CN101432847A - Byproduct collecting apparatus of semiconductor apparatus - Google Patents

Byproduct collecting apparatus of semiconductor apparatus Download PDF

Info

Publication number
CN101432847A
CN101432847A CNA2007800148666A CN200780014866A CN101432847A CN 101432847 A CN101432847 A CN 101432847A CN A2007800148666 A CNA2007800148666 A CN A2007800148666A CN 200780014866 A CN200780014866 A CN 200780014866A CN 101432847 A CN101432847 A CN 101432847A
Authority
CN
China
Prior art keywords
plate
housing
cooling
waste gas
reaction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2007800148666A
Other languages
Chinese (zh)
Other versions
CN101432847B (en
Inventor
赵宰孝
洪正义
金泰佑
黄仁文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Milaebo Co Ltd
Original Assignee
Milaebo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020060041531A external-priority patent/KR100647725B1/en
Application filed by Milaebo Co Ltd filed Critical Milaebo Co Ltd
Priority claimed from PCT/KR2007/002008 external-priority patent/WO2007129820A1/en
Publication of CN101432847A publication Critical patent/CN101432847A/en
Application granted granted Critical
Publication of CN101432847B publication Critical patent/CN101432847B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D45/00Separating dispersed particles from gases or vapours by gravity, inertia, or centrifugal forces
    • B01D45/04Separating dispersed particles from gases or vapours by gravity, inertia, or centrifugal forces by utilising inertia
    • B01D45/08Separating dispersed particles from gases or vapours by gravity, inertia, or centrifugal forces by utilising inertia by impingement against baffle separators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D51/00Auxiliary pretreatment of gases or vapours to be cleaned
    • B01D51/02Amassing the particles, e.g. by flocculation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D8/00Cold traps; Cold baffles
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16LPIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L55/00Devices or appurtenances for use in, or in connection with, pipes or pipe systems
    • F16L55/07Arrangement or mounting of devices, e.g. valves, for venting or aerating or draining
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2258/00Sources of waste gases
    • B01D2258/02Other waste gases
    • B01D2258/0216Other waste gases from CVD treatment or semi-conductor manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Treating Waste Gases (AREA)
  • Chemical Vapour Deposition (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)

Abstract

Provided is a byproduct collecting apparatus for efficiently collecting reaction-byproducts contained in an exhaust gas exhausted from a process chamber during a semiconductor manufacturing process. The apparatus includes a housing and a trap module. The housing has a gas inlet port and a gas outlet port. The trap module is installed inside the housing and has first plates curved or inclined to guide an exhaust gas flow in a curved fashion.

Description

The byproduct gathering-device of semiconductor equipment
Technical field
The present invention relates to the byproduct gathering-device, it is used for being collected in effectively the reaction by-product that semiconductor fabrication is comprised from the waste gas that process chamber is discharged.
Background technology
Usually, semiconductor fabrication is divided into preprocessing process (manufacture process) and last handling process (assembling process).Preprocessing process is meant by forming predetermined pattern makes the process of semiconductor chip, and this predetermined pattern forms by repeating following process: in various process chambers on wafer deposit film, and the film that optionally etching deposited.Last handling process is meant by produced chip in the preprocessing process is separated into independently chip, and with these independently chip combine with lead frame (lead frame), thereby the process of assembling out complete product.About this respect, carry out etched process in process chamber and at high temperature use such as toxic gases such as silane, arsenic hydride (arsine) and boron chlorides and such as processing gases such as hydrogen and carry out at deposit film on the wafer or to being deposited on film on the wafer.In preprocessing process, in process chamber, understand the toxic gas that produces a large amount of various inflammable gases, corrosive impurities and comprise toxic component.
Therefore, semiconductor manufacturing facility comprises gas cleaner, and this gas cleaner is positioned at the rear end that is used for producing at process chamber the vacuum pump of vacuum state.The waste gas that this gas cleaner will also will purify from the waste gas purification that process chamber is discharged is discharged to the atmosphere.Yet when the waste gas of discharging from process chamber contacts with atmosphere or ambient temperature when very low, waste gas just can solidify and be transformed into powder.Thereby this powder adherence has increased blowdown presssure on discharge pipe line, simultaneously, can cause the vacuum pump imbalance when powder enters vacuum pump, thereby and causes the backflow of waste gas to pollute the wafer that is placed in the process chamber.
Be head it off, as shown in figure 14, the waste gas that is used for discharging from process chamber 1 be installed between process chamber 1 and vacuum pump 2 be transformed into pulverous powder trap unit.That is to say that as shown in figure 14, process chamber 1 is connected with vacuum pump 3 by aspiration line 5.Catch pipeline 7 and come out, and be used to catch and gather the reaction by-product of the powder type that produces from process chamber 1 from aspiration line 5 branches.
In traditional powder trap unit, deposition or the unreacting gas that produced during etch thin film flow to aspiration line 5 in process chamber 1, this aspiration line 5 is compared with process chamber 1 has relatively low ambient temperature, therefore above-mentioned unreacting gas is solidified into powder 9, and accumulates in from catching the pipeline 7 that aspiration line 5 branches come out.
Yet above-mentioned traditional powder trap unit has following problem.
At first, because the reaction by-product that produces in process chamber is transformed into powder and accumulates to catch in the pipeline and need for a long time, so cycle period (TAT) is also corresponding has prolonged.That is to say, up to be transformed into powder apace at deposition or the reaction by-product that produced during etch thin film and accumulate to catch in the pipeline after, just can carry out next thin film deposition or etching process, need for a long time but reaction by-product is transformed into powder.Therefore, be removed after-processing chamber up to all reaction by-products and just can carry out next process, and want standby for a long time.Therefore, not only the operating rate of equipment reduces, and owing to the long TAT that causes of stand-by time of process chamber prolongs.
Secondly, because it is very narrow to be used to gather the collecting zone of catching pipeline (space) of powder, thereby must remove continually to accumulate in and catch ducted powder, this is very inconvenient.Especially, because powder only concentrated and accumulate in the porch of catching pipeline, thereby it is very short to catch the cleaning cycle of pipeline.
Summary of the invention
The technical problem that solves
The invention provides a kind of byproduct gathering-device that can collect reaction by-product fast.
The present invention also provides a kind of byproduct gathering-device with longer replacement cycle.
Technical scheme
Embodiments of the invention provide the byproduct gathering-device, and it comprises: the housing with air inlet and gas outlet; And trapping module, it is installed in the described housing, thereby and has and be first plate that bending or skewed direct exhaust flow with bending or inclination mode.
In certain embodiments, first plate of described trapping module is radial setting.
In other embodiments, described trapping module also comprises a plurality of second plates, and described second plate is installed in the described housing and is formed direct exhaust and flows with zigzag.
In other embodiments, described trapping module also comprises: first catches portion, and described first plate is installed in described first and catches in the portion; And second catch portion, and described second plate is installed in described second and catches in the portion, and described second plate is separated and had a plurality of openings by multistage setting and by predetermined space, and described a plurality of openings are set to the passage that allows exhaust flow cross.
In other embodiments, described second portion that catches compares with described first portion of catching and is set at the position that is adjacent to described gas outlet.
In other embodiments, described first plate has the outer surface that contacts with the inner surface of described housing, and on the outer surface of described first plate, be formed with cutting part, thereby allow waste gas between the outer surface of the inner surface of described housing and described first plate, flow.
In other embodiments, on described first plate, be formed with a plurality of through holes, and the size of described through hole becomes big along with the distance of described through hole and described air inlet and reduces.
In other embodiments, described trapping module also comprises: inner core, and it has the inner passage that allows exhaust flow cross, and described first plate and described second plate are fixed on the periphery of described inner core; And the 3rd catch portion, and it is installed in the inner passage of described inner core, thereby collect the reaction by-product of the waste gas that flows through from described inner passage.
In other embodiments, described the 3rd portion of catching comprises: the support bar of center that vertically is arranged on the inner passage of described inner core; Be mounted obliquely within the 3rd plate on the described support bar; And flatly be installed in the 4th plate on the described support bar.
In other embodiments, described byproduct gathering-device also comprises block piece, and described block piece is used to prevent that passing through described gas outlet from the bulk powder that described trapping module drops discharges.
In certain embodiments, described block piece comprises: stop border (blocking threshold) and the barrier plate that places top, described gas outlet from housing one side that is provided with described gas outlet what protrude facing to the direction of described housing inboard.
In other embodiments, described housing also comprises: cylindrical body, and open its upper and lower; Upper plate, the upper junction of itself and described main body merge and have described air inlet; And lower plate, the lower junction of itself and described main body merges and has described gas outlet.
In other embodiments, described byproduct gathering-device also comprises cooling-part, and described cooling-part has first cooling end that is used to cool off described housing; And second cooling end that is used to cool off the inner core of described trapping module.
In other embodiments, described first cooling end comprises the cooling of first on the wall that is arranged on described housing pipeline, and described second cooling end comprises the cooling of second on the wall that is arranged on described inner core pipeline.
In other embodiments, described byproduct gathering-device also comprises the heater block that is used for heating the waste gas that is introduced in described housing.
In other embodiments of the invention, the byproduct gathering-device comprises: the housing with air inlet and gas outlet; Be located at first in the described housing and catch portion, and catch described first and to be provided with first plate that is used to collect reaction by-product in the portion; Be located at second in the described housing and catch portion, and catch described second and to be provided with second plate that is used to collect reaction by-product in the portion, wherein said first plate and described second plate are shaped as direct exhaust and flow in different directions.
In certain embodiments, thereby each described first plate has the tilted shape direct exhaust to flow with bend mode, each described second plate is configured to vertical with the longitudinal direction of described housing, described second plate is separated by predetermined space and is faced with each other, thereby and is formed with opening in described second plate gas is flowed with zigzag.
In other embodiments, being shaped as of described first plate: when flowing on the longitudinal direction of waste gas at described housing, this shape allows waste gas not carry out perpendicular flow.
In other embodiments, being shaped as of described first plate: when flowing on the longitudinal direction of waste gas at described housing, this shape allows waste gas flow with bend mode.
In other embodiments, each described first plate is installed to be and has 50 °~60 ° gradient with respect to the longitudinal direction of described housing.
Beneficial effect
The present invention utilizes the dual-cooled line construction thereby has the special result that cools off reaction by-product more quickly.
The present invention can be by cooling off the collection efficiency that reaction by-product improves reaction by-product simultaneously in the outer surface of housing and inner surface.
The present invention has following advantage: be divided into annular space and central space by the inner space with housing, and in each space the plate with different shape be set, thereby utilize the powder binding domain of widening to make the collecting amount maximization.
According to the present invention, owing to powder is collected on the whole trapping module equably, therefore can prolong the work period of gathering-device, and can solve the productivity ratio reduction problem that causes owing to the caused work interruption of frequent replacing.
Thereby the present invention can be by preventing to discharge the damage that prevents vacuum pump through the gas outlet from the powder block that collection module drops.
Description of drawings
Fig. 1 is the view of outward appearance that the byproduct gathering-device of the embodiment of the invention has been described;
Fig. 2 is the partial sectional view of byproduct gathering-device;
Fig. 3 is the exploded perspective view of byproduct gathering-device;
Fig. 4 is the end view that the byproduct gathering-device has been described;
Fig. 5 is the sectional view along the A-A line among Fig. 4;
Fig. 6 is the exploded perspective view of trapping module;
Fig. 7 is the end view of trapping module;
Fig. 8 is the stereogram that portion is caught in the 3rd of modification;
Fig. 9 has the stereogram that the trapping module of portion is caught in the 3rd of modification;
Figure 10 is the partial sectional view that the byproduct gathering-device of trapping module shown in Figure 9 is installed;
Figure 11 has illustrated among Figure 10 that the 3rd catches the view of the 6th plate of portion;
Figure 12 is the photo that the reaction by-product of being collected by trapping module of the present invention has been described;
Figure 13 is the photo that the reaction by-product of the trapping module collection that is equipped with multistage plate has been described; And
Figure 14 is the skeleton diagram that the byproduct gathering-device of prior art has been described.
Embodiment
The structure of gathering-device of the present invention can allow waste gas also pass through the complicated and narrow passage of locating at the rear portion through the simple and wide passage of forwardly locating, thereby powder not only can be accumulated in equably on the front portion, also can accumulate on the rear portion equably.In addition, the structure of gathering-device of the present invention can also be carried out dual-cooled to the temperature of waste gas in the outside and the inboard of housing, thereby reduces the temperature of waste gas more quickly.
Fig. 1 is the view of outward appearance that the byproduct gathering-device of the embodiment of the invention has been described, Fig. 2 is the partial sectional view of byproduct gathering-device, Fig. 3 is the exploded perspective view of byproduct gathering-device, Fig. 4 is the end view that the byproduct gathering-device has been described, and Fig. 5 is the sectional view along the A-A line among Fig. 4.
This byproduct gathering-device is installed in the rear end of the pump on the discharge pipe line of process chamber, when deposition or etch thin film in semiconductor or liquid crystal display manufacture process or similar procedure, can produce reaction by-product in described process chamber.
With reference to Fig. 1~Fig. 5, byproduct gathering-device 100 comprises housing 110, heater block 120, trapping module 130 and cooling-part 170.
Housing 110 comprises: cylindrical body 112 is bonded to the upper plate 114 on main body 112 tops and the lower plate 116 that is bonded to main body 112 bottoms by bolt by bolt.
Main body 112 has the double-walled construction that comprises inwall 112a and outer wall 112b.The first cooling pipeline 172 is installed between inwall 112a and the outer wall 112b with spiral-shaped, and cooling agent circulation in the first cooling pipeline 172.The surface temperature of main body 112 and the internal temperature of described housing are reduced by the first cooling pipeline 172.Upper plate 114 has the air inlet 114a that is used to introduce waste gas, and lower plate 116 has the gas outlet 116a that is used for combustion gas.The discharge pipe line that is connected with process chamber is connected to air inlet 114a.The discharge pipe line that is connected with vacuum pump is connected to gas outlet 116a.As a reference, the O ring can be installed in housing 110, this O ring is the seal member that is used to prevent the waste gas leakage.
As mentioned above, be easy to separate and assembled construction, therefore be convenient to the maintenance of housing 110 because housing 110 has.For example, thus be deposited on the inwall (inwall of main body 112) of housing 110 and the powder on the trapping module by housing 110 being safeguarded remove.
Heater block 120 is installed in below the upper plate 114 of housing 110.Heater block 120 comprises the heating plate 124 on heater 122 and a plurality of upper surface that is installed in heater 122.Heating plate 124 is radial installation, and therefore, the waste gas that is introduced in central part can be the inwall 112a diffusion of housing 110 to periphery.By being the radial heating plate 124 that is installed on the heater 122, waste gas is diffused into equably the circumferential part place at housing 110 inwall places.Simultaneously, arrive the central upper portion of heater 122 and immediately before the edge diffusion, heating plate 124 provides heat tunnel at waste gas.Therefore, thus waste gas is heated plate 124 to be heated fully and obtains the required energy of chemical transformation.
Heater 122 is connected with external power source and is provided with heating wire in heater 122.Heater 122 can be by making such as pottery and Inconel materials such as (Ying Kenaier).In addition, the sleeve pipe 127 of tractive heating wire is connected with heater 122 to be used for inserting also from housing 110 outsides.Simultaneously, heater 120 comprises cylindrical guide 128, and mobile making via air inlet 114a is incorporated into the exhaust flow of housing 110 to central part thereby it is used for direct exhaust.Cylindrical guide 128 is installed on the heating plate 124.Heating plate 128 of the present invention can made amendment on some degree to guarantee the exhaust-gas flow under vacuum pressure.
With reference to Fig. 2, Fig. 5~Fig. 7, trapping module 130 is unusual important components in powder collection.Trapping module 130 comprises that first catches portion 134, second and catch portion the 142, the 3rd and catch portion 150 and inner core 132.
Inner core 132 is positioned at the center of housing 110.Inner core 132 is separated with preset distance by a plurality of horizontal support pins 133 and the lower plate of housing 110.Horizontal support pins 133 is installed on the flange ring 119 of housing 110.First catches portion 134 and second catches portion 142 and is installed on the periphery of inner core 132.The 3rd catches portion 150 is installed in the inner core 132.Inner core 132 is by 174 coolings of the second cooling pipeline.The second cooling pipeline 174 is with between the spiral-shaped outer wall 132b and inwall 132a that is installed in inner core 132.
That is to say that the inner space of housing 110 is divided into corresponding to the annular space a1 in inner core 132 outsides with corresponding to the interior central space a2 of inner core 132 inboards (inner passage) by inner core 132.A part is introduced in exhaust flow in the inner space of housing 110 to annular space a1, and remaining exhaust flow is to interior central space a2.First catches portion 134 and second catches portion 142 and is positioned at annular space a1.The 3rd catches portion 150 is positioned at interior central space a2.The temperature that flows to the waste gas of annular space a1 is subjected to the temperature effect of housing 110 and inner core 132 and descends.The temperature that flows to the waste gas of interior central space a2 (inner passage of inner core) is subjected to the temperature effect of inner core 132 and descends.As mentioned above, in the present invention, because the waste gas of process is cooled off equably from the inner space of housing 110, so trapping module 130 can more effectively change reaction by-product into powder and collect powder.
As mentioned above, powder collection device 130 of the present invention is characterised in that, it not only has and comprises housing 110 and be positioned at the structure of the inner core 132 of housing 110, but also has the multiple cooling structure that housing 110 and inner core 132 all are cooled.
First catches portion 134 comprises and is radial (with 60 ° interval) and is mounted obliquely within six first plates 136 on the periphery of inner core 132.Thereby first plate 136 is the curved shape direct exhaust to flow with bend mode.First plate 136 is opened so that waste gas can flow apace with enough separating distances.That is to say, sweeping first plate is mounted obliquely within on the periphery of inner core.About this respect, first plate 136 can be installed by 50 °~60 ° pre-determined tilt angle.For example, when the gradient very big (that is, first plate 136 is almost set level) of first plate 136, powder only concentrates on first plate 136.On the other hand, when the gradient very little (that is, first plate, 136 nearly erects) of first plate 136, powder can not accumulate on first plate 136, but only accumulates on second plate.Simultaneously, first plate 136 comprises a plurality of through hole 136a.The size of through hole 136a can become big and reduce along with the distance of these through holes 136a and air inlet 114a.Because the outer surface 137 of first plate 136 and the inwall 112a (that is, the inwall of main body) of housing 110 contact, thereby be easy to carry out heat exchange with housing 110.That is to say that first plate 136 is cooled by inner core 132 and housing 110.First plate 136 comprises cutting part 136b, and this cutting part 136b forms by a part of cutting away first plate 136 along outer surface 137.For example, first plate 136 can have writing board shape and tilt at a predetermined angle on the periphery of inner core.
The following describes the exhaust-gas flow of catching portion 134 places first.Waste gas flows when the bending channel between first plate 136 turns to.Part waste gas is downward through the through hole 136a and the cutting part 136b of first plate 136.For waste gas is flowed fast, first catches portion 134 also provides a plurality of additional vertical passages except main ramp way is provided.
Second catches portion 142 is positioned at first lower end of catching portion 134.Second catches portion 142 comprises three rank, second plate 144, and this three rank, second plate 144 is used to provide horizontal channel and the vertical channel that waste gas is flowed with zigzag on the periphery of inner core 132.Described horizontal channel is located between second plate 144, and described vertical channel is made of a plurality of opening 144a that form in second plate 144.The opening 144a of second plate 144 is formed on the diverse location place.Be positioned at first second plate 144 of catching the contiguous place, the top of portion 134 and have acclivitous rake 144b, therefore, catch between first plate 136 of portion 132 waste gas of process from first and can easily be incorporated into second and catch the portion 142.Under the situation that does not have rake 144b, to catch the place, space that portion 134 and second catches between the portion 142 first and can produce eddy current, this eddy current can hinder flowing fast of powder, and this will make powder only concentrate on second upper end of catching portion 142.
As shown in drawings, first length of catching portion 134 is greater than second length of catching portion 142.For example, first catch the length ratio that portion 134 and second catches portion 142 and can be 7:3.For example, when catching length ratio that portion and second catches portion when being controlled to be 5:5 with first, reaction by-product can occur and concentrate on first phenomenon of catching in the portion.This phenomenon may be to produce owing to byproduct accumulates in first portion of catching place.This byproduct gathers and can be caused by the long moving conduit that portion is caught at first angle of inclination and second of catching first plate of portion.
The 3rd catches among the inner passage a2 that portion 150 is installed in inner core 132.The 3rd catches portion 150 designed to be used the waste gas that collection flows through from the inner passage a2 of inner core 132 reaction by-product.The 3rd catches portion 150 comprises: 152, four of support bars that vertically are arranged at the a2 center, inner passage of inner core 132 are mounted obliquely within the 3rd plate 154 on the support bar 152, and flatly are installed in the 4th plate 156 on the support bar 152.Use three bolts that the top of support bar 152 is combined with inner core 132.Each the 4th plate 154 is installed on the support bar by six rank.Therefore that the 4th plate 154 that is installed in bottom is formed circle, do not have bulk powder to drop to gas outlet 116a, and the outer surface of that the 4th plate is formed curved shape so that combustion gas easily.
Fig. 8~Figure 11 has illustrated that the 3rd catches the view of the various modifications of portion.
Fig. 8 has illustrated and has comprised support bar 152 and catch the 150a of portion by multistage the 3rd of the 4th plate 158 on the support bar 152 that is installed in.In addition, Fig. 9~Figure 11 has illustrated and has comprised that the 3rd of six the 5th plates 159 with through hole 159a and level the 6th plate 160 catch the 150a of portion.The 5th plate 159 is tilted placement with respect to the inner passage a2 of inner core 132, and is installed to be the inboard that makes these the 5th plates and contacts with the inner surface 132a of inner core 132.In addition, the 6th plate 160 is installed to be multistage, and is being supported by the upper surface of three support bars 161 from lower plate 116.
Simultaneously, byproduct gathering-device of the present invention comprises block piece.Described block piece blocks powder, therefore the bulk powder that breaks away from from trapping module 130 can not released through gas outlet 116a.Described block piece comprise from the inner surface of lower plate 116 protruding upward stop border 162.The described border that stops is designed to stop the bulk powder of direction introducing from the side.For example, this block piece can be installed in the 3rd and catch portion 130 places.Shown in Figure 6 be positioned at the 3rd and catch the 4th plate 154 that portion 150 locates bottom and shown in Figure 10 be positioned at the 3rd and catch the 6th plate that the 150b of portion locates bottom as barrier plate.
Although for the quantity that is installed in the plate in the trapping module 130 without limits, when too much plate is installed, can hinder flowing fast of waste gas.In addition, under the too narrow situation in the interval between each plate, can very fast blocking channel when powder deposition.Therefore, to considering comprehensively, suitably select the quantity of the plate installed by on the whole such as installation environment, enclosure interior pressure and the various factorss such as processing that will carry out.
As mentioned above, byproduct gathering-device of the present invention is characterised in that, by allowing simple and wide moving conduit and the complicated and narrow moving conduit through at rear portion locate of waste gas, can make powder not only be deposited on anterior place equably, and be deposited on the place, rear portion equably through forwardly locating.In other words, by the low temperature environment of housing 110, the reaction by-product that is incorporated into the waste gas in the housing 110 is transformed into powder.About this respect, when waste gas is caught the inclination of portion 134 and wide moving conduit through first, change and a part of powder of coming accumulates in first and catches on the outer surface and inner core 132 of first plate 136 of portion 134 from this waste gas.In addition, when waste gas during, accumulate on the periphery of the surface of second plate 144 and inner core 132 by first all the other powder of catching the waste gas of portion 134 through the complicated and narrow moving conduit that provides by second second plate 144 of catching portion 142.
Cooling-part 170 is designed to make housing 110 inside to become low temperature environment, so that catch the reaction by-product that is included in the waste gas that is incorporated in the housing 110.With reference to accompanying drawing, cooling-part 170 comprises: the first cooling pipeline 172 that is used to cool off the main body 112 of housing 110, be used to cool off the second cooling pipeline 174 of the inner core 132 of trapping module 130, be used for supply line 176, and be used to discharge the discharge line 177 that cools off the cooling agent of pipeline by each to the first cooling pipeline 172 and the second cooling pipeline, 174 supply coolants.
Here, the surface that the first cooling pipeline 172 and the second cooling pipeline 174 not only cool off housing 110 and inner core 132, but also the temperature of each plate of the internal temperature of reduction housing 110 and trapping module 130.In the time of in cooling agent being incorporated into the first cooling pipeline 172 and the second cooling pipeline 174, the internal temperature of housing 110, inner core 132 and each plate 136,144,154 are compared with the temperature of waste gas all and can be reduced significantly and relatively with 156 temperature.
Therefore, waste gas (particularly reaction by-product) is introduced in the housing 110 and by heater block 120 and heats.When the waste gas that is in gaseous state at once with the housing 110 that is cooled to low temperature, inner core 132 and each plate 136,144,154 when 156 surface contacts, this waste gas is transformed into one deck immediately and is deposited, and therefore can carry out gas sampling rapidly.Here, the reaction by-product that is produced when waste gas is deposited on trapping module 130 surfaces is transformed into that time when solid-state from gaseous state, this reaction by-product be transformed into one deck and rapider, evenly and firmly deposit to each plate 136,144,154 and 156 and the surface of inner core 132 on.
Especially, by the first cooling pipeline 172 and the second cooling pipeline 174 housing 110 and inner core 132 are cooled off, thereby promptly reduce the internal temperature of housing 110 and the surface temperature of each plate 136,144,154 and 156.First plate 136 is installed to be with the inwall of housing 110 and the outer wall of inner core 132 with second plate 144 and contacts, and the 3rd plate 154 is installed to be with the inwall of inner core 132 with the 4th plate 156 and contacts, thereby increases the heat exchange area of each plate 136,144,154 and 156.Thereby, formed and can solidify the environment that is introduced in the reaction by-product in the housing 110 more quickly.
As mentioned above, the structure of byproduct gathering-device of the present invention can be at the outside and the inner dual-cooled reaction by-product of housing, thereby more promptly solidifies the reaction by-product that is introduced in the described housing.
The work of the byproduct gathering-device that has said structure in semiconductor equipment is described with reference to the accompanying drawings.
At first, by the cooling agent supply line 40 that links to each other with the external refrigeration agent container cooling agent is supplied to the first cooling pipeline 410 and the second cooling pipeline 420.When cooling agent flow through the first and second cooling pipelines, the surface temperature of housing, inner core and each plate and the internal temperature of housing all descended.In addition, because the heater 220 of heater block is worked and given out heat of high temperature, therefore the heating plate 210 that contacts with heater 220 is heated to high temperature.When the byproduct gathering-device was worked, the waste gas that contains a large amount of reaction by-products that produce from the process chamber that is connected with described gathering-device was introduced in the housing via air inlet.This waste gas is heated the parts heating and is diffused in the inner space of housing 110.
A part has been diffused into exhaust flow in the inner space of housing 110 to annular space a1, and remaining exhaust flow is to central space a2.Flowing to this part waste gas of annular space a1 contacts with the inwall of the housing 110 that is cooled to low temperature, the outer wall surface of first plate and the outer wall surface of inner core.When that time that the outer wall surface of the outer wall surface of the inwall of this part waste gas and housing 110, first plate and inner core contacts, this part waste gas just is cooled, and is being deposited on each surface the process that promptly takes place to solidify from gaseous state.
In addition, that part of waste gas that flows to central space (the inner passage a2 of inner core) contacts with the inwall of the inner core that is cooled to low temperature and the surface of the 3rd plate.When that time that the surface of the inwall of that part of waste gas that flows to central space and inner core and the 3rd plate contacts, that part of waste gas just is cooled, and is being deposited on each surface the process that promptly takes place to solidify from gaseous state.
Because structure of the present invention can be as mentioned above be carried out the dual-cooled operation in the outside of housing and inside, so the internal temperature of housing can be maintained low temperature, thereby reaction by-product can more promptly solidify.As a reference, when temperature reduced rapidly, the reaction by-product of gaseous state was transformed into the powder with strong characterization of adsorption.Especially, reaction by-product has stronger characterization of adsorption at the part place that is cooled to below the predetermined temperature.Therefore, the reaction by-product of the inner space of process housing 110 is promptly cooled off, thereby trapping module 130 can more effectively be transformed into reaction by-product powder and collect powder.
Simultaneously, when other reaction by-products of collecting when first portion of catching that obtains module at large are caught the horizontal channel of portion and vertical channel with zigzag through second, these reaction by-products are cooled to below the predetermined temperature, take place to solidify and accumulate on the inwall of the outer wall of surface, inner core of second plate and housing.In addition, when not being collected into the 3rd other reaction by-products of catching portion's upper end when catching the 4th plate of portion with zigzag through the 3rd, these reaction by-products take place to solidify and accumulate on the inwall of the surface of the 4th plate and inner core.Therefore, as shown in figure 12, powder is deposited on the whole trapping module equably.With reference to Figure 13, because powder only accumulates on the upper surface of upper plate at the top place that is positioned at the trapping module that multistage discoid plate is installed, therefore not only the replacement cycle is very short, and collection efficiency obviously reduces.
That is to say, the structure of byproduct gathering-device of the present invention can allow waste gas also pass through the complicated and narrow moving conduit of locating at the rear portion through the simple and wide moving conduit of forwardly locating, thereby powder not only can be accumulated on the front portion equably, and can accumulate on the rear portion equably.Therefore, obviously prolonged the replacement cycle of gathering-device, thereby reduced processing delay, improved productivity ratio and reduced manufacturing cost.
Above-mentioned disclosed theme should be considered to illustrative rather than restrictive, and claims are intended to cover all changes, improvement and other embodiment that falls in true spirit of the present invention and the scope.Therefore, allow to the full extent at law, scope of the present invention is allowed to explain by claims and equivalent thereof the wideest and limits, and is not subjected to above-mentioned constraint that specifies or restriction.
Industry is used
The present invention can be applicable to the equipment of ownership manufacturing semiconductor and LCD. Especially, of the present invention Thereby the byproduct gathering-device be applied in effectively collect on the discharge pipe line of process chamber be disposed to described The reaction by-product of discharge pipe line is in described process chamber, when in semiconductor, LCD manufacture process Or deposition or during etch thin film in other similar processing procedures, can produce reaction by-product.

Claims (34)

1. device that is used for being collected in the reaction by-product that waste gas comprised that process chamber produces, described device comprises:
Housing, it has air inlet and gas outlet; And
Trapping module, it is installed in the described housing, thereby and has and be first plate that bending or skewed direct exhaust flow with bend mode.
2. device as claimed in claim 1, first plate of wherein said trapping module are radial and are provided with obliquely.
3. device as claimed in claim 2, wherein said trapping module also comprise a plurality of second plates, and described second plate is installed in the described housing and is shaped as direct exhaust and flows with zigzag.
4. device as claimed in claim 2, wherein said trapping module comprises:
First catches portion, and described first plate is installed in described first and catches in the portion; And
Second catches portion, and described second plate is installed in described second and catches in the portion, and described second plate is separated and had a plurality of openings by multistage setting and by predetermined space, and described a plurality of openings are set to the passage that allows exhaust flow cross.
5. device as claimed in claim 4, wherein said first length of catching portion is greater than described second length of catching portion.
6. device as claimed in claim 4, wherein said second portion that catches compares with described first portion of catching and is set at the position that is adjacent to described gas outlet.
7. device as claimed in claim 4, wherein said first plate has the outer surface that contacts with the inner surface of described housing, and on the outer surface of described first plate, be formed with cutting part, thereby allow waste gas between the outer surface of the inner surface of described housing and described first plate, flow.
8. device as claimed in claim 4 wherein is formed with a plurality of through holes on described first plate.
9. device as claimed in claim 8, the size of wherein said through hole becomes big along with the distance of described through hole and described air inlet and reduces.
10. device as claimed in claim 4, wherein said trapping module also comprises:
Inner core, it has the inner passage that allows exhaust flow cross, and wherein said first plate and described second plate are fixed on the periphery of described inner core, and
The 3rd catches portion, and it is installed in the inner passage of described inner core, thereby collects the reaction by-product of the waste gas that flows through from described inner passage.
11. device as claimed in claim 10, wherein said the 3rd portion of catching comprises:
Vertically be arranged on the support bar of center of the inner passage of described inner core;
Be mounted obliquely within the 3rd plate on the described support bar; And
Flatly be installed in the 4th plate on the described support bar.
12. device as claimed in claim 10 also comprises block piece, described block piece is used to prevent that passing through described gas outlet from the bulk powder that described trapping module drops discharges.
Stop the border 13. device as claimed in claim 12, wherein said block piece comprise, it is protruding facing to the direction of described housing inboard from housing one side that is provided with described gas outlet.
14. device as claimed in claim 13, wherein said block piece also comprise the barrier plate that places top, described gas outlet.
15. device as claimed in claim 1, wherein said housing comprises:
Cylindrical body, open its upper and lower;
Upper plate, the upper junction of itself and described main body merge and have described air inlet; And
Lower plate, the lower junction of itself and described main body merge and have described gas outlet.
16. device as claimed in claim 10 also comprises the cooling-part that is used for cooling off the waste gas that flows through from described housing.
17. device as claimed in claim 16, wherein said cooling-part comprises:
Be used to cool off first cooling end of described housing; And
Be used to cool off second cooling end of the inner core of described trapping module, wherein said first plate and described second plate and the described housing and the described inner core heat-shift that are cooled off by described cooling-part.
18. device as claimed in claim 17, wherein said first cooling end comprise the cooling of first on the wall that is arranged on described housing pipeline, and described second cooling end comprises the cooling of second on the wall that is arranged on described inner core pipeline.
19. device as claimed in claim 1 also comprises the heater block that is used for heating the waste gas that is introduced in described housing.
20. a device that is used for being collected in the reaction by-product that waste gas comprised that process chamber produces, described device comprises:
Housing with air inlet and gas outlet;
Be located at first in the described housing and catch portion, wherein catch on the surface of portion first plate that is used to collect reaction by-product is installed described first;
Be located at second in the described housing and catch portion, wherein catch on the surface of portion second plate that is used to collect reaction by-product is installed, and described first plate and described second plate are shaped as direct exhaust and flow in different directions described second.
21. device as claimed in claim 20, wherein thereby each described first plate has the tilted shape direct exhaust and flows with bend mode, each described second plate is configured to vertical with the longitudinal direction of described housing, described second plate is separated by predetermined space and is faced with each other, thereby and is formed with opening in described second plate gas is flowed with zigzag.
22. device as claimed in claim 21, wherein each described first plate is installed to be and has 50 °~60 ° gradient with respect to the longitudinal direction of described housing.
23. device as claimed in claim 21, being shaped as of wherein said first plate: when flowing on the longitudinal direction of waste gas at described housing, this shape allows waste gas not carry out perpendicular flow.
24. device as claimed in claim 21, being shaped as of wherein said first plate: when flowing on the longitudinal direction of waste gas at described housing, this shape allows waste gas flow with bend mode.
25. a device that is used for being collected in the reaction by-product that waste gas comprised that process chamber produces, described device comprises:
Housing, the inner passage that it has air inlet, gas outlet and allows exhaust flow cross;
Cooling tower, it is installed in the described housing; And
Trapping module, it is arranged in the described housing, thereby and has a lip-deep reaction by-product that a plurality of plates are collected described a plurality of plates.
26. device as claimed in claim 25 also comprises the cooling-part that is used to cool off described housing and described cooling tower.
27. device as claimed in claim 26, wherein said cooling tower is formed tubular, thereby described inner passage is divided into annular space and interior central space.
28. as claim 26 or 27 described devices, wherein said a plurality of plates abut against on the outer surface of the inner surface of described housing and described cooling tower.
29. as claim 26 or 27 described devices, wherein said a plurality of plates comprise and are shaped as first plate and second plate that direct exhaust flows in different directions.
30. device as claimed in claim 29, wherein said trapping module comprises:
First catches portion, and described first plate is installed in described first and catches in the portion; And
Second catches portion, and described second plate is installed described second and caught in the portion, thereby wherein said first plate is bending or plane direct exhaust flows with bend mode, and described second plate has the shape that direct exhaust flows with zigzag.
31. device as claimed in claim 30, wherein said first plate are radial and are provided with obliquely.
32. device as claimed in claim 27 also comprises the 3rd plate, it is installed in the central space of described cooling tower, thereby collects the reaction by-product of the waste gas that flows through from described central space.
33. as claim 26 or 27 described devices, also comprise block piece, described block piece is used to prevent that passing through described gas outlet from the bulk powder that described trapping module drops discharges.
34. as claim 26 or 27 described devices, wherein said cooling-part comprises:
First cooling end, it has the cooling of first on the wall that is arranged on described housing pipeline; And
Second cooling end, it has the cooling of second on the wall that is arranged on described cooling tower pipeline, wherein said a plurality of plates and the described housing and the described cooling tower heat-shift that are cooled off by described cooling-part.
CN2007800148666A 2006-05-04 2007-04-25 Byproduct collecting apparatus of semiconductor apparatus Active CN101432847B (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
KR1020060040700 2006-05-04
KR10-2006-0040700 2006-05-04
KR1020060040700A KR100676927B1 (en) 2006-05-04 2006-05-04 Apparatus for caching products in semiconductor apparatus
KR1020060041531A KR100647725B1 (en) 2006-05-09 2006-05-09 Apparatus for caching by-products in semiconductor apparatus
KR10-2006-0041531 2006-05-09
KR1020060041531 2006-05-09
PCT/KR2007/002008 WO2007129820A1 (en) 2006-05-04 2007-04-25 Byproduct collecting apparatus of semiconductor apparatus

Publications (2)

Publication Number Publication Date
CN101432847A true CN101432847A (en) 2009-05-13
CN101432847B CN101432847B (en) 2012-05-09

Family

ID=38105022

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800148666A Active CN101432847B (en) 2006-05-04 2007-04-25 Byproduct collecting apparatus of semiconductor apparatus

Country Status (2)

Country Link
KR (1) KR100676927B1 (en)
CN (1) CN101432847B (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109979849A (en) * 2017-12-27 2019-07-05 未来宝株式会社 Semiconductor technology by-product capturing device
CN110779357A (en) * 2018-07-31 2020-02-11 应用材料公司 Device with multistage cooling
EP3527691A4 (en) * 2016-10-14 2020-06-24 IHI Corporation Reheating collection device for gas phase process
CN112546799A (en) * 2019-09-25 2021-03-26 未来宝株式会社 Semiconductor engineering reaction byproduct collecting device with cooling flow path
CN112546798A (en) * 2019-09-25 2021-03-26 未来宝株式会社 Semiconductor engineering reaction byproduct collecting device with cooling flow path
CN113227683A (en) * 2019-12-06 2021-08-06 赞解株式会社 Cooling water circulation system integral type accessory substance entrapment device
CN113663426A (en) * 2021-08-25 2021-11-19 湖北玖恩智能科技有限公司 Powder collecting and filtering device and gas purifying equipment
US11562943B2 (en) 2019-10-31 2023-01-24 Milaebo Co., Ltd. Apparatus for collecting by-product in semiconductor manufacturing process
TWI815493B (en) * 2022-03-29 2023-09-11 南韓商未來寶股份有限公司 Apparatus for trapping of reaction by-product with extended available collection area

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100768887B1 (en) 2007-07-24 2007-10-22 주식회사 엠아이 Apparatus for trapping semiconductor residual product
KR100896025B1 (en) * 2007-07-31 2009-05-11 (주)티티에스 Semiconductor manufacturing apparatus having trap for vacuum line
KR100840518B1 (en) 2007-11-16 2008-06-23 주식회사 엠아이 Apparatus for trapping semiconductor residual product
KR101024504B1 (en) * 2009-04-01 2011-03-31 주식회사 미래보 Aapparatus for collecting remaining chemicals and by-products in semiconductor processing using particle inertia
KR101317626B1 (en) * 2011-09-09 2013-10-10 (주)제이오션 Gathering apparatus for exhaust gas
KR101267949B1 (en) * 2011-10-06 2013-05-27 (주)엘오티베큠 Trap apparatus
KR101678154B1 (en) * 2016-01-20 2016-11-22 주식회사 코셉솔루션 Apparatus for trapping semiconductor residual product
KR102087389B1 (en) * 2017-12-21 2020-03-10 (주)피앤테크 Apparatus of exhausting process gas for wafer doping process tube
KR102154196B1 (en) * 2018-11-27 2020-09-09 주식회사 미래보 Apparatus for collecting by-product of semiconductor manufacturing process
US11054174B2 (en) 2019-01-09 2021-07-06 Milaebo Co., Ltd. Semiconductor process by-product collecting device
KR102188604B1 (en) * 2019-04-02 2020-12-09 주식회사 미래보 Apparatus for collecting by-product of semiconductor manufacturing process
KR102209662B1 (en) * 2019-07-19 2021-02-01 (주)제이솔루션 Trapping apparatus for cobalt-carbon gas
KR20210061680A (en) 2019-11-20 2021-05-28 주식회사 비에스티코리아 a powder trap
KR20210086258A (en) 2019-12-31 2021-07-08 주식회사 비에스티코리아 a powder trap
KR20220063799A (en) 2020-11-09 2022-05-18 삼성전자주식회사 Apparatus for collecting by-product and method for collecting by-product
KR102316922B1 (en) * 2021-01-25 2021-10-26 (주) 엠엠티케이 A collecting byproduct trapping device for semiconductor manufacturing process
KR102316093B1 (en) * 2021-01-25 2021-10-22 (주) 엠엠티케이 A collecting byproduct trapping device for semiconductor manufacturing process
KR102352815B1 (en) * 2021-06-08 2022-01-17 권도희 A collecting byproduct trapping apparatus for semiconductor manufacturing device
KR102658879B1 (en) * 2021-12-27 2024-04-19 (주)한화 Cold trap
KR102658880B1 (en) * 2021-12-27 2024-04-19 (주)한화 Cold trap

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE460220B (en) * 1987-12-11 1989-09-18 Allan Inovius REACTOR FOR REDUCTION OF CONCENTRATION GAS CONDITIONS OF NITROGEN AND SULFUR OXIDES
JP2913040B2 (en) * 1988-08-26 1999-06-28 東京エレクトロン株式会社 Trap device
JP3547799B2 (en) * 1994-07-19 2004-07-28 富士通株式会社 Cold trap and semiconductor device manufacturing apparatus
JP3540064B2 (en) * 1995-09-04 2004-07-07 株式会社アルバック Trap for the first stage of dry vacuum pump
JPH09225230A (en) * 1996-02-20 1997-09-02 Kokusai Electric Co Ltd Cooling and collecting device and semiconductor producing device

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3527691A4 (en) * 2016-10-14 2020-06-24 IHI Corporation Reheating collection device for gas phase process
CN109979849A (en) * 2017-12-27 2019-07-05 未来宝株式会社 Semiconductor technology by-product capturing device
TWI681809B (en) * 2017-12-27 2020-01-11 南韓商未來寶股份有限公司 Semiconductor process by-product trapping device
CN109979849B (en) * 2017-12-27 2023-01-13 未来宝株式会社 Semiconductor technology by-product trapping device
CN110779357A (en) * 2018-07-31 2020-02-11 应用材料公司 Device with multistage cooling
US11221182B2 (en) 2018-07-31 2022-01-11 Applied Materials, Inc. Apparatus with multistaged cooling
CN112546799A (en) * 2019-09-25 2021-03-26 未来宝株式会社 Semiconductor engineering reaction byproduct collecting device with cooling flow path
CN112546798A (en) * 2019-09-25 2021-03-26 未来宝株式会社 Semiconductor engineering reaction byproduct collecting device with cooling flow path
US11562943B2 (en) 2019-10-31 2023-01-24 Milaebo Co., Ltd. Apparatus for collecting by-product in semiconductor manufacturing process
CN113227683A (en) * 2019-12-06 2021-08-06 赞解株式会社 Cooling water circulation system integral type accessory substance entrapment device
CN113663426A (en) * 2021-08-25 2021-11-19 湖北玖恩智能科技有限公司 Powder collecting and filtering device and gas purifying equipment
TWI815493B (en) * 2022-03-29 2023-09-11 南韓商未來寶股份有限公司 Apparatus for trapping of reaction by-product with extended available collection area

Also Published As

Publication number Publication date
CN101432847B (en) 2012-05-09
KR100676927B1 (en) 2007-02-02

Similar Documents

Publication Publication Date Title
CN101432847B (en) Byproduct collecting apparatus of semiconductor apparatus
US7988755B2 (en) Byproduct collecting apparatus of semiconductor apparatus
KR100647725B1 (en) Apparatus for caching by-products in semiconductor apparatus
CN109979849B (en) Semiconductor technology by-product trapping device
KR100621660B1 (en) Apparatus for trapping semiconductor residual product
CN111760414B (en) Reaction by-product trap device for semiconductor process
CN111223790B (en) Reaction byproduct collecting device for semiconductor process
KR100862684B1 (en) Apparatus for trapping by-product gas in semiconductor producing line
KR101865337B1 (en) Semiconductor process by-product collecting device
US20220178617A1 (en) Heat exchanger with multistaged cooling
KR101280541B1 (en) Residual product trap apparatus for semiconductor manufacturing equipment
KR100768882B1 (en) Apparatus for trapping semiconductor residual product
KR100923265B1 (en) Apparatus and method for deposition of exhaust gas
CN203112961U (en) Reaction furnace of etching baking device
KR102256549B1 (en) Apparatus with multistaged cooling
KR20050079302A (en) A apparatus for caching residual products in semiconductor device
CN103060769A (en) Etching and baking equipment and operation method thereof
CN110617729A (en) Cold trap for tail gas treatment
CN112546798B (en) Semiconductor engineering reaction byproduct collecting device with cooling flow path
KR200397523Y1 (en) Apparatus for trapping semiconductor residual product
KR200350279Y1 (en) A apparatus for caching residual products in semiconductor device
KR101164200B1 (en) Apparatus for trapping semiconductor residual product
KR100898064B1 (en) Equipment of dust collection for semi-conductor production having a cartridge type heater
CN110812874A (en) Quick cooling and recovering device for reaction solvent

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant