KR100868110B1 - Substrate detecting mechanism and substrate container - Google Patents

Abstract

An object of the present invention is to provide a substrate detecting mechanism capable of reliably or easily detecting the presence or absence of a substrate even when the amount of warpage of the substrate supported by the support member is changed. The support member 54 which supports the board | substrate G in the container main body 102 which accommodates the board | substrate G, and the board | substrate detection mechanism which detects the presence or absence of the board | substrate supported by the support member 54 are provided. The board | substrate detection mechanism emits light in a container, the optical sensor 108 which receives reflected light, the actuator 109 which changes the angle of the optical sensor 108, and the board | substrate G supported by the support member 54 The control unit 130 controls the angle of the optical sensor 108 by the actuator 109 in accordance with the amount of warpage.

Description

SUBSTRATE DETECTING MECHANISM AND SUBSTRATE CONTAINER}

In the container which accommodates board | substrates, such as the glass substrate for flat panel display (FPD) manufacture represented by liquid crystal display device (LCD), in the state supported by the support member, this invention detects the board | substrate which detects the presence or absence of the board | substrate therein. A substrate and a container containing the substrate detection mechanism are provided.

In the manufacturing process of a flat panel display (FPD) represented by a liquid crystal display (LCD), a so-called multichamber-type vacuum treatment provided with a plurality of vacuum processing apparatuses for performing predetermined processing such as etching, ashing, and film formation on a glass substrate under vacuum. The system is in use.

This vacuum processing system has a conveyance chamber provided with the conveying apparatus which conveys a board | substrate, and the some process chamber provided in the circumference | surroundings, A to-be-processed board | substrate is carried in each process chamber by the conveyance arm in a conveyance chamber, The substrate is taken out from the process chamber of each vacuum processing apparatus. The load lock chamber is connected to the transfer chamber, and the plurality of substrates can be processed while the process chamber and the transfer chamber are kept in a vacuum state in carrying in and out of the substrate on the atmospheric side. Such a multichamber type processing system is disclosed in Patent Document 1, for example.

In such a processing system, after confirming that a glass substrate is normally supported on a conveyance arm in a conveyance chamber, carrying out conveyance of the glass substrate to a process chamber is calculated | required, and for this reason, having a glass substrate in a conveyance chamber It is equipped with a sensor that detects. As this kind of board | substrate detection technique, as shown in patent document 2 and patent document 3, an optical sensor is provided above a board | substrate, receives the reflected light at the time of injecting a light beam from an optical sensor, and detects the presence or absence of a board | substrate. It is known to do.

[Patent Document 1] Japanese Unexamined Patent Publication No. 1999-340208

[Patent Document 2] Japanese Unexamined Patent Publication No. 1995-183361

[Patent Document 3] Japanese Unexamined Patent Publication No. 1998-64971

When such a technique is applied to the transfer chamber, the optical sensor is mounted on the ceiling of the transfer chamber. However, the transfer chamber has a structure in which the ceiling is opened for maintenance, and it is difficult to perform stable detection, and the position of the optical sensor There is a fear that the precision is lowered.

On the other hand, in a conveyance chamber, although providing an optical sensor in the position corresponding to the four corners of a glass substrate, and detecting the presence or absence of the defect of a glass substrate, a support state, etc. simultaneously with the presence or absence of a glass substrate, Since the thickness is not constant and the thickness of the substrate is different, the warpage of the substrate when the glass substrate is supported in the transport chamber is different, so that the direction of the reflected light when the light emitted from the optical sensor reflects off the glass substrate It may change, and it may not be able to detect normally.

This invention is made | formed in view of such a situation, and an object of this invention is to provide the board | substrate detection mechanism which can detect the presence or absence of the board | substrate supported by the support member stably and with high density. Moreover, it is an object to provide a board | substrate detection mechanism which can detect the presence or absence of a board | substrate reliably and easily even if the curvature amount of the board | substrate supported by the support member changes. Furthermore, an object of the present invention is to provide a substrate accommodating container including the substrate detecting mechanism.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, in the 1st viewpoint of this invention, it is a board | substrate detection mechanism which detects the presence or absence of the board | substrate in the container accommodated in the state supported by the support member, and attached to the bottom part of the said container. Provided is a substrate detecting mechanism having an optical sensor and detecting the presence or absence of a substrate by receiving reflected light of light emitted from the optical sensor.

According to a second aspect of the present invention, there is provided a substrate detection mechanism that detects the presence or absence of a substrate in a container that is accommodated in a state supported by a support member, comprising: an optical sensor that emits light into the container and receives reflected light; An actuator for changing the angle of the optical sensor is provided, and the angle of the optical sensor is changed by the actuator according to the amount of warpage of the substrate supported by the support member.

According to a third aspect of the present invention, there is provided a substrate detecting mechanism that detects the presence or absence of a substrate in a container accommodated in a state where the substrate is supported by a supporting member, the optical sensor emitting light into the container and receiving reflected light; An actuator for changing the angle of the optical sensor, and a control unit for controlling the angle of the optical sensor by the actuator in accordance with the amount of warpage of the substrate supported by the support member.

In the third aspect, the control unit stores in advance the relationship between the thickness of the substrate and the amount of warpage, and controls the optical sensor to be at an angle corresponding to the substrate supported by the support member based on the relationship. have.

In the said 2nd, 3rd viewpoint, the said optical sensor can be set as the structure provided in the bottom part of the said container.

In the said 1st thru | or 3rd viewpoint, a board | substrate has a rectangular shape, and the said optical sensor can be set as the structure provided in the position corresponding to the four corners of the said board | substrate. Moreover, the said support member may be the board | substrate support arm for board | substrate conveyance.

In a 4th viewpoint of this invention, the board | substrate accommodation container provided with the container main body which accommodates a board | substrate, the support member which supports a board | substrate in the said container main body, and the board | substrate detection mechanism which detects the presence or absence of the board | substrate supported by the said support member. The substrate detecting mechanism provides a substrate accommodating container having an optical sensor mounted to a bottom portion of the container body, and detecting the presence or absence of a substrate by receiving reflected light of light emitted from the optical sensor.

In a fifth aspect of the present invention, a substrate accommodating container includes a container body for accommodating a substrate, a support member for supporting a substrate in the container body, and a substrate detecting mechanism for detecting the presence or absence of a substrate supported by the support member. The substrate detecting mechanism includes an optical sensor that emits light into a container and receives reflected light, and an actuator that changes an angle of the optical sensor, and is operated by the actuator in accordance with the amount of warpage of the substrate supported by the support member. Provided is a substrate container, characterized in that for changing the angle of the optical sensor.

According to a sixth aspect of the present invention, there is provided a substrate housing including a container main body for accommodating a substrate, a support member for supporting a substrate in the container main body, and a substrate detecting mechanism for detecting the presence or absence of a substrate supported by the support member. As the container, the substrate detecting mechanism includes an optical sensor that emits light into the container and receives reflected light, an actuator that changes an angle of the optical sensor, and an amount of bending caused by the amount of warpage of the substrate supported by the support member. It is provided with a substrate holding container characterized by having a control unit for controlling the angle of the optical sensor.

In the sixth aspect, the control unit stores in advance the relationship between the thickness of the substrate and the amount of warpage, and controls the optical sensor to be at an angle corresponding to the substrate supported by the support member based on the relationship. Can be.

In said 5th, 6th viewpoint, the said optical sensor can be set as the structure provided in the bottom part of the said container main body.

In the fourth to sixth aspects, the substrate has a rectangular shape, and the optical sensor can be configured to be provided at positions corresponding to four corners of the substrate. Moreover, the support part provided in the said container main body and connected with the process container which performs a predetermined process to a board | substrate, and the conveyance mechanism provided in the said container main body and conveying a board | substrate to the said processing container, The said support member Can be made into the structure which is the board | substrate support arm of the said conveyance mechanism.

According to the present invention, since the optical sensor is attached to the bottom of the container for accommodating the substrate in a state supported by the supporting member, the substrate detecting mechanism is configured, so that the light accompanying the opening and closing of the cover is provided even when the lid is provided on the top of the container. It is not necessary to consider the positional shift of the sensor and the like, so that stable detection can be performed.

An optical sensor which emits light into the container and receives the reflected light, and an actuator that changes the angle of the optical sensor, comprises an angle of the optical sensor by the actuator in accordance with the amount of warpage of the substrate supported by the support member. Since it is possible to change the angle of the optical sensor, even when processing a substrate having different warpage, the reflected light from the substrate can be received by a simple operation of changing the angle of the optical sensor by the actuator according to the change in the warpage amount. Moreover, the presence or absence of a board | substrate can be detected easily.

EMBODIMENT OF THE INVENTION Hereinafter, the preferred form of this invention is demonstrated, referring an accompanying drawing. Here, the multichamber type plasma etching system equipped with the plasma etching apparatus which performs plasma etching with respect to the glass substrate G for FPD which is one Embodiment of the substrate processing apparatus of this invention is demonstrated as an example. Here, as FPD, a liquid crystal display (LCD), an electroluminescence (EL) display, a plasma display panel (PDP), etc. are illustrated.

1 is a perspective view schematically showing a multi-chamber plasma etching system, and FIG. 2 is a horizontal sectional view schematically showing the inside thereof.

In this plasma etching system 1, the transfer chamber 20 and the load lock chamber 30 are continuously provided in the center part. Three process chambers 10 which perform plasma etching are connected to the surroundings of the conveyance chamber 20.

The openings communicating between the transfer chamber 20 and the load lock chamber 30, the transfer chamber 20 and each processing chamber 10, and the load lock chamber 30 and the outside atmosphere are hermetically sealed between the transfer chamber 20 and the load lock chamber 30. And a gate valve 22 configured to be openable and closed, respectively.

On the outer side of the load lock chamber 30, two cassette indexers 41 are provided, and a cassette 40 for accommodating a glass substrate G having a rectangular shape thereon is mounted thereon. These cassettes 40 can accommodate, for example, an untreated substrate on one side thereof and a processed substrate on the other side. These cassettes 40 are liftable by the lift mechanism 42.

The conveyance mechanism 43 is provided on the support base 44 between these two cassettes 40, and this conveyance mechanism 43 has the picks 45 and 46 which were provided in the upper and lower two stages, and these are integrated and retracted. And a base 47 rotatably supported.

The transfer chamber 20 is maintained in a predetermined reduced pressure atmosphere similarly to the process chamber 10, and has a transfer apparatus 50 (see FIG. 2) provided therein. And glass substrate G is conveyed between the load lock chamber 30 and three process chambers 10 by this conveyance apparatus 50. The conveying apparatus 50 is mentioned later.

The load lock chamber 30 can be maintained in the same predetermined pressure-reduced atmosphere as each of the process chambers 10 and the transfer chambers 20 performing plasma etching. In addition, the load lock chamber 30 is for carrying out the transfer of the glass substrate G between the cassette 40 in the atmospheric atmosphere and the processing chamber 10 in the reduced pressure atmosphere. The inside volume is extremely small. Moreover, the load lock chamber 30 is provided with the board | substrate accommodating part 31 in two stages up and down (only the upper end is shown in FIG. 2), and is for supporting the glass substrate G in each board | substrate accommodating part 31. FIG. The positioner 33 which performs alignment of the buffer 32 and the glass substrate G is provided.

As shown in FIG. 2, each component of the plasma etching system 1 is configured to be controlled by a process controller 60 having a microprocessor. The process controller 60 has a display for visualizing and displaying the operation state of the plasma etching system 1 or a keyboard for performing a process of inputting a command for managing the plasma etching system 1 or the like. The user interface 61 which consists of etc. is connected. In the process controller 60, a recipe in which a control program (software), process condition data, and the like are recorded for realizing various processes executed in the plasma etching system 1 by the control of the process controller 60. The storage unit 62 stored therein is connected. Then, if necessary, an arbitrary recipe is called from the storage unit 62 by the instruction from the user interface 61 and executed by the process controller 60, so that the plasma etching system (under the control of the process controller 60) The desired process in 1) is executed. A recipe such as the control program or processing condition data can be used as a computer-readable storage medium, for example, a state stored in a CD-ROM, a hard disk, a flexible disk, a flash memory, or the like.

Next, the conveyance chamber 20 is demonstrated in detail. 3 is a vertical sectional view of the transfer chamber 20, and FIG. 4 is a horizontal sectional view thereof. This conveyance chamber 20 has the conveyance chamber main body 102. This conveyance chamber main body 102 is shape | molded in the shape of a square cylinder with the bottom which consists of aluminum, for example, the surface whose alumite process (anodic oxidation process) has carried out, and the upper part is opened. The opening of the upper part of the conveyance chamber main body 102 is closed by the cover 103, and the conveyance chamber main body 102 inside becomes a sealed space by this. The cover 103 is opened at the time of maintenance of the conveying apparatus 50 in the conveyance chamber main body 102, etc. The lid 103 is provided with a plurality of window portions 104 for monitoring the situation inside the transport chamber body 102.

Four sidewalls of the transfer chamber main body 102 are provided with openings 121 that can communicate with the three processing chambers 10 and the load lock chambers 30, respectively, and the openings 121 are formed by the gate valve 22 described above. Opening and closing is possible.

Moreover, the glass substrate hold | maintained in the conveying apparatus 50 when the said conveying apparatus 50 provided in the conveyance chamber main body 102 is in the home position in the bottom wall 102a of the conveyance chamber main body 102. Four window portions 105 are provided at positions corresponding to the four corners of (G). A translucent member 105a, such as quartz, is fitted in the window portion 105, and the optical sensor 108 is angle-adjusted by the bracket 106 and the mounting member 107 in the outer portion of the translucent member 105a. It is attached so that light may be emitted from the optical sensor 108 toward the corner part of the glass substrate G. As shown in FIG. And when the conveyance apparatus 50 supported the glass substrate G in the steady state, the light inject | emitted from the light emitting parts of the four optical sensors 108 is reflected by the glass substrate, and the reflected light is detected by a light receiving part. . Therefore, when the four optical sensors 108 detect the reflected light, it determines with the glass substrate G being supported by the steady state. On the contrary, when the at least one optical sensor 108 does not detect the reflected light, when the glass substrate G does not exist, when it is not supported in a steady state, and when there is a flaw in the glass substrate G, In either case. Moreover, the reflecting plate 125 for diffusely reflecting the light from the optical sensor 108 is provided in the back surface side of the cover 103, and an optical sensor, such as a case where the glass substrate G does not exist in the conveyance chamber main body 102, etc. In the case where the light from 108 further travels further from the predetermined position at which the substrate is present, the reflected light incident on the light receiving portion is minimized.

The mounting state of the optical sensor 108 will be described with reference to the enlarged view of FIG. 5. The mounting member 107 is made of a spring material, and is fixed to the bottom portion of the bracket 106 by a fixing portion 107a, which is bent upward from the fixing portion 107a, and the optical sensor 108 is mounted on the tip end thereof. It has a mounting part 107b. The actuator 109 is provided in the part opposite to the bracket 106 of the window part 105, and the displacement rod 110 extended from the actuator 109 is in contact with the optical sensor 108. As shown in FIG. The angle of the optical sensor 108 is changed by protruding the displacement bar 110 by the actuator 109 to displace the optical sensor 108. In addition, when the displacement bar 110 enters by the actuator 109, the optical sensor 108 follows the displacement bar 110 by the pressing force of the mounting member 107 which consists of a spring material, and is displaced. Thereby, the angle of the optical sensor 108 can be changed according to the curvature of glass substrate G. As shown in FIG. In addition, since the angle adjustment of the optical sensor 108 requires extremely fine adjustment, the piezoelectric actuator is preferable as the actuator 109. Of course, it is applicable even if a cylinder mechanism or a motor is used.

Control of the optical sensor 108 by the actuator 109 is executed by the control unit 130 as shown in FIG. 3. The control unit 130 is connected to the process controller 60 and is configured to execute angle control of the optical sensor 108 by the command of the process controller 60. In this case, when the magnitude | size of glass substrate G is the same, since the curvature amount is determined almost uniquely by the thickness of the glass substrate G, the relationship between the thickness of the glass substrate G and the curvature amount is previously stored. The curvature amount corresponding to the thickness of the glass substrate G which is stored in the 131 and actually supported is selected from the information stored in the storage unit 131, and the angle of the optical sensor 108 is adjusted based on the information. Control automatically.

In addition, although the control system is slightly complicated, it is also possible to autotun the angle of the optical sensor 108 in accordance with the amount of warpage of the glass substrate G.

The conveying apparatus 50 is attached to the shaft 51 of the rotation mechanism (not shown) provided below the conveyance chamber main body 102, and is linearly provided with respect to the base member 52 and the base member 52 provided rotatably. The slide member 53 provided slidably and the board | substrate support arm 54 provided so that the slide member 53 is slidable in the same direction as the slide direction of the slide member 53 is provided. That is, the conveying apparatus 50 has a linear motion arm mechanism. The slide to the base member 52 of the slide member 53 is executed by the slide mechanism 56, and the slide to the slide member 53 of the substrate support arm 54 is performed by the slide mechanism 57. It is. The slide mechanism 56 has a guide rail 56a provided along the longitudinal direction of the slide member 53 and a guide member 56b mounted to the base member 52 and slidably fitted to the guide rail 56a. have. In addition, the slide mechanism 57 is a guide rail 57a provided along the longitudinal direction of the slide member 53, and a guide member 57b attached to the substrate support arm 54 and slidably fitted to the guide rail 57a. ) In addition, the slide mechanisms 56 and 57 are made to slide the slide member 53 and the board | substrate support arm 54 by the drive motor, a belt mechanism, etc. which are not shown in figure.

Next, the processing operation in the plasma etching system 1 configured as described above will be described. First, either one of the two picks 45 and 46 of the conveyance mechanism 43 is driven forward and backward, and the glass substrate G is carried into the load lock chamber 30 from one cassette 40 containing the untreated substrate. do.

After the picks 45 and 46 are withdrawn, the gate valve 22 on the atmospheric side of the load lock chamber 30 is closed. Thereafter, the inside of the load lock chamber 30 is exhausted and the inside is pressurized to a predetermined degree of vacuum. After completion of the vacuum suction, positioning of the glass substrate G is performed by pressing the substrate with the positioner 33.

After the alignment as described above, the gate valve 22 between the transfer chamber 20 and the load lock chamber 30 is opened, and the load lock chamber 30 is transferred to the load lock chamber 30 by the transfer apparatus 50 in the transfer chamber main body 102. The accommodated glass substrate G is received. Specifically, the board | substrate support arm 54 of the conveying apparatus 50 will be in the state which supported the glass substrate G. As shown in FIG.

And the conveying apparatus 50 hold | maintains the groove position shown in FIG. 2 in the conveyance chamber main body 102, and in this state, the presence or absence of a glass substrate on the board | substrate support arm 54, and the position of the glass substrate G The presence or absence of a shift | offset | difference or a flaw is detected by the optical sensor 108 provided in the bottom wall of the conveyance room main body 102.

In the conveyance chamber main body 102, when the detection of this glass substrate G is performed and it is detected that the glass substrate G is supported by the board | substrate support arm 54 in a steady state, the conveyance mechanism 50 will The glass substrate G is conveyed to any one of the process chambers 10, and the etching process of the glass substrate G is performed in it. On the other hand, when there is an abnormality in the state of glass substrate G, a process is stopped.

After the etching process, the glass substrate G after the etching process is received by the substrate support arm 54 of the conveyance mechanism 50, and is conveyed to the load lock chamber 30. In the state where the processed glass substrate G is carried in the load lock chamber 30, the load lock chamber 30 is returned to the standby state, and the cassette is removed from the load lock chamber 30 by either of the picks 45 and 46. The glass substrate is conveyed to 40. Then, the above procedure is repeated for the number of wafers in the cassette 40, and the process is finished.

In the above-mentioned process, in detecting the presence or absence of the glass substrate G in the conveyance chamber 20, as mentioned above, according to the prior art, attaching an optical sensor to the ceiling part of the conveyance chamber 20 is described. However, in the conveyance chamber 20, it has a structure which opens and closes the upper opening of the chamber 102 by the cover 103, and cannot attach an optical sensor to the cover 103 which opens and closes. For this reason, it is difficult to perform stable detection, and there exists a possibility that the positional accuracy of an optical sensor may fall.

On the other hand, in this embodiment, since the optical sensor 108 was provided in the bottom part of the conveyance chamber main body 102, the position shift of the optical sensor accompanying opening / closing of a cover does not occur, and stable detection can be performed.

On the other hand, since one side of the glass substrate G is large in 1 m or more, in the state supported by the board | substrate support arm 54 of the conveying apparatus 50, as shown in FIG. 6, curvature arises. And when the magnitude | size of glass substrate G is the same, this curvature amount changes with thickness, and when thickness becomes thin, curvature becomes large and it moves to the position of B from the position of A of FIG. Conventionally, since the optical sensor is fixed and provided, when the optical sensor is positioned so as to receive the reflected light when the glass substrate G is at the position of A, the reflected light with respect to the glass substrate G at the position of B is reflected. There is a situation in which the glass substrate G cannot be detected because no light is received. And when trying to respond to such a situation, whenever the thickness of the glass substrate to process differs, it is necessary to adjust the mounting position or angle of an optical sensor, and it was extremely complicated.

In contrast, in the present invention, even when processing the glass substrate G having different warpage, the glass substrate (by a simple operation of changing the angle of the optical sensor 108 by the actuator 109 in accordance with the change in the warpage amount) Since the reflected light from G) can be received, the presence or absence of the glass substrate G can be detected reliably and easily.

At this time, as described above, since the amount of warpage is almost uniquely determined by the thickness of the glass substrate G when the sizes of the glass substrate G are the same, the relationship between the thickness and the amount of warpage of the glass substrate G in advance Is stored in the storage unit 131, the curvature amount corresponding to the thickness of the glass substrate G that is actually supported is selected from the information stored in the storage unit 131, and the optical sensor 108 is based on the information. Automatically control the angle of

For example, as shown in FIG. 7, when the board | substrate support arm (pitch 710mm) is inserted in the short side of a 1300x1500 (mm) glass substrate, when the thickness of the glass substrate edge part is 0.7 mm, it is 8 mm in thickness. When the thickness is 0.5 mm, the thickness becomes 16 mm, and the angle difference between the optical sensors capable of receiving the reflected light normally is 2 degrees. Therefore, by storing the table in the storage unit 131 for each thickness of the substrate using such a relationship, it becomes possible to cope with any substrate processing. In addition, since the curvature amount of a glass substrate changes also with the kind of glass substrate, when the relationship of the curvature amount according to the kind of glass substrate is also memorize | stored in the memory | storage part 131, it respond | corresponds also when processing other types of glass substrates. It becomes possible.

In addition, this invention is not limited to the said embodiment, A various deformation | transformation is possible. For example, in the said embodiment, although the example which detected the board | substrate supported on the board | substrate support arm 54 of the conveyance chamber 20 was shown, if it is a case where it supports in the state which the warpage generate | occur | produces in a board | substrate, it limits to this. For example, the support which only supports a board | substrate may be sufficient. Therefore, also in the load lock chamber 30, it is applicable as long as the support form of a board | substrate makes it possible to produce curvature. In addition, although this embodiment showed about the case where this invention is applied to a plasma etching system, it is applicable as long as it is a container which accommodates and supports a board | substrate. Moreover, in the said embodiment, although the example which provided four optical sensors 108 corresponding to four corners of the board | substrate was shown, what is necessary is just one or more.

Moreover, in the said embodiment, although the control part 130 made it change the angle of an optical sensor automatically according to the curvature of a board | substrate, it is not limited to this.

In addition, in the said embodiment, although the example using the glass substrate for FPD was shown as a board | substrate, it is not limited to this, It is applicable as long as it is a board | substrate which becomes a problem.

(Industrial availability)

This invention is effective when supporting a board | substrate in the form which warpage arises in a container with respect to the large board | substrate which a warpage becomes a problem, and detecting the presence or absence of the board | substrate.

1 is a perspective view schematically showing a multi-chamber plasma etching system having a transfer chamber according to an embodiment of the present invention;

2 is a horizontal cross-sectional view schematically showing the interior of the plasma etching system of FIG.

3 is a vertical sectional view showing a conveyance chamber according to one embodiment of the present invention;

4 is a horizontal sectional view showing a conveyance chamber according to one embodiment of the present invention;

5 is an enlarged view showing a mounting state of an optical sensor in a transport chamber;

FIG. 6 is a diagram showing a deviation in a reflection direction of light emitted from an optical sensor due to a difference in size of warpage of a glass substrate;

7 is a schematic diagram showing an example in which the angle of the optical sensor is actually controlled using the present invention.

Explanation of symbols for the main parts of the drawings

1 plasma etching system 10 process chamber

20: conveying chamber 22: gate valve

30: load lock chamber 50: conveying device

54 substrate support arm (support member) 60 process controller

102: carrier body 102a: floor wall

108: light sensor 109: actuator

130: control unit 131: storage unit

G: glass substrate

Claims (14)

In the board | substrate detection mechanism which detects the presence or absence of the board | substrate in the container accommodated in the state supported by the support member, And having an optical sensor mounted on the bottom of the container so as to be adjustable in angle, and detecting the presence of the substrate by receiving the reflected light of the light emitted from the optical sensor. Board detection mechanism. In the board | substrate detection mechanism which detects the presence or absence of the board | substrate in the container accommodated in the state supported by the support member, An optical sensor which emits light into the container and receives reflected light; An actuator for changing an angle of the optical sensor, The angle of the optical sensor is changed by the actuator according to the amount of warpage of the substrate supported by the support member Board detection mechanism. In the board | substrate detection mechanism which detects the presence or absence of the board | substrate in the container accommodated in the state supported by the support member, An optical sensor which emits light into the container and receives reflected light; An actuator for changing an angle of the optical sensor; And a control unit for controlling the angle of the optical sensor by the actuator according to the amount of warpage of the substrate supported by the support member. Board detection mechanism. The method of claim 3, wherein The control unit memorizes in advance the relationship between the thickness of the substrate and the amount of warpage, and controls the optical sensor to be at an angle corresponding to the substrate supported by the support member based on the relationship. Board detection mechanism. The method according to any one of claims 2 to 4, The optical sensor is provided on the bottom of the container, characterized in that Board detection mechanism. The method according to any one of claims 1 to 4, The substrate has a rectangular shape, and the optical sensor is provided at a position corresponding to four corners of the substrate. Board detection mechanism. The method according to any one of claims 1 to 4, The support member is a substrate support arm for substrate transport. Board detection mechanism. A substrate accommodating container comprising a container body for accommodating a substrate, a support member for supporting a substrate in the container body, and a substrate detecting mechanism for detecting the presence or absence of a substrate supported by the support member. The substrate detecting mechanism has an optical sensor mounted on the bottom of the container body so as to be angle-adjustable, and detects the presence or absence of a substrate by receiving reflected light of light emitted from the optical sensor. Substrate receiving container. A substrate accommodating container comprising a container body for accommodating a substrate, a support member for supporting a substrate in the container body, and a substrate detecting mechanism for detecting the presence or absence of a substrate supported by the support member. The substrate detection mechanism, An optical sensor which emits light into the container and receives reflected light; Has an actuator for changing the angle of the optical sensor, The angle of the optical sensor is changed by the actuator according to the amount of warpage of the substrate supported by the support member Substrate receiving container. A substrate accommodating container comprising a container body for accommodating a substrate, a support member for supporting a substrate in the container body, and a substrate detecting mechanism for detecting the presence or absence of a substrate supported by the support member. The substrate detection mechanism, An optical sensor which emits light into the container and receives reflected light; An actuator for changing an angle of the optical sensor; And a controller for controlling the angle of the optical sensor by the actuator according to the amount of warpage of the substrate supported by the support member. Substrate receiving container. The method of claim 10, The control unit memorizes in advance the relationship between the thickness of the substrate and the amount of warpage, and controls the optical sensor to be at an angle corresponding to the substrate supported by the support member based on the relationship. Substrate receiving container. The method according to any one of claims 9 to 11, The optical sensor is provided on the bottom of the container body, characterized in that Substrate receiving container. The method according to any one of claims 8 to 11, The substrate has a rectangular shape, and the optical sensor is provided at positions corresponding to four corners of the substrate. Substrate receiving container. The method according to any one of claims 8 to 11, And a connection part provided in the container body and to which a processing container subjected to a predetermined process is connected to the substrate, and a conveying mechanism provided in the container body and conveying the substrate to the processing container, wherein the support member is provided as described above. It is a board | substrate support arm of a conveyance mechanism Substrate receiving container.

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