KR100864344B1 - Sheet for drilling of printed circuit board - Google Patents

Abstract

The present invention is a metal plate; And an organic material layer formed by coating a composition including a resin having a polymerizable functional group, a water-soluble resin having a hydroxyl group, a curing agent, and a polymer binder on one or both surfaces of the metal plate, wherein the organic material layer has a polymerizable functional group in the composition. The present invention relates to a sheet for drilling a printed circuit board comprising a composite resin formed by reacting a resin, a water-soluble resin having a hydroxy group, and a curing agent. In addition, the present invention is a sheet comprising an organic material formed by using a composition comprising a resin having a polymerizable functional group, a water-soluble resin having a hydroxyl group, a curing agent and a polymer binder, the organic material is a resin having a polymerizable functional group in the composition And a composite resin formed by reacting a water-soluble resin having a hydroxy group and a curing agent.

Description

Drilling sheet for printed circuit board {SHEET FOR DRILLING OF PRINTED CIRCUIT BOARD}

1 is a view showing an example of a sheet for drilling a printed circuit board according to the present invention.

The present invention relates to a sheet for drilling a printed circuit board used in a drill processing step of the manufacturing process of the printed circuit board.

A printed circuit board is a board that mounts electronic components and serves to electrically connect the electronic components to each other, and is very important as an internal component of an electrical product. In general, a printed circuit board is composed of a composite material obtained by laminating a conductor layer made of copper foil and an insulating layer impregnated and cured with epoxy resin on a cross-web made of glass fiber. There is a difference in physical properties.

In the manufacturing process of such a printed circuit board, there exists a drill process of forming through-holes in the cross-sectional direction in order to enable energization between the uppermost layer and the lowermost layer of the laminated substrate. At this time, due to the difference in physical properties between the materials constituting the printed circuit board, various problems may occur when drilling the printed circuit board.

Specifically, defects such as interfacial peeling or cracking between materials are likely to occur during the drilling process, resulting in deterioration of surface roughness on the inner wall of the processing hole or wear or damage of the drill bit. In addition, since periodic irregularities derived from the irregularities of the glass fiber cross-web exist on the surface of the printed circuit board, the precision of the hole position may be degraded during the drilling process. In addition, the heat generated during the drilling process softens the resin in the printed circuit board and easily adheres to the inner layer copper foil, which causes a problem of poor electrical conduction.

In order to solve this problem, the drilling sheet is placed on a printed circuit board and then drilled.

Conventional drilling sheets are generally coated with a water-soluble resin such as polyethylene glycol, dimethyl terephthalate copolymer, oleic amide, polyoxyethylene sorbitan laurate, water-insoluble lubricant, and water-soluble lubricant on one side of the aluminum plate. . However, since the resin layer is made of a water-soluble component, moisture absorption occurs according to storage conditions and processing conditions, thereby causing a problem of resin transfer and a problem of inferior precision of processing hole positions. In addition, the strength of the resin layer is not appropriate, and when drilling, it is difficult to fix the movement of the drill bit due to the up and down vibration pressure, and thus the positional accuracy is deteriorated.

Another conventional technique uses ethylene-ethyl acrylate copolymer resin, ethylene-methacrylate copolymer resin, or the like which is a water-insoluble resin as a constituent of the resin layer, thereby improving problems of lubricity and resin surface hardness due to low melt viscosity. Was intended.

However, the conventional technology does not meet the efficient drill machinability required for a variety of complex drill machining process.

In view of the above problems, the present invention can improve the hole position accuracy when drilling, can suppress the wear or damage of the drill bit, can minimize the movement of the drill bit due to the up and down vibration pressure, after drilling An object of the present invention is to provide a sheet for drilling a printed circuit board which is excellent in removing residual resin residues and removes water absorption that may occur during storage and processing conditions.

The present invention is a metal plate; And

An organic material layer formed by coating a composition including a resin having a polymerizable functional group, a water-soluble resin having a hydroxy group, a curing agent, and a polymer binder on one or both surfaces of the metal plate,

The organic material layer provides a sheet for drilling a printed circuit board, characterized in that the composition includes a resin having a polymerizable functional group, a water-soluble resin having a hydroxyl group, and a composite resin formed by reacting a curing agent.

In addition, the present invention provides a sheet comprising an organic material formed using a composition comprising a resin having a polymerizable functional group, a water-soluble resin having a hydroxyl group, a curing agent and a polymer binder,

The organic material provides a sheet for drilling a printed circuit board, characterized in that the composition includes a resin having a polymerizable functional group, a water-soluble resin having a hydroxyl group, and a composite resin formed by reacting a curing agent.

Hereinafter, the present invention will be described in detail.

Drilling sheets of a printed circuit board according to the present invention can be classified into two types, the first type of drilling sheet is for a sheet comprising a metal plate and the organic layer formed on the metal plate, for drilling of a second form The sheet is for a sheet comprising the organic material.

In the drilling sheet of the two types of printed circuit board according to the present invention, the organic material layer and the organic material comprises a resin having a polymerizable functional group in the composition, a water-soluble resin having a hydroxyl group and a composite resin formed by reacting a curing agent Is characteristic.

In particular, since the composite resin has a non-hygroscopic property, the organic material layer and the organic material do not exhibit moisture absorption and do not appear sticky. Therefore, in the drilling sheet of the present invention, many problems that may occur due to the organic material layer or the stickiness of the organic material, in particular, problems such as wear or damage of the drill bit due to resin agglomeration, degradation of hole position precision, or the like are greatly suppressed. Can be.

In addition, the composite resin may form a matrix, and the unreacted material in the composition may be dispersed in the matrix of the composite resin. In this case, the unreacted material in the composition may be a polymer binder, and may further be part of the water-soluble resin and / or curing agent having a hydroxyl group.

As described above, since the composite resin forms a matrix, and the unreacted material is dispersed in the matrix of the composite resin in the composition, the organic layer and the organic material are Hv 11 to 15 (50 μm thick and 25 gf load with a viscose hardness). It may have an appropriate surface hardness of ()). In addition, this can minimize the movement of the drill bit due to the up and down vibration pressure during drilling, it is also characterized in that the workability according to the diameter of the various drill bits can be improved.

In the sheet for drilling two types of printed circuit board according to the present invention, the composite resin is a resin formed by the coupling reaction of (i); And a resin formed by the bonding reaction of (i) and the bonding reaction of (ii) below.

In this case, the bonding reaction of (i) is a bonding reaction between the polymerizable functional group of the resin having the polymerizable functional group and the hydroxy group of the water-soluble resin having the hydroxy group;

 The coupling reaction of (ii) is at least one of the coupling reaction between the resins having the polymerizable functional group and the coupling reaction between the polymerizable functional groups of the resin having the polymerizable functional group and the curing agent.

In the sheet for drilling two types of printed circuit board according to the present invention, the polymerizable functional group may be at least one selected from the group consisting of vinyl group, epoxy group, allyl group, and (meth) acryl group.

Therefore, the resin having the polymerizable functional group may have one or two or more polymerizable functional groups, and the two or more polymerizable functional groups may be the same or different from each other. Preferably, the resin having a polymerizable functional group is a resin having two or more polymerizable functional groups, and may be a resin capable of causing a polymerization reaction. More preferably, the resin having a polymerizable functional group may be an epoxy resin.

The epoxy resin is not particularly limited and may be a common epoxy resin known in the art. Non-limiting examples thereof include bisphenol epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, polyfunctional amine epoxy resin, cycloaliphatic epoxy resin, bromine epoxy resin, rubber modified epoxy resin , DCPD (dicyclopentadiene) type epoxy resin, and the like, these may be used alone or mixed two or more kinds.

In addition, in the drilling sheet of the two types of printed circuit board according to the present invention, the water-soluble resin having a hydroxy group is polyethylene glycol, polyoxyethylene mono ether, polyoxyethylene mono ester, polypropylene glycol, polyvinyl alcohol, It may be one or more selected from the group consisting of sorbitan monoester, polyglycerol, polyglycerol mono ether, polyglycerol mono ester, polyglycerol diether, polyglycerol diester and polyoxyethylene-polyoxypropylene block copolymer, It is not limited to this. In addition, the resin having a hydroxy group is preferably a low molecular weight substance having a molecular weight of 1000 or less. In addition, the water-soluble resin having a hydroxy group is a resin capable of reacting with the resin having the polymerizable functional group, as described above may cause a coupling reaction between the hydroxy group and the polymerizable functional group.

The water-soluble resin having a hydroxyl group may be included in the composition at 1 to 40 parts by weight based on 100 parts by weight of the total amount of the resin having the polymerizable functional group and the curing agent. When the water-soluble resin having the hydroxyl group is included in less than 1 part by weight based on 100 parts by weight of the total amount of the resin having the polymerizable functional group and the curing agent, the surface of the drilling sheet of the present invention is too high surface hardness may cause problems when drilling. And, when included in excess of 40 parts by weight of the organic material layer and the organic material is not preferable because the water absorption phenomenon can be made sticky.

In the drilling sheet of the two types of printed circuit board according to the present invention, the curing agent is a material for curing the resin having the polymerizable functional group, may be any conventional curing agent known in the art without particular limitation. Non-limiting examples thereof include aliphatic amines, aromatic amines, tertiary amines, imidazoles, acid anhydrides, polyamide resins, polysulfide resins, bisphenol novolac curing agents, phenol novolacs Curing agents, cresol novolac curing agents, dicyanamides, and the like, and these may be used alone or in combination of two or more thereof. Preferably, the curing agent may be dicyanamide. In addition, the usage-amount of the said hardening | curing agent is not specifically limited, It can be adjusted according to resin which has a polymeric functional group. As a non-limiting example, the curing agent may be included in an amount of 0.1 to 50 parts by weight based on 100 parts by weight of the resin having the polymerizable functional group.

In the sheet for drilling two types of printed circuit board according to the present invention, the polymer binder is polyvinylacetate, phenoxy resin, poly (styrene-butadiene-methyl methacrylate) block copolymer, and poly (methyl meta It may be one or more selected from the group consisting of acrylate-butyl acrylate-methyl methacrylate) block copolymer, but is not limited thereto.

The polymer binder is an unreacted substance that remains without reacting with a resin having a polymerizable functional group, a water-soluble resin having a hydroxy group, and a curing agent, and is formed by reacting a resin having a polymerizable functional group, a water-soluble resin having a hydroxy group, and a curing agent. It may be dispersed between the composite resin.

In particular, the surface hardness of the drilling sheet of the present invention is too high when the organic layer and the organic material comprises only a composite resin formed by reacting the resin having the polymerizable functional group, the water-soluble resin having a hydroxyl group, and a curing agent, so that the drilling problem is high. May be generated. However, since the polymer binder is included in the organic material layer and the organic material, the surface hardness of the drilling sheet of the present invention may be adjusted to be suitable for drilling, and the organic material layer and the metal plate may be well bound.

In addition, the polymer binder may be included in the composition in an amount of 0.01 to 20 parts by weight based on 100 parts by weight of the total amount of the resin having the polymerizable functional group and the curing agent. When the polymer binder is contained less than 0.01 part by weight based on 100 parts by weight of the total amount of the resin having the polymerizable functional group and the curing agent, the effect of using the polymer binder is insignificant, and when included in excess of 20 parts by weight for drilling of the present invention. The sheet may have a too low surface hardness which may cause problems in drilling.

In the sheet for drilling a printed circuit board according to the present invention, the composition comprising the resin having a polymerizable functional group, a water-soluble resin having a hydroxyl group, a curing agent and a polymer binder is a curing accelerator, a dye, a surfactant, an ethylene propylene copolymer and It may further comprise one or more selected from the group consisting of a solvent.

The hardening accelerator may be a conventional hardening accelerator known in the art as a material to enable rapid curing or low temperature curing of the resin having the polymerizable functional group. Preferably, the curing accelerator may be imidazole.

The dye is used to color the resin, and is not particularly limited and conventional dyes known in the art may be used.

The surfactant is not particularly limited, and anionic surfactants, cationic surfactants, nonionic surfactants, and the like may be used.

The ethylene propylene copolymer may be applied to a resin having a molecular weight of less than 6000. If the resin is not sufficiently dispersed in the composition may cause a fish eye problem, the ethylene propylene copolymer can inhibit the occurrence of the fish eye by increasing the degree of dispersion by interconnecting the low-molecular and polymer materials in the composition.

In addition, the amount of each of the curing accelerator, the dye, the surfactant, and the ethylene propylene copolymer is not particularly limited. Preferably, the amount of the curing accelerator, the dye, the surfactant, and the ethylene propylene copolymer is 0.001 to 5 parts by weight based on 100 parts by weight of the total amount of the resin having the polymerizable functional group and the curing agent. It can be included in the composition.

The solvent is not particularly limited as long as it can lower the viscosity of the composition, dissolve the materials contained in the composition, or increase the dispersibility of the composition, and conventional solvents known in the art can be used. In addition, the solvent may be used in an amount of 1 to 300 parts by weight based on 100 parts by weight of solids, but is not limited thereto.

The manufacturing method of the drilling sheet of the 1st form which concerns on this invention is not specifically limited, It can follow the conventional method known in the art. Non-limiting examples thereof include a resin having a polymerizable functional group, a water-soluble resin having a hydroxyl group, a curing agent and a polymer binder, or a composition comprising a curing accelerator, a dye, a surfactant, an ethylene propylene copolymer and a solvent in the composition. The composition further comprising one or more selected from the group can be prepared by coating and drying on one or both sides of the metal plate.

The method of coating the composition on a metal plate may use conventional coating methods known in the art, and include, but are not limited to, for example, lip coating, die coating, roll coating, comma Various methods, such as coating or a mixing method thereof, can be used.

In addition, the manufacturing method of the drilling sheet of the 2nd aspect which concerns on this invention is not specifically limited, It can follow the conventional method known in the art. Non-limiting examples thereof include a method of forming a sheet having a desired thickness by molding a composition comprising a resin having a polymerizable functional group, a water-soluble resin having a hydroxy group, a curing agent and a polymer binder with a press, roll or extruder; Or after coating and drying the composition on the substrate, separating the coated sheet from the substrate and forming the composition; Or coating and drying the composition on the substrate, the composition further comprising at least one selected from the group consisting of a curing accelerator, a dye, a surfactant, an ethylene propylene copolymer, and a solvent, on the substrate, and then separating the coated sheet from the substrate. How to do it.

In addition, in the drilling sheet of the second aspect according to the present invention, a metal plate may be laminated on one surface of the sheet. That is, the sheet for drilling of the 2nd aspect which concerns on this invention is a sheet containing the organic substance formed using the composition containing resin which has a polymeric functional group, water-soluble resin which has a hydroxyl group, a hardening | curing agent, and a polymeric binder; And it may be to include a metal plate laminated on one surface of the sheet.

At this time, another second type of drilling sheet comprising a metal plate laminated on one surface of the sheet, the sheet is not attached to the metal plate, that is, the drilling sheet containing the organic material according to the present invention mentioned above to the metal plate After that, it can be produced by a method such as a press or a roll or a method using an adhesive.

In the drilling sheet of the printed circuit board according to the present invention, the metal plate is not particularly limited, a plate made of a conventional metal known in the art may be used. Non-limiting examples of metal plates include plates of pure aluminum, hard aluminum, soft aluminum, alloy aluminum, copper, or magnesium alloys.

The thickness of the metal plate may be 5 ~ 500㎛, when the thickness of the metal plate is less than 5㎛, the precision and workability of the hole position during the drilling process is lowered, when the thickness of the metal plate exceeds 500㎛ the economic efficiency is lowered when drilling Removal of the resulting debris is not easy.

In the drilling sheet of the first aspect according to the present invention, the thickness of the organic layer and the thickness of the sheet (organic matter) in which the metal sheet is not laminated in the drilling sheet of the second aspect may be 10 to 500 µm, respectively. When the thickness of the sheet on which the organic layer or the metal plate is not laminated is less than 10 μm, the precision and workability of the hole position during drilling are reduced, and when the thickness is more than 500 μm, the winding around the drill bit becomes large.

1 is a view showing an example of a sheet for drilling a printed circuit board according to the present invention. In FIG. 1, the upper layer 10 is an organic material layer, and the lower layer 20 is a metal plate.

On the other hand, the present invention also provides a hole drilling method using a sheet for drilling a printed circuit board according to the present invention. As a non-limiting example thereof, there is a method of drilling a hole with a drill after arranging a sheet for drilling a printed circuit board according to the present invention on a printed circuit board. In addition, when arranging the drilling sheet on the printed circuit board, it is preferable to bring the metal plate of the drilling sheet into contact with the printed circuit board.

Hereinafter, the present invention will be described in detail with reference to the following Examples. However, the following examples are merely to illustrate the present invention and the present invention is not limited by the following examples.

(Example 1)

78 parts by weight of a bisphenol A epoxy resin (E.E.W 475g / eq, Kukdo Chemical Co., Ltd., trade name YD-011); 17 parts by weight of a phenol novolac curing agent (OH E.E.W 106g / eq, Kolon Emulsion Co., KPH-L2108); 5 parts by weight of Sorbitane Monostearate (trade name M-TWO, Dongnam Chemical); 0.12 parts by weight of 2-ethyl-4-methylimidazole (BASF, trade name 2E4Mz) as a curing accelerator; 0.01 part by weight of polyvinylacetate (suitable chemistry) as a polymer binder; 0.1 parts by weight of an ethylene-propylene copolymer (Unigema, trade name EO / PO copolymer); And 40 parts by weight of methyl cellosolve (MCS) as a solvent was homogeneously mixed to prepare a composition.

The composition was comma coated on a pure aluminum plate (A1050) having a thickness of 70 μm and then dried to prepare a sheet for drilling in which an organic layer having a thickness of 50 μm was coated on the aluminum plate.

(Example 2)

Except for using dicyanamide (Degusa Co., Ltd.) instead of the phenol novolak hardener, a composition and a drilling sheet were prepared in the same manner as in Example 1.

(Example 3)

A composition and a drilling sheet were prepared in the same manner as in Example 1, except that dicyanamide was used instead of the phenol novolac hardener and 10 parts by weight instead of 0.01 parts by weight of polyvinylacetate.

 (Example 4)

A composition and a drilling sheet were prepared in the same manner as in Example 1, except that dicyanamide was used instead of the phenol novolac hardener, and 10 parts by weight of phenoxy polymer (Shin-Atech Co., Ltd.) was used instead of 0.01 parts by weight of polyvinylacetate. It was.

(Example 5)

In the same manner as in Example 1, except that dicyanamide was used instead of the phenol novolac curing agent, 10 parts by weight was used instead of 5 parts by weight of Sorbitane Monostearate, and 10 parts by weight of phenoxy polymer was used instead of 0.01 parts by weight of polyvinylacetate. The composition and the sheet for drilling were prepared.

(Example 6)

In the same manner as in Example 1, except that dicyanamide was used instead of the phenol novolac curing agent, 20 parts by weight was used instead of 5 parts by weight of Sorbitane Monostearate, and 10 parts by weight of phenoxy polymer was used instead of 0.01 parts by weight of polyvinylacetate. The composition and the sheet for drilling were prepared.

(Example 7)

In the same manner as in Example 1, except that dicyanamide was used instead of the phenol novolac curing agent, 30 parts by weight instead of 5 parts by weight of Sorbitane Monostearate, and 10 parts by weight of phenoxy polymer was used instead of 0.01 parts by weight of polyvinylacetate. The composition and the sheet for drilling were prepared.

(Example 8)

In the same manner as in Example 1, except that dicyanamide was used instead of the phenol novolac curing agent, 40 parts by weight instead of 5 parts by weight of Sorbitane Monostearate, and 10 parts by weight of phenoxy polymer was used instead of 0.01 parts by weight of polyvinylacetate. The composition and the sheet for drilling were prepared.

(Example 9)

Dicyamide is used instead of the phenol novolac hardener, 30 parts by weight is used instead of 5 parts by weight of Sorbitane Monostearate, 10 parts by weight of phenoxy polymer is used instead of 0.01 parts by weight of polyvinylacetate, and Green 151 (Orient Corporation) 0.5 as a dye. Except for using parts by weight, a composition and a sheet for drilling were prepared in the same manner as in Example 1.

(Comparative Example 1)

Except not using a polymeric binder, a composition and a sheet for drilling were prepared in the same manner as in Example 1.

(Comparative Example 2)

In the same manner as in Example 1, except that dicyanamide was used instead of the phenol novolac curing agent, 50 parts by weight instead of 5 parts by weight of Sorbitane Monostearate, and 10 parts by weight of phenoxy polymer was used instead of 0.01 parts by weight of polyvinylacetate. The composition and the sheet for drilling were prepared.

(Comparative Example 3)

82 parts by weight of a bisphenol A epoxy resin (E.E.W 475g / eq, Kukdo Chemical Co., Ltd., trade name YD-011); 18 parts by weight of a phenol novolac curing agent (OH E.E.W 106g / eq, Kolon Emulsion Co., KPH-L2108); 0.1 part by weight of dimethylbenzylamine as a curing accelerator; And 40 parts by weight of methyl cellosolve (MCS) as a solvent, except that the composition was prepared by homogeneously, the drilling sheet was prepared in the same manner as in Example 1.

Experiment 1: Coating Evaluation

The coating properties of the drilling sheets prepared in Examples 1 to 9 and Comparative Examples 1 to 3 were visually observed, and the results are shown in Table 1 below.

Coating evaluation was observed according to the following criteria.

Coatability (O): Number of bubble and fish eye / sheet area (406 × 510 mm 2) less than 3,

Coating property (X): Number of bubble and fish eye / sheet (406 x 510 mm 2) is three or more.

(Experiment 2: Resin Transfer Evaluation)

It was visually observed whether the resin (organic layer) was transferred to the sheet for drilling prepared in Examples 1 to 9 and Comparative Examples 1 to 3.

Specifically, after stacking 100 sheets of the drilling sheet and stored at 70 ° C./RH for 70 days for 30 days, it was examined whether the resin layer (coating layer) was transferred to the upper aluminum surface when the product was separated, and the results are shown in the following table. It described in 1.

(Experiment 3: Drill Bit Fracture Evaluation)

Using the sheet for drilling prepared in Examples 1 to 9 and Comparative Examples 1 to 3 was observed whether the drill bit breaks during drilling, the results are shown in Table 1 below.

In the drill processing method, the drilling sheet is placed on the side where the resin-coated surface (organic layer) is in contact with the drill, and the three sheets of double-sided materials made of BT (Bismaleimide Triazine) resin with a thickness of 0.1 mm are superimposed thereon and then drilled. Was carried out. At this time, the drilling process was performed under the conditions of the diameter of the drill bit 0.1mm, the drill rotation speed 200krpm, and the drill bit number 3000hit.

The determination of whether or not the drill bit was broken was made according to the following criteria.

If the drill bit breaks below 1000hit, X,

When a drill bit breaks at 1000 hit or more and less than 2000 hit, △,

○, if the drill bit breaks more than 2000 hit and less than 3000 hit,

If no drill bit break occurs after 3000 hit machining.

(Experiment 4: Hole Roughness Evaluation)

Using the sheets for drilling prepared in Examples 1 to 9 and Comparative Examples 1 to 3, the roughness of the holes formed after the drilling was observed, and the results are shown in Table 1 below.

Hole roughness was evaluated according to the following criteria by micro-sectioning the roughness of the left and right inner walls of the hole wall surface of the last five holes after 3000hit hole processing. At this time, the drill processing conditions and processing methods were performed in the same manner as in Experiment 3.

The average value is less than 5 µm, the average value is 5 µm or more and less than 10 µm, and the average value is 10 µm or more and less than 15 µm.

(Experiment 5: Hole Position Accuracy Evaluation)

Using the sheets for drilling prepared in Examples 1 to 9 and Comparative Examples 1 to 3, the precision of the hole positions formed after the drilling was observed, and the results are shown in Table 1 below.

The hole position precision was set on the basis of the hole target guide line 35 μm of the lower plate product of the drill actual product, and evaluated as follows. At this time, the drill processing conditions and processing methods were performed in the same manner as in Experiment 3.

cpk is 1.90 or more, it is (circle), cpk 1.50 or more is less than 1.90, it is (circle), cpk 1.33 or more is less than 1.50, it is (triangle | delta), and cpk 1.33 or less is X.

(Experiment 6: Evaluate Resin Removal Around Drill Bits)

Using the sheet for drilling prepared in Examples 1 to 9 and Comparative Examples 1 to 3, it was visually observed whether the resin residue (Bird nesting) remaining in the drill bit after drilling, the results are shown in the following table It described in 1.

Resin residues should be free from the drill bit frictional heat during drilling, but if there is a lot of resin residue, it will not be completely exhausted by the drill bit frictional heat and will remain on the hole wall, affecting the plating reliability later.

In Table 1 below, if the drill bit had a lot of resin residues (Bird nesting), X was used, △ was used, and ◎ was used.

Coating Resin transfer Bit breaking Hole roughness Hole position precision Resin residue removal Example 1 ○ none △ △ △ △ Example 2 ○ none ○ △ △ △ Example 3 ○ none ◎ ○ ○ △ Example 4 ○ none ◎ ◎ ◎ ◎ Example 5 ○ none ◎ ◎ ◎ ◎ Example 6 ○ none ◎ ◎ ◎ ◎ Example 7 ○ none ◎ ○ △ ◎ Example 8 ○ none △ △ △ ◎ Example 9 ○ none ◎ ◎ ◎ ◎ Comparative Example 1 X none X X X X Comparative Example 2 ○ Occur △ X X ◎ Comparative Example 3 X none X X X X

According to Table 1, the drilling sheet prepared in Examples 1 to 9 was excellent in coating property, and resin transfer did not occur. In addition, the results of evaluation of bit breaking, hole roughness, hole positional accuracy and resin residue removal were superior to those in the drilling sheet of the comparative example when drilling using the drilling sheet prepared in Examples 1 to 9. In particular, the drilling sheets produced in Examples 4 to 6 and 9 showed very good results.

Drilling sheet of the printed circuit board according to the present invention is to remove the water absorption phenomenon that can occur during the storage conditions and processing conditions, when using the drill processing, it is possible to improve the hole position accuracy without stickiness It is possible to suppress the wear and breakage of the drill bit, to minimize the movement of the drill bit due to the up and down vibration pressure, and excellent in the ability to remove residual resin residues.

Claims (15)

plate; And On one side or both sides of the metal plate, comprising a resin layer having a polymerizable functional group, a water-soluble resin having a hydroxyl group, a curing agent and an organic material layer coated with a composition comprising a polymer binder, The organic material layer includes a composite resin formed by reacting a resin having a polymerizable functional group, a water-soluble resin having a hydroxy group, and a curing agent in the composition, The resin having a polymerizable functional group is an epoxy resin, The water-soluble resin having the hydroxy group is a sorbitan monoester, The polymer binder is a sheet for drilling a printed circuit board, characterized in that the phenoxy resin. The sheet for drilling a printed circuit board of claim 1, wherein the unreacted material in the composition is dispersed in a matrix of the composite resin. The method of claim 1, wherein the composite resin is a resin formed by the coupling reaction of the following (i); And a resin formed by the bonding reaction of (i) and the bonding reaction of (ii) below, the bonding reaction of (i) is a bonding reaction between the polymerizable functional group of the resin having the polymerizable functional group and the hydroxy group of the water-soluble resin having the hydroxy group; The bonding reaction of (ii) is one or more of the bonding reaction between the resin having the polymerizable functional group and the bonding reaction between the polymerizable functional group and the curing agent of the resin having the polymerizable functional group. Drilling sheet for circuit board. delete delete delete delete The water-soluble resin having the hydroxy group in the composition is contained in 1 to 40 parts by weight based on 100 parts by weight of the total amount of the resin having the polymerizable functional group and the curing agent, The polymer binder of the composition is a sheet for drilling a printed circuit board, characterized in that it comprises 0.01 to 20 parts by weight based on 100 parts by weight of the total amount of the resin and the curing agent having the polymerizable functional group. The sheet for drilling a printed circuit board of claim 1, wherein the composition further comprises at least one selected from the group consisting of a curing accelerator, a dye, a surfactant, an ethylene propylene copolymer, and a solvent. The sheet for drilling a printed circuit board of claim 1, wherein the metal plate is an aluminum plate. The sheet for drilling a printed circuit board of claim 1, wherein the organic layer has a thickness of 10 μm to 500 μm. The sheet for drilling a printed circuit board of claim 1, wherein the metal plate has a thickness of 5 μm to 500 μm. A sheet comprising an organic material formed by using a composition comprising a resin having a polymerizable functional group, a water-soluble resin having a hydroxyl group, a curing agent and a polymer binder, The organic substance includes a composite resin formed by reacting a resin having a polymerizable functional group, a water-soluble resin having a hydroxy group, and a curing agent in the composition, The resin having a polymerizable functional group is an epoxy resin, The water-soluble resin having the hydroxy group is a sorbitan monoester, The polymer binder is a sheet for drilling a printed circuit board, characterized in that the phenoxy resin. The sheet for drilling of a printed circuit board according to claim 13, wherein a metal plate is laminated on one surface of the sheet. The sheet for drilling of a printed circuit board according to claim 14, wherein the sheet containing the organic material is loaded on a metal plate, and then the metal plate is laminated on one surface of the sheet with a press, a roll, or an adhesive.

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