KR100676927B1 - Apparatus for caching products in semiconductor apparatus - Google Patents

Abstract

An apparatus for collecting by-products of a semiconductor device is provided to more quickly cool the by-products through a double cooling tube, thereby increasing collecting efficiency. An apparatus includes a housing(110) having a gas inlet port(114a) and a gas outlet port(116a), and a trap module(130) installed in the housing. The trap module has first plates(136) for guiding a flow of discharge gas in a curve pattern, and second plates(144) for guiding the flow of the discharge gas in a zigzag pattern. The first plates of the trap module are arranged in a radiation direction. The first trap is bent to guide the flow of the discharge gas in the curve pattern.

Description

Apparatus for caching products in semiconductor apparatus

1 is an external view showing a by-product collecting device according to an embodiment of the present invention.

2 is a partial cross-sectional view showing a by-product collecting device.

3 is an exploded perspective view showing the by-product collecting device.

4 is a side view showing the by-product collecting device.

5 is a cross-sectional view taken along the line a-a shown in FIG. 4.

6 is an exploded perspective view of the trap module.

7 is a side view of the trap module.

8 is a perspective view illustrating a modified third trap part.

9 is a perspective view illustrating a trap module having a modified third trap part.

FIG. 10 is a partial cross-sectional view showing a by-product collecting device in which the trap module of FIG. 9 is installed.

FIG. 11 is a view illustrating sixth plates of the third trap part in FIG. 10.

12 is a photograph showing a state in which reaction by-products are collected in the trap module of the present invention.

Figure 13 is a photograph showing the reaction by-product collection state in the trap module is arranged in a multi-stage plate.

14 is a conceptual view illustrating a conventional by-product collecting device.

<Description of Symbols for Main Parts of Drawings>

110: housing

120: heating means

130: trap module

170: cooling member

The present invention relates to a semiconductor device, and more particularly, to a by-product collecting device for efficiently collecting the reaction by-products contained in the exhaust gas exhausted from the process chamber in the semiconductor device manufacturing process.

In general, a semiconductor manufacturing process is mainly composed of a pre-process (Fabrication process) and a post-process (Assembly process), the pre-process is to deposit a thin film on a wafer (wafer) in various process chambers (Chamber), the deposition It is a process of manufacturing a so-called semiconductor chip by repeatedly performing a process of selectively etching the prepared thin film, and processing a specific pattern, and the post process refers to the chips manufactured in the previous process individually. After separating, refers to the process of assembling the finished product by combining with the lead frame.

At this time, the process of depositing a thin film on the wafer or etching the thin film deposited on the wafer is a process gas such as hydrogen and toxic gases such as silane (Silane), arsine (Arsine) and boron chloride and a process gas such as hydrogen It is carried out at a high temperature by using, a large amount of harmful gases such as various ignitable gases, corrosive foreign substances and toxic components are generated in the process chamber during the process.

Therefore, in the semiconductor manufacturing equipment, a scrubber is installed at the rear end of the vacuum pump that makes the process chamber vacuum and purifies the exhaust gas discharged from the process chamber and discharges it to the atmosphere. However, when the exhaust gas discharged from the process chamber contacts the atmosphere or the ambient temperature is low, the exhaust gas becomes solid and becomes powder. The powder adheres to the exhaust line to increase the exhaust pressure and at the same time the vacuum is introduced into the vacuum pump. There has been a problem of causing a failure of the pump and a backflow of the exhaust gas to contaminate the wafer in the process chamber.

In order to solve the above problems, as shown in FIG. 14, between the process chamber 10 and the vacuum pump 30, a powder trap device for adhering the exhaust gas discharged from the process chamber 10 to a powder state is provided. I install it.

That is, as shown in FIG. 14, the process chamber 1 and the vacuum pump 3 are connected to the pumping line 5, and the pumping line 5 includes reaction by-products generated in the process chamber 1. A trap tube 7 for trapping and accumulating in powder form is installed branched from the pumping line 5.

In the conventional powder trap apparatus, the unreacted gas generated during deposition or etching of a thin film in the process chamber 1 is directed toward the pumping line 5 having a relatively lower temperature atmosphere than the process chamber 1. After being solidified into powder 9 in powder form, it is accumulated in the trap tube 7 branched from the pumping line 5.

However, the powder trap apparatus of the prior art as described above had the following problems.

First, since the reaction by-product generated in the process chamber takes a long time to be converted into a powder state and accumulated in the trap tube, the entire process time is long. That is, the reaction by-products generated when depositing or etching the thin film are rapidly converted into powder and accumulated in the trap tube, so that the next thin film deposition or etching process cannot be performed until the reaction by-products are not present in the process chamber. However, since it takes a long time for the reaction by-products to be converted into powder, the process chamber does not proceed with the process until the reaction by-products are removed. Due to the long waiting time of the process chamber, the total process time (TAT) is increased accordingly.

Second, since the trapping area (space) of the trap tube in which the powder is accumulated is very narrow, there is an inconvenience of frequently removing the powder accumulated in the trap tube. In particular, since powder is concentrated only on the inlet side of the trap tube, the cleaning cycle of the trap tube is short.

The present invention is to provide a by-product collecting device that can quickly collect the reaction by-products.

The present invention also provides a by-product collecting device with a long replacement cycle.

The by-product collecting device according to the present invention for achieving the above object comprises a housing having a gas inlet port and a gas discharge port; And a trap module installed inside the housing and having first or second curved plates that are curved or inclined to direct the flow of exhaust gas.

According to an embodiment of the present invention, the trap module has the first plates disposed radially.

According to an embodiment of the present invention, the trap module is installed inside the housing, and further includes a plurality of second plates configured to guide the flow of the exhaust gas to a zigzag.

According to an embodiment of the present invention, the trap module includes: a first trap unit in which the first plates are installed; And a second trap part disposed in multiple stages at regular intervals and provided with second plates having a plurality of openings provided in a passage through which the exhaust gas flows.

According to an embodiment of the present invention, the second trap portion is provided at a position adjacent to the gas discharge port relative to the first trap portion.

According to an embodiment of the present invention, the first plate is provided such that an outer side is in contact with an inner side of the housing; A cutout is formed in the outer side of the first plate to allow exhaust gas to pass between the inner side of the housing and the outer side of the first plate.

According to an embodiment of the present invention, a plurality of through holes are formed in the first plate, and the size of the through holes decreases as the distance from the gas inlet port increases.

According to an embodiment of the present invention, the trap module has an inner passage through which exhaust gas can pass, and an inner tube to which the first plates and the second plates are fixed on an outer circumferential surface thereof; A third trap unit is installed in the inner passage of the inner tube and collects the reaction by-products of the exhaust gas passing through the inner passage.

According to an embodiment of the invention, the third trap portion and the support is positioned perpendicular to the center of the inner passage of the inner tube; Third plates installed on the support to be inclined; Fourth plates are installed on the support to be provided in the horizontal direction.

According to an embodiment of the present invention, the collecting device further includes a blocking member that prevents the powder mass separated from the trap module from escaping through the gas discharge port.

According to an embodiment of the present invention, the blocking member includes a blocking jaw formed to protrude in a direction toward the inside of the housing from one surface of the housing provided with the gas discharge port, and a blocking plate positioned above the gas discharge port. It includes.

According to an embodiment of the invention, the housing and the tubular body of the upper and lower openings; An upper plate coupled to an upper portion of the body and provided with the gas inlet port; The lower plate is coupled to the lower portion of the body and provided with the gas discharge port.

According to an embodiment of the present invention, a first cooling unit for cooling the housing; And a second cooling part for cooling the inner tube of the trap module.

According to an embodiment of the present invention, the first cooling unit includes first cooling lines provided on the wall of the housing, and the second cooling unit includes second cooling lines provided on the wall of the inner tube.

According to an embodiment of the present invention, the collecting device further includes a heating member for heating the exhaust gas introduced into the housing.

The by-product collecting device according to the present invention for achieving the above object comprises a housing having a gas inlet port and a gas discharge port; A first trap part provided in the housing and provided with first plates for collecting reaction by-products on a surface thereof; A second trap portion provided in the housing and provided with second plates for collecting reaction byproducts on a surface thereof; The first plates and the second plates are shaped to guide the flow of exhaust gas in different directions.

According to an embodiment of the present invention, each of the first plates is formed to be inclined to guide the flow of exhaust gas in a curve, each of the second plate is disposed perpendicular to the longitudinal direction of the housing, the second Plates are provided spaced apart from each other to face each other, the opening is formed in the second plate so that the flow direction of the gas is zigzag.

According to an embodiment of the invention, the first plate is shaped to guide away from the vertical flow when the exhaust gas flows in the longitudinal direction of the housing.

According to an embodiment of the invention, the first plate is shaped to guide the streamlined flow when the exhaust gas flows in the longitudinal direction of the housing.

According to an embodiment of the present invention, each of the first plates is installed with an inclination of 50 to 60 degrees with respect to the longitudinal direction of the housing.

For example, embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Accordingly, the shape of the elements in the drawings and the like are exaggerated to emphasize a clearer description.

(Example)

Hereinafter, with reference to the accompanying drawings illustrating a preferred embodiment of the present invention, the powder collecting device of the present invention will be described in detail. In addition, in the drawings, the same reference numerals are denoted together for components that perform the same function.

 The collecting device of the present invention has a structure in which the exhaust gas passes through simple and wide movement paths in the front part and through complicated and narrow movement paths in the rear part so that the powder is uniformly accumulated not only in the front part but also in the rear part. In addition, the collecting device of the present invention has a structure capable of double cooling in the outside and inside of the housing in order to lower the temperature of the exhaust gas more quickly.

1 is an external view showing a by-product collecting device according to an embodiment of the present invention, Figure 2 is a partial cross-sectional view showing a by-product collecting device, Figure 3 is an exploded perspective view showing a by-product collecting device, Figure 4 is a by-product collecting device Side view showing. 5 is a cross-sectional view taken along the line a-a shown in FIG. 4.

The by-product collecting device of the present invention is installed on the exhaust line of the process chamber where the reaction by-products are generated during deposition or etching of a thin film in a semiconductor, LCD manufacturing process or other similar processes and at the rear of the pump.

1 to 5, the by-product collecting device 100 of the semiconductor device according to the present invention includes a housing 110, a heating means 120, a trap module 130, and a cooling member 170. .

The housing 110 has a cylindrical body 112 to facilitate separation and coupling, an upper plate 114 coupled to an upper portion of the body 112 by bolting, and a lower plate 116 coupled to a lower portion of the body by bolting. It consists of

The body 112 has a double wall structure including an inner wall 112a and an outer wall 112b, and a first cooling line 172 in which a refrigerant is circulated is installed in a spiral form between the inner wall 112a and the outer wall 112b. . The surface temperature of the body 112 and the internal temperature of the housing are dropped by the first cooling line 172. The upper plate 114 has a gas inlet port 114a through which the exhaust gas flows from the process chamber, and the lower plate 116 has a gas discharge port 116a through which the exhaust gas is discharged. An exhaust line connected to the process chamber is connected to the gas inlet port 114a, and an exhaust line connected to the vacuum pump is connected to the gas discharge port 116a. For reference, the housing 110 is preferably provided with an O-ring 111 and the like sealing means for preventing the leakage of the exhaust gas.

As described above, the housing 110 has a structure that is easy to detach and combine, thereby providing convenience in maintenance and repair. For example, maintenance and repair of the housing 110 is performed to remove powder deposited on the inner wall of the housing 110 (inner wall of the body) and the trap module.

The heating means 120 is installed below the upper plate 114 of the housing 110. The heating unit 120 includes a heater 122 and a plurality of heating plates 124 installed on the heater 122. The heating plates 124 are radially installed so that the exhaust gas flowing into the center portion can diffuse toward the outer side, that is, toward the inner wall 112a of the housing 110. The exhaust gas is uniformly diffused to the periphery of the inner wall of the housing 110 by the heating plates 124 radially installed on the upper surface of the heater 122. In addition, the heating plates 124 provide a heating path until the exhaust gas diffuses to the edge immediately after reaching the center of the upper surface of the heater 122, whereby the exhaust gas is sufficiently heated by the heating plates 124 to be chemically supplied. You get the energy you need to change.

The heater 122 is connected to an external power source, and a heating wire is installed therein, and it is preferable that the heater 122 is made of a material such as ceramic, inconel, or the like so that corrosion by the exhaust gas does not occur. In addition, the heater 122 is connected to the covering pipe 127 for drawing in and out the hot wire from the outside of the housing 110.

On the other hand, the heating means 120 has a cylindrical guide 128 for guiding the flow of the exhaust gas so that the exhaust gas flowing into the housing 110 through the gas inlet port 114a toward the central portion of the heater 122 Have The cylindrical guide 128 is installed on top of the heating plates 124. The heating plate 124 according to the present invention may be configured to be slightly modified to ensure the maximum flow of the exhaust gas under vacuum pressure.

2, 5, 6 and 7, the trap module 130 is a very important configuration for collecting the powder. The trap module 130 includes a first trap part 134, a second trap part 142, a third trap part 150, and an inner tube 132.

The inner tube 132 is located at the inner center of the housing 110. The inner tube 132 is installed to be spaced apart from the lower plate of the housing 110 by a plurality of horizontal support pins 133. The horizontal support pins 133 are installed in the flange ring 119 portion of the housing 110. The inner tube 132 is provided with a first trap portion 134 and a second trap portion 142 on the outer circumferential surface, the third trap portion 150 is installed in the inner passage. The inner tube 132 is cooled by the second cooling line 174. The second cooling line 174 is helically installed in the space between the outer wall 132b and the inner wall 132a of the inner tube 132.

That is, the inner space of the housing 110 is an annular space a1 corresponding to the outer side of the inner tube 132 by the inner tube 132 and a central space a2 corresponding to the inner side (inner passage) of the inner tube. Compartment. A part of the exhaust gas introduced into the inner space of the housing 110 flows into the annular space a1, and the remaining exhaust gas flows into the central space a2. The first and second trap parts 134 and 142 are positioned in the annular space a1, and the third trap part 150 is located in the central space a2. Exhaust gas flowing into the annular space (a1) is affected by the temperature of the outer housing 110 and the inner inner tube 132, the temperature is reduced, the exhaust gas flowing into the central space (inner passage of the inner tube; a2) The temperature is lowered under the influence of the temperature of the inner tube (132). As such, in the present invention, since the uniform cooling of the exhaust gas passing through the internal space of the housing 110 is made, the reaction by-product is converted into a powder form, and the efficiency of collecting the trap module 130 is greatly improved.

As such, the powder collecting device 130 of the present invention is not only a double tube structure consisting of the housing 110 and the inner tube 132 inside the housing, but also the multiple cooling in which both the housing 110 and the inner tube 132 are cooled. It has a structure and its structural features.

The first trap part 134 has six first plates 136 installed on the outer circumferential surface of the inner tube 132 so as to be inclined radially (60 degree intervals). The first plates 136 are curved to direct the flow of the exhaust gas into a curve, and the first plates 136 are positioned at a sufficient distance for the smooth flow of the exhaust gas. That is, the first plates are inclined on the outer circumferential surface of the inner tube in a curved shape. At this time, the first plate 136 may be installed with an inclination of a predetermined angle (50-60 degrees). For example, when the inclination of the first plate 136 is large (if it is laid down a lot), the powder concentrates only on the first plates 136, and conversely, when the inclination of the first plate 136 is small (a lot of standing), the powder is concentrated. Is not stacked on the first plate is stacked only on the second plate. Meanwhile, the first plates 136 are formed with a plurality of through holes 136a. The through holes 136a are preferably smaller in size as they move away from the gas inlet port 114a. The first plate 136 has an outer surface 137 in contact with the inner surface (inner wall of the body) 112a of the housing to facilitate heat exchange with the housing 110. That is, the first plates 136 are cooled by the housing 110 and the inner tube 132. The first plates 136 have cutouts 136b, which are partially cut off on the outer surface 137. For example, the first plate 136 may have a flat plate shape and may be installed on an outer circumferential surface of the inner tube to be inclined at a predetermined angle.

The exhaust gas flow in the first trap part 134 described above is as follows. The exhaust gas is moved while turning along the curved passages between the first plates 136, and a part of the exhaust gas is vertically downward through the through holes 136a and the cutout 136b of the first plate 136. Is moved to. Thus, the first trap part 134 provides a plurality of vertical auxiliary paths in addition to the inclined main path for the smooth flow of exhaust gas.

The second trap part 142 is located at the lower end of the first trap part 134. The second trap portion 142 has three stages of second plates 144 on the outer circumferential surface of the inner tube 132 to provide horizontal and vertical passages through which exhaust gas can pass in a zigzag. The horizontal passage is provided between the second plates 144, and the vertical passage is provided by a plurality of openings 144a formed in the second plates 144. The openings 144a of the second plates 144 are formed at different positions. The second plate 144 at the uppermost end adjacent to the first trap part 134 has an easy exhaust gas passing between the first plates 136 of the first trap part 132 to the second trap part 142. The inclined portions 144b are inclined upwardly to be introduced therethrough. If there is no inclined portion 144b, vortices are generated in the space between the first trap portion 134 and the second trap portion 142, and these vortices prevent the smooth flow of powder and thus the second trap portion 142. This only causes powder to accumulate at the top.

As shown in the figure, the length of the first trap portion 134 is formed longer than the length of the second trap portion 142. For example, the length ratio of the first trap part 134 and the second trap part 142 is preferably 7: 3. For example, when the length ratio of the first trap part and the second trap part is adjusted to 5: 5, a phenomenon in which reaction by-products are concentrated on the first trap part occurs. This phenomenon may be caused by the stagnation of the reaction byproduct in the first trap part, and the stagnation of the reaction byproduct may be caused by the inclination angle of the first plates of the first trap part and the long moving path of the second trap part. .

The third trap part 150 is installed in the inner passage a2 of the inner tube 132. The third trap part 150 is for collecting the reaction by-products of the exhaust gas passing through the inner passage a2 of the inner tube 132. The third trap part 150 includes a support 152 positioned perpendicular to the center of the inner passage a2 of the inner tube 132, four third plates 154 installed to be inclined to the support 152, and a support. And fourth plates 156 installed horizontally at 152. The upper portion of the support 152 is fastened to the inner tube 132 by three bolts. The fourth plates 154 are installed in six stages on the support 152, the fourth plate 154 is installed at the bottom end is made of a disc so that the powder mass does not fall into the gas discharge port 116a, the outer surface is curved It was shaped like a fork so that the exhaust gas was easily discharged.

8 to 11 illustrate various modifications of the third trap part.

8 illustrates a third trap part 150a including a support 152 and fourth plates 158 installed in multiple stages on the support 152. 9 to 11 illustrate a third trap part 150a including six fifth plates 159 having through holes 159a formed therein and a horizontal sixth plate 160. The fifth plate 159 is disposed to be inclined in the inner passage a2 of the inner tube 132, and is installed such that the outer surface thereof contacts the inner wall 132a of the inner tube 132. The sixth plates 160 are installed in multiple stages while being supported by three support members 161 from the upper surface of the lower plate 116.

On the other hand, the collecting device of the present invention has a blocking member. The blocking member blocks the powder mass separated from the trap module 130 so as not to escape through the gas discharge port 116a. The blocking member is formed of a blocking jaw 162 protruding upward from the inner surface of the lower plate 116. The blocking jaw 162 is for blocking the powder mass flowing from the side direction. For example, the blocking member may be installed in the third trap unit 130, the fourth plate 154 positioned at the lowermost end of the third trap unit 150 shown in FIG. 6, and the third plate illustrated in FIG. 10. The sixth plate 160 positioned at the bottom of the trap unit 150b performs a blocking plate function.

Although the number of installation of the plates in the trap module 130 is not limited, too many blocks the smooth flow of exhaust gas, and if the spacing between the plates becomes too narrow, the passage may be quickly blocked when powder is deposited. . Therefore, the number of installation of the plates can be appropriately selected in consideration of various factors such as the installation environment, the internal pressure of the housing, the process being performed.

As described above, the by-product collecting device of the present invention allows the exhaust gas to pass through simple and wide movement paths in the front and through complicated narrow movement paths in the rear part so that the powder is uniformly deposited not only in the front part but also in the rear part. In other words, the reaction by-products of the exhaust gas flowing into the housing 110 are changed into powder by the low temperature atmosphere inside the housing 110. At this time, the exhaust gas passes through the inclined and wide movement paths of the first trap part 134, and a part of powder of the exhaust gas is formed on the first plates 136 and the inner tube 132 of the first trap part 134. It is accumulated on the outer circumference. The remaining powder passing through the first trap part 134 passes through a narrow and complicated passage provided by the second plates 144 of the second trap part 142 and the surface and the inner tube of the second plates 144. On the outer circumferential surface of 132.

The cooling member 170 is for making the inside of the housing 110 into a low temperature atmosphere to trap the reaction by-products included in the exhaust gas flowing into the housing 110. As shown in the figure, the cooling member 170 is for cooling the first cooling line 172 for cooling the body 112 of the housing 110 and the inner tube 132 of the trap module 130. And a supply pipe 176 for supplying refrigerant to the second cooling line 174 and the first and second cooling lines 172 and 174, and a discharge pipe 177 through which the refrigerant passing through the cooling line is discharged.

Here, the first cooling line 172 and the second cooling line 174 cools the surfaces of the housing 110 and the inner tube 132, as well as the internal temperature and trap module 130 of the housing 110. Will lower the temperature of the plates. When the refrigerant is flowed into the first and second cooling lines 172 and 174, the temperature of the housing 110, the inner tube 132, the plates 136, 144, 154, 156, and the housing is significantly lower than the temperature of the exhaust gas. .

Therefore, the exhaust gas (especially the reaction by-product) enters the housing 110 and immediately after being heated by the heating member 120, the housing 110, the inner tube 132 and the plate (cooled to a low temperature in a vapor state). 136, 144, 154, 156 is in contact with the surface of the instantaneous film formation and deposition is rapidly captured. Here, the reaction by-products at the moment of being deposited on the surface of the trap module 130 are nitrided at the point of transition from the vapor state to the solid state, and the surfaces of the plates 136, 144, 154, 156 and the surface of the inner tube 132. Is deposited more quickly, uniformly and firmly.

In particular, the present invention allows the housing 110 and the inner tube 132 to be cooled by the first and second cooling lines 172 and 174 to quickly lower the internal temperature of the housing 110 and the surface temperature of the plates 136, 144, 154 and 156. The first and second plates 136 and 144 may be installed to contact the inner wall of the housing 110 and the outer wall of the inner tube 132, and the third and fourth plates 154 and 156 may contact the inner wall of the inner tube 132. Installed to increase the heat exchange area of the plates 136,144,154,156. As a result, an atmosphere in which the reaction byproduct flowing into the housing 110 may be solidified more quickly may be formed.

As described above, the by-product collecting device of the present invention has a structure capable of dual cooling in the outside and the inside of the housing so as to solidify the reaction by-product flowing into the housing more quickly.

Hereinafter, the operation of the by-product collecting device of the semiconductor device according to the present invention configured as described above will be described based on the flow of the reaction by-product with reference to the drawings.

First, the refrigerant is supplied to the first cooling line 410 and the second cooling line 420 through the refrigerant supply pipe 40 connected to the external refrigerant tank. As the refrigerant flows into the first cooling line and the second cooling line, the temperature of the housing, the inner tube, the surfaces of the plates, and the inside of the housing drops. Then, the heating plate 210 in contact with the heater 220 is heated to a high temperature while releasing a high temperature heat by the heater operation of the heating member.

As described above, the exhaust gas containing a large amount of reaction by-products generated in the process chamber connected to the collecting device of the present invention while the collecting device of the present invention is operating is introduced into the housing through the gas inlet port. The exhaust gas is heated by the heating member and then diffused into the interior space of the housing.

A part of the exhaust gas diffused into the inner space of the housing 110 flows into the annular space a1, and the remaining exhaust gas flows into the central space a2. The exhaust gas flowing into the annular space a1 comes into contact with the inner wall, the first plates, and the outer wall surface of the housing that has already been cooled to a low temperature, and the inner wall of the housing, the first plates, and the outer wall surface of the inner tube. As soon as it comes into contact with it, it cools down and deposits on each surface as it rapidly solidifies in the vapor state.

In addition, the exhaust gas flowing into the central space (inner passage of the inner tube; a2) comes into contact with the inner wall of the inner tube and the surfaces of the third plates that have already been cooled to low temperature, and the inner wall of the inner tube and the surfaces of the third plates. As soon as it comes into contact with it, it cools down and deposits on each surface as it rapidly solidifies in steam.

As such, the present invention has the advantage that the internal temperature of the housing can be kept low because the structure is double-cooled at the outside and the inside of the housing, and thus the reaction by-product can be solidified more quickly. For reference, when the temperature of the reaction by-products rapidly decreases the temperature becomes a strong adsorbent powder, in particular, the reaction by-products are cooled to a predetermined temperature or less to have a more adsorptive characteristic at the site. Therefore, since the reaction by-products passing through the inner space of the housing 110 are rapidly cooled, the efficiency of the reaction by-products converted into powder form and collected in the trap module 130 is greatly improved.

On the other hand, other reaction by-products not collected in the first trap portion of the trap module are solidified while being cooled below a predetermined temperature while passing through the vertical vertical passages of the second trap portion in a zigzag manner, so that the surface of the second plates and the outer wall of the inner tube and the housing It will accumulate on the inner wall. Then, other reaction by-products not collected at the upper end of the third trap part are solidified while passing through the fourth plates of the third trap part in a zigzag, and are accumulated on the surface of the fourth plates and the inner wall of the inner tube, as shown in FIG. 12. The powder is deposited uniformly throughout the module. As shown in FIG. 13, in the case of a trap module in which plates of the original plate are provided in multiple stages, since the powder is accumulated only on the upper plate upper surface, the replacement cycle is very short and the collection efficiency is remarkably decreased.

That is, the by-product collecting device of the present invention allows the exhaust gas to pass through simple and wide travel paths in the front and through the complicated narrow travel paths in the rear part so that the powder is uniformly deposited on the rear part as well as the front part. Therefore, the replacement cycle of the collecting device is significantly extended, thereby improving productivity and reducing costs by reducing process delay.

Meanwhile, the by-product collecting device according to the present invention may be variously modified and may take various forms. It is to be understood, however, that the present invention is not limited to the specific forms referred to in the above description, but rather includes all modifications, equivalents and substitutions within the spirit and scope of the invention as defined by the appended claims. It should be understood to do.

As described above, since the present invention has a double cooling tube structure, the present invention has a special effect of cooling the reaction byproduct more quickly.

The present invention can improve the collection efficiency of the reaction by-products because the reaction by-products are simultaneously cooled at the outside and the inside of the housing.

The present invention divides the inner space of the housing into an annular space and a central space, and by placing plates of various shapes in each space, there is an advantage of maximizing the collection amount by further widening the powder adsorption area.

In the present invention, since the powder is uniformly collected throughout the trap module, the use cycle of the collecting device can be extended, and productivity can be obtained by reducing the process interruption due to frequent replacement.

The present invention can prevent damage to the vacuum pump by preventing the powder mass falling from the collecting module to escape to the gas discharge port.

Claims (25)

In the by-product collection device for collecting the reaction by-products in the exhaust gas generated in the process chamber: A housing having a gas inlet port and a gas outlet port; And A trap module installed inside the housing and having first plates installed inside the housing to direct the flow of exhaust gas into a curve; The trap module is installed inside the housing, the by-product collection device of the semiconductor manufacturing apparatus, characterized in that it comprises a plurality of second plates shaped to guide the flow of the exhaust gas in a zigzag (zigzag). In the by-product collection device for collecting the reaction by-products in the exhaust gas generated in the process chamber: A housing having a gas inlet port and a gas outlet port; And A trap module installed inside the housing and having first plates installed inside the housing to direct the flow of exhaust gas into a curve; The trap module A first trap unit in which the first plates are installed; And And a second trap part disposed in multiple stages at regular intervals and provided with second plates having a plurality of openings provided in a passage through which the exhaust gas flows. The method according to claim 1 or 2, The trap module is a by-product collecting device of the semiconductor manufacturing apparatus, characterized in that the first plate is disposed inclined radially. The method according to claim 1 or 2, The by-product collecting device of the semiconductor manufacturing apparatus, characterized in that the first plate is curved. The method of claim 2, The by-product trap device of the semiconductor manufacturing apparatus, characterized in that the length of the first trap portion is longer than the length of the second trap portion. The method of claim 2, And the second trap portion is provided at a position adjacent to the gas discharge port relative to the first trap portion. The method of claim 2, The first plate is provided such that its outer side is in contact with the inner side of the housing; And a cutout is formed on the outer surface of the first plate to allow exhaust gas to pass between the inner surface of the housing and the outer surface of the first plate. The method of claim 2, The by-product collecting device of the semiconductor manufacturing apparatus, characterized in that a plurality of through holes are formed in the first plate. The method of claim 8, The by-product collection device of the semiconductor manufacturing apparatus, characterized in that the size of the through-holes becomes smaller as the distance from the gas inlet port. The method of claim 2, The trap module An inner tube having an inner passage through which exhaust gas can pass, and fixed to the outer circumferential surface of the first plates and the second plates; And a third trap unit installed in the inner passage of the inner tube and collecting the reaction by-products of the exhaust gas passing through the inner passage. The method of claim 10, The third trap part A support positioned perpendicular to the center of the inner passage of the inner tube; Third plates installed on the support to be inclined; By-product collecting device of the semiconductor manufacturing apparatus, characterized in that it comprises a fourth plate installed on the support to be provided in the horizontal direction. The method of claim 10, The collecting device By-product collecting device of the semiconductor manufacturing apparatus, characterized in that it further comprises a blocking member for preventing the powder mass separated from the trap module to escape through the gas discharge port. The method of claim 12, The blocking member And a blocking jaw formed to protrude in a direction toward the inside of the housing from one surface of the housing provided with the gas discharge port. The method of claim 13, The blocking member By-product collecting device of the semiconductor manufacturing apparatus, characterized in that it further comprises a blocking plate located on the upper portion of the gas discharge port. In the by-product collection device for collecting the reaction by-products in the exhaust gas generated in the process chamber: A housing having a gas inlet port and a gas outlet port; And A trap module installed inside the housing and having first plates installed inside the housing to direct the flow of exhaust gas into a curve; The housing is A cylindrical body with upper and lower openings; An upper plate coupled to an upper portion of the body and provided with the gas inlet port; The by-product collecting device of the semiconductor manufacturing apparatus, characterized in that the bottom plate is coupled to the lower portion of the body and provided with the gas discharge port. The method of claim 10, The device is The by-product collection device of the semiconductor manufacturing apparatus, characterized in that it further comprises a cooling member for cooling the exhaust gas passing through the housing. The method of claim 16, The cooling member A first cooling unit for cooling the housing; And It includes a second cooling unit for cooling the inner tube of the trap module, And the first plates and the second plates exchange heat with the housing and the inner tube cooled by the cooling member. The method of claim 17, The first cooling unit includes first cooling lines provided on the wall of the housing, And the second cooling unit includes second cooling lines provided on the wall of the inner tube. In the by-product collection device for collecting the reaction by-products in the exhaust gas generated in the process chamber: A housing having a gas inlet port and a gas outlet port; A trap module installed inside the housing and having first plates installed inside the housing to direct the flow of exhaust gas into a curve; And By-product collecting device of the semiconductor manufacturing apparatus, characterized in that it comprises a heating member for heating the exhaust gas flowing into the housing. In the by-product capture device for collecting the reaction by-products in the exhaust gas generated in the process chamber: A housing provided in a cylindrical shape and having a gas inlet port and a gas outlet port; A first trap part provided in the housing and provided with first plates for collecting reaction by-products on a surface thereof; A second trap portion provided in the housing and provided with second plates for collecting reaction byproducts on a surface thereof; And the first plates and the second plates are configured to guide the flow of exhaust gas in different directions from each other. The method of claim 20, Each of the first plates is shaped to be inclined to guide the flow of exhaust gas in a curve, Each of the second plates is disposed perpendicular to the longitudinal direction of the housing, and the second plates are provided to be spaced apart by a predetermined distance to face each other, and the openings are formed in the second plate so that the flow direction of the gas is zigzag. By-product collecting device of the semiconductor manufacturing apparatus, characterized in that. The method of claim 21, The by-product collecting device of the semiconductor manufacturing apparatus, characterized in that each of the first plate is installed with an inclination of 50-60 degrees relative to the longitudinal direction of the housing. The method of claim 20 or 21, And the first plate is inclined to guide away from the vertical flow when the exhaust gas flows in the longitudinal direction of the housing. The method of claim 20 or 21, The first plate is a by-product collecting device of the semiconductor manufacturing apparatus, characterized in that curved to guide the streamlined flow when the exhaust gas flows in the longitudinal direction of the housing. The method according to claim 1 or 2, The by-product collecting device of the semiconductor manufacturing apparatus, characterized in that the first plate is inclined.

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