KR100845578B1 - Water tank for scrubber system - Google Patents

Abstract

A water tank for a scrubber system is provided to collect the water-soluble gas more effectively by dissolving water-soluble gas contained in combustion gas into water, and prevent movements of alien particles contained in the combustion gas due to shaking of water, thereby prevent the alien particles from ascending again and remove the alien particles through a drainpipe easily. In a water tank(300) for a scrubber system comprising a plasma torch, a combustion tank(200), the water tank, and a wet tower(400) to treat waste gas generated in the semiconductor process, the water tank comprises: a water tank housing which is formed on a bottom part of the combustion tank, and which has a combustion gas inlet and a combustion gas outlet formed on one side thereof; and a gas guiding pipe which is formed in a vertically opened cylindrical shape and connected to a top part of the water tank housing such that the combustion gas inlet and the combustion gas outlet are positioned within the gas guiding pipe. The water tank housing comprises: a particle guiding plate inclined to direct a collecting zone, the particle guiding plate including a first inclined plate and a second inclined plate; and a first filter, a first separation plate, a second filter, and a second separation plate. The water tank further comprises a flowing preventing plate which is formed in a "n" shape and has a lower space in the collecting zone.

Description

 Water Tank for Scrubber System

1 shows a front view of a scrubber system according to an embodiment of the present invention.

2A illustrates a front view of a plasma torch in accordance with an embodiment of the present invention.

2B illustrates a cross-sectional view of a plasma torch in accordance with an embodiment of the present invention.

Figure 2c is a plan view of the waste gas inlet of the plasma torch according to an embodiment of the present invention.

FIG. 2D is a cross-sectional view taken along the line A-A of FIG. 2C.

3 is a cross-sectional view of a combustion tank constituting a scrubber system according to an embodiment of the present invention.

Figure 4a shows a plan view of a tank tank constituting a scrubber system according to an embodiment of the present invention.

4B is a sectional view taken along the line B-B in FIG. 4A.

4C shows a side view of the tank of FIG. 4A.

<Description of Symbols for Major Parts of Drawings>

10-scrubber system

100-plasma torch

110-cathode electrode 120-pilot electrode

130-first positive electrode 140-second positive electrode

150-waste gas inlet

200-combustion tank

210-Outer Housing 220-Inner Housing

230-lower housing 240-connector

300-tank tank

310-Bath Housing 320-Gas Guide Tube

330-Particle guide plate 340-First filter

350-Second Filter 360-Flow Block

400-wet tower

The present invention relates to a tank tank for a scrubber system, and more particularly, it is possible to more effectively dissolve and collect the water-soluble gas contained in the combustion gas by bringing the combustion gas flowing into the tank housing directly into water. When foreign matter particles contained in the combustion gas fall into the tank housing, the foreign matter particles are introduced into the lower space of the flow preventing plate by the particle guide plate, thereby preventing foreign matter particles from flowing and rising again as the water shakes. The present invention relates to a water tank for a scrubber system that can be easily removed through a drain pipe.

Exhaust gases emitted from chemical processes or semiconductor manufacturing processes are toxic, explosive and corrosive, and therefore are not only harmful to the human body but also cause environmental pollution when released into the atmosphere. Therefore, the exhaust gas must be purged to lower the content of harmful components below the allowable concentration, and it is legally mandated to discharge only harmless gases that have undergone the purification process to remove such toxic substances into the atmosphere.

There are two types of scrubber systems for treating harmful gases emitted from semiconductor manufacturing processes, such as burning and wetting. The burning method is mainly a method of treating exhaust gas by decomposing, reacting or burning a ignitable gas containing a hydrogen group in a high temperature combustion chamber, and the wet method mainly dissolves water in water while passing a water gas stored in the tank. By treating the exhaust gas.

One of the burning-type scrubber systems burns waste gases using plasma and discharges them into harmless gases. The scrubber system using the plasma generates a plasma using a plasma torch and injects waste gas into the plasma to burn the waste gas.

The general burning type scrubber system has a combustion tank and a water tank installed under the plasma torch and a wet tower connected to the combustion tank by a separate pipe. Combustion gas combusted in the plasma torch is sent to the wet tower through the piping over the combustion tank. At this time, the combustion gas is not directly in contact with the water stored in the tank tank, it is sent directly to the wet tower through the pipe. Therefore, the water-soluble harmful gas present in the combustion gas is removed only by the water sprayed from the wet tower, so that the removal efficiency of the water-soluble harmful gas is reduced. On the other hand, foreign matter particles contained in the combustion gas will fall to the tank tank located in the lower portion of the combustion tank. In general, a tank tank has a flat bottom surface, and foreign particles falling from the combustion tank are scattered on the bottom of the tank tank, which is difficult to remove from the tank tank. In addition, there is a problem that foreign matter particles that are not sinking to the lower portion of the tank tank rises to the upper side according to the flow of water.

The present invention for solving the above problems is to contact the water directly into the combustion gas flowing into the water tank housing so that the water-soluble gas contained in the combustion gas can be effectively dissolved in the water and collected, the combustion gas When foreign matter particles contained in the fall into the tank housing, foreign matter particles are guided to the lower space of the flow preventing plate by the particle guide plate, thereby preventing foreign matter particles from flowing as the water shakes and rising again, and easily through the drain pipe. It is an object of the present invention to provide a water tank for a scrubber system that can be removed.

The scrubber tank for scrubber system of the present invention devised to solve the above problems includes a plasma torch, a combustion tank, a tank tank and a wet tower, and a scrubber system used in a scrubber system for treating waste gas generated in a semiconductor process. In the tank for water tank, the tank tank is located in the lower portion of the combustion tank and the tank housing having a combustion gas inlet for the combustion gas flows in one side and a combustion gas outlet for the combustion gas flows in one side and a cylinder open from the top to the bottom It is characterized in that it comprises a gas induction pipe coupled to the upper portion of the tank housing so that the combustion gas inlet and the combustion gas outlet is located therein.

Further, in the present invention, the tank housing is formed in the lower portion of the tank housing in the area where the gas guide pipe is formed, the particle guide plate and the gas guide pipe is formed to be inclined toward the collection area where foreign particles of the tank housing are collected. A first filter formed between an area and a rear wall of the tank housing, a first separator plate supporting the first filter, a second filter provided between the first filter and a rear wall of the tank housing, and the second filter It may be formed including a second separation plate for supporting the filter.

In addition, in the present invention, the tank housing is formed in a box shape having a front wall, a rear wall, one side wall, the other side wall, the top plate and the bottom plate, the combustion gas inlet is formed on one side of the top plate, the combustion gas outlet May be formed on the other side of the top plate.

In addition, the tank housing in the present invention is formed in a box shape having a front wall, a rear wall, one side wall, the other side wall, the top plate and the bottom plate, the particle guide plate is inclined from one side wall to the other side wall of the tank housing. It may be formed including a first inclined plate to be installed and a second inclined plate inclined in the front wall direction in the first filter direction of the water tank housing. In addition, the first inclined plate is formed so as to be spaced apart from the one side wall of the tank housing and coupled to the bottom plate, the second inclined plate is formed to be in contact with the bottom plate is spaced from the front wall of the water tank housing so that the collection region is It may be formed between one side wall and the front side wall of the tank housing.

In addition, in the present invention, the tank tank may further include a flow preventing plate is formed in a "∩" shape having a lower space in the collection region. In addition, the flow preventing plate may be formed so that the drain pipe and the lower space for draining the water of the tank housing in the collection area of the tank housing.

In addition, in the present invention, the gas induction pipe may be formed so that the lower end is lower than the water level (W) of the tank housing.

Hereinafter, with reference to the accompanying drawings will be described in more detail with respect to the tank tank for the scrubber system according to the present invention.

1 shows a front view of a scrubber system according to an embodiment of the present invention. 2A illustrates a front view of a plasma torch in accordance with an embodiment of the present invention. 2B illustrates a cross-sectional view of a plasma torch in accordance with an embodiment of the present invention. Figure 2c is a plan view of the waste gas inlet of the plasma torch according to an embodiment of the present invention. FIG. 2D is a cross-sectional view taken along the line A-A of FIG. 2C. 3 is a cross-sectional view of a combustion tank constituting a scrubber system according to an embodiment of the present invention. Figure 4a shows a plan view of a tank tank constituting a scrubber system according to an embodiment of the present invention. 4B is a sectional view taken along the line B-B in FIG. 4A. 4C shows a side view of the tank of FIG. 4A.

Scrubber system 10 according to an embodiment of the present invention, referring to Figure 1, is formed including a plasma torch 100, the combustion tank 200, the tank tank 300 and the wet tower (400). The scrubber system 10 burns waste gas containing noxious gas generated in a semiconductor manufacturing process using plasma to make a combustion gas, and the water-soluble water contained in the combustion gas in the tank tank 300 and the wet tower 400. After collecting harmful gases and foreign particles, only harmful gases flow out.

2A to 2D, the plasma torch 100 includes a cathode electrode 110, a first anode electrode 130, a second cathode electrode 140, and a waste gas inlet 150. . In addition, the plasma torch 100 may further include a pilot electrode 120 positioned between the cathode electrode 110 and the first anode electrode 130. The plasma torch 100 is formed by separating the anode electrode into the first cathode electrode 130 and the second anode electrode 140, and the cathode electrode 110, the first cathode electrode 130, and the second cathode electrode ( 140 is formed to be disposed sequentially from the top. The plasma torch 100 has an inlet hole into which waste gas discharged and used in a semiconductor process is introduced, and a spray hole for injecting plasma supply gas is formed in a different position, and thus, foreign matter particles in which the spray gas is injected into the waste gas are included in the waste gas. To prevent clogging. That is, the plasma torch 100 has a plasma between the cathode electrode 110 and the first anode electrode 130 (or the pilot electrode 120) and between the pilot electrode 120 and the first anode electrode 130. Supply ports 126 and 137 through which the supply gas is supplied may be formed, and a waste gas inlet hole 143 through which the waste gas is introduced may be formed in the second anode electrode 140. Therefore, the plasma torch 100 can prevent foreign particles mixed in the waste gas from blocking the supply ports 126 and 137 supplying the plasma supply gas. As the plasma supply gas, an inert gas such as argon (Ar) or nitrogen (N 2) is used.

The negative electrode 110 includes a negative electrode body 112, a negative electrode rod 114, and a negative electrode terminal 116. In addition, the cathode electrode 110 may further include a cathode case 118. The cathode electrode 110 is electrically connected to an anode of an external direct current power source and causes discharge with the cathode electrodes.

The cathode body 112 is formed in a cylindrical shape and is provided with a cathode hole 112a penetrating from the top to the bottom therein. In addition, the cathode body 112 is formed with an outer groove 112b in which a conductive coil is wound on an outer surface thereof. The conductive coil is electrically connected to a cathode of a DC power supply (not shown) to supply electricity to the cathode electrode 110 and to form a magnetic field by the supplied current. do.

The cathode rod 114 is formed in a cylindrical shape, the terminal groove 114a is formed at the bottom. The negative electrode rod 114 is coupled to the upper surface is exposed to the negative electrode hole 112a of the negative electrode body 112 to be separated. For example, the cathode rod 114 has a screw formed on the outer surface, it can be coupled to the cathode hole 112a by screwing. In addition, the cathode rod 114 is formed by including at least two coolant passages 117 formed on the lower surface thereof and connected to the terminal grooves 114a. The cooling water passage 117 of the cathode rod 114 supplies the cooling water supplied from the cooling water supply pipe 119 coupled to the upper surface of the cathode terminal 116. In addition, the cooling water passage 117 of the cathode rod 114 discharges the cooling water in contact with the upper surface of the cathode terminal 116 to the outside. Therefore, the negative electrode 110 is cooled while the negative electrode 114 and the negative electrode terminal 116 are in direct contact with the cooling water.

The negative electrode terminal 116 is formed in a cylindrical shape, and is electrically connected to the negative electrode rod 114 and the negative electrode body 112. At this time, the negative electrode terminal 116 is coupled to the terminal groove 114a of the negative electrode rod 114 and is formed so that the upper surface is spaced apart from the lower surface of the terminal groove 114a. That is, the upper surface of the negative electrode terminal 116 is formed between the lower surface of the terminal groove 114a is a space in which the coolant flows. Therefore, the coolant supplied to the cathode rod 114 contacts the upper surface of the anode terminal 116 to directly cool the cathode terminal 116. In addition, the negative electrode terminal 116 is coupled to the lower surface of the terminal groove 114a of the negative electrode rod 114 to be exposed to the discharge space inside the plasma torch 100 to discharge the positive electrode 120, 130, 140. Will be raised. The negative electrode terminal 116 is made of a metal such as tungsten, which consumes less material during the discharge process. The negative electrode terminal 116 is separated from the negative electrode body 112 together with the negative electrode rod 114 when it is consumed in the discharge process, separated from the negative electrode rod 114, or replaced with the negative electrode rod 114. Accordingly, the negative electrode 110 may replace the exhausted negative electrode terminal 116 more easily.

The negative electrode case 118 is formed of an electrical insulator, and is formed to completely surround an area including the upper and outer surface grooves 112b of the negative electrode body 112. The cathode case 118 electrically insulates the cathode electrode 110 and the conductive coil from the outside.

The pilot electrode 120 includes a pilot body 122, a pilot through hole 122a, a pilot outer groove 122b, and a pilot case 124. The pilot electrode 120 is electrically connected to the positive electrode of the direct current power source and causes initial discharge with the negative electrode 110. Therefore, the pilot electrode 120 is applied with a higher voltage than other anode electrodes. The pilot electrode 120 may not be formed when the first cathode electrode 130 is formed to cause discharge with the cathode electrode 110. The pilot electrode 120 is formed so that the upper surface is spaced apart from the lower surface of the cathode electrode 110 so that the first gas supply hole 126 is formed between the upper surface and the lower surface of the cathode electrode 110. The pilot electrode 120 is formed to be electrically insulated from the cathode electrode 110.

The pilot body 122 is formed in a cylindrical shape, and is electrically connected to the anode of the DC power supply to receive electricity. In addition, the pilot body 122 includes a pilot through hole 122a penetrating up and down therein and a pilot outer groove 122b formed in a groove shape along a horizontal direction on an outer surface thereof. In addition, the pilot body 122 is supported to be spaced apart from the cathode electrode 110 in the vertical direction so that the first gas supply port 126 is formed between the cathode electrode 110 and.

The pilot through hole 122a is formed to penetrate from the top to the bottom of the pilot electrode 120. In addition, the pilot through hole 122a may have a step formed at a lower portion thereof, and thus may be wider than the upper portion thereof. The pilot through hole 122a allows the plasma supply gas supplied from the first gas supply port 126 to flow from top to bottom.

The pilot outer groove 122b is formed along the circumferential direction on the outer surface of the pilot body 122 and forms a pilot case 124 and a coolant passage. The pilot body 122 is cooled by the coolant supplied to the coolant because heat is generated during the discharge process.

The pilot case 124 is formed of an electrical insulator and is formed to completely surround the lower outer surface of the cathode electrode 110 and the upper outer surface of the pilot body 122. The pilot case 124 electrically insulates the pilot body 122 from the outside.

In addition, the pilot case 124 vertically up and down the cathode body 110 and the pilot body 122 such that a first gas supply port 126 is formed between the cathode body 110 and the pilot body 122. Spaced in the direction to support.

In addition, the pilot case 124 is coupled to the first gas supply pipe 127 is formed at a position corresponding to the position of the first gas supply port 126. The first gas supply pipe 127 supplies a plasma supply gas to the first gas supply port. The first gas supply pipe 127 is formed to be inclined toward the outer surface with respect to the center direction of the pilot case 124 to form a vortex when the plasma supply gas is supplied to the first gas supply port 126.

In addition, the pilot case 124 forms a coolant passage along with the pilot outer groove 122b. Since the pilot body 122 generates heat during the discharge process, the pilot body 122 is cooled by the coolant supplied to the coolant passage.

The first positive electrode 130 includes a first positive electrode body 132, a first through hole 132a, and a first outer groove 132b. In addition, the first positive electrode 130 may further include a first positive electrode case 134. The first positive electrode 130 is formed under the negative electrode 110 or the pilot electrode 120. Meanwhile, when the pilot electrode 120 is not formed in the plasma torch 100, the first anode electrode 130 is spaced apart from the lower surface of the cathode electrode 110 to supply a plasma supply gas (FIG. Not shown). In addition, the first positive electrode 130 causes discharge with the negative electrode 110 and forms a plasma using the supplied plasma supply gas. The first positive electrode 130 is formed to be electrically insulated from the negative electrode 110 or the pilot electrode 120.

The first anode body 132 is formed in a cylindrical shape as a whole, and is electrically connected to the anode of the DC power supply to receive electricity. In addition, the first positive electrode body 132 includes a first through hole 132a penetrating up and down therein and a first outer surface groove 132b formed in an circumferential direction on an outer surface thereof. The first positive electrode body 132 is spaced apart from the lower surface of the pilot body 122 in an up and down direction to form a second gas supply hole 137 through which a plasma supply gas is supplied.

The first through hole 132a is formed to penetrate from the top to the bottom of the first cathode body 132. In the first through hole 132a, a plasma supply gas supplied from the first gas supply port 126 or the second gas supply port 137 flows, and a plasma is formed therein. In addition, the first through hole 132a is formed to gradually widen in a downward direction. That is, the first through hole 132a is formed to be inclined toward the outer surface toward the lower direction, so that the horizontal cross-sectional area is gradually widened. Therefore, the plasma formed in the first through hole 132a becomes wider in the area formed downward.

The first outer groove 132b is formed in the circumferential direction on the side of the first anode body 132 and forms a cooling water passage together with the first anode case 134. The first positive electrode body 132 is cooled by the coolant supplied to the coolant passage because heat is generated during the discharge process.

The first cathode case 134 is formed of an electrical insulator and is formed to surround the lower outer surface of the pilot body 122, the outer surface of the first anode body 132, and the upper outer surface of the second anode electrode 140. The first cathode case 134 electrically insulates the lower portion of the first anode body 132 and the pilot body 122 and the upper portion of the second anode electrode 140 from the outside. In addition, the first cathode case 134 forms a cooling water passage together with the first outer groove 132 b so that the cooling water flows through the side surface of the first anode body 132.

The first positive electrode case 134 may be divided into a first positive electrode upper case 134a and a first positive electrode lower case 134b. The first cathode case 134 may be separated into an upper case 134a and a lower case 134b for assembling the first anode body 132 and the pilot body 122.

The first positive electrode upper case 134a supports the upper surface of the first positive electrode body 132 and the lower surface of the pilot body 122 so as to be spaced apart from each other, and thus, between the first positive electrode body 132 and the pilot body 122. The second gas supply port 137 is formed in the. The first anode upper case 134a is formed to include an upper support block 135a protruding from an inner surface at a position corresponding to a position between the first anode body 132 and the pilot body 122. The upper support block 135a is coupled between the lower portion of the pilot outer groove 122b and the upper portion of the first outer groove 132b to support the first cathode body 132 and the pilot body 122 to be spaced apart from each other. Done.

The first anode lower case 134b is formed to include a lower support block 135b protruding from an inner surface at a position corresponding to a position between the first anode electrode 130 and the second cathode electrode 140. The lower support block 135b is coupled to the lower portion of the first positive electrode 130 and the upper portion of the second positive electrode 140 to support the first positive electrode 130 and the second positive electrode 140 to be spaced apart from each other. Done.

In addition, the first cathode case 134 may include a second gas supply pipe 138 for supplying a plasma supply gas to the second gas supply hole 137 in a region corresponding to a region where the second gas supply hole 137 is formed. Is formed. The second gas supply pipe 138 is formed in the first anode upper case 134a of the first cathode case 134. The second gas supply pipe 138 is formed to be inclined toward the outer surface with respect to the center direction of the first cathode case 134 so as to form a vortex when the plasma supply gas is supplied to the second gas supply port 137.

In addition, the first anode upper case 134a and the first anode lower case 134b surround the first outer groove 132b formed on the outer surface of the first anode body 132. The first anode upper case 134a is formed with a cooling water supply pipe 139 for supplying cooling water to the first outer groove 132b.

On the other hand, the first cathode case 134 has a coupling step 134c is formed to be coupled to the waste gas inlet described below.

The second positive electrode 140 is formed with a second positive electrode body 142, a second through hole 142a, and a waste gas inlet hole 143. In addition, the second positive electrode 140 may be formed to include a second outer surface groove 142b on an outer surface thereof. The second positive electrode 140 is formed under the first positive electrode 130 and is electrically insulated from the first positive electrode 130. In addition, the second positive electrode 140 generates a discharge with the negative electrode 110 and forms a plasma using the supplied plasma supply gas. The second positive electrode 140 burns the waste gas introduced into the waste gas inlet hole 143 using a plasma formed therein.

The second cathode body 142 is formed in a cylindrical shape as a whole, and is electrically connected to the anode of the DC power supply to receive electricity. In addition, the second cathode body 142 is formed with a second through hole 142a penetrating up and down inside and a waste gas inlet hole 143 penetrating from the outer surface to the second through hole 142a. In addition, the second positive electrode body 142 is formed to further include a second outer surface groove 142b formed in the circumferential direction on the outer surface. The second positive electrode body 142 is spaced apart from the lower surface of the first positive electrode body 132 in the vertical direction to be electrically insulated.

The second through hole 142a is formed to penetrate from the top to the bottom of the second cathode body 142. In the second through hole 142a, a plasma supply gas supplied from an upper portion flows, and a plasma is formed therein.

In addition, the second through hole 142a may have an inner surface gradually widened from an upper end of the second anode body 142 to the waste gas inlet hole 143. That is, the second through hole 142a is formed to be inclined toward the outer surface of the second cathode body 142 from the top to the downward direction, so that the horizontal cross-sectional area is gradually widened. At this time, the inner surface of the second through hole 142a is formed to be inclined at the same angle as the inner surface of the first through hole 132a and is formed like a surface extending from the inner surface of the first through hole 132a. Therefore, the plasma formed from the first through hole 132a is formed to extend to the second through hole 142a without interference.

In addition, the second through hole 142a is formed to gradually narrow from the waste gas inlet hole 143 to the lower end of the second positive electrode 140. That is, the second through hole 142a is formed to be inclined toward the inner surface from the waste gas inlet hole 143 toward the lower direction, so that the horizontal cross-sectional area is gradually narrowed. Plasma formed inside the second through hole 142a is formed in a narrower area toward the lower portion. In other words, the second through hole 142a guides the plasma formed therein into the narrowing space to strengthen the plasma. Therefore, the second through hole 142a burns the waste gas introduced from the waste gas inlet hole 143 more effectively.

The waste gas inlet hole 143 is formed to penetrate through the second through-hole 142a from the upper outer surface of the second cathode body 142 and is formed of at least two. The waste gas inlet hole 143 is spaced apart at the same angle in the circumferential direction of the second cathode body 142 and is preferably formed in four. Therefore, the waste gas inlet hole 143 is formed at intervals of 90 degrees in the circumferential direction of the second cathode body 142. The waste gas inlet hole 143 is formed as large as possible in the circumferential direction of the second cathode body 142 so that the waste gas can be more smoothly introduced. In addition, the waste gas inlet hole 143 is formed at an appropriate height so that the waste gas can be smoothly introduced.

On the other hand, the waste gas inlet hole 143 is exposed to the outer surface of the second cathode body 142 when the second cathode case 144 is coupled to the second cathode body 142 in the lower portion of the waste gas inlet hole 143 The exposed area 143a is formed. As described below, the exposed region 143a does not directly enter the waste gas inlet hole 143 as the entirety of the waste gas introduced from the outside, but a portion of the waste gas strikes the exposed region 143a and then the waste gas inlet hole 143. To get into

The second outer surface groove 142b is formed in the outer surface of the second cathode body 142 in the circumferential direction, and forms a cooling water passage along with the second cathode case 144. The second outer surface groove 142b is formed in a lower direction of the waste gas inlet hole 143. Since the second cathode body 142 generates heat during the discharge process, the second cathode body 142 is cooled by the cooling water supplied to the cooling water passage.

The second cathode case 144 is formed of an electrical insulator and is formed to surround the outer surface of the second anode electrode 140 including the second outer groove 142b. However, the second cathode case 144 surrounds an area excluding the area where the waste gas inlet hole 143 is formed, and is formed such that the waste gas inlet hole 143 is exposed to the outside. The second cathode case 144 electrically insulates the second cathode electrode 140 from the outside. In addition, the second cathode case 144 forms a cooling water passage together with the second outer groove 142b to allow the cooling water to flow to the side surface of the second cathode electrode 140. In addition, the second cathode case 144 has a coolant supply pipe 149 for supplying coolant to the second outer groove 142b. Meanwhile, the second cathode case 144 may be separated into an upper case 144a and a lower case 144b for assembling with the first anode electrode 130.

On the other hand, the second cathode case 144 has a coupling step 146b is formed to be coupled to the waste gas inlet described below.

The waste gas inlet 150 is formed to include an inlet case 152 and a waste gas inlet pipe 154. The waste gas inlet 150 allows the waste gas discharged from the semiconductor processing equipment to flow into the second anode electrode 140 of the plasma torch 100. The waste gas inlet unit 150 forms a vortex when the waste gas flows into the second anode electrode 140 so that the waste gas can be burned more effectively. In addition, the waste gas inlet 150 is formed to be introduced into the waste gas inlet hole 143 after first colliding with the exposed area 143a of the second anode body when the waste gas is introduced through the waste gas inlet hole 143. do. Therefore, the waste gas flows inside the second anode electrode 140 at a lower pressure when it enters the waste gas inlet 150 and can be burned more effectively.

The inflow case 152 is formed in a cylindrical shape with a hollow inside, so as to surround the outer surface of the second cathode body 142 so that the area where the waste gas inlet hole 143 of the second cathode body 142 is formed is sealed with the outside. Combined. In addition, the inflow case 152 is formed to be spaced apart from the outer surface of the second cathode body 142 so that a space is formed between the outer surfaces of the second cathode body 142. Therefore, the inflow case 152 is formed so that the waste gas discharged from the semiconductor processing equipment can be introduced while causing a vortex. The inflow case 152 is installed between the first cathode case 134 and the second cathode case 144. In more detail, the inflow case is supported and coupled between the coupling step 134c formed at the bottom of the first cathode case 134 and the coupling step 146b formed at the top of the second cathode case 144.

The waste gas inlet pipe 154 is formed to be supported by the channel inlet case 152 corresponding to the waste gas inlet hole 143. The waste gas inlet pipe 154 has a central axis directed downwardly from the central axis of the waste gas inlet hole 143 based on the vertical direction, and is directed outward from the central axis of the waste gas inlet hole 143 based on the horizontal direction. It is formed to. Thus, the waste gas inlet pipe 154 causes the waste gas to vortex and flow into the inlet case 152. In addition, the waste gas inlet pipe 154 is formed so that the waste gas flowing into the inlet case 152 may first collide with the outside of the waste gas inlet hole 143. That is, the central axis of the waste gas inlet pipe 154 is formed to meet the exposed area 143a of the waste gas inlet hole 143.

3, the combustion tank 200 includes an outer housing 210, an inner housing 220, and a lower housing 230, and is coupled to a lower portion of the plasma torch 100. In addition, the combustion tank 200 may be formed by further comprising a connection pipe 240 in the lower portion. The combustion tank 200 forms a space so that the waste gas combusted by the plasma can be continuously burned. However, the combustion tank 200 shown in FIG. 3 is an example and may be composed of a combustion tank having various structures.

The outer housing 210 is formed in a cylindrical shape to form an outer shape of the combustion tank 200, and is separated from the outside of the inner housing 220 in which combustion occurs. The outer housing 210 may be separated into a plurality of if necessary. That is, the outer housing 210 may be divided into a first outer housing 210a, a second outer housing 210b, and a third outer housing 210c.

The inner housing 220 has a cylindrical shape inside the outer housing 210, and is formed to be spatially connected to the second through hole 142a of the second positive electrode 140. Therefore, the inner housing 220 is formed so that the waste gas combusted by the plasma flows in the second through hole 142a. The plasma generated from the second through hole 142a may be formed at an upper portion of the inner housing 220, and additionally, waste gas may be combusted.

The inner housing 220 may be separated into a plurality of like the outer housing 210. That is, the inner housing 220 may be divided into a first inner housing 220a, a second inner housing 220b, and a third inner housing 220c positioned at an upper portion thereof. In this case, the first inner housing 220a is formed such that the upper portion thereof gradually widens so that the waste gas can be smoothly introduced from the plasma torch 100. In addition, the third inner housing 220c is formed such that the lower portion thereof is gradually narrowed so that the burned combustion gas smoothly flows into the tank tank 300. That is, the third inner housing 220c is formed in a funnel shape.

The lower housing 230 is formed in a lower shape of the inner housing 220, that is, a shape corresponding to the third inner housing 220c, and is spaced apart from the lower part of the third inner housing 220c. That is, the lower housing 230 has an upper portion formed in a funnel shape. Accordingly, the lower housing 230 forms a transport gas injection hole 235 between the lower housing 230 and the inner housing 220. The transfer gas injection hole 235 may inject the transfer gas supplied from the outside into the inside, and promote the flow of the combustion gas introduced into the lower housing 230 from the inner housing 220.

The connection pipe 240 connects the lower housing 230 with the tank tank 300 installed at the bottom to allow the combustion gas to flow into the tank tank 300. The connection pipe 240 may be integrally formed with the lower housing 230 according to the structure of the scrubber system 10, may be divided into a plurality of.

4 to 6, the tank tank 300 is formed to include a tank housing 310 and a gas induction pipe 320. In addition, the tank tank 300 may be formed with a particle guide plate 330, the first filter 340 and the second filter 350.

The tank tank 300 is located below the combustion tank 200, and the combustion gas flowing from the upper combustion tank 200 to contact the water to remove the water-soluble harmful gas contained in the combustion gas. In addition, the tank tank 300 flows the combustion gas from which the water-soluble harmful gas is removed to the wet tower 400. In addition, the water tank tank 300 allows the foreign matter particles generated while the waste gas is burned in the plasma torch 100 and the combustion tank 200 to fall so that the combustion gas and the foreign matter particles are separated. In addition, the tank tank 300 is supplied to the water sprayed into the interior of the wet tower 400, to filter the water recovered from the wet tower 400 to be injected back into the interior of the wet tower (400). Will be supplied.

The tank housing 310 is formed in a box shape and stores water used for the scrubber system 10. That is, the water tank housing 310 is formed with a front wall 310a, a rear wall 310b, one side wall 310c, the other side wall 310d, an upper plate 310e, and a bottom plate 310f. The tank housing 310 includes a combustion gas inlet 312 and a combustion gas outlet 314. In addition, the tank housing 310 may be formed by further including a drain pipe (316).

The water tank housing 310 may include a first region 310g whose interior is divided by the first filter 340, a second region 310h which is divided by the first filter 340, and the second filter 350. The third region 310j may be divided by the second filter 350. Here, the front side of the tank housing 310 means the direction in which the combustion gas inlet 312 and the combustion gas outlet 314 is formed, the rear side means the opposite direction. In addition, one side of the tank housing 310 means the direction in which the combustion gas inlet 312 is formed, the other side means the direction in which the combustion gas outlet 314 is formed in the opposite direction.

The combustion gas inlet 312 is formed on the upper plate 310e of one side of the water tank housing 310 to be connected to the combustion tank 200. Accordingly, the combustion gas of the combustion tank 200 is introduced into the tank housing 310 through the combustion singer inlet 312. The combustion gas inlet 312 is formed in the first region 310g.

The combustion gas outlet 314 is formed on the upper plate 310e of the other side of the tank housing 310 to be connected to the wet tower 400. Therefore, the combustion gas introduced into the tank housing 310 is discharged to the wet tower 400 through the combustion gas outlet 314. The combustion gas outlet 314 is formed in the first region 310g.

The drain pipe 316 is formed on one side wall 310c of the tank housing 310 to discharge water and foreign particles stored in the tank housing 310 to the outside. The drain pipe 316 is formed in the collection area a where foreign particles are described below.

The gas induction pipe 320 is formed in a tubular shape that is open from the top to the bottom and is coupled to the bottom of the upper plate 310e of the tank housing 310 so that the combustion gas inlet 312 and the combustion gas outlet 314 are located therein. do. Therefore, the gas guide tube 320 is formed in the first region 310g of the tank housing 310.

The gas induction pipe 320 is formed so that the lower end is lower than the water level (W) of the tank housing (310). Therefore, the combustion gas introduced into the combustion gas inlet 312 is in direct contact with water in the space formed by the gas induction pipe 320 and the tank housing 310 and the water. The gas induction pipe 320 induces the combustion gas introduced from the combustion gas inlet 312 to be in direct contact with water so that the water-soluble harmful gas contained in the combustion gas can be more effectively dissolved in water. In addition, the gas induction pipe 320 prevents the combustion gas from flowing into the other region inside the tank housing 310.

The particle guide plate 330 is formed in a plate shape, any of the tank housing 310 in the lower portion of the tank housing 310 of the region including the region where the combustion gas inlet 312 and the combustion gas outlet 314 is formed. It is formed to be inclined to face one corner. That is, the particle guide plate 330 is formed in the first region 310g in the tank housing 310. The particle guide plate 330 may be formed in various shapes to collect foreign particles into the corner of the tank housing 310. For example, the particle guide plate 330 may be formed to be inclined in the corner direction between the front side wall 310a and the side wall 310c from the other side wall 310d and the first filter. In addition, the particle guide plate 330 may be formed to be inclined in the corner direction between the front wall (310a) and the other side wall (310d).

The particle guide plate 330 may be divided into a first inclined plate 332 and a second inclined plate 334. The first inclined plate 332 is installed to be inclined from the other side wall 310d of the water tank housing 310 to one side wall 310e. In addition, the second inclined plate 334 may be formed to be inclined toward the front wall 310a in the direction of the first filter 340 of the tank housing 310.

The particle guide plate 330 is in contact with the bottom plate 310f of the tank housing 310 and is coupled to the bottom plate 310f so as to be spaced apart from the front side wall 310a and the one side wall 310c. For example, the first inclined plate 332 is formed to be in contact with the bottom plate 310f spaced apart from one side wall 310c. In addition, the second inclined plate 334 is formed to be in contact with the bottom plate 310f spaced apart from the front wall 310a. Therefore, a collecting region a in which foreign particles are collected is formed on an upper surface of the bottom plate 310f of the tank housing 310.

The first filter 340 is formed of a general filter that can filter the particles. The first filter 340 is vertically formed between the first region 310g and the second region 310h in which the gas induction pipe 320 is formed. In addition, the first filter 340 filters the foreign particles contained in the water flowing from the first region 310g to the second region 310h. Accordingly, the water in the second region 310h of the tank housing 310 has a smaller number of foreign particles than the water of the first region 310g.

The first filter 340 is supported by the first separation plate 342 and is coupled to and supported by the first mounting groove 344 formed in the first separation plate 342. The first filter 340 is formed in a number corresponding to the number of the first mounting grooves 344 formed in the first separation plate 342. For example, two first filters 340 may be formed at one side and the other side of the tank housing 310.

The first separating plate 342 is supported by being coupled to one side plate 310c and the other side wall 310d of the tank housing 310 in a plate shape. In addition, a lower portion of the first separator 342 is combined with the particle guide plate 330. Accordingly, the first separation plate 342 divides the interior of the water tank housing 310 into a region different from the first region 310g in which the gas induction tube 320 is formed. Therefore, the water tank housing 310 prevents foreign particles contained in the combustion gas flowing from the combustion gas inlet 312 so as not to flow to the lower portion of the first region 310g without flowing to other regions. The foreign particles that do not go to the lower portion of the tank housing 310 are collected around the drain pipe 316 through the particle guide plate 330, and can be easily removed to the outside of the tank housing 310.

In addition, the first separation plate 342 includes at least one first mounting groove 344 on which the first filter 340 is mounted. Therefore, the first separation plate 342 supports the first filter 340 coupled to the first mounting groove 344.

The second filter 350 is formed of a general filter capable of filtering particles. The second filter 350 is vertically formed between the second region 310h and the third region 310j. The second filter 350 once again filters foreign particles contained in the water flowing from the second region 310h to the third region 310j. Accordingly, the water in the third region 310j of the tank housing 310 has a smaller number of foreign particles than the water of the first region 310g and the second region 310h. Therefore, the water tank housing 310 can supply water having relatively few foreign particles to the wet tower 400.

The second filter 350 is supported by the second separation plate 352 and is coupled to and supported by the second mounting groove 354 formed in the second separation plate 352. The second filter 330 is formed in a number corresponding to the number of mounting grooves 354 formed in the second separation plate 352.

The second separation plate 352 is supported by being combined with one side plate 310c, the other side wall 310d and the bottom plate 310f of the tank housing 310 in a plate shape. Accordingly, the second separation plate 352 divides the inside of the tank housing 310 into a second region 310h and a third region 310j.

In addition, the second separator 352 is provided with at least one second mounting groove 354 on which the second filter 350 is mounted. Therefore, the second separator 352 supports the second filter 350.

Reference numeral 358, which is not described, is a second drain pipe for draining water through the second region 320h. The second drain pipe 358 may be used to remove foreign matter particles collected under the second region 320h. The second drain pipe 358 is not necessarily formed.

The flow preventing plate 360 is formed in a "∩" shape so that a space is formed at the bottom, and is formed on the bottom plate 310f of the housing 310 in which the collecting region a is formed. Accordingly, the lower portion of the flow preventing plate 360 provides a space for collecting foreign particles falling from the upper portion, and prevents foreign particles from rising again when the water is shaken. In addition, the lower space of the flow preventing plate 360 is connected to the drain pipe 316. That is, the drain pipe 316 is connected to the lower space of the flow preventing plate 360 through one side wall 310c of the tank housing 310. Therefore, the foreign particles collected in the lower space of the flow preventing plate 360 can be easily removed through the drain pipe (316).

In addition, reference numeral 380 is a supply pipe for supplying water to the wet tower. The supply pipe is connected to the wet tower through a separate pump (not shown) and pipes (not shown) connected to the pump to supply water to the wet tower. The supply pipe is formed to extend to the third region 310j of the tank housing 310, and the water of the third region 310j is supplied to the pump. The pump may be used a variety of pumps that are commonly used, the detailed description thereof will be omitted. The pipe connected to the pump connects the pump and the nozzle (not shown) of the wet tower 400 so that the pump can supply water to the wet tower 400.

The wet tower 400 is installed on the other side of the water tank housing 310 and is formed to be connected to the combustion gas outlet 314. The wet tower 400 is formed to include a plurality of nozzles for spraying water in the downward direction in order to remove the fine foreign particles contained in the combustion gas rising from the tank housing 310 therein. In addition, the wet tower 400 is formed with a plurality of filter layers by filtering foreign particles therein. The wet tower 400 may be formed by various combinations of nozzles and filter layers, although not illustrated in detail. Since the wet tower 400 is generally used in the scrubber system 10, the detailed structure and operation thereof will be omitted here.

The following describes the operation of the scrubber system and the tank tank according to an embodiment of the present invention.

Before the waste gas enters the scrubber system 10 from the semiconductor processing line, the plasma supply gas is introduced through the first supply gas inlet 126 of the plasma torch 100, and the cathode electrode 110 and the pilot electrode 120 are introduced. The initial discharge takes place between the plasma and the plasma is formed. Next, the plasma supply gas flows into the second supply gas inlet 137 (when it is formed by separating the first anode electrode 130 and the second anode electrode 140) and the plasma is lower than the second anode electrode 140. Is extended to. Waste gas flows into the waste gas inlet hole 143 formed in the second anode electrode 140 and is combusted by plasma to form combustion gas. The plasma burns waste gases including various harmful gases and foreign particles generated during the semiconductor process into harmless combustion gases, and forms foreign particles through some pyrolysis reactions. The plasma torch 100 forms a supply port 126 and 137 through which a plasma supply gas for plasma formation is supplied and a waste gas inlet hole 143 through which the waste gas is introduced to supply plasma by foreign particles mixed in the waste gas. The supply ports 126 and 137 for supplying the gas are prevented from being blocked. In addition, the plasma torch 100 allows waste gas to be more effectively combusted by allowing the waste gas to flow directly into the plasma formed therein.

In addition, the waste gas combusted by the plasma torch 100 flows into the combustion tank 200 while the combustion proceeds. The combustion gas and the foreign particles introduced into the combustion tank 200 are cooled and flow into the tank housing 310 through the combustion gas inlet 312 below. The water tank housing 310 allows the combustion gas introduced into the gas contact with water while flowing through the gas induction pipe 320. In particular, the water tank housing 310 maintains the water level higher than the lower end of the gas induction pipe 320, so that the combustion gas introduced from the combustion gas inlet 312 is the gas induction pipe 320 and the water tank housing 310. In the space formed by the top and the water is in contact with the water and does not flow to other areas of the tank housing (310). The tank housing 310 allows the combustion gas to come into contact with water, thereby dissolving and collecting the water-soluble gas contained in the combustion gas in water.

In addition, the combustion gas flows out through the combustion gas outlet 314 of the tank housing 310, and flows to the wet tower 400 formed at the upper portion. The wet tower 400 is sprayed with water to the combustion gas flowing from the bottom to drop and remove foreign particles contained in the combustion gas.

On the other hand, when the foreign particles contained in the combustion gas falls into the water of the tank housing 310, the particle guide plate 330 guides the foreign particles to the area where the flow preventing plate 360 is formed. Therefore, the flow preventing plate 360 prevents foreign particles introduced into the lower space from flowing and rising again as the water shakes. In addition, the flow preventing plate 360 prevents foreign particles from flowing in the bottom plate 310f of the tank housing 310, the foreign matter particles can be easily removed by the drain pipe (316).

As described above, the present invention is not limited to the specific preferred embodiments described above, and any person having ordinary skill in the art to which the present invention pertains without departing from the gist of the present invention claimed in the claims. Various modifications are possible, of course, and such changes are within the scope of the claims.

The scrubber system water tank according to the present invention has an effect that can effectively collect and dissolve the water-soluble gas contained in the combustion gas in water by making the combustion gas flowing into the tank housing directly contact with water.

In addition, according to the present invention, when the foreign matter particles contained in the combustion gas falls into the tank housing, the scrubber system tank tank, foreign matter particles are guided to the lower space of the flow preventing plate by the particle guide plate, whereby foreign matter particles The flow is prevented from rising again by shaking, and there is an effect that can be easily removed through the drain pipe.

Claims (8)

In the tank tank for the scrubber system including a plasma torch, combustion tank, tank tank and wet tower, and used in the scrubber system for treating waste gas generated in the semiconductor process, The tank tank Located in the lower portion of the combustion tank and the tank housing having a combustion gas inlet for the combustion gas flows into one side and a combustion gas outlet for the combustion gas flows out; A tank tank for a scrubber system, comprising: a gas inlet pipe connected to an upper portion of the tubular housing so that the combustion gas inlet and the combustion gas outlet are located therein, the tub shape being opened from the top to the bottom. The method of claim 1, The tank housing A particle guide plate that is formed to be inclined toward a collection area where foreign particles of the tank housing are collected at a lower portion of the tank housing in a region where the gas guide pipe is formed; A first filter formed between an area in which the gas induction pipe is formed and a rear wall of the tank housing, a first separation plate supporting the first filter, and a first filter installed between the first filter and the rear wall of the tank housing. And a second separation plate for supporting the second filter and the second filter. The method of claim 2, The tank housing is formed in a box shape having a front side wall, a rear side wall, one side wall, the other side wall, a top plate and a bottom plate, The combustion gas inlet is formed on one side of the top plate, the combustion gas outlet is formed in the other side of the top plate scrubber system tank tank. The method of claim 2, The tank housing is formed in a box shape having a front side wall, a rear side wall, one side wall, the other side wall, a top plate and a bottom plate, The particle guide plate includes a first inclined plate installed to be inclined from the other side wall of the tank housing to one side wall, and a scrubber system formed to be inclined in the front wall direction from the first filter direction of the tank housing. Countertop tank. The method of claim 4, wherein The first inclined plate is formed to be coupled to the bottom plate is spaced apart from one side wall of the tank housing, The second inclined plate is formed to be in contact with the bottom plate spaced apart from the front wall of the tank housing. The collection area is the tank tank for the scrubber system, characterized in that formed between the one side wall and the front wall of the tank housing. The method of claim 2, The tank tank The tank tank for a scrubber system, characterized in that it further comprises a flow preventing plate formed in the "∩" shape having a lower space in the collecting region. The method of claim 6, The flow preventing plate is a tank for a scrubber system, characterized in that the drain pipe for draining the water of the tank housing in the collecting region of the tank housing and the lower space is connected. The method of claim 1, The gas induction pipe is a tank tank for a scrubber system, characterized in that the lower end is formed to be lower than the water level (W) of the water tank housing.

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