KR100862684B1 - Apparatus for trapping by-product gas in semiconductor producing line - Google Patents

Apparatus for trapping by-product gas in semiconductor producing line Download PDF

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Publication number
KR100862684B1
KR100862684B1 KR1020080014680A KR20080014680A KR100862684B1 KR 100862684 B1 KR100862684 B1 KR 100862684B1 KR 1020080014680 A KR1020080014680 A KR 1020080014680A KR 20080014680 A KR20080014680 A KR 20080014680A KR 100862684 B1 KR100862684 B1 KR 100862684B1
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South Korea
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lead
inlet
trap plate
outer housing
cooling
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KR1020080014680A
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Korean (ko)
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강진
주형진
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(주)화인
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D51/00—Auxiliary pretreatment of gases or vapours to be cleaned
    • B01D51/02—Amassing the particles, e.g. by flocculation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment

Abstract

An apparatus for trapping a by-product gas in a semiconductor producing line is provided to perform easily a maintenance process of a heater by attaching the heater to an intermediate lead. An entrance lead(10) includes an inlet. An external housing(20) includes an outlet. A heating unit(30) has a tubular structure for heating a reaction gas. The heating unit is arranged perpendicularly to an inflow direction of the reaction gas. A trap plate structure(40) is installed in the inside of the external housing. A trap plate is arranged in the trap plate structure to trap the heated reaction gas. A cooling unit cools the trap plate. An intermediate lead is positioned between the entrance lead and the external housing. The intermediate lead is positioned perpendicularly to a reaction gas flow path from the entrance lead and the external housing. The heating unit is attached to the inside of the intermediate lead.

Description

반도체공정의 부산물 포집장치{Apparatus for trapping by-product gas in semiconductor producing line}Apparatus for trapping by-product gas in semiconductor producing line

도 1a 및 1b는 반도체 공정라인의 부산물가스 배출경로를 나타내는 도면이다.1A and 1B are diagrams illustrating a by-product gas discharge path of a semiconductor processing line.

도 2는 부산물 가스의 포화곡선을 나타내는 도면이다. 2 is a diagram illustrating a saturation curve of a by-product gas.

도 3a 및 3b는 종래의 포집장치를 나타내는 도면이다.3A and 3B show a conventional collecting device.

도 4 및 5는 본 발명에 따른 포집장치의 외부 및 내부를 나타내는 도면이다.4 and 5 are views showing the outside and inside of the collecting device according to the present invention.

도 6은 본 발명의 포집장치의 분해도이다.6 is an exploded view of the collecting device of the present invention.

도 7 및 8은 본 발명의 효과를 나타내는 도면이다.7 and 8 illustrate the effects of the present invention.

본 발명은 반도체공정의 부산물 포집 장치에 관한 것으로서, 보다 상세하게는 공정라인의 구조에 영향을 주지 않고 분리가능함으로써 유지 및 보수작업이 보다 용이해진 부산물 포집 장치에 관한 것이다.The present invention relates to a by-product collecting device of a semiconductor process, and more particularly, to a by-product collecting device which is easier to maintain and repair by being separable without affecting the structure of a process line.

도 1a 및 1b는 반도체 공정라인의 부산물가스 배출경로를 나타내는 도면이다.1A and 1B are diagrams illustrating a by-product gas discharge path of a semiconductor processing line.

반도체 제조공정은 전 공정과 후 공정으로 구분되며, 전 공정은 반도체칩을 제조하기 위해 웨이퍼(wafer) 상에 박막을 증착하고 식각하는 물리/화학적 공정을 의미하며, 후 공정은 전 공정에서 제작된 웨이퍼를 특정의 규격으로 절단하여 별도제작된 리드프레임에 얹고 와이어 본딩 후 몰딩하는 패키지(package) 제작공정을 의미한다.The semiconductor manufacturing process is divided into the pre-process and the post-process, and the pre-process means a physical / chemical process of depositing and etching a thin film on a wafer to manufacture a semiconductor chip. It refers to a package fabrication process in which a wafer is cut to a specific standard, placed on a separately manufactured lead frame, and molded after wire bonding.

상기 과정에서 전 공정은 공정이 수행되기 위한 공간을 제공하는 프로세스 챔버의 내부에 웨이퍼를 투입하고, 웨이퍼 상에 박막의 증착, 식각을 수행하기 위해 작업분위기를 형성하는 실란(silane), 아르신(arsine) 및 염화 붕소 등과 수소 등의 가스를 챔버 내부로 주입한 후 칩 제조 프로세스를 수행하게 된다. 이 때, 상기 전 공정이 수행되는 동안 프로세스 챔버의 내부에는 각종 발화성 가스와 부식성 이물질 및 유독 성분을 함유한 유해가스가 다량 발생되며, 이 유해가스를 정화하여 방출하기 위해 반도체 제작장치에는 반드시 스크루버(scrubber; 가스 세정기)가 설치된다. 이와 같은 스크루버는 단지 가스형태의 반응부산물 만을 정화처리하기 때문에 반응부산물이 프로세스 챔버의 외부로 진행 되어 파우더의 형태로 고형화되면, 배기라인에 고착됨에 따른 배기압력 상승, 진공펌프로 유입되어 펌프의 고장유발, 프로세스 챔버로 유해가스가 역류하여 웨이퍼를 오염시키는 등의 문제점이 노출되었다.In the above process, the entire process includes silane and arsine, which inject a wafer into a process chamber that provides a space for performing the process, and form a working atmosphere for performing deposition and etching of a thin film on the wafer. arsine), boron chloride, etc., and gas such as hydrogen is injected into the chamber to perform the chip manufacturing process. At this time, a large amount of harmful gas containing various ignition gases, corrosive foreign substances and toxic components is generated inside the process chamber during the entire process, and a screwdriver must be provided in the semiconductor manufacturing apparatus to purify and release the harmful gases. (scrubber; gas scrubber) is installed. Since such a scrubber purifies only the reaction byproducts in the form of gas, when the reaction byproducts proceed to the outside of the process chamber and become solid in the form of powder, the exhaust pressure rises due to the fixation on the exhaust line and flows into the vacuum pump. Problems such as contamination, harmful gas flow back into the process chamber, and contamination of the wafer were exposed.

이를 해소하기 위해 도 1에서와 같이 프로세스 챔버(1)와 진공펌프(2)의 사이에 포집장치(3)(트랩장치라 통칭되는)를 설치하여 고형화된 반응부산물을 포집처리하고 있다. 이 포집장치(3)는 콜드 트랩장치 또는 핫 트랩장치 등으로 구현되어 기체상태의 반응부산물을 하우징 내에서 고형화시키고, 고형화된 파우더 형태의 반응부산물을 하우징 내부에 장착된 포집부재에 수집하여 진공펌프 측으로는 정화된 반응부 산물 가스가 진행되도록 하고 있으며, 이러한 과정에 의해 고형화된 반응부산물은 포집장치에 의해 포집되고 정화된 가스가 외부로 배출될 수 있게됨은 주지된 것과 같다. In order to solve this problem, as illustrated in FIG. 1, a collecting device 3 (commonly referred to as a trap device) is installed between the process chamber 1 and the vacuum pump 2 to collect the solidified reaction byproduct. The collecting device 3 is implemented as a cold trap device or a hot trap device to solidify the gaseous reaction by-products in the housing, and collect the solidified powder reaction by-products in the collecting member mounted inside the vacuum pump. On the side, the purified reaction part product gas is allowed to proceed, and the reaction byproduct solidified by this process is collected by the collecting device, and the purified gas can be discharged to the outside.

도 2는 부산물 가스의 포화곡선을 나타내는 도면이다. 2 is a diagram illustrating a saturation curve of a by-product gas.

부산물은 도 2의 포화곡선을 가지며 이는 포집장치의 포집원리를 설명한다. 포집장치(3)는 첫째 vapor 상태인 미반응 부산물 가스를 가스물질의 도 2의 포화곡선을 이용한 solid 상태로 전환하고, 둘째 vapor-solid 상태의 물질의 열 에너지 탈취시의 흡착작용을 이용하여 포집한다. 즉 포집장치는 vapor-solid 로의 전환방식 및 파우더포집방식으로 분류된다. 이러한 포집원리는 당업자에게 주지되어 있다. The byproduct has a saturation curve of Figure 2 which illustrates the capture principle of the capture device. The collecting device 3 converts the first unreacted by-product gas, which is a vapor state, into a solid state using the saturation curve of FIG. do. That is, the collection device is classified into a vapor-solid conversion method and a powder collection method. Such capture principles are well known to those skilled in the art.

도 3a 및 3b는 종래의 포집장치를 나타내는 도면이다.3A and 3B show a conventional collecting device.

도 3에 나타난 바와 같이 종래의 포집장치(100)는 유입구(140) 및 배출구(150)사이에 설치된 원형의 하우징내외부에 히터(220), 제1냉각라인(410), 제2냉각라인(420), 제1트랩플레이트(310), 제2트랩플레이트(320)가 형성된 구조이다. 즉 유입구로 유입된 부산물가스는 히터(220)에서 가열된후, 제1 및 제2트랩플레이트로 유도되는데, 이 트랩플레이트(310,320)는 제1 및 제2 냉각라인(410,420)에 의해 냉각된 상태로 유지되어 있기 때문에 포화곡선의 특성에 의해 트랩플레이트의 표면에 부산물가스가 반응을 일으켜 고체화되어 포집된다. As shown in FIG. 3, the conventional collecting device 100 includes a heater 220, a first cooling line 410, and a second cooling line 420 inside and outside a circular housing installed between an inlet 140 and an outlet 150. ), The first trap plate 310 and the second trap plate 320 is formed. That is, the by-product gas introduced into the inlet is heated in the heater 220 and then led to the first and second trap plates, and the trap plates 310 and 320 are cooled by the first and second cooling lines 410 and 420. Due to the characteristic of the saturation curve, the by-product gas reacts on the surface of the trap plate and becomes solid and is collected.

그러나, 이러한 종래의 포집 장치는, 첫째 히터가 유입구에 부착된 상태로 설치되어 있기 때문에 청소 및 유지관리가 어렵고, 둘째 냉각수단이 하우징의 외벽에 감겨있기 때문에, 역시 청소 및 유지관리가 용이하지 않다. 즉 이러한 포집장치는 주기적 유지관리(periodical management, PM)를 위해서 각 부품의 분리, 청소 및 부품교체가 필수적인데, 유입구 및 배출구가 연결된 상태에서 히터의 분리 및 제1,2냉각라인의 분리는 용이하지 않다. However, such a conventional collection device is difficult to clean and maintain because the first heater is attached to the inlet, and secondly, since the cooling means is wound on the outer wall of the housing, the cleaning and maintenance is also not easy. . In other words, such a collection device is essential to separate, clean and replace parts for periodic management (PM), and it is easy to separate the heater and the first and second cooling lines while the inlet and the outlet are connected. Not.

특히 도 3의 포집장치는 냉각라인이 외부의 하우징에 감겨있으므로 유지보수작업시 분리가 매우 용이하지 않고, 히터는 유입구의 인렛에 부착되어 있기 때문에, 포집장치 전체부품을 해체하지 않는 한 유지관리가 불가능한 구조이다.In particular, since the cooling line is wound around the outer housing, the collecting device of FIG. 3 is not very easy to be removed during maintenance work, and since the heater is attached to the inlet of the inlet, the maintenance is not performed unless the entire collection device is dismantled. Impossible structure.

따라서, 본 발명은 상기와 같은 문제점을 해결하기 위해 안출된 것으로서, 본 발명의 목적은 청소 및 유지관리가 용이한 포집장치를 제공하는 것이다.Accordingly, the present invention has been made to solve the above problems, the object of the present invention is to provide a collection device that is easy to clean and maintain.

전술한 과제를 해결하기 위해 본 발명은, 반도체 공정의 부산물 포집장치에 있어서, 유입구가 형성된 입구리드(10); 배출구가 형성된 외부하우징(20); 상기 유입구로 유입된 반응가스를 가열하는 가열수단(30); 상기 외부하우징내에 설치되며, 상기 가열된 반응가스를 포집하는 트랩플레이트가 배열된 트랩플레이트구조체(40); 상기 트랩플레이트를 냉각하는 냉각수단(50)을 포함하고, 상기 가열수단(30)은, 상기 입구리드(10)와 상기 외부하우징(20)의 사이에 위치하며 반응가스이동경로에 대해 수직방향으로 분리가능하도록 설치된 중간리드(60)에 부착된 것을 특징으로 한 다. In order to solve the above problems, the present invention, the by-product collecting device of the semiconductor process, the inlet lead 10 is formed with an inlet; An outer housing 20 formed with an outlet; Heating means 30 for heating the reaction gas introduced into the inlet; A trap plate structure (40) installed in the outer housing and arranged with a trap plate for collecting the heated reaction gas; Cooling means 50 for cooling the trap plate, wherein the heating means 30 is located between the inlet lead 10 and the outer housing 20 in a direction perpendicular to the reaction gas flow path It is characterized in that attached to the intermediate lead 60 is installed to be removable.

일 실시예에서, 상기 포집장치(100)는 상기 외부하우징와 상기 트랩플레이트구조체사이에 위치하는 내부하우징(70)을 더 포함하며, 상기 냉각수단(50) 및 상기 트랩플레이트구조체(40)는 상기 내부하우징(70)에 내면에 부착된 것을 특징으로 한다.In one embodiment, the collecting device 100 further comprises an inner housing 70 located between the outer housing and the trap plate structure, wherein the cooling means 50 and the trap plate structure 40 are the inner. It is characterized in that attached to the inner surface to the housing (70).

일 실시예에서, 상기 냉각수단(50)은상기 트랩플레이트구조체를 외부에서 둘러싸는 격자형상의 제1냉각라인(52); 및 상기 트랩플레이트구조체의 중앙부를 관통하는 판상형상의 제2냉각라인(54)를 포함하는 것을 특징으로 한다.In one embodiment, the cooling means 50 comprises a grid-shaped first cooling line 52 surrounding the trap plate structure from the outside; And a plate-shaped second cooling line 54 penetrating the central portion of the trap plate structure.

일 실시예에서, 상기 포집장치(100)는 상기 외부하우징 말단에 분리가능하도록 설치된 출구리드(80)를 더 포함하고, 상기 제1냉각라인 및 상기 제2냉각라인의 유입 및 배출구는 상기 출구리드에 설치되는 것을 특징으로 한다. In one embodiment, the collecting device 100 further includes an outlet lead 80 detachably installed at the outer housing end, wherein the inlet and outlet of the first cooling line and the second cooling line are the outlet lead. Characterized in that installed in.

일 실시예에서, 상기 가열수단(30)은 판상형상으로 형성되고 상기 반응가스의 유입방향에 대해 수직으로 배치된 것을 특징으로 한다.In one embodiment, the heating means 30 is formed in a plate shape and is characterized in that it is disposed perpendicular to the inflow direction of the reaction gas.

일 실시예에서, 상기 유입된 반응가스를 상기 가열수단의 표면으로 분배시키기 위한 분배플레이트(90)를 더 포함하고, 상기 분배플레이트(90)는 상기 입구리드(10)에서 상기 가열수단을 향하는 표면에 부착된 것을 특징으로 한다.In one embodiment, it further comprises a distribution plate 90 for distributing the introduced reaction gas to the surface of the heating means, wherein the distribution plate 90 is a surface facing the heating means at the inlet lead 10. It is characterized in that attached to.

이하에서는 첨부된 도면을 참조하여 본 발명의 바람직한 일 실시예를 상세하게 설명하기로 한다. Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

도 4 및 5는 본 발명에 따른 포집장치의 외부 및 내부를 나타내는 도면이고, 도 6은 포집장치의 분해도이다. 4 and 5 are views showing the outside and inside of the collecting device according to the present invention, Figure 6 is an exploded view of the collecting device.

본 발명에 따른 포집장치(100)는 입구리드(10), 외부하우징(20), 가열수단(30), 트랩플레이트구조체(40), 냉각수단(50) 및 중간리드(60)를 포함한다. 유입관(1) 및 배출관(2)은 부산물가스가 유입 및 배출되는 통로로서 포집장치(100)의 전단 및 후단에서 각각 유입구(12) 및 배출구(22)에 연결된다.The collecting device 100 according to the present invention includes an inlet lead 10, an outer housing 20, a heating means 30, a trap plate structure 40, a cooling means 50, and an intermediate lead 60. The inlet pipe 1 and the outlet pipe 2 are passages through which the by-product gas is introduced and discharged, and are connected to the inlet 12 and the outlet 22 at the front and rear ends of the collecting device 100, respectively.

입구리드(10)는 부산물가스가 유입되는 유입구(12)가 형성된 사각평면형상의 입구 인렛이다.The inlet lead 10 is a square inlet inlet formed with an inlet 12 through which the by-product gas is introduced.

외부하우징(20)은 사각통형상의 하우징으로서 배출구(22)가 형성되어 있다. The outer housing 20 is a rectangular cylindrical housing having a discharge port 22 formed therein.

가열수단(30)은 유입구(12)로 유입된 부산물 가스를 가열시키는 히터이며, 중간리드(60)에 부착되어 있다. 히터는 전기히터가 일반적으로 사용된다.The heating means 30 is a heater for heating the by-product gas introduced into the inlet 12, and is attached to the intermediate lead 60. Electric heaters are generally used.

일 실시예에서, 가열수단은 판상형상으로 형성되고, 부산물가스의 유입방향에 대해 수직으로 배치된다. 즉 판상의 히터는 유입되는 부산물가스와 정면으로 부딪히도록 형성된다. 이렇게 함으로써 유입되는 가스와 접촉면적을 넓히고 접촉시간을 증가시킴으로써 좀더 효율적인 가열이 가능하다. 또한 후술하는 바와 같이 본발명에서는 히터는 중간리드에 설치되기 때문에 종래의 포집장치에 비해 이러한 배치는 더욱 용이하게 구현가능하다. In one embodiment, the heating means is formed in a plate shape and is disposed perpendicular to the inflow direction of the by-product gas. In other words, the plate heater is formed to face the incoming by-product gas in front. This allows more efficient heating by increasing the contact area with the incoming gas and increasing the contact time. In addition, in the present invention, as described below, since the heater is installed in the intermediate lead, such an arrangement may be more easily implemented than in the conventional collecting device.

트랩플레이트구조체(40)는 가열된 부산물가스를 포집하는 트랩플레이트가 격자형상으로 배열된 구조체이며, 외부하우징의 내부에 설치된다. 트랩플레이트는 다수의 관통공이 형성된 금속성의 평면구조체이다. 트랩플레이트 및 트랩플레이트 구조체는 당업자에게 널리 알려져 있다.The trap plate structure 40 is a structure in which a trap plate for collecting the heated by-product gas is arranged in a lattice shape, and is installed inside the outer housing. The trap plate is a metallic planar structure in which a plurality of through holes are formed. Trapplates and trapplate structures are well known to those skilled in the art.

냉각수단(50)은 트랩플레이트에 접하도록 설치된 냉각라인의 집합체로서 트 랩플레이트를 냉각한다. 일반적으로 냉각라인속에는 냉각수가 유입되며, 일 실시예에서, 냉각수 유입구(62) 및 배출구(64)는 중간리드(60)에 형성된다. The cooling means 50 cools the trap plate as an assembly of cooling lines provided to contact the trap plate. In general, the cooling water flows into the cooling line, and in one embodiment, the cooling water inlet 62 and the outlet 64 are formed in the intermediate lead 60.

일 실시예에서, 냉각수단(50)은 트랩플레이트구조체(40)를 외부에서 둘러싸는 격자형상의 제1냉각라인(52) 및 트랩플레이트구조체(40)의 중앙부를 관통하는 판상형상의 제2냉각라인(54)을 포함한다. 이렇게 함으로써 트랩플레이트를 좀더 효율적으로 냉각할 수 있으며, 제1냉각라인과 제2냉각라인의 유입 및 배출구를 분리할 수 있기 때문에, 유지보수를 위한 분리작업이 더욱 용이해진다.In one embodiment, the cooling means 50 is a lattice-shaped first cooling line 52 externally surrounding the trap plate structure 40 and a plate-shaped second cooling line passing through the central portion of the trap plate structure 40. (54). In this way, the trap plate can be cooled more efficiently, and the inlet and outlet ports of the first cooling line and the second cooling line can be separated, thereby making the separation for maintenance easier.

중간리드(60)는 입구리드(10)와 외부하우징(20)의 사이에 위치하며, 부산물가스 이동경로에 대해 수직방향으로 분리가능하도록 설치된다. 중간리드(60)의 내부에는 가열수단(30)이 설치된다.The intermediate lead 60 is positioned between the inlet lead 10 and the outer housing 20 and is installed to be separated in a vertical direction with respect to the by-product gas movement path. The heating means 30 is installed inside the intermediate lead 60.

일 실시예에서, 포집장치(100)는 외부하우징(20)과 트랩플레이트구조체(40)사이에 위치하는 사각통형상의 내부하우징(70)을 추가적으로 포함하고, 냉각수단(50) 및 트랩플레이트구조체(40)는 내부하우징(70)의 내면에 부착 및 설치된다. In one embodiment, the collecting device 100 further comprises a rectangular cylindrical inner housing 70 located between the outer housing 20 and the trap plate structure 40, and the cooling means 50 and the trap plate structure. 40 is attached to and installed on the inner surface of the inner housing 70.

일 실시예에서, 포집장치(100)는 외부하우징(20)의 말단에 분리가능하도록 설치된 판상의 출구리드(80)를 더 포함한다. 이러한 경우에는 제1냉각라인(52) 및 제2냉각라인(54)의 유입 및 배출구(82,84)는 출구리드(80)에 형성된다.In one embodiment, the collecting device 100 further comprises a plate-shaped outlet lead 80 detachably mounted at the end of the outer housing 20. In this case, the inlet and outlet ports 82 and 84 of the first cooling line 52 and the second cooling line 54 are formed in the outlet lead 80.

일 실시예에서, 포집장치(100)는 유입된 부산물가스를 가열수단의 표면으로 효율적으로 분배시키기 위한 분배플레이트(90)를 포함하고, 분배플레이트(90)는 입구리드(10)에서 가열수단(30)을 향하는 방향의 표면에 부착된다. 분배플레이트는 방사형으로 배열된 분배날개(92)를 이용하여 유입된 부산물가스의 이동경로를 효율 적으로 분배해주며, 본 발명에서는 특히 분배플레이트가 입구리드측에 설치됨으로써 중간리드의 분리에 분배플레이트가 영향을 주지 않으므로, 중간리드 즉 히터의 분리 및 보수작업이 용이해진다. In one embodiment, the collecting device 100 comprises a distribution plate 90 for efficiently distributing the incoming by-product gas to the surface of the heating means, the distribution plate 90 is the heating means (at the inlet lead 10) 30) is attached to the surface in the direction facing. The distribution plate efficiently distributes the movement path of the by-product gas introduced by using radially arranged distribution blades 92. In the present invention, the distribution plate is installed at the inlet lead side, so that the distribution plate is separated from the intermediate lead. Since it does not affect, the intermediate lead, that is, the separation and maintenance work of the heater becomes easy.

본 발명에서, 포집장치(100)는 입구리드(10)와 외부하우징(20)사이에 중간리드(60)가 가스이동경로방향에 수직으로 분리가능한 형상으로 설치되고, 가열수단은 중간리드(60)에 설치된다. 따라서, 가열수단의 유지관리 및 청소시에는 중간리드의 분리작업만 수행하면 되므로, 유지관리가 용이해진다.In the present invention, the collecting device 100 is installed between the inlet lead 10 and the outer housing 20 in a shape in which the intermediate lead 60 is separable perpendicularly to the gas movement path direction, and the heating means is an intermediate lead 60. It is installed in). Therefore, when maintaining and cleaning the heating means, only the separation operation of the intermediate lead needs to be performed, thereby making maintenance easy.

또한, 냉각수단중에서 제1 및 제2냉각라인(52,54)는 모두 외부하우징내부에 설치되므로, 외부하우징의 분리만으로 유지 및 보수가 가능하다. 특히 내부하우징이 추가적으로 설치된 실시예에서는 외부하우징의 분리후 내부하우징의 분리만으로 유지 및 보수관리가 가능하다.In addition, since the first and second cooling lines 52 and 54 of the cooling means are both installed inside the outer housing, maintenance and repair are possible only by removing the outer housing. In particular, in an embodiment in which the inner housing is additionally installed, maintenance and repair management is possible only by separating the inner housing after separation of the outer housing.

도 7 및 8은 본 발명의 효과를 나타내는 도면이다.7 and 8 illustrate the effects of the present invention.

도 7은 가열수단 즉 히터에 대한 유지보수작업을 하는 과정을 나타내는 도면이다. 도 7에 나타난 바와 가티, 본 발명에서는 히터의유지 및 보수작업을 위해, 유입관(1) 및 배출관(2)로부터 포집장치(100)의 전체를 분리할 필요가 없이, 중간리드(60)를 가스이동경로 즉 유입관(1) 및 배출관(2)이 설치된 경로로부터 수직방향으로 분리하면 된다. 일단 중간리드는 분리된 상태이므로, 분리된 중간리드(60)로부터 냉각수유입 및 배출구(62,64) 및 히터연결선(32,34)의 분리등의 유지보수작업은 반도체공정라인의 외부에서 수행가능하다.7 is a view illustrating a process of performing maintenance work on a heating means, that is, a heater. As shown in FIG. 7, in the present invention, for maintaining and repairing the heater, it is not necessary to separate the entire collection apparatus 100 from the inlet pipe 1 and the outlet pipe 2, and the intermediate lead 60 may be removed. The gas movement path, that is, the inlet pipe 1 and the discharge pipe 2 may be separated in the vertical direction from the path installed. Since the intermediate leads are separated, maintenance work such as cooling water inlet and outlet 62 and 64 and heater connection lines 32 and 34 can be performed from the separated intermediate lead 60. Do.

도 8은 냉각수단 및 트랩플레이트구조체에 대한 유지보수작업 과정을 나타내 는 도면이다. 도 8에 나타난 바와 같이, 유입관(1) 및 배출관(2)로부터 포집장치(100)의 전체를 분리할 필요가 없이, 외부하우징(20)부분을 가스이동경로 즉 유입관(1) 및 배출관(2)이 설치된 경로로부터 수직방향으로 분리하면 된다. 외부하우징(20)으로부터 내부하우징(70)의 분리 및 내부하우징(70)으로부터 냉각라인 및 트랩플레이트구조체(52,54,40)의 분리는 반도체공정라인의 외부에서 수행가능하다. 8 is a view showing a maintenance operation process for the cooling means and the trap plate structure. As shown in FIG. 8, the outer housing 20 may be moved to a gas movement path, that is, an inlet pipe 1 and an outlet pipe, without having to separate the entire collection device 100 from the inlet pipe 1 and the outlet pipe 2. What is necessary is just to isolate | separate in the vertical direction from the path | route provided with (2). Separation of the inner housing 70 from the outer housing 20 and separation of the cooling line and trap plate structures 52, 54, 40 from the inner housing 70 can be performed outside of the semiconductor processing line.

특히 배출관(2)는 외부하우징에 연결되어 있고, 제1냉각라인(52), 제2냉각라인(54) 및 트렙플레이트구조체(40)는 내부하우징의 내부에 부착되어 있고, 냉각수단의 유입 및 배출구는 중간리드 및 출구리드에만 연결되어 있으므로, 냉각수단 및 트랩플레이트구조체의 분리는 외부하우징으로부터 내부하우징을 분리하는 동작만으로 더욱 쉽게 분리작업이 가능하고, 그 결과 유지보수작업이 더욱용이해진다.In particular, the discharge pipe 2 is connected to the outer housing, the first cooling line 52, the second cooling line 54 and the trap plate structure 40 is attached to the inside of the inner housing, the inflow of the cooling means and Since the outlet is connected only to the intermediate lead and the outlet lead, the separation of the cooling means and the trap plate structure can be more easily performed only by separating the inner housing from the outer housing, and as a result, maintenance work becomes easier.

이제까지 본 발명에 대하여 그 바람직한 실시예들을 중심으로 살펴보았다. 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자는 본 발명이 본 발명의 본질적인 특성에서 벗어나지 않는 범위에서 변형된 형태로 구현될 수 있음을 이해할 수 있을 것이다. 그러므로 개시된 실시예들은 한정적인 관점이 아니라 설명적인 관점에서 고려되어야 한다. 본 발명의 범위는 전술한 설명이 아니라 특허청구범위에 나타나 있으며, 그와 동등한 범위 내에 있는 모든 차이점은 본 발명에 포함된 것으로 해석되어야 할 것이다.So far I looked at the center of the preferred embodiment for the present invention. Those skilled in the art will appreciate that the present invention can be implemented in a modified form without departing from the essential features of the present invention. Therefore, the disclosed embodiments should be considered in descriptive sense only and not for purposes of limitation. The scope of the present invention is shown in the claims rather than the foregoing description, and all differences within the scope will be construed as being included in the present invention.

전술한 바와 같이 본 발명에 의하면, 가스이동경로에 대해 수직으로 분리가능한 중간리드가 입구리드 및 외부하우징사이에 추가되고, 히터는 중간리드에 부착 되므로, 히터의 유지보수작업이 보다 용이해진다.As described above, according to the present invention, since an intermediate lead that is vertically separable with respect to the gas flow path is added between the inlet lead and the outer housing, and the heater is attached to the intermediate lead, maintenance work of the heater becomes easier.

또한 본 발명에 의하면, 냉각수단 및 트랩플레이트구조체가 외부하우징의 내부에 설치되므로, 냉각수단 및 트랩플레이트의 분리작업이 용이해지고 그 결과 유지보수작업이 용이해진다.Further, according to the present invention, since the cooling means and the trap plate structure are installed inside the outer housing, the separating operation of the cooling means and the trap plate is facilitated, and as a result, the maintenance work becomes easy.

또한 본 발명에 의하면, 내부하우징이 추가되어, 냉각수단등의 분리가 더욱 용이해진다.In addition, according to the present invention, the inner housing is added, and the separation of the cooling means and the like becomes easier.

또한 본 발명에 의하면, 냉각라인의 유입 및 배출구가 중간리드 및 출구리드에 형성되기 때문에 냉각라인의 분리 및 보수작업이 더욱 용이해진다.In addition, according to the present invention, since the inlet and outlet of the cooling line are formed in the intermediate lead and the outlet lead, the separation and maintenance work of the cooling line becomes easier.

또한 본 발명에 의하면, 판상형의 히터가 반응가스와 마주보도록 위치하므로, 접촉시간 및 면적이 증가되어 열전달 효율이 증가된다.In addition, according to the present invention, since the plate-shaped heater is positioned to face the reaction gas, the contact time and area is increased to increase the heat transfer efficiency.

또한 본 발명에 의하면, 분배플레이트가 히터와 분리되어 입구리드에 위치하므로, 중간리드의 분리에 영향을 주지않으므로, 히터의 분리 및 보수작업이 용이하다. In addition, according to the present invention, since the distribution plate is separated from the heater and positioned in the inlet lead, the separation and maintenance work of the heater is easy since it does not affect the separation of the intermediate lead.

Claims (6)

반도체 공정의 부산물 포집장치에 있어서,In the by-product collecting device of the semiconductor process, 유입구가 형성된 입구리드(10);An inlet lead 10 having an inlet formed therein; 배출구가 형성된 외부하우징(20);An outer housing 20 formed with an outlet; 상기 유입구로 유입된 반응가스를 가열하는 판상형상의 가열수단으로서, 상기 반응가스가 정면으로 부딪히도록 상기 반응가스의 유입방향에 대해 수직으로 배치된 가열수단(30);A plate-shaped heating means for heating the reaction gas introduced into the inlet, the heating means being disposed perpendicularly to the inflow direction of the reaction gas so that the reaction gas collides with the front face; 상기 외부하우징내에 설치되며, 상기 가열된 반응가스를 포집하는 트랩플레이트가 배열된 트랩플레이트구조체(40);A trap plate structure (40) installed in the outer housing and arranged with a trap plate for collecting the heated reaction gas; 상기 트랩플레이트를 냉각하는 냉각수단(50); 및,Cooling means (50) for cooling the trap plate; And, 상기 입구리드(10)와 상기 외부하우징(20)의 사이에 위치하며 상기 입구리드(10)와 상기 외부하우징(20)으로부터 반응가스이동경로에 대해 수직방향으로 분리가능하도록 설치된 중간리드(60)를 포함하고, An intermediate lead 60 disposed between the inlet lead 10 and the outer housing 20 so as to be separated from the inlet lead 10 and the outer housing 20 in a vertical direction with respect to the reaction gas flow path; Including, 상기 가열수단(30)은, 상기 중간리드(60)의 내부에 부착된 것을 특징으로 하는 반응부산물 포집장치.The heating means (30), the reaction by-product collection device, characterized in that attached to the inside of the intermediate lead (60). 제 1 항에 있어서, 상기 포집장치(100)는 상기 외부하우징와 상기 트랩플레이트구조체사이에 위치하는 내부하우징(70)을 더 포함하며, The method of claim 1, wherein the collecting device 100 further comprises an inner housing 70 located between the outer housing and the trap plate structure, 상기 냉각수단(50) 및 상기 트랩플레이트구조체(40)는 상기 내부하우징(70)에 내면에 부착된 것을 특징으로 하는 반응부산물 포집장치. The cooling means (50) and the trap plate structure (40) is a reaction by-product collection device, characterized in that attached to the inner housing 70. 제 1 항에 있어서, 상기 냉각수단(50)은The method of claim 1, wherein the cooling means 50 상기 트랩플레이트구조체를 외부에서 둘러싸는 격자형상의 제1냉각라인(52); 및A grid-shaped first cooling line 52 surrounding the trap plate structure from the outside; And 상기 트랩플레이트구조체의 중앙부를 관통하는 판상형상의 제2냉각라인(54)를 포함하는 것을 특징으로 하는 반응부산물 포집장치.And a plate-shaped second cooling line (54) passing through the center portion of the trap plate structure. 제 3 항에 있어서, 상기 포집장치(100)는 상기 외부하우징 말단에 분리가능하도록 설치된 출구리드(80)를 더 포함하고,The method of claim 3, wherein the collecting device 100 further comprises an outlet lead (80) detachably installed at the outer housing end, 상기 제1냉각라인 및 상기 제2냉각라인의 유입 및 배출구는 상기 출구리드에 설치되는 것을 특징으로 하는 반응부산물 포집장치.Reaction by-product collection device, characterized in that the inlet and outlet of the first cooling line and the second cooling line is installed in the outlet lead. 삭제delete 제 1 항에 있어서, 상기 유입된 반응가스를 상기 가열수단의 표면으로 분배시키기 위한 분배플레이트(90)를 더 포함하고, The method of claim 1, further comprising a distribution plate (90) for distributing the introduced reaction gas to the surface of the heating means, 상기 분배플레이트(90)는 상기 입구리드(10)에서 상기 가열수단을 향하는 표면에 부착된 것을 특징으로 하는 반응부산물 포집장치.The distribution plate (90) is a reaction by-product collection device, characterized in that attached to the surface facing the heating means in the inlet lead (10).
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