KR100847989B1 - Image pickup apparatus equipped with a microscope and size measuring apparatus - Google Patents

Abstract

A microscope imaging device and a dimensional measurement device having a plurality of imaging heads provide a system that can be covered by another imaging head when an abnormality occurs in either. A retracting area is provided for each of the plurality of imaging devices, and each imaging head has a stroke that can move to the position of the measurement point of the object to be measured, so that the remaining imaging head is covered by the remaining imaging head when the imaging head is broken or inoperable. Provided are a microscope imaging device and a dimensional measurement device.

Description

Microscope Imaging Apparatus and Dimension Measuring Apparatus {IMAGE PICKUP APPARATUS EQUIPPED WITH A MICROSCOPE AND SIZE MEASURING APPARATUS}

1 is a block diagram illustrating a dimension measuring apparatus of an embodiment of the present invention;

2 is a control block diagram for explaining a method of control of a dimension measuring apparatus according to an embodiment of the present invention;

3 is a block diagram illustrating a conventional dimensional measuring apparatus;

4 is a control block diagram for explaining a method of controlling a dimensional measuring apparatus of a conventional configuration;

5 is a view for explaining the configuration of an embodiment of a line width measurement apparatus of the present invention;

6 is a view for explaining position error and correction caused by loading error of a sample;

7 is a block diagram showing the configuration of an embodiment of a linewidth measuring apparatus according to the present invention;

8 is a flowchart showing an embodiment of an operation sequence of each axis according to the present invention;

9 is a flowchart showing an embodiment of an operation sequence of each axis according to the present invention;

10 is a flowchart showing an embodiment of an operation sequence of each axis according to the present invention;

11 is a flowchart showing an embodiment of an operation sequence of each axis according to the present invention;

12 is a flowchart showing an embodiment of an operation sequence of each axis according to the present invention;

13 is a flowchart showing an embodiment of an operation sequence of each axis according to the present invention;

14 is a flowchart showing an embodiment of an operation sequence of each axis according to the present invention;

15 is a flowchart showing an embodiment of an operation sequence of each axis according to the present invention;

16 is a flowchart showing an embodiment of an operation sequence of each axis according to the present invention;

17 is a flowchart showing an embodiment of an operation sequence of each axis according to the present invention;

18 is a flowchart showing an embodiment of an operation sequence of each axis according to the present invention;

19 is a flowchart showing an embodiment of an operation sequence of each axis according to the present invention;

20 is a flowchart illustrating one embodiment of an operation sequence of the present invention.

Explanation of symbols for main parts of the drawings

81, 91: microscope head,

82, 92: X-direction moving stage,

83, 93: Shanghai-dong stage,

84, 95: transmission lighting device,

85, 96: transmissive lighting device X-direction moving stage,

86: the object to be measured,

87: Y-direction stage,

88, 88 ′: stage drive control device,

89, 97: image processing apparatus,

90, 90 ′: system control unit,

94: Y-direction microstage stage,

98: Y-direction arrow,

99: arrow in the X direction.

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a dimension measuring apparatus for measuring a dimension by expanding a dimension of a pattern formed on a substrate with a microscope imaging apparatus, and more particularly, to an operating system of a plurality of imaging heads.

The dimension measuring device magnifies a pattern image obtained by illuminating an object, such as a pattern formed on a glass substrate, with a microscope, and image-processes the pattern image obtained by imaging the image with an imaging device such as a CCD camera. It is a device to measure dimensions automatically.

When irradiating an object to illumination, the reflection illumination method which irradiates with a coaxial fall-off from a microscope, and processes the image obtained from the reflected light, and the image obtained by irradiating from the back surface side of a sample with respect to a microscope, There is a transmission lighting method.

In measuring the size of a near transparent substrate (hereinafter referred to as a glass substrate), such as an LCD (Liquid Crystal Device) substrate, both lighting means are provided and used according to a target pattern.

Conventionally, the pattern dimension measurement of a glass substrate was generally implemented by the structure shown in FIG. 3 is a block diagram illustrating a conventional dimension measuring apparatus, and is a view of the dimension measuring apparatus viewed from above. 4 is a control block diagram for explaining the method of control of the dimension measuring apparatus of the structure of FIG.

3 and 4, the measurement target object 86, which is a glass substrate, is fixed on the Y-direction moving stage 87 and moved in the Y-direction (arrow 98) by the stage drive control device 88.

On the other hand, the microscope head 81 provided with the imaging device and the illumination device is installed on the shanghai-dong stage 83 and used for the autofocus control of focusing the microscope image by the image processing device 89.

In addition, the image processing apparatus 89 controls the microscope head 81 to perform illumination measurement of the microscope head 81, lens magnification selection, autofocus control, imaging, and dimensional measurement by image processing.

The shanghai stage 83 is installed in the X direction movement stage 82 for moving the microscope head 81, and the X direction movement stage 82 is controlled by the stage drive control device 88. By moving 83 in the X direction, the microscope head 81 is moved in the X direction (arrow 99).

Further, a transmission illumination device 84 is disposed below the microscope head 81, and is moved in the X direction in synchronism with the microscope head 81 by the stage drive control device 88.

The stage drive control device 88 is constituted by a drive circuit unit for driving the Y-direction moving stage 87 and the X-direction moving stage 82, and a stage control unit which performs movement control and position coordinate management of the stage. Positioning of each stage (Y direction movement stage 87 and X direction movement stage 82) is performed to the position coordinate indicated from 90.

At the end of the movement range of each stage, a limit sensor (not shown) for preventing mechanical collision is provided, and when the stage drive control device 88 detects the signal, it emergency stops the corresponding stage.

The microscope head 81 is subjected to the measurement object by the X-direction moving stage 82, the microscope head shangdong stage 83, the transmission lighting apparatus X-direction moving stage 85, and the measurement target Y-direction moving stage 87. It is possible to move to any position on 86, and after the microscope head 81 moves to any position, the dimensional measurement is performed by the image processing apparatus 89 (for example, Japanese Patent Laid-Open No. 2002). -228411).

By the way, glass substrates, such as an LCD substrate, are enlarged in recent years, and with this, the number of points measured with one glass substrate is increasing.

On the other hand, the time required for measurement per point has been improved, but since it cannot catch up with the expansion face of the enlargement of the substrate, it is necessary to increase the number of dimensional measuring devices in one line or more so as to digest the required measurement process. There was a need.

If the number of dimensional measuring devices is increased, there is a problem that the investment amount is greatly increased. In order to prevent such an increase in the investment amount, when the number of the dimensional measuring devices is not increased, a significant shortening of the tact time in the dimensional measuring process of the glass substrate is a big problem.

In order to solve the problem mentioned above, the method of providing a plurality of microscope heads and measuring a pattern of a different position with a plurality of microscopes at the same time has already been put into practical use.

This is done by dividing a plurality of areas to be measured, having one microscope head in charge of one divided area, and simultaneously measuring patterns at different positions with a plurality of microscopes. In this case, since a plurality of microscope heads, an operation stage of the microscope, and an image processing apparatus are required, the possibility of failure increases, and there is a problem of lowering the operation rate of the apparatus and lowering the stability of the line.

In other words, if a part of the device, for example, the microscope head or part of the operation stage of the microscope or the image processing device fails, it becomes impossible to measure the divided measurement target area to be in charge of the broken system. There was a problem that global measurements could not be made. In addition, due to some failures, device alarms occurred and the entire system of the device did not operate. In addition, there is a problem that a huge cost, such as the preparation of spare parts, maintenance costs, such as the maintenance of the failure recovery process.

On the other hand, if a failure recovery processing system is not provided, the device cannot be operated for a long time, so even if a significant shortening of the tact time is realized, a backup device is required and the investment amount by reducing the number of dimensional measuring devices is required. There was a problem that reduction could not be achieved.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems and to realize a shortening of the tact time, by employing a plurality of microscope heads, simultaneously adopting a method of measuring patterns of different positions in a plurality of microscopes, and backing up the device in case of failure. It is to reinforce a function and to solve the problem of the operation | operation rate fall of the apparatus by the failure, or the fall of stability of a line.

In order to achieve the above object, the dimensional measuring apparatus of the present invention provides a measuring method that employs a method of installing a plurality of microscope heads and simultaneously measuring patterns of different positions with a plurality of microscopes, and a device backup function in the event of failure. In order to solve the problem of lowering the operation rate of the device and lowering the stability of the line due to failure, the plurality of microscope heads and the transmission lighting device each have a stroke that can move linearly on the area under measurement on the glass substrate. Even if the at least one microscope head is in an abnormal state such as failure or non-operation, the microscope head in the failure or non-operation state is moved to the retracted position, and the other microscope head moves all the regions of the measurement target object to be measured. It was set as the structure and control which can perform a measurement process.

In addition, the sensor detects a state in which at least one microscope head is in the retracted position, and while the sensor detects the state, the microscope head is in an inactive state, and the microscope head, the associated operation axis, or the associated image processing. Even if one or all of the power supplies are disconnected, software control is performed so that measurements can be made with the remaining microscope head.

In addition, a limit sensor that detects each of the microscope heads and the transmissive lighting device in the X-direction operating axis immediately before the collision with each other is provided, and the signal is constantly monitored, and between the plurality of microscope heads and the plurality of transmission lights. The difference in the coordinates in the X direction between the devices is constantly monitored, and when the difference is within a predetermined value, the software is controlled to decelerate and stop so that the mechanical collision is prevented to reduce the failure rate.

That is, the microscope imaging apparatus which concerns on Claim 1 of the present invention is the 1st stage which can be moved in parallel with a 1st direction among the 1st direction and 2nd direction which cross | intersect each other on the planar area | region which has a some measurement point in a to-be-measured object. And N regions provided on the first stage, each of which can independently move the first stage image in parallel with the second direction, captures the object to be measured, and divides the image on the planar region. N is an integer of 2 or more), N imaging heads individually moving the measurement points, a shanghai-dong stage moving each of the imaging heads up and down independently, and abnormality detection for detecting abnormality for each of the N imaging heads. N microscopes provided with a means and a control means for individually moving measurement points in N areas (N is an integer of 2 or more) divided on the planar area. And an abnormality detecting means for detecting an abnormality with respect to each of the N microscope heads, and a control means, wherein the control means is configured to move the imaging head to the object to be measured when the abnormality detecting means detects an abnormality. It is to control to retract from the planar area | region to the retraction | recovery area | region, and to make it possible to move the whole flat area | region of the to-be-measured object by the imaging head which the detection means does not detect abnormality.

Also preferably, the microscope imaging apparatus according to claim 2 of the present invention is configured such that the N imaging heads and the N transmission illumination devices respectively corresponding to the N imaging heads and the transmission illumination devices are synchronized with positions on the planar regions of the N imaging heads. And a transmission light moving stage for moving, wherein the control means retracts the corresponding transmission lighting apparatus from the planar area of the object to be evacuated when the abnormality detecting means detects an abnormality of the imaging head.

Also preferably, the microscope imaging apparatus according to claim 3 of the present invention is configured such that the N imaging heads and the N illumination heads respectively corresponding to the N imaging heads and the transmission illumination devices are synchronized with positions on the planar regions of the N imaging heads. The apparatus further includes a transmissive illumination moving stage, wherein the abnormality detecting means detects an abnormality of the N transparent lighting devices, and the control means detects an abnormality of any one of the N transparent lighting devices. The transmissive lighting device is evacuated to the retracted area together with the corresponding imaging head, and the detection means makes it possible to move the entire planar area of the object under measurement by the imaging head corresponding to the transmissive lighting device in which no abnormality is detected. To control.

In addition, the dimension measuring apparatus of the present invention measures the plurality of measuring points of the measurement target object based on the microscope imaging device according to claim 1 and the image signals corresponding to the N imaging heads and output from the N imaging heads. N image processing units for executing the above, wherein the abnormality detecting means further detects abnormalities of the N image processing units, and the control means detects an abnormality of any one of the N image processing units by the abnormality detecting means. In this case, the image capturing head corresponding to the image processing unit that detected the abnormality is saved in the retracted area.

Further, the dimensional measuring device of the present invention is a plurality of measuring points of the measurement target object based on the microscope imaging device according to claim 2 or 3 and the image signals corresponding to the N imaging heads and output from the N imaging heads. N image processing units for performing the measurement of the abnormality detecting means further detects abnormalities of the N image processing units, and the control means detects an abnormality of any one of the N image processing units. In the case where it is detected, the image capturing head and the transmission lighting apparatus corresponding to the image processing unit that detected the abnormality are evacuated to the evacuation area.

(Example)

The microscope imaging device and the dimension measurement device of the present invention are described in particular with the dimension measurement device of a pattern formed on a glass substrate such as an LCD line width measurement device.

1 is a block diagram illustrating a dimension measuring apparatus according to an embodiment of the present invention. 2 is a control block diagram for explaining the method of control of the dimension measuring apparatus of the structure of FIG.

1 and 2, the measurement target object 86, which is a glass substrate such as an LCD substrate, is fixed on the Y-direction moving stage 87, and is moved in the Y-direction (arrow 98) by the stage drive control device 88 '. Go to).

On the other hand, the microscope head 81 provided with the imaging device and the illumination device is provided on the shanghai-dong stage 83 as the imaging head, and is used for the autofocus control for focusing the microscope image by the image processing device 89. . Moreover, the microscope head 91 provided with the imaging device and the illuminating device is provided on the vertical movement stage 93, and is used for the autofocus control which focuses a microscope image by the image processing apparatus 97. As shown in FIG.

In addition, the image processing apparatus 89 controls the microscope head 81 to perform dimensional measurement by illumination adjustment, lens magnification selection, autofocus control, imaging, and image processing of the microscope head 81. Similarly, the image processing apparatus 97 controls the microscope head 91 to perform illumination measurement of the microscope head 91, lens magnification selection, autofocus control, imaging, and dimensional measurement by image processing.

That is, the microscope heads 81 and 91 can be moved independently of each other by the stage drive control device 88 'to the position of the measurement point in the planar region of the object to be measured, and the image processing devices 89 and 97 Control the microscope heads 81 and 91 to perform position correction individually, and also independently measure dimensions by illumination adjustment, lens magnification selection, autofocus control, imaging and image processing. .

The shanghai-dong stage 83 is installed in the X-direction moving stage 82 for moving the microscope head 81, and the X-direction moving stage 82 is located in the shandong-dong stage under the control of the stage drive control device 88 '. By moving the 83 in the X direction, the microscope head 81 is moved in the X direction (arrow 99). Similarly, the shangdong stage 93 is installed in the X direction movement stage 92 for moving the microscope head 91, and the X direction movement stage 92 is vertically moved under the control of the stage drive control device 88 '. By moving the moving stage 93 in the X direction, the microscope head 91 is moved in the X direction.

Between the shanghai stage 93 and the X-direction movement stage 92, the Y-direction micromovement stage 94 which moves (micromoves) the microscope head 91 slightly in the Y direction is provided, and the object to be measured ( The measurement pattern position error caused by the eccentric error of the lens between the microscope heads and the rotational direction of the measurement target object 86 with respect to the stage when 86) is moved in the Y direction by the Y-direction moving stage 87 is corrected. (Described later).

The X-direction moving stages 82 and 92 have strokes in which each of the microscope heads 81 and 91 can move the entire planar region of the object to be measured, and at least one microscope head, a transmission illumination device, or an image processing device includes: In the case of an abnormal state such as a failure or non-operation, when the abnormality detecting means (not shown) detects the abnormal state, the stage drive control device 88 'is configured to transmit a microscope head with a failure or non-operation state and corresponding transmission light. The apparatus, the transmission illumination device in abnormal state, the microscope head corresponding thereto, and the microscope head and transmission illumination device corresponding to the image processing device in abnormal state are moved to the retracted position, and the remaining microscope head and transmission illumination device are placed on the plane of the object to be measured. It is possible to move the whole area and include the measurement point position that the imaging head was in charge of, such as failure or non-operation. It can be moved to the measurement point position.

For this purpose, even in the transmission lighting apparatuses 84 and 95, each of them has a stroke which can move on the area under measurement, and even if at least one transmission lighting apparatus is broken or inoperative, the microscope head and the transmission lighting apparatus are It can be moved to the retracted position, and the other microscope head and the transmission lighting device can be moved in a straight line over the entire area under measurement.

Further, a retreat position detection sensor (not shown) is disposed at the retreat position of each of the microscope heads 81 and 91, and while the sensor detects a state where at least one microscope head is at the retreat position, Even if the microscope head is left in an inactive state and any one or all power sources of the microscope head, its associated motion axis, or associated image processing apparatuses 89 and 97 are shut off, the remaining microscope head, its associated motion axis, and associated Software control is performed so that the image processing apparatus can make a measurement.

In addition, the control is executed by the system control device 90 ', and the system control device 90' is provided with abnormality detection means for detecting a failure, whether it is in an operating state or in an inactive state, but has a separate detection means. You may be.

The stage drive control device 88 'is composed of a drive circuit for driving the stage and a stage control device that performs movement control and position coordinate management of the stage, and each of the position drive control devices 88' is positioned at a position coordinate indicated by the system control device 90 '. Position the stage.

Further, the stage drive control device 88 'constantly monitors the difference in the coordinates in the X direction between the plurality of microscope heads and the plurality of transmission lighting devices, and performs software control to decelerate and stop when the difference is within a predetermined value. To prevent collisions.

A limit sensor for preventing mechanical collision is provided at the stage of the movement range of each stage, and when the stage drive control device 88 'detects the signal, the stage is emergency stopped.

In addition, the X direction moving stages 82 and 92 are provided with a limit sensor (not shown) which detects immediately before each of them collide mechanically, and the stage drive control device 88 'constantly monitors the signal and The difference between the coordinates in the X direction between the microscope heads is constantly monitored, and the mechanical control is prevented by software control to decelerate and stop when the difference is within a predetermined value.

Similarly, the transmissive lighting device X-direction moving stages 85 and 96 are also provided with a limit sensor that detects immediately before each of the mechanical collisions, and the stage drive control device 88 'constantly monitors the signal and simultaneously The difference in the coordinates in the X-direction between the transmission lighting apparatuses is constantly monitored, and when the difference is within a predetermined value, the software is controlled to stop decelerating to prevent mechanical and collision.

Further, the microscope head X-direction moving stages 82 and 92, the microscope head shangdong stages 83 and 93, the transmission lighting apparatus X-direction moving stages 85 and 96, and the Y-direction moving stage 87, respectively, Of the microscope heads 81 and 91 and the transmission illumination devices 84 and 95 can be moved to any position on the object 86 to be measured, and each microscope head at the timing at which the object to be measured moves in the Y direction. Moves simultaneously in the X direction, and the microscope head 91 moves slightly in the Y direction. At the same time as the completion of the movement, the measurement software executes the measurement processing by the respective microscope heads at substantially the same time independently of each other on the measurement target object 86.

Moreover, in the said embodiment, although it was the structure which moves an imaging head by moving a Y direction movement stage, the structure which moves a glass substrate to a Y direction may be sufficient, and the structure which moves both a glass substrate and an imaging head may be sufficient.

Further, in the above embodiment, the microscope head 81, the X-direction moving stage 82, the shanghai-dong stage 83, the transmission lighting device 84, the transmission lighting device X-direction moving stage 85, and the image processing device 89 ), The microscope head 91, the X-direction moving stage 92, the Shanghai-dong stage 93, the transmission lighting device 95, and the transmission lighting device X-direction moving stage (96), the embodiment of the present invention has been described in the case of the combination which controls the image processing apparatus 97 and the Y-direction micromovement stage 94 as a set of measurement processing units.

However, as in the above embodiment, not only two combinations but also three or more combinations may be employed, and a configuration in which there are a plurality of Y-direction moving stages may be used.

In addition, at least one of the microscope head 81, the X-direction moving stage 82, or the shangdong stage 83 is in a faulty or non-operational state, and the transmission illumination device 95 or the transmission illumination device is moved in the X direction. When at least one of the stages 96 is in a faulty or non-operating state, the remaining combinations, for example, the microscope head 91, the X-direction moving stage 92 and the shangdong stage 93, and the transmission illumination device ( 84) and the penetrating illumination device X-direction moving stage 85 may be executed.

The same can be done in the case of the image processing apparatuses 89 and 97, and the combination of the microscope head, the X-direction moving stage, and the shandong movement stage, the combination of the transmission lighting apparatus and the transmission lighting apparatus X-direction movement stage, and the image Measurement processing may be performed between the combinations of the processing apparatuses.

In addition, although the above embodiment has been described in terms of the measurement in the transmission illumination method, the same can be said of the measurement in the reflection illumination method and the combination of the transmission illumination method, and in the case of only the reflection illumination method, the transmission illumination device and the transmission illumination device X As long as the direction movement stage is unnecessary, the configuration and processing are simplified.

In addition, in recent years, the size of flat panel displays (FPDs) such as LCD substrates has been increased, and not only the production method of taking a plurality of products on one glass substrate as in the above-described embodiment, but also one FPD product on one glass substrate. The case where only one pattern is produced is also considered.

When only one product pattern can be made in one such board | substrate, since the same pattern of a separate product is not measured or inspected by several imaging heads, it is not necessary to operate multiple heads simultaneously.

Therefore, if one set or multiple sets of imaging heads, image processing apparatuses, and transmission lighting apparatuses are used depending on the product, the present invention can be applied to products of more uses, thereby increasing the scope of use. In this case, it is also possible to remove and maintain unused equipment.

As in the above-described embodiment, it is possible to measure simultaneously using a plurality of microscopes on one device, and thus significantly reduce the tact time. In addition, a plurality of microscope operating axes and transmission illumination operating axes are provided with an operating stroke having a margin of retraction area and appropriate software control to reinforce the device backup function at the time of failure and to reduce the operation rate of the device due to the failure. The problem of the stability fall of one line can be prevented.

The Y-direction micromovement stage 94 which slightly moves (fine-moves) the microscope head 91 in FIG. 1 and FIG. 2 is further demonstrated below.

An embodiment of the present invention will be described with reference to FIGS. 5 and 6. 5 is a view for explaining the configuration of a two-head LCD (Liquid Crystal Display) line width measurement apparatus using the present invention. Fig. 5 (a) is a plan view of the device from above, Fig. 5 (b) is a view of the plan view of Fig. 5 (a) from the direction of arrow A, and Fig. 5 (c) is a plane view of the device of Fig. 5 (a). It is the figure seen from the B direction.

5, the structure and the operation direction of the moving shaft of the 2-head type LCD linewidth measuring apparatus are demonstrated. Reference numeral 101 denotes a mounting table, 103 denotes a sample to be measured, and 102 denotes a sample table on which the object to be measured 103 is mounted. The sample stand 102 is fixed on the mounting table 101, and the object to be measured 103 is carried in or taken out by a conveyance unit (not shown) on the sample table 102. The object to be measured 103 carried in from the conveying unit is fixed to the sample stage 102 by vacuum suction or the like. For example, the object to be measured 103 is adsorbed by an adsorption mechanism (not shown) of the two-head type LCD line width device and fixed to the sample stage 102. The object to be measured 103 is, for example, a plate-shaped substrate such as a substrate, and measures or inspects the line width of the film pattern formed or coated on the plate-shaped substrate. The plate-shaped substrate is, for example, a thin film transistor (TFT) of a liquid crystal display (LCD) substrate or a mask of a semiconductor.

The two-head LCD linewidth measuring device is an LCD linewidth measuring device having two imaging head portions, and the N-head type LCD linewidth measuring device is an LCD linewidth measuring device having N imaging head portions (N is a natural number of two or more).

1 is a beam along the Y axis, 2 is a guide along the X1 axis, and 3 is a guide along the X2 axis. The beam 1 of the Y axis moves parallel to the X axis along the guide 2 on the X1 axis and the guide 3 on the X2 axis (in Fig. 5 (a), the left and right directions of the paper surface). The rail portion of the beam 1 of the Y axis (hereinafter referred to as the rail of the Y axis) is configured to be perpendicular to the X axis. In addition, the height of the guide 2 on the X1 axis and the guide 3 on the X2 axis may be lowered, and the beam 1 on the Y axis may have a gate gantry structure.

4 is a guide on the Y1-axis, and 5 is a guide on the Y2-axis. The guide 4 of the Y1-axis and the guide 5 of the Y2-axis each move independently along the rail of the Y-axis. At this time, the guide on the Y1-axis and the guide on the Y2-axis move in the direction orthogonal to the X-axis (in the Y-axis (in Fig. 5 (a), the paper vertical direction).

6 is a guide on the Z1 axis, 7 is a guide on the Z2 axis. The guide 6 of the Z1-axis is mounted on the guide 4 of the Y1-axis, and the guide 7 of the Z2-axis is mounted to the guide 5 of the Y2-axis. The guide 6 of the Z1-axis moves along the Z-axis (in Fig. 5 (b), up and down direction of the paper) along the guide 4 of the Y1-axis, and likewise, the guide 7 of the Z2-axis is a guide of the Y2-axis ( Move in the Z-axis direction according to 5).

8 is a guide on the ΔX1 axis, 9 is a guide on the ΔX2 axis, and 10 and 11 are imaging head portions. The guide 8 of the X1 axis is mounted on the guide 6 of the Z1 axis, and the guide of the X2 axis 9 is mounted to the guide 7 of the Z2 axis.

The imaging head portion 10 is mounted on the guide 8 on the ΔX1-axis, and the imaging head portion 11 is mounted on the guide 9 on the ΔX2-axis.

The imaging head portion 10 moves in the X-axis direction along the guide 8 on the ΔX1 axis, and similarly, the imaging head portion 11 moves in the X-axis direction along the guide 9 on the ΔX2 axis.

In addition, in the embodiment of Fig. 5, a transmission illumination shaft mechanism which is operated in pairs with the imaging head portions 10 and 11, respectively, is equipped. That is, 12 denotes a Py1 axis of the imaging head unit 10, 13 denotes a Py2 axis of the imaging head unit 11, 14 denotes a ΔPx1 axis of the imaging head unit 10, and 15 denotes a position of the imaging head unit 11. ΔPx2 axis.

The Py1 axis 12 and the Py2 axis 13 are mounted on the transmission light guide 104 suspended from the beam 1 of the Y axis, and operate in the Z axis direction along the transmission light guide 104.

In addition, the DELTA Px1 axis 14 is provided on the Py1 axis 12, and the DELTA Px2 axis 15 is provided on the Py2 axis 13. The transmission light 16 is mounted on the ΔPx1 axis 14, and the transmission light 17 is mounted on the ΔPx2 axis 15.

The transmission light 16 moves in the X-axis direction along the ΔPx1 axis 14, and similarly, the transmission light 17 moves in the X-axis direction along the ΔPx2 axis 15.

The movement along the ΔPx1 axis 14 of the transmission light 16 and the movement along the ΔX1 axis 8 of the imaging head unit 10 are linked, for example, the illumination of the illumination light of the transmission light 16. The emission center axis and the incident optical axis of the imaging head portion 10 are the same optical axis 111.

Similarly, the movement along the ΔPx2 axis 15 of the transmission light 17 and the movement along the ΔX2 axis 9 of the imaging head portion 11 are linked, for example, the transmission of the transmission light 17 The emission center axis of the illumination light and the incident optical axis of the imaging head portion 11 are the same optical axis 112.

In addition, in FIG. 5B, a part of the beam 1, the Py1 axis 12, the Py2 axis 13, the ΔPx1 axis 14, the ΔPx2 axis 15, which are attached to the beam 1, and The transmission illuminations 16 and 17 and the sample stage 102 are made into the figure which is easy to see by mixing the location which cannot be seen from the location seen from the arrow B direction, and is not an exact side view. Similarly, FIG. 5C is a schematic cross-sectional view.

Fig. 6 is a view for explaining position error and correction caused by mounting error of a sample required by the present invention. The horizontal axis in FIG. 6 shows the moving direction of the X axis on the sample stand 102 of the line width measuring device, and the vertical axis shows the moving direction of the Y axis on the sample stand 102 of the line width measuring device.

The dashed border 24 is an ideal mounting position of the measurement target, and the coordinate axis of the measurement target 103 at this mounting position is parallel to the XY axis of the stage mechanism of the linewidth measurement device and is also referred to as a reference (object to be measured). This is the mounting position where the origin of and the origin of the line width measuring device coincide. When the object to be measured is, for example, an LCD substrate, when the plurality of inspection target products having the same shape are broken lines 24, x pieces parallel to the X-axis and y parallel to the Y-axis at the same pitch X x y pieces are arranged in total.

The solid line border 25 is a sample position actually mounted, and a position error (mismatch of a reference point) in the XY axis direction and an error in the rotation direction occur. These errors are a cause of measurement error requiring position correction. For example, among the two products arranged in the same column, the measurement coordinate P1 is included in the imaging field of the imaging head unit 10, but the measurement coordinates are arranged in the same column in the imaging field of the imaging head unit 11. The case where P2 is not included is a measurement error that requires position correction. Hereinafter, it demonstrates in detail.

Fig. 6 is a diagram showing an error (especially an error in the direction of rotation) caused by mounting of an object to be measured, where 24 is a broken line border indicating an ideal mounting position of the object under test, and 25 is a mounting position of the actual measuring object. The solid line border 18 is the position error amount θ in the rotation direction. In the actual mounting position of the object under measurement, the positional error of the ideal object under measurement and the rotational direction are generated. 18 is the position error amount θ in the rotation direction, 19 is the position of the measurement coordinate P1 (measurement point) of the imaging head portion 10, which is a reference for position control among the multiple imaging head portions, and 20 is actually the imaging head portion 11. The position of measurement coordinate P2 to be measured, 21 is the position of the measurement coordinate of the imaging head portion 11 at the ideal mounting position of the measurement target object, and 22 is an error in the X-axis direction caused by an error in the rotation direction to be corrected. Vehicles ΔX, 23 are error amounts ΔY, 24 in the Y-axis direction caused by errors in the rotational direction to be corrected, and the distances Y _{P1 -P2} between the measurement coordinates P1 and _P2 . In addition, the rectangular frame surrounding each point P1, P2, P2 'has shown typically the visual field (observation field) range at the time of image picking centering around each measuring point here. In addition, although FIG. 6 shows one measuring point (actually 1 pair since there are two imaging head parts), there exist a some measuring point normally.

In addition, in order to detect the error of a rotation direction, pattern recognition is performed by the matching process of the image which was imaged by the imaging head part 10 previously registered pattern using the alignment pattern 28 of FIG. The positional coordinates of the alignment pattern 28 are obtained, the image capturing head portion 10 is then moved, the positional coordinates of the alignment pattern 29 are obtained by similar pattern recognition, and the difference from the ideal sample placement position. Find and find.

The error amount ΔX (22) and error amount ΔY (23) can be obtained by the following equations (1) and (2).

ΔX = Y _P1-P2 × sinθ

ΔY = Y _P1-P2 × (1-cosθ)

In FIG. 6, when the mounting position of the object to be measured 103 is shifted as in the solid line border 25, the position 19 on the sample stage 102 of the measurement coordinate P1 of the imaging head unit 10 and the imaging image. The position 21 on the sample stage 102 of the measurement coordinate P2 of the head portion 11 is an ideal mounting position of the object to be measured, and the coordinates on the X-axis should coincide with each other, but are shifted by ΔX (22), and Y On the axis, they are shifted by ΔY (23).

Based on the position 19 of the measurement coordinate P1 of the imaging head unit 10, in order to move the imaging head unit 11 to the correct measurement position 20, it is moved by ΔX (22) and ΔY (23). You must do it. Here, in order to perform correction movement by? X22, a driving shaft for separately moving the imaging head portion 10 and the imaging head portion 11 is required. That is, the ΔX1 axis 8 and the ΔX2 axis 9 of the present invention are required.

For example, only the imaging head portion 11 is slightly moved in the X-axis direction by the ΔX2 axis 9, and only the imaging head portion 10 is slightly moved in the X-axis direction by the ΔX1 axis 8. By making at least one of the imaging head portion 10 or the imaging head portion 11 move individually, the measurement points of the imaging head portion 10 and the imaging head portion 11 coincide on the X axis. Can be corrected.

Moreover, the Y-axis direction is also correct | amended more accurately by moving at least one of the imaging head part 10 or the imaging head part 11 separately by the guide 4 of a Y1-axis, or the guide 5 of a Y2-axis. can do.

In addition, although the number of imaging head parts is two in the said Example, many may be sufficient as several.

In addition, in the above embodiment, the measurement or inspection by transmission illumination is used. However, in the case of the line width measuring device only for measurement or inspection by reflection illumination, transmission illumination is not necessary, and of course, interlocking movement with the imaging head portion is also unnecessary.

In FIG. 5, only the configuration related to the invention has been described in the line width measuring apparatus. For example, a unit for acquiring an image of a predetermined portion of an object to be measured from the image capturing head unit and outputting the image after the image processing unit is measured or inspected. need. In addition, a light source must be attached to transmission light, and all the structures which are required in a line width measuring apparatus, such as a mechanism part for moving each guide | shaft or an axis, for position correction etc. are not described. For example, the structure as demonstrated in FIG. 7 below is required at least.

7 is a block diagram showing the general configuration of a line width measuring apparatus.

In Fig. 7, reference numeral 508 denotes an imaging head portion comprising an observation color camera unit, a measuring camera unit, an electric revolver unit, a laser autofocus unit, and the like, 509 denotes a sample stage, 510 denotes a position correction unit, and 512 denotes a vibration damper Note: 513 is a lighting power source, 514 is a color monitor, 515 is a measurement monitor, 516 is a measurement display, 517 is a video printer, 518 is an image processing PC, 519 is a control PC, and 520 is a stage. The control unit 521 is a power source for the transmission light, 522 is a transmission light head. In addition, 501 denotes an imaging head 508, a sample stage 509, a position correction unit 510, a vibration damper 512, an illumination power source 513, a stage control unit 520, a transmission power source 521, transmission It is a measurement part comprised by the illumination head part 522.

In FIG. 7, the image taken by the color camera for observation of the imaging head unit 508 is displayed on the color monitor 514, and the image taken by the measurement camera is displayed on the measurement monitor 515. FIG.

The measurement device starts measurement by the command of an external host (HOST) or control PC 519. The measurement is started by automatic or manual operation based on a preset recipe, the measurement result is displayed on the measurement result display monitor 516, and the measurement result is, for example, HD (hard disk) in the control PC 519. It is written in a predetermined area of a magnetic disk such as the above. Moreover, these measurement result data are distributed to an external host by the request of an external host.

In addition, the vibration damping table 512 prevents external vibration from being transmitted to the sample table 509.

The image processing PC 518 analyzes the image input from the imaging head unit 508, recognizes a predetermined pattern set in the object to be measured 103 in advance, acquires coordinates, and obtains a correction amount.

The obtained information of the correction amount is output to the control PC 519, and the control PC 519 gives the control instruction signal to the stage controller 520 based on the information of the correction amount. The stage controller 520 applies a control signal corresponding to the input control instruction signal to the position correction unit 510 and performs position correction.

In this way, while performing position correction, measurement or inspection is performed.

In addition, the dimension (unit: mm) of an LCD board | substrate is horizontal (X) x vertical (Y), for example, 1850x1500 or 2250x1950, etc., and thickness is about 0.5-0.7. For example, when the position error amount when the object to be measured is brought into the sample object by a transport robot or the like is estimated to be about ± 5 to 10 mm, the maximum of the correction amount is set to ± 10 mm. In other words, the stroke of the guide 8 on the ΔX1 axis and the guide 9 on the ΔX2 axis may be set to ± 10 mm.

In addition, correction of the error of the Y-axis direction may be performed by the guide 4 of the Y1-axis, or the guide 5 of the Y2-axis as mentioned above.

Further, the control PC 519 may correct a manipulator that can be finely adjusted in the X-axis direction, the Y-direction, and the rotation (θ) direction.

As described above, according to the present invention, by using a conventional clamping mechanism (a pressing mechanism by an air cylinder or the like), the size of the object under measurement is increased by a method of forcibly moving the mounting position of the object under measurement. Even when the sample cannot be moved by the influence of static electricity or the like, and the method of measuring and correcting the error of the mounting position by image recognition, the efficiency due to the position error between the heads caused by the multi-imaging heading is used. Problem that measurement cannot be performed well (originally, when two points that make the coordinates in the X-axis direction equal are measured by, for example, two imaging heads, simultaneous images by one positioning operation in the X-axis direction It is efficient to carry out the process by carrying out the process, and it is the purpose of multi-imaging heading, but the rotational component is included in the mounting position error of the sample. Position error occurs by ΔX, and in a large sample, in particular, the detection process cannot be carried out substantially in one time of the X-direction positioning operation). This is solved by controlling the mechanism as the position correction for ΔX.

8 to 19 are flowcharts showing one embodiment of an operation sequence of each axis in the present invention.

The flowchart of the positioning operation of one embodiment of the present invention is roughly divided into four processing sequences (sequences). That is, a gaze sequence part in charge of the entire process, a first image analysis sequence part for analyzing an image picked up by the imaging head part 10 by an instruction from the gaze sequence part, and an imaging head part by instructions from the gaze sequence part. The measurement section 501 (in the configuration shown in FIG. 7) of the line width measuring apparatus according to the instruction from the second image analysis sequence section and the focus sequence section for analyzing the image picked up by (11). , Sample table 509, position compensator 510, vibration isolation table 512, lighting power source 513, stage control unit 520, transmission power source 521, and transmission head unit 522) It consists of a stage sequence unit for controlling.

7, the main sequence unit is processed in the control PC 519, and the first image analysis sequence unit and the second image analysis sequence unit receive instructions from the control PC 519 to the image processing PC 518. Is processed. In addition, the operation of the measuring unit 501 is processed by the stage control unit 520 in response to an instruction from the control PC 519.

8, 11, and 16 are flowcharts showing the central processing operation of the sequence of the positioning operation of the present invention, which shows the main processing operation sequence in the control PC 519. 9 to 10, 12 to 15, and 17 to 19 show the image processing and line width measuring apparatus for each head based on the instructions from the main processing operation sequences of Figs. 8, 11 and 16. Figs. The flowchart which shows the process operation sequence which performs control of each stage part of and returns a result information to a main process operation sequence is shown.

For example, FIG. 9, FIG. 12, and FIG. 17 show flowcharts of the image 1 processing sequence for processing the image (Image 1) picked up by the imaging head section 10. FIG. 9, FIG. The flowchart of the image 2 processing operation sequence which processes the image Image 2 which the imaging head part 11 image | photographed is shown. 10, 14, 15, and 19 show measurement unit processing sequences for processing commands received from the main processing sequence for components that are necessary for the measurement unit 501.

The interlock signal in Fig. 8 is an emergency stop command and is generated by detecting that the door is opened, for example, when an operator or the like enters a room where the apparatus is installed. In addition, when the operator pressed the stop button of the device. When the interlock signal is input, the interlock presence / absence determination process is executed, and when there is an input of the interlock signal, the operation of the apparatus is stopped as an error process. Although this interlock signal input and interlock presence determination process are shown as this sequence of FIG. 8 as needed in a figure, a process operation | movement is performed when an interlock signal is input in any sequence of a main processing operation sequence.

In addition, an image captured by the imaging head unit is stored in the image PC HDD of FIG. 9, and a desired image is received by designating an address or the like from the main processing sequence, and the processing operation sequence of the image 1 or 2. Used in In addition, the processing result is stored.

In addition, the correction table of FIG. 10 stores correction data for correcting the mechanical error of the apparatus, such as a straightness, and is used for correction of position coordinates and the like.

In addition, although the laser autofocus process (laser AF) and the measurement autofocus process (measurement AF) in the sequence of FIGS. 12-15 and 17-19 are not shown in FIG. 7, a well-known technique is used (for example, , Japanese Patent Application Laid-Open No. 2005-98970, and Japanese Patent Publication No. Hei 7-17013).

Next, with reference to FIG. 20 and FIG. 6, one Example of the process of the position correction of the imaging head part with respect to the error in the rotation direction at the time of mounting the sample (object to be measured) of this invention is demonstrated. 20 is a flowchart illustrating one embodiment of an operation sequence of the present invention.

As shown in FIG. 6, as can be seen from the ideal mounting position (dashed line border 24), the measurement target object (solid line border 25) mounted on the sample stage 102 is displaced in the rotation direction. The operation of processing the position correction in the case will be described.

First, in Fig. 6, the error amount DELTA X in the X direction and the error amount DELTA Y in the Y direction caused by the error in the rotational direction to be corrected are calculated by the equations (1) and (2) described above.

Position correction is performed by the sequence shown in FIG. 20 using the calculated error amount ΔX (22) and error amount ΔY (23).

In Fig. 20, the measurement position coordinate data 301 is output from the main PC HDD of Fig. 8, and the alignment correction amount data 302 is output from the imaging head unit 508. The input image is analyzed and the predetermined pattern set in the object to be measured 103 is recognized, and the position coordinate thereof is obtained and obtained.

From these data, the amount of movement on the X axis (X1 + X _{AL_offset} ), the amount of movement on the Y1 axis (Y1 + Y _{AL_offset} ), the amount of movement on the Y2 axis (Y2 + Y _{AL_offset} + Y _{AL_angle} ), and the amount of movement on the _ΔX2 axis (X2-X1 + Y _{AL_offset} + Y _{AL_angle} is sent from the control PC 519 to the stage control unit 520, and each axis moves (stage movement 303).

As a result, the respective measuring points P1 and P2 are projected in the viewing ranges of the imaging heads 10 and 11.

Next, a pattern matching position detection process of a part of the image 1 acquired by the image capturing head unit 10 and a pattern registered in advance is executed by the image processing PC 518 (detection process 304), and the measurement object is displayed in the field of view. The correction amount for moving to the center is calculated, and the amount of movement on the Y1 axis and the amount on the ΔX1 axis are sent to the stage control unit 520 via the control PC 519 (process 305).

Similarly, in the image processing PC 518, a pattern matching position detection process of a part of the image 2 acquired by the imaging head unit 11 and a pattern registered in advance is executed (detection process 306), and the measurement target is centered in the viewing range. The correction amount for moving is calculated, and the amount of movement on the Y2 axis and the amount of movement on the ΔX2 axis are sent to the stage controller 520 via the control PC 519 (process 307).

The stage control unit 520 receives the instruction of the above movement and moves the Y1 axis, the ΔX1 axis, the Y2 axis, and the ΔX2 axis while the X axis is fixed, and then each imaging head unit 10, 11 An image is acquired by performing line width measurement processing (309, 310).

When the line width measurement processing within the viewing range centering on the current measurement points P1 and P2 is finished, the measurement position coordinate data 301 of the next measurement point is output from the main PC HDD of FIG. 8, and the next measurement point Go to. That is, the operation of FIG. 20 is repeated.

As described above, in the case where the plurality of imaging heads are moved to the measurement point, the number and procedure of axes required for the movement of the plurality of imaging heads are minimized in order to correct the rotation when the object to be measured is mounted on the sample stage. As a result, the tact time can be shortened.

Incidentally, in the above embodiment, the positional correction of the ΔX2 axis is performed for each movement of the measuring point. However, if the manufacturing position precision of each of a plurality of acquired products on one object to be measured is good, once the positional correction of the ΔX2 axis is performed, It is not necessary to perform the position correction on the ΔX2 axis for each movement of the measuring point.

According to the present invention, it is possible to measure simultaneously using a plurality of microscopes with one device, and it is possible to significantly shorten the tact time.

In addition, a plurality of microscope operating axes and illumination operating axes are provided with an operating stroke having a margin of retraction area, and appropriate software control is performed to reinforce the device backup function at the time of failure to reduce the operation rate of the device due to the failure. The problem of the stability fall of one line can be prevented, and reliability increased.

In the case where a plurality of identical patterns are present on the glass substrate, the measurement is performed using a plurality of heads. When there is only one pattern, only one head is driven to perform measurement. It is also possible to have a function for switching. For this reason, since various measurements can be performed according to the kind of glass substrate, the kind of product, or the kind of measurement, various usages can be performed by one apparatus.

Claims (5)

In the microscope imaging device, First stages 82 and 92 movable in parallel with the first direction among the first and second directions crossing each other on a planar region having a plurality of measurement points on the object to be measured 86; It is provided on the first stage (82, 92), each of the first stage (82, 92) can be moved independently of each other in parallel with the second direction, the image to be measured 86 N imaging heads 81 and 91 for individually moving measurement points in N areas (N is an integer of 2 or more) divided on the planar area; Shanghai-dong stages 83 and 93 for moving the imaging heads 81 and 91 independently up and down, Abnormality detecting means for detecting abnormality for each of the N imaging heads 81 and 91; With control means, When the abnormality detecting means detects the abnormality, the control means evacuates the imaging heads 81 and 91 from the planar area of the measurement target object 86 to the evacuation area, and the detecting means does not detect the abnormality. To control the entire planar region of the object to be measured 86 by the non-imaging heads 81 and 91. Microscope imaging device. The method of claim 1, The N imaging heads 81 and 91 and the N transmission lighting devices 84 and 95 respectively corresponding to the N imaging heads 81 and 91, Further comprising transmission lighting moving stages 85, 96 for moving the transmission lighting devices 84, 95 in synchronization with positions on the planar regions of the N imaging heads 81, 91, When the abnormality detecting means detects an abnormality of the imaging heads 81 and 91, the control means retracts the corresponding transmission lighting devices 84 and 95 from the planar area of the object 86 to be evacuated. Microscope imaging device. The method of claim 1, The N imaging heads 81 and 91 and the N transmission lighting devices 84 and 95 respectively corresponding to the N imaging heads 81 and 91, Further comprising transmission lighting moving stages 85 and 96 for moving the transmission lighting devices 84 and 95 in synchronization with positions on the planar regions of the N imaging heads 81 and 91, The abnormality detecting means detects abnormalities of the N transmission lighting devices 84 and 95, When the control means detects an abnormality of any one of the N transmission lighting devices 84 and 95, the control means moves the transmission lighting devices 84 and 95 together with the corresponding imaging heads 81 and 91 to the evacuation area. It is controlled so that the entire detection area of the object to be measured 86 can be moved by the imaging heads 81 and 91 corresponding to the transmissive lighting devices 84 and 95 which are not detected by the detection means. doing Microscope imaging device. The microscope imaging device of claim 1, N pieces corresponding to the N imaging heads 81 and 91 and performing measurement of a plurality of measurement points of the object to be measured 86 based on video signals output from the N imaging heads 81 and 91. An image processing unit, The abnormality detecting means further detects abnormalities of the N image processing units, The control means retracts the imaging heads 81 and 91 corresponding to the image processing unit that has detected the abnormality to the evacuation area when the abnormality detecting means detects any one of the N image processing units. Dimensioning device. The microscope imaging device of claim 2, N pieces corresponding to the N imaging heads 81 and 91 and performing measurement of a plurality of measurement points of the object to be measured 86 based on video signals output from the N imaging heads 81 and 91. An image processing unit, The abnormality detecting means further detects abnormalities of the N image processing units, The control means includes the imaging heads 81 and 91 and the transmission illumination devices 84 and 95 corresponding to the image processing unit that detected the abnormality when the abnormality detecting means detects any one of the N image processing units. ) To the retraction area Dimensioning device.

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