And And rectifying the two spaces between the air buffer space and the mixing buffer space and rectifying the air moving from the air buffer space to the mixing buffer space in a laminar flow. Nozzle. The nozzle of claim 1, wherein the rectifying part has an upper rectifying plate having a large porosity and a lower rectifying plate having a lower porosity than the upper rectifying plate. 3. The nozzle of claim 2, wherein the rectifying portion further comprises at least one mesh body positioned between the upper and lower rectifying plates and having fine holes. 3. The nozzle of claim 2, wherein the rectifying portion is made of a porous body. The method of claim 1, wherein a sub buffer space is formed on one side of the nozzle body to temporarily store the pure water supplied from the pure water source and to supply the mixed buffer space through the pure water supply passage. Substrate cleaning nozzle. 6. The nozzle of claim 5, wherein the pure water supply passage is inclined at a predetermined angle. delete

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