KR100976402B1 - Chemical vapor deposition apparatus - Google Patents

Abstract

A chemical vapor deposition apparatus is disclosed. The chemical vapor deposition apparatus of the present invention includes at least one process module chamber in which a substantial chemical vapor deposition process is performed on a substrate, and a substrate is entered into the process module chamber before the substrate enters the process module chamber. A transfer module chamber connecting a load lock chamber for creating an environment in which the environment can be formed and having a substrate handling robot configured to transfer the substrate to the load lock chamber and the process module chamber; And a substrate breakage detection sensor freely rotatable in at least two axes, and detachably coupled to a side wall surface of the transfer module chamber to detect whether or not a breakage of a substrate introduced into the transfer module chamber occurs. Characterized in that it comprises a. According to the present invention, it is possible to easily perform the installation work and the orientation control work of the substrate breakage detection unit while having a simple and simple structure.

Description

Chemical Vapor Deposition Apparatus {CHEMICAL VAPOR DEPOSITION APPARATUS}

The present invention relates to a chemical vapor deposition apparatus, and more particularly, to a chemical vapor deposition apparatus that can easily perform the installation operation and orientation control operation of the substrate damage detection unit while having a simple and simple structure.

Flat panel displays are widely used in personal handheld terminals, as well as TVs and computer monitors.

Such flat displays include liquid crystal displays (LCDs), plasma display panels (PDPs), and organic light emitting diodes (OLEDs).

Among them, liquid crystal displays (LCDs) inject liquid crystals, which are solid and liquid intermediates, between two thin upper and lower glass substrates, and generate contrast by changing the arrangement of liquid crystal molecules by the electrode voltage difference between the upper and lower glass substrates. It is a device using a kind of optical switch phenomenon to display an image.

LCDs are now widely used in electronic clocks, electronic calculators, TVs, notebook PCs, electronic products, automobiles, aircraft speed displays and driving systems.

Previously, LCD TVs had a size of about 20 inches to about 30 inches, and most monitors had a size of 17 inches or less. However, in recent years, large TVs of 40 inches or more and large monitors of 20 inches or more have been released and sold, and the preference for them is increasing day by day.

Therefore, manufacturers of LCDs are researching to produce wider glass substrates. Currently, mass production of so-called 8th generation glass substrates with widths and widths of about 2 meters is in progress at some manufacturers. It is in sight.

Such LCD is a TFT process in which deposition, photolithography, etching, chemical vapor deposition, etc. are repeatedly performed, a cell process for bonding upper and lower glass substrates, and an apparatus It is released as a product through a module process that completes the process.

The chemical vapor deposition process, which is one of the above-described TFT processes, is performed in a process module chamber in which an optimal environment for the process is established. In particular, recently, a chemical vapor deposition apparatus (CHEMICAL VAPOR DEPOSITION APPARATUS) having a plurality of process module chambers arranged at regular intervals to process many substrates in a short time has been widely used.

The chemical vapor deposition apparatus includes a transfer module chamber, a load lock chamber coupled to one side of the transfer module chamber, and a plurality of process module chambers coupled to the other side of the transfer module chamber. do.

Thus, when the substrate of the working object is introduced into the load lock chamber, the substrate handling robot provided in the transfer module chamber transfers the substrate to the transfer module chamber, and then transfers the substrate to any one of the plurality of process module chambers to the corresponding process module chamber. The deposition process is performed on the substrate within the substrate, and when the operation is completed, the substrate is taken out in the reverse order described above.

On the other hand, since the substrate is made of glass (glass) material, there is a high risk of being easily broken or broken. Therefore, it is necessary to determine whether there is a broken portion on the substrate before the substrate is transferred to the process module chamber where the actual deposition process is performed. For this purpose, it is considered to install a substrate breakage sensor in the transfer module chamber.

In this case, since the substrate is often damaged the edge or the edge region, the substrate breakage detection sensor is required to be installed in the transfer module chamber to detect whether the edge or the edge region of the substrate is broken.

However, according to the structure known to date, the installation and orientation adjustment work of the substrate breakage sensor is very cumbersome and difficult. In particular, it is difficult to adjust the substrate breakage detection sensor to an appropriate position, that is, to adjust the orientation, in order to adjust the direction, the operator must hold a separate tool while holding the substrate breakage detection sensor to adjust the orientation. As a result, the work time increases accordingly, and thus, it is expected to cause a lot of work loss, so the structural improvement is required.

SUMMARY OF THE INVENTION An object of the present invention is to provide a chemical vapor deposition apparatus having a simple and simple structure and which can easily perform installation work and orientation control work of a substrate breakage detection unit.

The object is, according to the present invention, at least one process module chamber in which a substantial chemical vapor deposition process is carried out on a substrate, and wherein said substrate is subjected to said process module before said substrate enters said process module chamber. A transfer module chamber which connects a load lock chamber for creating an environment into which the chamber can be entered, and has a substrate handling robot configured to transfer the substrate to the load lock chamber and the process module chamber. CHAMBER); And a substrate breakage detection sensor freely rotatable in at least two axes, and detachably coupled to a side wall surface of the transfer module chamber to detect whether or not the substrate breakage is introduced into the transfer module chamber. It is achieved by a chemical vapor deposition apparatus comprising a breakage detection unit.

Here, the substrate damage detection unit, the base detachably coupled to one side of the outer wall surface of the transfer module chamber; And a rotation support supporting the substrate breakage detection sensor to be rotatable in a three-axis direction with respect to the base breakage sensor.

The rotation support may include a first rotation shaft provided in the base; A first rotatable body rotatably coupled to an exposed end of the first rotating shaft and rotatable along the circumferential direction of the first rotating shaft based on the first rotating shaft; A second rotating shaft disposed in a direction crossing the first rotating shaft and having one end rotatably coupled to the first rotating body; A second rotating body rotatably coupled to the other end of the second rotating shaft and rotatable along the circumferential direction of the second rotating shaft based on the second rotating shaft; A third rotating shaft disposed in a direction crossing the second rotating shaft and having one end rotatably coupled to the second rotating body; And a third rotating body supporting the substrate breakage detection sensor and rotatably coupled to the other end of the third rotating shaft to be rotatable along the circumferential direction of the third rotating shaft based on the third rotating shaft. .

At least one of the first to third rotating bodies may be coupled to the rotational strength adjusting pin for adjusting the rotational strength of the rotating body with respect to the corresponding rotating shaft.

The rotational strength adjusting pins may be provided on the first and second rotating bodies, respectively.

The base may have a donut shape.

The transfer module chamber may have a hexagonal structure in planar projection, and the at least one substrate breakage detection unit may be a plurality of substrate breakage detection units provided in an edge region of the transfer module chamber.

The plurality of substrate breakage detection units may be coupled one by one in the corner region of the transfer module chamber.

The substrate breakage detection sensor may be a laser sensor that detects whether or not the substrate is broken based on a difference in the amount of light reflected after the light is irradiated toward the substrate.

According to the present invention, it is possible to easily perform the installation operation and the orientation control operation of the substrate damage detection unit while having a simple and simple structure.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

For reference, the substrate to be described below refers to a flat panel display (FPD) including a liquid crystal display (LCD) substrate, a plasma display panel (PDP) substrate, an organic light emitting diodes (OLED) substrate, and the like. For the convenience of description, these will be referred to as substrates without being divided.

1 is a schematic diagram of a chemical vapor deposition apparatus according to an embodiment of the present invention.

As shown in this figure, the chemical vapor deposition apparatus according to the present embodiment includes a plurality of process module chambers 200 (PROCESS MODULE CHAMBER) in which a substantial chemical vapor deposition process is performed on a substrate, and a corresponding process module chamber ( Before the substrate enters the substrate 200, the load lock chamber (100, LOADLOCK CHAMBER) to create an environment in which the substrate can enter the process module chamber 200, the process module chamber 200 and the load lock chamber 100 It has a transfer module chamber (300, TRANSFER MODULE CHAMBER) to connect.

The process module chamber 200 performs a chemical vapor deposition process on a substrate in an environment of high temperature and low pressure. Although not shown, the process module chamber 200 is a place where a predetermined thickness of reactive gas ions emitted from an electrode is deposited on a surface of a substrate placed on a susceptor by a predetermined thickness. to be.

In the present embodiment, since five process module chambers 200 are provided based on one load lock chamber 100, the productivity may be improved. However, since the scope of the present invention is not limited thereto, the number of process module chambers 200 may be more than five or at least not limited thereto.

In order to proceed with the deposition process of the substrate through the process module chamber 200, in the process module chamber 200, the substrate handling robot 400 transfers the substrate of the object to the corresponding process module chamber 200, where atmospheric pressure Since it is difficult to directly enter the substrate in the state into the process module chamber 200 of high temperature and low pressure, the same environment as the process module chamber 200 is created before the substrate is transferred to the process module chamber 200. I need to do it. To this end, the load lock chamber 100 is provided.

When the load lock chamber 100 receives a substrate, which is a target of a chemical vapor deposition process, from the outside by a transfer robot (not shown), the load lock chamber 100 creates an internal environment at a temperature and pressure substantially the same as that of the process module chamber 200. Play a role.

As such, the substrate in the load lock chamber 100 having the substantially same environment as the process module chamber 200 is drawn out by the substrate handling robot 400 provided in the transfer module chamber 300 so as to correspond to the process module chamber 200. After the transfer, the deposition process is carried out. On the contrary, the substrate in which the chemical vapor deposition process is completed in the process module chamber 200 is taken out by the substrate handling robot 400 and taken out by the transfer robot (not shown) while maintaining substantially the same temperature and pressure as the outside. do.

As such, the load lock chamber 100 may be configured to be used in the environment or exterior of the process module chamber 200 before the substrate is drawn from the outside into the process module chamber 200 or before the substrate is drawn out from the process module chamber 200. It serves to receive the substrate in substantially the same state as the environment. Although not shown in detail, the load lock chamber 100 according to the present embodiment includes a three-stage unit chamber (not shown) in which a substrate is accommodated along a height direction.

The transfer module chamber 300 is a chamber connecting the process module chamber 200 and the load lock chamber 100. In the transfer module chamber 300, a substrate to be deposited is transferred from the load lock chamber 100 to the process module chamber 200, or the substrate on which the deposition process is completed is transferred from the process module chamber 200 to the load lock chamber. A substrate handling robot 400 for transferring to 100 is provided.

In this embodiment, since five process module chambers 200 are provided for one load lock chamber 100, the substrate handling robot 400 is a robot having a multi-arm arm that can rotate and move forward and backward at the corresponding position. Apply.

FIG. 2 is an external perspective view of the transfer module chamber region illustrated in FIG. 1, and FIG. 3 is a plan view of FIG. 2.

As shown in these figures, the transfer module chamber 300 is a huge structure having a hexagonal structure in planar projection. In other words, the substrate, called the 8th generation, having a width of about 2 meters in width and length within the inside, is provided as a huge structure because the substrate handling robot 400 must be transferred.

As shown in FIG. 2, the transfer module chamber 300 is provided on the frame structure 310. Of course, the structure in which the transfer module chamber 300 is mounted on the frame structure 310 is applied to the load lock chamber 100 and the process module chamber 200 in addition to the transfer module chamber 300.

As described above, the transfer module chamber 300 is a structure having a large height and volume, the safety guard 320 is provided on the outer surface of the transfer module chamber 300. In addition, an upper opening and closing plate 330 is formed on the upper surface of the transfer module chamber 300 to form an access path of the substrate handling robot 400. Since the opening and closing of the upper opening and closing plate 330 is impossible by manpower, a crane connection part 331 is provided in the central region of the upper opening and closing plate 330 to which the rope of the crane is connected.

4 is an enlarged perspective view of the main door area, and FIG. 5 is a partially enlarged view of FIG. 4.

As shown in Figure 2 to 5, for the entrance and exit of the operator in the vicinity of the upper opening and closing plate 330 which is provided to open and close on the upper surface of the transfer module chamber 300 for access to the substrate handling robot 400. A pair of main door units 340 for opening and closing a hatch (not shown) are provided.

In the present embodiment, a pair of main door unit 340 is provided on both sides with the upper opening and closing plate 330 therebetween, but the scope of the present invention is not limited thereto. That is, one main door unit 340 may be provided or may be provided on the side surface of the transfer module chamber 300 or the like.

The main door unit 340 includes a hatch coupler 350 coupled to and released from the hatch, and a vacuum release unit provided at the hatch coupler 350 to selectively release the internal vacuum of the transfer module chamber 300. 360.

The hatch coupler 350 serves as a door that opens and closes the hatch as a substantially rectangular structure. Although the hatch coupling plate 350 is smaller than the upper opening and closing plate 330, the hatch coupling plate 350 is also difficult to open and close manually because it is made of a metal material having a predetermined size and thickness.

Accordingly, a pickup protrusion 351 to which a rope of a crane is coupled to the hatch coupling plate 350 is further formed to pick up the hatch coupling plate 350. The pickup protrusion 351 may be used as a place where the rope of the crane is coupled or the like, and may be used as a place where the exposed end of the lever 363 to be described below is in contact with each other. Therefore, it is preferable that the upper surface of the pick-up protrusion 351 forms a flat one surface.

The vacuum release unit 360 may include an air pipe 361 coupled to the transfer module chamber 300 so that one end thereof communicates with the inside of the transfer module chamber 300, and a valve configured to open and close an internal flow path of the air pipe 361. 362 and a lever 363 that operates the opening and closing operation of the valve 362.

A support plate 361a is further formed on the upper surface of the transfer module chamber 300 so that the air pipe 361 may be coupled to the transfer module chamber 300.

The valve 362 is a conventional mechanical valve, and serves to open and close the internal flow path of the air pipe 361 by a spring (not shown) moved up and down therein. That is, when the lever 363 coupled to the upper portion of the valve 362 rotates a predetermined distance from the upper surface of the pickup protrusion 351, the valve 362 is opened to release the internal vacuum of the transfer module chamber 300, and conversely, the lever When the 363 reaches the top surface of the pick-up protrusion 351, the valve 362 is closed to prevent air from moving through the air pipe 361. Of course, since the scope of the present invention is not limited thereto, an electronic valve may be applied to the valve 362.

The lever 363 manipulates the opening and closing operation of the valve 362. In the present embodiment, the lever 363 can move between the vacuum release position at which the valve 362 is opened and the vacuum position at which the valve 362 is closed. It is applied as a rotary lever to be provided.

One end of the lever 363 as the rotary lever is rotatably connected to the valve 362, and the other end is selectively contacted with the upper surface of the pickup protrusion 351. In this embodiment, the lever 363 has a partially stepped rod shape, but it is not necessarily so.

In the present embodiment, the air pipe 361 and the valve 362 are partially shielded by separate bracket housings 365.

On the other hand, as described above, since the substrate is made of a glass (glass) material, there is a high risk of being easily broken or broken. Therefore, it is necessary to determine whether there is a broken portion on the substrate before the substrate is transferred to the process module chamber 200 where the actual deposition process is performed. However, when the sensor is simply installed on the inner wall of the process module chamber 200, it is difficult because the installation or maintenance work and the directional adjustment work are not easy. That is, since the substrates are often broken at edges or edge areas, the sensor must be easily adjusted in order to detect whether the edges or edge areas of the substrate are broken. Therefore, the present embodiment proposes the substrate damage detecting unit 500 as follows.

FIG. 6 is a layout view of a pair of substrate breakage detection units, FIG. 7 is a perspective view of a board breakage detection unit, FIG. 8 is a partially exploded perspective view of FIG. 7, and FIGS. 9 to 12 are substrate breakage detection sensors, respectively. These are perspective views of a state in which the directionality with respect to is adjusted.

As shown in these figures, the substrate breakage detection unit 500 of the present embodiment is detachably coupled to the outer wall surface of the transfer module chamber 300 to determine whether or not the substrate has been broken into the transfer module chamber 300. It plays a role of sensing.

As shown in FIG. 3, the substrate breakage detection unit 500 is detachably coupled to the corner region of the transfer module chamber 300, and is coupled one by one in the corner region of the transfer module chamber 300. That is, as shown in Figure 6, it is coupled in pairs in the corner region of the transfer module chamber 300 to detect whether the substrate is damaged in the corresponding position.

In the present embodiment, since the transfer module chamber 300 has a hexagonal structure, a total of 12 substrate breakage detection units 500 are provided to detect whether the edge or side area of the substrate is damaged at a corresponding position.

However, since the scope of the present invention is not limited thereto, it is not necessary to provide 12 substrate break detection units 500. In addition, the substrate breakage detection unit 500 may detect whether or not the damage to the other area other than the edge or side area of the substrate.

Mainly referring to FIGS. 7 and 8, the substrate breakage detection unit 500 includes a substrate breakage sensor 510 and a base 520 detachably coupled to one side of an outer wall surface of the transfer module chamber 300. In addition, the substrate breakage sensor 510 may include a rotation support 530 rotatably supporting the substrate breakage sensor 510 such that the substrate breakage sensor 510 is freely rotatable in a direction required for the base 520.

The substrate breakage sensor 510 may be coupled to the rotation support 530 to be freely rotated in any direction with respect to the base 520 together with the rotation support 530. Rotation at this time means, but is not necessarily the manual operation of the operator.

In this embodiment, the substrate breakage detection sensor 510 irradiates light toward the substrate located inside the transfer module chamber 300 from the outer wall surface of the transfer module chamber 300, and then, reflects the light amount difference of the reflected light that is reflected again. It is applied as a laser sensor that detects whether or not the substrate is broken based on the However, the scope of the present invention is not limited thereto.

The base 520 supports the rotation support 530, but is detachably coupled to one side of an outer wall surface of the transfer module chamber 300. In this embodiment, the base 520 has a donut shape because the rotation support 530 to which the substrate breakage sensor 510 is coupled should be freely rotatable on the base 520.

However, if there is no restriction or restriction on the rotation of the rotary support 530, the base 520 does not necessarily have a donut shape. As such, the base 520 does not necessarily have a donut shape, but in order for the laser from the substrate breakage sensor 510 to be incident into the transfer module chamber 300 on the outer wall of the transfer module chamber 300. It is advantageous for the base 520 to have a donut shape. Of course, transparent or translucent glass windows or plastic windows should be provided on the sidewall surface of the transfer module chamber 300 in the region where the base 520 is located so that the path through which the laser is incident and reflected is not blocked. Will be omitted.

The base 520 is provided with a fastener 521 that is detachably coupled to one side of the outer wall surface of the transfer module chamber 300. Due to the simple and simple fastener 521 as described above, the substrate breakage detection unit 500 has an advantage of facilitating installation or maintenance work.

On the other hand, the rotation support 530 is rotatably coupled to the first rotating shaft 541 provided on the base 520 and the exposed end of the first rotating shaft 541, the first rotating shaft based on the first rotating shaft 541 A first rotating body 551 rotatable along the circumferential direction of 541 and a second rotating shaft disposed in a direction crossing the first rotating shaft 541 and one end rotatably coupled to the first rotating body 551. 542 and a second rotating body 552 rotatably coupled to the other end of the second rotating shaft 542 and rotatable along the circumferential direction of the second rotating shaft 542 based on the second rotating shaft 542. And a third rotating shaft 543 disposed in a direction crossing the second rotating shaft 542 and rotatably coupled to the second rotating body 552, and supporting the substrate breakage sensor 510. A third rotatably coupled to the other end of the rotation shaft 543 and rotatable along the circumferential direction of the third rotation shaft 432 based on the third rotation shaft 543. And a body (553).

As such, the rotation support 530 of the present embodiment is rotatably coupled to the three first to third rotation shafts 541 to 543 and the first to third rotation shafts 541 to 543 disposed in the direction crossing each other. Due to the first to third rotating bodies 551 to 553, the substrate breakage detection sensor 510 can be easily rotated in a required direction.

As described above, in the reference state as shown in FIG. 7, the substrate breakage detection sensor 510 is rotated by the angle A1 relative to the reference line by rotating the third rotation body 553 in one direction based on the third rotation shaft 543 as shown in FIG. 9. Can be rotated. In addition, by rotating the second and third rotating bodies 552 and 553 together in one direction based on the second rotating shaft 542 in the reference state as shown in FIG. Can be rotated. In the case of FIG. 11, the substrate breakage sensor 510 is rotated by an angle A3 relative to the reference line as the operations of FIGS. 9 and 10 are performed together. In the reference state as shown in FIG. 7, the substrate breakage sensor 510 is angled relative to the reference line by rotating the first to third rotary bodies 551 to 553 together in one direction based on the first rotation shaft 541 as shown in FIG. 12. You can rotate it by A4.

As described above, the substrate breakage sensor 510 is easily rotated by rotating any one or more of the first to third rotating bodies 551 to 553 based on the first to third rotating shafts 541 to 543. There is an advantage in that the orientation adjustment of the substrate damage sensor 510 is facilitated. In particular, the directional adjustment work for the substrate damage sensor 510 does not need to be performed by the operator with two hands or using a separate tool as in the prior art, it is very convenient in use because it can be fully operated with one hand. There is this.

On the other hand, by adjusting any one or more than one of the first to third rotating bodies (551 to 553) on the basis of the first to third rotating shafts (541 to 543) to adjust the orientation of the substrate damage sensor 510 Therefore, if the rotation of the first to third rotational bodies 551 to 553 about the first to third rotation shafts 541 to 543 is too free, the direction of the substrate breakage detection sensor 510 may be arbitrarily twisted due to vibration or the like. On the contrary, if the rotation of the first to third rotary bodies 551 to 553 about the first to third rotary shafts 541 to 543 is too tight, the operation may not be easy.

To this end, as shown in the drawings, at least one of the first to third rotating bodies 551 to 553, that is, the first and second rotating bodies 551 and 552, includes the first and second rotating bodies 551 and 552. Rotational strength adjusting pins 540 for adjusting the rotational strength with respect to the corresponding rotating shaft (541 ~ 543) is coupled. Rotational strength adjusting pin 540 is a means for tightening or loosening the divided inlets of the first and second rotating bodies 551,552 to which the first to third rotating shafts 541 to 543 are rotatably coupled. .

That is, when the first and second rotary shafts 541 to 543 are rotatably coupled to each other by tightening the rotational force adjusting pins 540, the breakage of the substrate is detected by pressing the divided inlets of the first and second rotary bodies 551 and 552. The rotational operation of the sensor 510 may take a lot of force, and on the contrary, the first and second rotating bodies in which the first to third rotating shafts 541 to 543 are rotatably coupled by releasing the rotational strength adjusting pin 540 ( Loosening the divided inlets of the 551, 552 to each other may require less force for the rotation operation of the substrate breakage sensor 510, which can be adjusted appropriately by the operator. For reference, the rotational strength adjustment pins 540 are provided in three places of different positions, but the roles and functions are the same, so that all have the same reference numerals.

Referring to the operation of the substrate breakage detection unit 500 in the chemical vapor deposition apparatus having such a configuration as follows.

First, the substrate damage detection unit 500 is prepared, and the base 520 is easily coupled to one side of the outer wall surface of the transfer module chamber 300 by using the fastener 521.

When the installation work of the substrate breakage detection unit 500 is simply finished, the work of adjusting the direction of the substrate breakage detection sensor 510 is performed at the position. In this case, the worker may work with one hand unless a separate tool is needed.

If the substrate damage sensor 510 is to be rotated by an angle A1 in the reference state as shown in FIG. 7, the third rotor 553 may be rotated in one direction based on the third rotation shaft 543. In addition, in the reference state as shown in FIG. 7, when the substrate breakage sensor 510 is rotated by an angle A2 as shown in FIG. 10, the second and third rotating bodies 552 and 553 are rotated together in one direction based on the second rotation axis 542. Just do it.

If the substrate damage detection sensor 510 is rotated by an angle A3 as shown in FIG. 11 in the reference state as shown in FIG. 7, the operations of FIGS. 9 and 10 may be sequentially performed. Of course, since the operations of FIGS. 9 and 10 are not in sequence, any operation may be performed first.

Lastly, in the reference state as shown in FIG. 7, if the plate breakage sensor 510 is rotated by an angle A4 as shown in FIG. 12, the first to third rotatable bodies 551 to 553 together with the first rotating shaft 541. Just rotate in one direction.

As such, according to the present exemplary embodiment, the installation work and the orientation adjustment work of the substrate breakage detection unit 500 can be easily performed while having a simple and simple structure.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

1 is a schematic diagram of a chemical vapor deposition apparatus according to an embodiment of the present invention.

FIG. 2 is an external perspective view of the transfer module chamber region shown in FIG. 1. FIG.

3 is a plan view of FIG. 2.

4 is an enlarged perspective view of the main door area.

5 is a partially enlarged view of FIG. 4.

6 is a layout view of a pair of substrate damage detecting units.

7 is a perspective view of the substrate breakage detection unit.

8 is a partially exploded perspective view of FIG. 7.

9 to 12 are perspective views of a state in which the orientation of the substrate damage detection sensor is adjusted.

* Explanation of symbols for the main parts of the drawings

100: load lock chamber 200: process module chamber

300: transfer module chamber 310: frame structure

320: safety guard 330: upper opening and closing plate

340: main door unit 350: hatch coupling plate

360: vacuum release unit 400: substrate handling robot

500: substrate damage detection unit 510: substrate damage detection sensor

520: base 530: rotary support

Claims (9)

At least one process module chamber in which a substantial chemical vapor deposition process is performed on the substrate and an environment in which the substrate can enter the process module chamber before the substrate enters the process module chamber. A transfer module chamber connecting a load lock chamber to the load lock chamber and having a substrate handling robot configured to transfer the substrate to the load lock chamber and the process module chamber; And At least one substrate breakage sensor having a substrate breakage detection sensor freely rotatable in at least two axes, and detachably coupled to a sidewall surface of the transfer module chamber to detect breakage of the substrate introduced into the transfer module chamber; Chemical vapor deposition apparatus comprising a sensing unit. The method of claim 1, The substrate breakage detection unit, A base detachably coupled to one side of an outer wall surface of the transfer module chamber; And And a rotation support for rotatably supporting the substrate breakage detection sensor so that the substrate breakage detection sensor is freely rotatable in the 3-axis direction with respect to the base. The method of claim 2, The rotation support is, A first rotating shaft provided in the base; A first rotatable body rotatably coupled to an exposed end of the first rotating shaft and rotatable along the circumferential direction of the first rotating shaft based on the first rotating shaft; A second rotating shaft disposed in a direction crossing the first rotating shaft and having one end rotatably coupled to the first rotating body; A second rotating body rotatably coupled to the other end of the second rotating shaft and rotatable along the circumferential direction of the second rotating shaft based on the second rotating shaft; A third rotating shaft disposed in a direction crossing the second rotating shaft and having one end rotatably coupled to the second rotating body; And And a third rotating body supporting the substrate breakage detection sensor and rotatably coupled to the other end of the third rotating shaft to be rotatable along the circumferential direction of the third rotating shaft based on the third rotating shaft. Chemical vapor deposition apparatus. The method of claim 3, At least one of the first to the third rotating body of the chemical vapor deposition apparatus, characterized in that the rotational strength adjusting pin for adjusting the rotational strength of the rotating body relative to the rotating shaft. The method of claim 4, wherein The rotational strength adjusting pins are provided on the first and second rotating bodies, respectively. The method of claim 2, And the base has a donut shape. The method of claim 1, The transfer module chamber has a hexagonal structure in planar projection, And the at least one substrate breakage detection unit is provided at an edge region of the transfer module chamber. The method of claim 7, wherein The at least one substrate breakage detection unit is a chemical vapor deposition apparatus, characterized in that coupled in pairs in the corner region of the transfer module chamber. The method of claim 1, The substrate breakage detection sensor is a chemical vapor deposition apparatus, characterized in that the laser sensor for detecting whether the breakage of the substrate based on the difference in the amount of light reflected after the irradiation toward the substrate.

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