KR100858046B1 - Trap for semiconductor fabrication equipment - Google Patents

Abstract

A trap for semiconductor fabrication equipment is provided to collect rapidly byproducts of discharged gas by heating and cooling the byproducts. A first housing(110) includes a gas inlet(112) connected to a process chamber, an internal space, and a gas outlet for discharging gas. A plurality of first baffle plates are formed within the first housing. A heater comes in contact with the first baffle plate in order to heat the first baffle plate. A second housing(160) includes a gas inlet(162) connected to the gas outlet of the first housing, an internal space, and a gas outlet connected to the pump. A plurality of second baffle plates are formed within the second housing and include a hole. A cooling unit comes in contact with the second baffle plate in order to cool the second baffle plate. An arrangement interval of the first baffle plate is getting reduced toward a backside of a gas flow path.

Description

Trap for Semiconductor Manufacturing Equipment {TRAP FOR SEMICONDUCTOR FABRICATION EQUIPMENT}

1 is a conceptual diagram illustrating a trap for semiconductor manufacturing equipment according to the present invention;

2 is a perspective view of a trap for semiconductor manufacturing equipment according to the present invention;

3 is a partial cutaway perspective view of FIG. 2, and

4 is a cross-sectional view of a trap for semiconductor manufacturing equipment according to the present invention.

※ Explanation of code for main part of drawing

10 process chamber 20 pump

30: refrigerant supply pipe 40: refrigerant discharge pipe

100: trap 110: first housing

112, 162: gas inlet 114, 164: interior space

116, 166: gas outlet 118: outer case

120: first baffle plate 122, 172: hole

130: heater 140: temperature sensor

160: the second housing 168: discharge pipe

170: second baffle plate 181: refrigerant inlet

182: refrigerant outlet 183: cooling tube

184: Refrigerant Tank

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to traps for semiconductor manufacturing equipment for capturing reaction by-products in gases discharged from a chemical vapor deposition (CVD) process chamber to a pump in semiconductor or LCD manufacturing.

In general, the semiconductor manufacturing process is largely composed of a pre-process (Fabrication process) and a post-process (Assembly process).

In the previous process, a semiconductor chip is manufactured by repeatedly depositing a thin film on wafers in various process chambers and selectively etching the deposited thin film to process a specific pattern. Say.

The post process refers to a process of separately separating chips manufactured in the previous process and then assembling them into a finished product by combining with a lead frame.

At this time, in the case of the process of depositing a thin film on the wafer or etching the thin film deposited on the wafer, it is carried out at a high temperature using a harmful gas in the process chamber. During this process, a large amount of ignitable gases, corrosive foreign substances, and gases containing toxic components are generated in the process chamber. That is, only about 30% of noxious gas is deposited on the surface of the wafer inside the chamber, and some unreacted gas is discharged.

Therefore, a scrubber is provided at the rear end of the vacuum pump for vacuuming the process chamber to purify the gas discharged from the process chamber and discharge it to the atmosphere.

By the way, the gas is solidified between the process chamber and the pump to turn into a powder, the powder is stuck to the exhaust pipe to increase the exhaust pressure and at the same time there is a problem causing the failure of the pump when entering the pump. In other words, the reaction by-products in the gas discharged from the process chamber to the pump is fixed to the inner wall of the exhaust pipe causing clogging of the exhaust pipe, it is coupled to the body of the pump damage the pump to shorten the life.

The present invention has been made to solve the above problems, an object of the present invention to effectively trap the reaction by-products in the gas discharged from the processor chamber to the pump, to prevent the failure or damage of the pump to ensure the durability of the pump To provide a trap for semiconductor manufacturing equipment.

The trap for semiconductor manufacturing equipment according to the present invention for achieving the above object,

In order to capture the reaction by-products in the gas discharged from the process chamber of the semiconductor manufacturing equipment to the pump,

A first housing provided with a gas inlet communicating with the process chamber, an inner space through which the introduced gas passes, and a gas outlet for discharging the gas to the outside;

A first baffle plate provided with a plurality of holes in the first housing so as to be in contact with the introduced gas during movement thereof;

A heater provided in contact with the first baffle plate to heat the first baffle plate;

A second housing provided with a gas inlet communicating with the gas outlet of the first housing, an inner space through which the inlet gas passes, and a gas outlet communicating with the pump;

A second baffle plate provided with a plurality of holes in the second housing to be in contact with the introduced gas during movement thereof;

It comprises a cooling means provided in contact with the second baffle plate to cool the second baffle plate,
The first baffle plate is achieved by providing a trap for semiconductor manufacturing equipment, characterized in that the arrangement interval is narrowed toward the rear in the gas flow path.

Here, preferably, the first baffle plates are arranged at narrow intervals toward the rear in the gas flow path.

Preferably, in the first baffle plate, the holes of the front baffle plate and the holes of the rear baffle plate are arranged in a zigzag manner with each other.

Preferably, the holes of the first baffle plate are elliptical.

Preferably, the aperture of the first baffle plate is provided with a mesh filter.

Preferably, the second baffle plates are arranged at narrow intervals toward the front of the gas flow path.

 Preferably, in the second baffle plate, the holes of the front baffle plate and the holes of the rear baffle plate are arranged zigzag with each other.

Preferably, the holes of the second baffle plate are oval.

Preferably, the hole of the second baffle plate is provided with a mesh filter.

Preferably, the cooling means includes a refrigerant inlet provided in the second housing for injecting the refrigerant into the second housing, and a second housing for discharging the refrigerant via the inside of the second housing to the outside of the second housing. A coolant outlet provided in the cooling chamber, one end of which communicates with the refrigerant inlet, the other end of which communicates with the refrigerant outlet, and a cooling tube provided to circulate and pass through the low temperature refrigerant in contact with the second baffle plate; A refrigerant tank provided inside the second housing for storage.

Preferably, the metal gasket is provided at the ends of the gas inlet and the gas outlet of the first housing.

Preferably, the outer case is further provided on the outside of the first housing.

Preferably, the first housing and the outer case are provided with a viewing window so as to externally identify the reaction by-products collected therein.

Preferably, the apparatus further includes a temperature sensor for sensing the temperature of the inner and outer walls of the first housing, and a controller for controlling the internal temperature of the first housing to a predetermined range using a value measured from the temperature sensor.

Preferably, Proportional Integral Derivative (PID) control is applied to the temperature sensing system.

According to the present invention configured as described above, by effectively collecting the reaction by-products flowing into the pump from the process chamber, it is possible to prevent the failure or damage of the pump to ensure the durability of the pump.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail.

1 to 4 show traps for semiconductor manufacturing equipment according to the present invention.

Referring to FIG. 1, a trap 100 is provided between the process chamber 10 and the pump 20 for trapping reaction byproducts in the gas discharged from the process chamber 10.

The trap 100 is connected to a refrigerant supply pipe 30 for supplying a refrigerant therein, and a refrigerant discharge pipe 40 for discharging after using the refrigerant.

2 and 3, the trap 100 for semiconductor manufacturing equipment according to the present invention includes a first housing 110 and a second housing 160. The first housing 110 is provided with a gas inlet 112 communicating with the process chamber 10, an internal space 114 through which the introduced gas passes, and a gas outlet 116 for discharging the gas to the outside. .

Although not shown, in order to prevent gas leakage from the first housing 110, metal gaskets are provided at the ends of the gas inlet 112 and the gas outlet 116 of the first housing 110.

In addition, the outer case 118 is provided on the outside of the first housing 110, although not shown, the first housing 110 and the outer case 118 are visible in order to check the reaction by-products collected therein from the outside. Is provided.

On the other hand, the trap 100 according to the present invention may be provided with a temperature sensing system to control the internal temperature of the first housing 110 within a predetermined range. The temperature sensing system includes a temperature sensor 140 for sensing temperatures of the inner and outer walls of the first housing 110, and a controller for controlling the internal temperature of the first housing 110 within a predetermined range. PID control may be applied to control the temperature sensing system.

A plurality of first baffle plates 120 are provided in the first housing 110, and a heater 130 is provided to heat the first baffle plate 120. The heater 130 is disposed in contact with the first baffle plate 120.

An elliptical hole 122 is formed in the first baffle plate 120, and although not shown, a mesh filter may be provided in the hole 122. In addition, the first baffle plate 120 is disposed at a narrower interval toward the rear in the gas movement path.

Gas introduced into the internal space 114 of the first housing 110 comes into contact with the first baffle plate 120 while moving. Here, in order to increase the gas movement path, the holes 122 of the front first baffle plate 120 and the holes 122 of the rear first baffle plate 120 are arranged in a zigzag. .

The second housing 160 has a gas inlet 162 communicating with the gas outlet 112 of the first housing 110, an inner space 164 through which the introduced gas passes, and a gas outlet communicating with the pump 20 ( 166, and a discharge pipe 168 for discharging the collected solids.

In addition, a plurality of second baffle plates 170 are provided in the second housing 160, and cooling means 180 are provided to cool the second baffle plates 170. The cooling means 180 is disposed in contact with the second baffle plate 170.

An elliptical hole 172 is formed in the second baffle plate 170, and although not shown, a mesh filter may be provided in the hole 172. In addition, the second baffle plate 170 is disposed at a narrower interval toward the front in the gas flow path.

The gas introduced into the inner space 164 of the second housing 160 comes into contact with the second baffle plate 170 while moving. Here, in order to increase the gas movement path, the hole 172 of the front second baffle plate 170 and the hole 172 of the rear second baffle plate 170 are arranged in a zigzag. .

The second housing 160 is provided with a refrigerant inlet 181 for injecting the refrigerant therein and a refrigerant outlet 182 for discharging the refrigerant via the inside of the second housing 160 to the outside. The coolant inlet 181 is connected to the coolant supply pipe 30, and the coolant outlet 182 is connected to the coolant discharge pipe 40, respectively.

In addition, a cooling pipe 183 is provided in the second housing 160 so that one end communicates with the refrigerant inlet 181 and the other end communicates with the refrigerant outlet 182. The cooling tube 183 is provided to circulate inside the second housing 160 while contacting and passing through the second baffle plate 170. A low temperature refrigerant circulates inside the cooling tube 183.

In addition, a coolant tank 184 is provided inside the second housing 160 to communicate with the cooling pipe 183 and temporarily store the coolant.

Hereinafter, the operation of the semiconductor manufacturing equipment trap 100 will be described again with reference to FIGS. 2 to 3.

The gas discharged from the process chamber 10 is introduced into the first housing 110 through the gas inlet 112 of the first housing 110. The introduced gas is heated in contact with the plurality of first baffle plates 120 and passes through the internal space 114 of the first housing 110 to move to the second housing 160 through the gas outlet 116. . The gas moves zigzag through the elliptical holes 122 of the plurality of first baffle plates 120 while passing through the internal space 114 of the first housing 110. By increasing the path of the gas in this way, the processing speed of the pump 20 may not be impaired.

While the gas discharged from the process chamber 10 passes through the first housing 110, the gas is heated by the first baffle plate 120, so that reaction by-products in the gas cause chemical changes. The gas may have a uniform temperature distribution inside the first housing 110 than the heating by the first baffle plate 120 is heated by the radiant heat of the heater 130. On the other hand, the large particles in the reaction by-products are filtered by a mesh filter provided in the hole 122 of the first baffle plate 120.

Since the internal temperature of the first housing 110 is controlled within a predetermined range by the temperature sensing system, the gas can be efficiently heated. In addition, the temperature of the outer wall of the first housing 110 is controlled to within a predetermined range and the outer case 118 is provided outside the first housing 110 can provide safety to the user.

On the other hand, the user can externally check the amount of the reaction by-products collected during the process through the viewing window of the first housing 110 and the outer case 118.

The gas discharged from the first housing 110 moves to the second housing 160. Since the inside of the second housing 160 is cooled by the cooling means 180, the internal temperature is lower than that of the first housing 110. Therefore, the gas introduced into the second housing 160 after being heated in the first housing 110 rises up inside the second housing 160. While the gas moves in the inner space 164 of the second housing 160, the gas moves zigzag through the elliptical holes 172 of the plurality of second baffle plates 170. Then, the gas is cooled while contacting the second baffle plate 170 so that the reaction byproduct in the gas is deposited as a solid on the second baffle plate 170. Here, since the second baffle plate 170 is disposed at a narrower interval toward the path in which the gas flows, the gas introduced into the high temperature vapor state from the first housing 110 is initially long in the second housing 160. It moves along the path and cools rapidly.

As such, according to the present invention, the reaction by-products in the gas discharged from the process chamber 10 to the pump 20 are rapidly converted from the gas state to the solid state in the trap 100 so that the first and second baffle plates 120 and 170 may be used. Because it is deposited on the surface of the), the reaction by-products do not flow into the pump 20 can be prevented failure or breakage of the pump 20.

According to the present invention, the first and second baffle plates 120 and 170 of the lower side are disposed in the trap 100 at narrow intervals, so that the reaction by-products can be effectively collected by increasing the gas movement path.

In addition, according to the present invention, the front and rear of the holes 122 and 172 of the first and second baffle plates 120 and 170 are zigzag arranged with each other, so that the speed and path of the gas are increased to increase the processing speed of the pump 20. Do not inhibit.

In addition, according to the present invention, the inlet 112 and the outlet 166 of the trap 100 is located at the top to prevent the reaction by-products fall to the pump 20 side, and the first and second baffle plate ( A mesh filter is provided in the holes 122 and 172 of the 120 and 170, respectively, so that large particles of metallic powder and the like are not introduced into the pump 20.

In addition, according to the present invention, by applying a metal gasket to the gas inlet 112 and the gas outlet 116 of the first housing 110, even if the internal temperature of the first housing 110 rises rapidly, the gas leaks Can be prevented.

In addition, according to the present invention, by considering the safety of the user by providing the outer case 118 on the outside of the first housing 110, the first housing 110 and the outer case 118 are respectively provided with a viewing window After checking the amount of reaction by-products collected inside, it is possible to determine the maintenance interval.

In addition, according to the present invention, the internal and external temperatures of the first housing 110 may be sensed and the internal temperature of the first housing 110 may be controlled within a predetermined range through PID control.

Although preferred embodiments of the present invention have been described above, modifications and changes made by those skilled in the art without departing from the technical spirit of the present invention belong to the scope of the present invention. Of course.

As described above, according to the trap for semiconductor manufacturing equipment according to the present invention, the reaction by-product in the gas discharged from the processor chamber to the pump during the semiconductor manufacturing is heated and then rapidly cooled to be collected quickly by switching from the gas phase to the solid phase.

Accordingly, since the reaction by-product does not flow into the pump, it is possible to prevent the failure or damage of the pump to ensure the durability of the pump.

Claims (15)

In the trap for semiconductor manufacturing equipment for trapping the reaction by-product in the gas discharged from the process chamber 10 of the semiconductor manufacturing equipment to the pump 20, A first housing 110 provided with a gas inlet 112 in communication with the process chamber 10, an internal space 114 through which the introduced gas passes, and a gas outlet 116 for discharging the gas to the outside; A first baffle plate (120) provided with a plurality of holes in the first housing (110) for contacting the introduced gas during movement; A heater (130) provided in contact with the first baffle plate (120) to heat the first baffle plate (120); The gas inlet 162 communicating with the gas outlet 116 of the first housing 110, the internal space 164 through which the introduced gas passes, and the gas outlet 166 communicating with the pump 20 are provided. Two housings 160; A second baffle plate 170 provided with a plurality of holes in the second housing 160 and having a hole 172 formed therein so as to be in contact with the introduced gas during movement; It comprises a cooling means 180 provided in contact with the second baffle plate 170 to cool the second baffle plate 170, The first baffle plate 120 is trapped for the semiconductor manufacturing equipment, characterized in that the arrangement interval is narrowed toward the rear in the gas movement path. delete According to claim 1, wherein the first baffle plate 120 is a hole 122 of the front first baffle plate 120 and the hole 122 of the rear first baffle plate 120 on the gas flow path is mutually Trap for semiconductor manufacturing equipment, characterized in that arranged in a zigzag. The trap of claim 1, wherein the hole (122) of the first baffle plate (120) is elliptical. The trap as claimed in claim 1, wherein a mesh filter is provided in the hole (122) of the first baffle plate (120). The trap of claim 1, wherein the second baffle plate is disposed at a narrower interval toward the front of the gas movement path. According to claim 1 or 6, The second baffle plate 170 is a hole (172) of the front of the second baffle plate 170 and the rear of the second baffle plate 170 in the gas path ( 172 is a trap for semiconductor manufacturing equipment, characterized in that arranged in a zigzag. The trap of claim 1 or 6, wherein the hole (172) of the second baffle plate (170) is elliptical. 7. The trap of claim 1 or 6, wherein a mesh filter is provided in the hole (172) of the second baffle plate (170). The method of claim 1 or 6, wherein the cooling means 180, A refrigerant inlet 181 provided in the second housing 160 for injecting refrigerant into the second housing 160; A refrigerant outlet 182 provided in the second housing 160 to discharge the refrigerant via the inside of the second housing 160 to the outside of the second housing 160; One end is in communication with the refrigerant inlet 181, the other end is in communication with the refrigerant outlet 182, a low-temperature refrigerant circulates therein, the cooling tube 183 provided to contact and pass through the second baffle plate 160 ); And And a refrigerant tank 184 communicating with the cooling tube 183 and provided inside the second housing 160 for temporarily storing the refrigerant. The trap of claim 1, wherein a metal gasket is provided at ends of the gas inlet and the gas outlet of the first housing. The trap of claim 1, wherein an outer case (118) is further provided on an outer side of the first housing (110). The method of claim 12, wherein the first housing (110) and the outer case (118) trap for semiconductor manufacturing equipment, characterized in that the viewing window is provided so that the reaction by-products collected therein can be identified from the outside. The method of claim 1, The internal temperature of the first housing 110 is ranged using a temperature sensor 140 for sensing the temperature of the inner and outer walls of the first housing 110 and a value measured from the temperature sensor 140. A trap for semiconductor manufacturing equipment, further comprising a control unit for controlling the inside. 15. The trap of claim 14, wherein PID control is applied to the temperature sensing system.

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