KR100848873B1 - Light emitting diode lamp and method for fabricating the same diode - Google Patents

Light emitting diode lamp and method for fabricating the same diode Download PDF

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Publication number
KR100848873B1
KR100848873B1 KR1020070032025A KR20070032025A KR100848873B1 KR 100848873 B1 KR100848873 B1 KR 100848873B1 KR 1020070032025 A KR1020070032025 A KR 1020070032025A KR 20070032025 A KR20070032025 A KR 20070032025A KR 100848873 B1 KR100848873 B1 KR 100848873B1
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KR
South Korea
Prior art keywords
led chip
light
clad
encapsulation
resin
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KR1020070032025A
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Korean (ko)
Inventor
조재호
Original Assignee
서울반도체 주식회사
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Priority to KR1020070032025A priority Critical patent/KR100848873B1/en
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Publication of KR100848873B1 publication Critical patent/KR100848873B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)

Abstract

An LED(light emitting diode) lamp is provided to obtain high light emission efficiency without optical loss in the lateral direction of an encapsulation member by forming a clad member on the slope of an encapsulation member wherein the clad member is made of resin with lower refractivity than that of the encapsulation part. An encapsulation member(35) is formed to cover the periphery of an LED chip(25). A clad member(40) is formed on the lateral surface of the encapsulation member to block emission of light from the LED chip. The clad member is made of a plurality of resin parts whose refractivity becomes lower as it goes from a boundary between the clad member and the encapsulation member. The lateral surface of the encapsulation member can be made of a slope. The light output surface(35a) of the encapsulation member can be made of a lens type.

Description

LED lamp and manufacturing method thereof {LIGHT EMITTING DIODE LAMP AND METHOD FOR FABRICATING THE SAME DIODE}

1 is a cross-sectional view for explaining a conventional LED lamp.

2 is a cross-sectional view for explaining an LED lamp according to an embodiment of the present invention.

3 is a cross-sectional view for explaining an LED lamp according to another embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

21a: first lead 21b: second lead

23: cup portion 25: LED chip

27: bonding wire 35: sealing member

35a: exit surface 40: clad member

The present invention relates to an LED lamp, and more particularly to an LED lamp that can obtain a high luminous efficiency by inducing light in the side direction from the LED chip in a desired direction.

LED lamps are widely used for indicators, billboards, and displays because they can realize color, and are also used for general lighting because they can realize white light. Such LED lamps are highly efficient, long-lived and environmentally friendly, and the field of using them continues to increase.

1 is a cross-sectional view illustrating a conventional LED lamp.

Referring to FIG. 1, a conventional LED lamp includes a cup portion 3 and a first lead 1a having legs extending from the cup portion 3. In addition, the second lead 1b is disposed spaced apart from the first lead 1a. The second lead 1b has a leg corresponding to the first lead 1a.

The LED chip 5 is mounted in the cup part 3 of the first lead 1a and electrically connected to the second lead 1b through a bonding wire 7. The cup part 3 of the first lead 1a has a cavity, and the LED chip 5 is mounted in the cavity. The side wall of the cavity forms an inclined reflecting surface to reflect light emitted from the LED chip 5 in a predetermined direction. In addition, the LED chip 5 is covered with a resin 11 containing phosphor in the cup part 3 of the first lead 1a.

On the other hand, the sealing member 15 seals the cup 3 of the first lid 1a, a part of the second lid 1b and the resin 11. Generally, after the resin 11 is formed, the encapsulation member 15 is disposed with the first lead 1a and the second lead 1b upside down in a mold containing a liquid or gel epoxy resin, and then the epoxy resin is cured. Is formed.

According to the prior art, the LED lamp can convert the wavelength of the light emitted from the LED chip 5 by the phosphor to implement the light of the required wavelength, for example white light.

However, in the conventional LED lamp, the light emitted from the LED chip 5 in the lateral direction is emitted to the side as it is, and light loss in the unwanted direction is generated. Accordingly, it is difficult to implement the LED lamp of high luminous efficiency by the prior art.

The technical problem to be achieved by the present invention is to provide a LED lamp and a method of manufacturing the same to minimize the light loss in the side direction in the LED chip, and to obtain a high luminous efficiency by inducing light in the desired direction in the desired direction.

In order to achieve the above technical problem, an LED lamp according to an embodiment of the present invention is an LED chip; An encapsulation member formed to cover a periphery of the LED chip; And a clad member formed to block emission of light emitted from the LED chip at the side of the encapsulation member. In this case, the clad member is formed of at least one resin having a lower refractive index than the encapsulation member.

According to an embodiment of the invention, the resin is preferably made of a transparent material. More preferably, the clad member is made of a plurality of resin parts whose refractive index is lowered sequentially from the interface with the encapsulation member. At this time, the side surface of the sealing member is formed as an inclined surface.

Furthermore, the light exit surface of the encapsulation member is made of a lens type.

In addition, the LED lamp manufacturing method according to an embodiment of the present invention comprises the steps of forming an encapsulation member made of a transparent resin around the LED chip; And forming a cladding member for blocking light on the side surface of the encapsulation member, avoiding the light exit surface.

Preferably, the forming of the clad member may include immersing the encapsulation member in a liquid resin having a lower refractive index than the encapsulation member, or sequentially dipping the encapsulation member in a plurality of liquid resins in order of decreasing refractive index.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to ensure that the spirit of the present invention can be fully conveyed to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. And, in the drawings, the width, length, thickness, etc. of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

2 is a cross-sectional view for explaining an LED lamp according to an embodiment of the present invention.

Referring to FIG. 2, the LED lamp includes a cup part 23 and a first lead 21a having legs extending from the cup part 23. In addition, the second lead 21b is disposed to be spaced apart from the first lead 21a. The second lead 21b has a leg corresponding to the first lead 21a.

The LED chip 25 is mounted in the cup part 23 of the first lead 21a and is electrically connected to the second lead 21b through a bonding wire 27. In addition, the LED chip 25 may be mounted on the cup part 23 using a conductive adhesive (not shown) to be electrically connected to the first lead 21a. Alternatively, another bonding wire (not shown) may be used. ) May be electrically connected to the first lead 21a.

The cup part 23 of the first lead 21a has a cavity, and the LED chip 25 is mounted in the cavity. The side wall of the cavity forms an inclined reflecting surface to reflect light emitted from the LED chip 25 in a predetermined direction.

Although the present invention has been described as a lead frame having the first and second leads 21a and 21b, the present invention is not limited thereto, and the present invention is also applicable to a lamp of a lead frame having more leads.

On the other hand, the LED chip 25 mounted in the cavity is covered with a resin 30 containing phosphor. The resin 30 containing the phosphor wavelength converts a part of the light emitted from the LED chip 25. The resin 30 may be formed by doping a liquid or gel-like transparent resin such as epoxy or silicone and curing the same.

The sealing member 35 covers the cup portion 23 of the first lead 21a, a part of the second lead 21b, and an upper portion of the resin 30. In addition, the light exit surface 35a of the encapsulation member 35 has a lens shape for collecting light within a predetermined direction angle. In addition, the encapsulation member 35 may be made of silicone or epoxy resin.

The side surface of the encapsulation member 35 is formed as an inclined surface, the clad member 40 is formed to surround the inclined surface. The inclined surface angle of the sealing member 35 is preferably about 20 to 75 degrees. The clad member 40 is formed of a resin of a transparent material having a lower refractive index than the encapsulation member 35. At this time, the clad member 40 is preferably added to the epoxy to enable the refractive index control.

The clad member 40 may block light emitted from the LED chip 25 at an inclined surface of the encapsulation member 35. That is, the clad member 40 totally reflects the light emitted from the LED chip 25 due to the difference in refractive index from the encapsulation member 35 and leads to the light exit surface 35a of the encapsulation member 35. By the action of the clad member 40, almost all of the light emitted from the LED chip 25 can be emitted through the light exit surface 35a without loss in the lateral direction. This is well illustrated in FIG.

Accordingly, by the clad member 40 surrounding the inclined surface of the encapsulation member 35, it is possible to manufacture an LED lamp of high luminous efficiency without loss of unwanted light (that is, light emitted to the side).

Hereinafter, a method of manufacturing an LED lamp according to an embodiment of the present invention will be described.

Referring back to FIG. 2, first, a lead frame having a first lead 21a and a second lead 21b is prepared. The first lead 21a has a cup portion 23 and a leg extending from the cup portion 23, and the second lead 21b has a leg corresponding to the leg of the first lead 21a. The cup portion 23 has a cavity.

Thereafter, the LED chip 25 is mounted in the cup 23 to be electrically connected to the first lead 21a and the second lead 21b. The LED chip 25 may be mounted on the cup part 23 through an electrically conductive adhesive (not shown) and electrically connected to the first lead 21a, and the second lead may be connected by a bonding wire 27. 21b) may be electrically connected.

The LED chip 25 may be electrically connected to the first lead 21a by another bonding wire (not shown) instead of the conductive adhesive.

Subsequently, the resin 30 containing the phosphor covering the LED chip 25 is formed. The resin 30 is formed by doping a liquid or gel-like transparent resin such as silicone or epoxy into the cavity of the cup part 23 and curing it. In this case, the resin 30 may fill the cavity to be convex upward.

Thereafter, an encapsulation member 35 covering the resin 30 containing the phosphor is formed. The encapsulation member 35 may be formed of, for example, epoxy. At this time, the side of the encapsulation member 35, in particular the side around the LED chip 25 is formed as an inclined surface.

Subsequently, the clad member 40 surrounding the inclined surface of the encapsulation member 35 is formed. In particular, the clad member 40 may be formed by dipping in a liquid resin having a lower refractive index than the encapsulation member 35 after the encapsulation member 35 is formed. At this time, the cladding member 30 may be formed on the inclined surface of the sealing member 35 except for the light exit surface 35a of the sealing member 35 and a part of the first and second leads 21a and 21b. It is formed on the bottom.

The clad member 40 blocks light at the side surface of the encapsulation member 35 and permits light to be emitted only through the light exit surface 35a.

Accordingly, by totally reflecting the light in the lateral direction from the LED chip 25 and emitting it to the light exit surface 35a, an LED lamp of high luminous efficiency can be manufactured without light loss in an undesired direction.

3 is a cross-sectional view illustrating an LED lamp according to another embodiment of the present invention.

The LED lamp according to another embodiment of the present invention shown in FIG. 3 emits all the light emitted from the LED chip 25 to the light exit surface 35a of the encapsulation member 35. Same as the example.

However, in the LED lamp according to another embodiment of the present invention, the clad member 40 is composed of a plurality of resin parts, which is different from the above-described embodiment of the present invention.

Referring to FIG. 3, the LED lamp according to another embodiment of the present invention is spaced apart from the cup part 23, the first lead 21a having a leg extended from the cup part 23, and the first lead 21a. A second wire 21b disposed, an LED chip 25 mounted in the cup part 23 of the first lead 21a, and a bonding wire to which the LED chip 25 is electrically connected to the second lead 21b. (27), a resin (30) containing phosphors covering the LED chip (25), an encapsulation member (35) having an inclined surface on its side, and an inclined surface formed on the inclined surface in turn, covering the upper portion of the resin (30). And first and second clad members 41, 42.

Here, the first and second clad members 41 and 42 are each made of a resin part having a low refractive index from an interface with the sealing member 35.

That is, the first clad member 41 of the transparent resin having a lower refractive index than the encapsulation member 35 is disposed so that the inclined surface of the encapsulation member 35 is prevented from emitting the light in the lateral direction incident from the LED chip 25 to the side. The second clad member 42 made of a transparent resin having a lower refractive index than the first clad member 41 is formed to surround the first clad member 41.

Hereinafter, the LED lamp manufacturing method according to another embodiment of the present invention is the same as the LED lamp manufacturing method of the previous embodiment, the process of forming a clad member on the inclined surface of the sealing member 35 is different.

That is, after the sealing member 35 is formed, the sealing member 35 is sequentially immersed in a plurality of liquid resins in order of decreasing refractive index, so that the first and second clad members 41 and 42 are sealed to the sealing member. It forms in the interface of 35. This is illustrated well in FIG. 3.

Accordingly, light in the lateral direction from the LED chip 25 is transferred to the boundary surface of the sealing member 35 by the first and second clad members 41 and 42 formed in turn from the boundary surface of the sealing member 35. Since the incident light can be totally reflected and emitted to the light exit surface 35a of the encapsulation member 35, an LED lamp of high luminous efficiency can be manufactured.

In the present exemplary embodiment, the cup part 23 is formed on the first lead 21a in the lead frame having the first and second leads 21a and 21b. However, in another embodiment, the cup part 23 is not formed. The LED chip 25 is mounted on the first flat lead 21a to totally reflect light incident on the boundary between the sealing member 35 and the clad member 40 from the mounted LED chip 25 to seal the sealing member 35. Can be emitted to the light exit surface 35a.

According to an embodiment of the present invention, by forming a clad member of a resin having a lower refractive index than that of the encapsulating member on the inclined surface of the encapsulating member, the light emitted from the LED chip in the lateral direction is totally reflected at the interface of the encapsulating member so that the light exit surface of the encapsulating member By inducing it has the effect of manufacturing an LED lamp that can obtain a high luminous efficiency without light loss in the side direction of the sealing member.

Claims (9)

LED chip; An encapsulation member formed to cover a periphery of the LED chip; And It includes a clad member formed to block the emission of light emitted from the LED chip on the side of the sealing member, The clad member is an LED lamp, characterized in that formed of at least one resin having a lower refractive index than the sealing member. delete The method according to claim 1, LED resin, characterized in that the transparent. LED chip; An encapsulation member formed to cover a periphery of the LED chip; And It includes a clad member formed to block the emission of light emitted from the LED chip on the side of the sealing member, The clad member is a LED lamp, characterized in that consisting of a plurality of resin parts that the refractive index is lowered in sequence from the interface with the sealing member. The method according to claim 1 or 4, The side surface of the sealing member LED lamp, characterized in that formed in the inclined surface. The method according to claim 1 or 4, LED light, characterized in that the light exit surface of the sealing member made of a lens type. Forming a sealing member made of a light transmissive resin around the LED chip; And Comprising a step of forming a cladding member for blocking light on the side of the sealing member to avoid the light exit surface, The forming of the clad member may include immersing the encapsulation member in a liquid resin having a refractive index lower than that of the encapsulation member. delete Forming a sealing member made of a light transmissive resin around the LED chip; And Comprising a step of forming a cladding member for blocking light on the side of the sealing member to avoid the light exit surface, Forming the clad member, LED lamp manufacturing method characterized in that the immersion of the encapsulation member in a plurality of liquid resin in order of decreasing refractive index.
KR1020070032025A 2007-03-30 2007-03-30 Light emitting diode lamp and method for fabricating the same diode KR100848873B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070032025A KR100848873B1 (en) 2007-03-30 2007-03-30 Light emitting diode lamp and method for fabricating the same diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070032025A KR100848873B1 (en) 2007-03-30 2007-03-30 Light emitting diode lamp and method for fabricating the same diode

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KR100848873B1 true KR100848873B1 (en) 2008-07-29

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200324610Y1 (en) * 2003-05-27 2003-08-25 광전자 주식회사 LED device having high reflectivity

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200324610Y1 (en) * 2003-05-27 2003-08-25 광전자 주식회사 LED device having high reflectivity

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