KR100870137B1 - A soldering method for a pcb - Google Patents

A soldering method for a pcb Download PDF

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Publication number
KR100870137B1
KR100870137B1 KR1020070074071A KR20070074071A KR100870137B1 KR 100870137 B1 KR100870137 B1 KR 100870137B1 KR 1020070074071 A KR1020070074071 A KR 1020070074071A KR 20070074071 A KR20070074071 A KR 20070074071A KR 100870137 B1 KR100870137 B1 KR 100870137B1
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KR
South Korea
Prior art keywords
component
circuit board
jig
prosthetic
soldering
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KR1020070074071A
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Korean (ko)
Inventor
이미정
엄태진
김대승
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넥스콘 테크놀러지 주식회사
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Priority to KR1020070074071A priority Critical patent/KR100870137B1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A component soldering method of a printed circuit board improves the soldering quality by limiting the movement of the components through a retaining jig. A printed circuit board(10) is supplied to an SMT through a loader. A component(20) is mounted on a printed circuit board mounted in the SMT. A retaining jig(30) is received in the component mounted on the printed circuit board. The component is soldered through the reflow. The retaining jig is detached and arranged. The retaining jig is moved to a standby position.

Description

회로기판의 부품 솔더링 방법 {a soldering method for a PCB}Soldering method for circuit board {a soldering method for a PCB}

본 발명은 회로기판(PCB)에 솔더 패드(Solder Pad)가 한쪽으로 치우친 부품을 보다 안정적으로 솔더링할 수 있도록 하는 회로기판의 부품 솔더링방법에 관한 것으로, 더 자세하게는 로더를 통해 공급된 회로기판에 보형지그를 안착하고 부품을 솔더링하는 것에 관한 것이다.The present invention relates to a method for soldering a component of a circuit board which enables more stable soldering of a component in which a solder pad is biased to a circuit board (PCB), and more particularly, to a circuit board supplied through a loader. It is about seating prosthetic jig and soldering parts.

일반적으로 회로기판에 부품을 솔더링(Soldering)할 때에는 로더(Loader)를 통해 장착기(SMT)에 회로기판을 공급하고, 회로기판에 부품을 마운팅하고, 리플로우(Reflow)를 이용하여 부품을 솔더링하게 된다.In general, when soldering a component to a circuit board, the circuit board is supplied to the SMT through a loader, the component is mounted on the circuit board, and the component is soldered using reflow. do.

그런데 도 1과 같이 솔더 패드(Solder Pad)가 한쪽으로 치우친 부품은 마운팅후에 컨베이어(Conveyor)로 이동하는 과정에서 미세한 진동에 의해 1차 틀어짐이 발생되고, 리플로우(Reflow) 안에서 솔더링을 하는 과정에서도 솔더의 응력에 의해 2차 틀어짐이 발생될 수 있게 된다.However, as shown in FIG. 1, a component in which a solder pad is biased to one side is firstly distorted due to a slight vibration in the process of moving to a conveyor after mounting, and also in a process of soldering in a reflow. Secondary distortion may occur due to the stress of the solder.

따라서 종래에는 회로기판에 솔더 패드가 한쪽으로 치우친 부품을 솔더링할 때에는 많은 불량이 발생되고, 품질이 저하되는 문제가 있었다.Therefore, conventionally, when soldering a component in which a solder pad is biased to one side of a circuit board, many defects are generated and quality is deteriorated.

본 발명은 상기와 같은 종래의 문제점을 해결하기 위해 안출한 것이며, 그 목적이 회로기판에 솔더 패드가 한쪽으로 치우친 부품을 솔더링할 때에 틀어짐 불량을 억제하여 솔더링 품질을 향상시킬 수 있도록 하는 회로기판의 부품 솔더링 방법을 제공하는 데에 있는 것이다.SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and an object thereof is to provide a circuit board capable of improving the soldering quality by suppressing distortion defects when soldering a component in which a solder pad is biased to one side of the circuit board. It is to provide a method of soldering components.

본 발명은 상기의 목적을 달성하기 위하여 로더를 통해 장착기(SMT)에 회로기판을 공급하고, 회로기판에 부품을 마운팅한 후 부품의 상부에 부품의 유동을 제한하는 보형지그를 안착한 다음 리플로우(Reflow)를 통해 부품을 솔더링을 하는 것을 특징으로 한다.In order to achieve the above object, the present invention supplies a circuit board to a mounter (SMT) through a loader, mounts a component on the circuit board, and then mounts a prosthetic jig for restricting the flow of the component on the upper part of the component, and then reflows ( Reflow) is characterized by soldering the parts.

아울러 본 발명은 솔더링을 마친 후 보형지그를 탈거하고, 보형지그를 정렬한 후 보형지그를 최초위치로 이동 대기시키는 것을 특징으로 한다.In addition, the present invention is characterized in that the removal of the prosthetic jig after the soldering, alignment of the prosthetic jig and waiting to move the prosthetic jig to the initial position.

본 발명에 있어서는 솔더 패드가 한 쪽으로 치우친 부품을 실장할 때에 보형지그를 통해 부품의 유동을 제한하기 때문에 부품의 틀어짐 불량을 방지할 수 있게 되고, 그에 따라 솔더링 품질을 크게 향상시킬 수 있게 됨은 물론 원가절감에 크게 기여할 수 있게 된다.In the present invention, when mounting a component in which the solder pad is biased to one side, it restricts the flow of the component through the prosthetic jig, thereby preventing the component from being misaligned, thereby significantly improving the soldering quality and, of course, the cost. It can contribute greatly to savings.

이하 본 발명의 구체적인 기술내용을 첨부도면에 의거하여 더욱 자세히 설명하면 다음과 같다.Hereinafter, the specific technical details of the present invention will be described in more detail with reference to the accompanying drawings.

즉, 도 2에는 본 발명의 한 실시예의 공정 흐름도가 도시되어 있는 바, 본 발명의 회로기판의 부품 솔더링방법은 로더(Loader)를 통해 장착기(SMT)에 회로기판을 공급하는 단계; 장착기(SMT)에 장착된 회로기판에 부품을 마운팅하는 단계; 회로기판에 마운팅된 부품에 보형지그를 안착하는 단계; 리플로우(Reflow)를 통해 부품을 솔더링하는 단계;로 이루어진 것이다.That is, Figure 2 shows a process flow diagram of an embodiment of the present invention, the component soldering method of the circuit board of the present invention comprises the steps of supplying a circuit board to the mounter (SMT) through a loader (Loader); Mounting a component on a circuit board mounted on the mounter (SMT); Mounting a prosthetic jig on a component mounted on a circuit board; Soldering the part through the reflow; consisting of.

아울러 본 발명은 리플로우(Reflow)를 통해 부품에 대한 솔더링을 마친 후 보형지그를 탈거하는 단계; 그리고 보형지그를 정렬하는 단계; 그리고 보형지그를 대기위치로 이동시키는 단계;를 포함한다.In addition, the present invention comprises the steps of removing the prosthetic jig after finishing soldering the parts through reflow; And arranging the prosthetic jig; And moving the prosthetic jig to a standby position.

또한 본 발명은 부품에 대한 솔더링을 마친 후에 회로기판에 부품이 제대로 솔더링되었는지를 육안검사 및 기능검사하는 검사단계;를 포함한다.The present invention also includes a test step of visually and functionally inspecting whether the component is properly soldered to the circuit board after the soldering of the component.

도 3에는 본 발명의 한 실시예의 보형지그의 정면도가 도시되어 있고, 도 4에서 도 4c까지에는 동 보형지그의 사용상태의 정면도, 평면도, 요부 종단면도가 도시되어 있는 바, 도시된 실시예에서 보형지그(30)는 부품(20)의 좌우폭과 대응되는 다수의 안착홈(31)과 흔들림 제한돌기(32)를 구비하는 형태를 갖으며, 회로기 판(10)에 마운팅된 부품(20)의 상부에 설치되어 부품(20)의 좌우 흔들림의 발생범위를 제한함으로써 한도 이상의 틀어짐을 방지하게 된다.Figure 3 is a front view of the prosthetic jig of an embodiment of the present invention, Figure 4 to Figure 4c is a front view, a plan view, a longitudinal cross-sectional view of the state of use of the prosthetic jig bar, the illustrated embodiment The prosthetic jig 30 has a shape having a plurality of seating grooves 31 and a shaking limiting protrusion 32 corresponding to the left and right widths of the parts 20, and the parts 20 mounted on the circuit board 10. It is installed on the top of the) to limit the occurrence range of the left and right shake of the component 20 to prevent the distortion more than the limit.

본 발명에 있어서 보형지그(30)는 부품 솔더링시에 열변형이 되지 않도록 열에 강한 재질을 사용하여야 함은 물론이며, 안착시 다른 부품과 간섭을 일으키지 않도록 설계되어야 하고, 그의 두께 및 폭, 각도 등은 회로기판(10) 및 부품의 폭과 두께, 높이 등에 따라 가변될 수 있음은 물론이다.In the present invention, the prosthetic jig 30 should be made of a material resistant to heat so as not to be thermally deformed at the time of soldering the part, and should be designed so as not to cause interference with other parts during mounting, and its thickness, width, angle, etc. Silver may vary depending on the width, thickness, height, etc. of the circuit board 10 and components.

도 1은 종래의 회로기판 부품 솔더링시의 부품 틀어짐 상태도1 is a view showing a state of component distortion when soldering a conventional circuit board component

도 2는 본 발명의 한 실시예의 공정 흐름도2 is a process flow diagram of one embodiment of the present invention.

도 3은 본 발명의 한 실시예의 보형지그의 정면도3 is a front view of the prosthetic jig of an embodiment of the present invention;

도 4a는 동 보형지그의 사용상태의 정면도Figure 4a is a front view of the state of use of the beam retaining jig

도 4b는 동 보형지그의 사용상태의 평면도Figure 4b is a plan view of the state of use of the beam retaining jig

도 4c는 동 보형지그의 사용상태의 요부 종단면도Fig. 4C is a longitudinal sectional view of principal parts of the use state of the beam retaining jig;

<도면의 주요부분에 대한 부호 설명><Description of Signs of Major Parts of Drawings>

10 : 회로기판 20 : 부품10: circuit board 20: parts

30 : 보형지그 31 : 안착홈30: prosthetic jig 31: seating groove

32 : 흔들림 제한돌기32: shake limiting projection

Claims (3)

회로기판에 보형지그를 통해 부품을 솔더링하는 회로기판의 부품 솔더링 방법을 구성함에 있어서, In the component soldering method of the circuit board to solder the component to the circuit board through the prosthetic jig, 로더(Loader)를 통해 장착기(SMT)에 회로기판을 공급하는 단계; 장착기(SMT)에 장착된 회로기판에 부품을 마운팅하는 단계; 회로기판에 마운팅된 부품에 보형지그를 안착하는 단계; 리플로우(Reflow)를 통해 부품을 솔더링하는 단계; 보형지그를 탈거하는 단계; 그리고 보형지그를 정렬하는 단계; 그리고 보형지그를 대기위치로 이동시키는 단계;를 포함하는 것을 특징으로 하는 회로기판의 부품 솔더링 방법.Supplying a circuit board to a mounter SMT through a loader; Mounting a component on a circuit board mounted on the mounter (SMT); Mounting a prosthetic jig on a component mounted on a circuit board; Soldering the component through reflow; Removing the prosthetic jig; And arranging the prosthetic jig; And moving the prosthetic jig to a standby position. 삭제delete 삭제delete
KR1020070074071A 2007-07-24 2007-07-24 A soldering method for a pcb KR100870137B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101440516B1 (en) 2012-08-24 2014-11-03 시스테크 주식회사 Soldering method of printed circuit board
CN105759861A (en) * 2014-12-18 2016-07-13 齐鲁工业大学 Motion control method of LED chip waxing robot

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02303088A (en) * 1989-05-17 1990-12-17 Fujitsu Ltd Method of soldering component to printed circuit board
JPH06350244A (en) * 1993-06-04 1994-12-22 Fujitsu Ten Ltd Protective housing for printed wiring board and soldering method of electronic component
JPH10107425A (en) * 1996-09-30 1998-04-24 Taiyo Yuden Co Ltd Circuit part mounting jig and mounting method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02303088A (en) * 1989-05-17 1990-12-17 Fujitsu Ltd Method of soldering component to printed circuit board
JPH06350244A (en) * 1993-06-04 1994-12-22 Fujitsu Ten Ltd Protective housing for printed wiring board and soldering method of electronic component
JPH10107425A (en) * 1996-09-30 1998-04-24 Taiyo Yuden Co Ltd Circuit part mounting jig and mounting method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101440516B1 (en) 2012-08-24 2014-11-03 시스테크 주식회사 Soldering method of printed circuit board
CN105759861A (en) * 2014-12-18 2016-07-13 齐鲁工业大学 Motion control method of LED chip waxing robot

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