KR100851243B1 - 반도체 제조용 오븐장치 - Google Patents
반도체 제조용 오븐장치 Download PDFInfo
- Publication number
- KR100851243B1 KR100851243B1 KR1020070010326A KR20070010326A KR100851243B1 KR 100851243 B1 KR100851243 B1 KR 100851243B1 KR 1020070010326 A KR1020070010326 A KR 1020070010326A KR 20070010326 A KR20070010326 A KR 20070010326A KR 100851243 B1 KR100851243 B1 KR 100851243B1
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- Prior art keywords
- heating chamber
- substrate
- support
- elevating member
- fixed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Die Bonding (AREA)
Abstract
Description
Claims (2)
- 전면으로 도어가 설치된 프레임 본체와,상기 프레임 본체 내부에 고정되어 열풍기에 의해 고온의 열이 내부로 공급되는 가열실과,상기 프레임 본체와 가열실의 일측을 수평상태로 잇도록 형성되어 본딩 또는 몰딩과정을 거친 기판이 기판 이동장치에 의해 가열실 내로 들어가도록 공급 통로역할을 하는 입구부와,상기 프레임 본체와 가열실의 타측을 수평상태로 잇도록 입구부와 동일한 수평선상에 형성되어 가열실에서 가열과정을 거친 기판이 기판 이동장치에 의해 가열실 외부로 빠져나가도록 배출 통로역할을 하는 출구부와,상기 프레임 본체에 고정되어 전원을 공급받아 정,역구동력을 발생시키는 모터와,상기 프레임 본체의 일측에 위치되도록 모터에 축결합되어 모터의 구동방향에 따라 정,역회전하는 구동풀리와,상기 프레임 본체의 일측에 위치되도록 구동풀리와 이격되게 출결합되어 구동풀리의 회전력을 벨트를 통해 전달받아 회전하는 종동풀리와,상기 가열실 내에 수직상태로 고정된 지지대와,상기 지지대의 후면 외측 상부에 위치되도록 종동풀리의 축과 이어진 상태로 회전가능하게 설치된 상부스프라켓과,상기 지지대의 후면의 외측 하부에 회전가능하게 설치되어 상부스프라켓의 회전력을 받아 회전할 수 있도록 상기 상부스프라켓과 연결체인에 의해 연결된 하부스프라켓과,상기 지지대 전면에 일부가 연결체인과 고정된 상태로 승강가능하게 설치되어 상기 연결체인의 회전방향에 따라 승강하는 승강부재와,상기 지지대에 형성되어 연결체인의 회전방향에 따라 승강부재가 승강할 때 상기 승강부재와 연결체인의 고정부분이 지지대에 간섭됨이 없도록 하는 피난공과,서로 마주보는 면에 복수개의 탑재홈을 층층으로 가지며 상부고정브라켓 및 하부고정브라켓으로서 상기 승강부재에 고정되어 상기 승강부재와 함께 승강되면서 입구부를 통해 가열실 내부로 인입되는 기판(리드프레임 또는 PCB기판)을 탑재하는 메거진으로 구성된 것을 특징으로 하는 반도체 제조용 오븐장치.
- 제 1 항에 있어서,상기 지지대의 후면 내측과 측면 내측에는 각각 가이드 절곡편이 고정되고, 승강부재의 상,하부에는 각 가이드 절곡편에 끼워진 상태로 가이드 롤러가 회전가능하게 설치되어 상기 승강부재의 승강시 각 가이드 롤러가 가이드 절곡편에 안내되면서 접촉에 의한 회전운동을 함에 따라 승강부재의 승강이 안정적으로 수행되도록 한 것을 특징으로 하는 반도체 제조용 오븐장치.
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KR1020070010326A KR100851243B1 (ko) | 2007-01-31 | 2007-01-31 | 반도체 제조용 오븐장치 |
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KR1020070010326A KR100851243B1 (ko) | 2007-01-31 | 2007-01-31 | 반도체 제조용 오븐장치 |
Publications (2)
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KR20080071869A KR20080071869A (ko) | 2008-08-05 |
KR100851243B1 true KR100851243B1 (ko) | 2008-08-08 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8916105B2 (en) | 2012-04-30 | 2014-12-23 | Samsung Electronics Co., Ltd. | Multi-stack cure system and method of operating the same |
KR20150097384A (ko) | 2013-03-27 | 2015-08-26 | 엔지케이 인슐레이터 엘티디 | 반도체용 복합 기판의 핸들 기판 |
US11646294B2 (en) | 2020-09-01 | 2023-05-09 | Samsung Electronics Co., Ltd. | Method of manufacturing a semiconductor package and apparatus for performing the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050121996A (ko) * | 2004-06-23 | 2005-12-28 | 노드슨상산 주식회사 | 기판 코팅 시스템의 오븐장치 |
-
2007
- 2007-01-31 KR KR1020070010326A patent/KR100851243B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050121996A (ko) * | 2004-06-23 | 2005-12-28 | 노드슨상산 주식회사 | 기판 코팅 시스템의 오븐장치 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8916105B2 (en) | 2012-04-30 | 2014-12-23 | Samsung Electronics Co., Ltd. | Multi-stack cure system and method of operating the same |
KR20150097384A (ko) | 2013-03-27 | 2015-08-26 | 엔지케이 인슐레이터 엘티디 | 반도체용 복합 기판의 핸들 기판 |
US11646294B2 (en) | 2020-09-01 | 2023-05-09 | Samsung Electronics Co., Ltd. | Method of manufacturing a semiconductor package and apparatus for performing the same |
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KR20080071869A (ko) | 2008-08-05 |
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