KR100840713B1 - Fixing device using air current flow - Google Patents

Fixing device using air current flow Download PDF

Info

Publication number
KR100840713B1
KR100840713B1 KR1020070048300A KR20070048300A KR100840713B1 KR 100840713 B1 KR100840713 B1 KR 100840713B1 KR 1020070048300 A KR1020070048300 A KR 1020070048300A KR 20070048300 A KR20070048300 A KR 20070048300A KR 100840713 B1 KR100840713 B1 KR 100840713B1
Authority
KR
South Korea
Prior art keywords
flow
air
flow path
wafer
fixing
Prior art date
Application number
KR1020070048300A
Other languages
Korean (ko)
Inventor
김영준
Original Assignee
로체 시스템즈(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 로체 시스템즈(주) filed Critical 로체 시스템즈(주)
Priority to KR1020070048300A priority Critical patent/KR100840713B1/en
Application granted granted Critical
Publication of KR100840713B1 publication Critical patent/KR100840713B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Abstract

A fixing device using an air current flow is provided to prevent a sticking phenomenon between a wafer and a wafer fixing portion by fixing the wafer in a contactless manner. A fixing portion(30) includes a first flow path(60) and plural second flow paths(70). The first flow path is penetrated upwards. The second flow path is connected to one end of the first flow path and slantingly penetrates an upper portion of the fixing portion. An inner diameter of the first flow path is greater than a sum of inner diameters of the second flow paths. An air supply portion(50) is connected to one end of the first flow path, such that the air sprayed from the upper portion of the fixing portion is maintained at a pressure lower than an ambient pressure. The air supply portion is connected to one end of the first flow path. A flow rate adjusting valve(40) is connected to the air supply portion and adjusts a flow rate of the air. The air flow sprayed from one of the second flow paths is overlapped with the air flow sprayed from an upper end of the second flow path. The second flow path is formed in a spiral shape.

Description

기류 흐름을 이용한 고정장치{Fixing device using air current flow}Fixing device using air current flow

도 1은 본 발명의 적용에 따른 기류 흐름을 이용한 고정장치를 나타낸 개략도.1 is a schematic view showing a fixing device using an airflow flow according to the application of the present invention.

도 2는 본 발명의 적용에 따른 기류 흐름을 이용한 고정장치의 기류 흐름을 도시한 개략도.Figure 2 is a schematic diagram showing the air flow of the fixing device using the air flow in accordance with the application of the present invention.

도 3은 본 발명의 적용에 따른 기류 흐름을 이용한 고정장치를 나타낸 도 2의 평면도.Figure 3 is a plan view of Figure 2 showing a fixing device using the airflow flow in accordance with the application of the present invention.

도 4는 본 발명의 적용에 따른 기류 흐름을 이용한 고정장치를 나타낸 도 3의 A부분의 확대도.Figure 4 is an enlarged view of portion A of Figure 3 showing a fixing device using the airflow flow in accordance with the application of the present invention.

도 5는 본 발명의 적용에 따른 기류 흐름을 이용한 고정장치의 유로를 도시한 도 2의 평면도.Figure 5 is a plan view of Figure 2 showing a flow path of the fixing device using the airflow flow in accordance with the application of the present invention.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

10: 흡착물체 20: 로더10: adsorption object 20: loader

30: 고정부 40: 유량조절밸브30: fixed part 40: flow control valve

50: 공기공급부 60: 제 1유로50: air supply unit 60: the first euro

70: 제 2유로70: second euro

본 발명은 기류 흐름을 이용한 고정장치에 관한 것으로서, 더욱 상세하게는 고속의 기류 흐름에 의해 순간 저압으로 변하는 기압의 변화를 이용한 고정장치에 관한 것이다.The present invention relates to a holding device using the air flow, and more particularly to a holding device using a change in the air pressure changes to instantaneous low pressure by a high speed air flow.

반도체 제조 공정중 많은 공정에서 웨이퍼 고정장치를 사용한다. 공정중 웨이퍼를 이송할 경우, 웨이퍼가 파손되거나 이물질의 접합으로 인한 불량으로 사용되지 못하게 되는 경우가 발생한다.Many processes in the semiconductor manufacturing process use wafer holding devices. When the wafer is transported during the process, the wafer may be broken or may not be used due to a defect due to the bonding of foreign matter.

이러한 점을 해결하기 위한 다양한 기술들이 제안되어 사용되고 있다.Various techniques have been proposed and used to solve this problem.

종래에는 웨이퍼 고정에 사용되는 장치로 메카니컬 클램프(Mechanical Clamp)가 부착되어 웨이퍼의 표면을 압박하여 웨이퍼를 고정하거나 메카니컬 클램프(Mechanical Clamp) 없이 정전기의 원리를 이용하여 웨이퍼를 고정하는 것등이 사용되어 왔다. Conventionally, a device used to fix a wafer is a mechanical clamp that is attached to press the surface of the wafer to fix the wafer, or to fix the wafer using the principle of static electricity without a mechanical clamp. come.

하지만, 전자의 경우 웨이퍼의 표면이 손상될 수 있다는 단점이 있다.However, the former has a disadvantage that the surface of the wafer may be damaged.

그리고, 스퍼터링(Sputtering)에 의해 웨이퍼 상에 특정물질을 증착시켜 박막을 형성할 경우, 상기 특정물질이 웨이퍼와 클램프의 접촉면 사이에 침투하여 플라즈마에 의한 높은 온도에 의해 접착됨으로써 웨이퍼와 클램프가 접착되는 스티 킹(Sticking) 현상이 발생하게 된다.When a specific material is deposited on the wafer by sputtering to form a thin film, the specific material penetrates between the contact surface of the wafer and the clamp and is bonded by a high temperature by plasma, thereby adhering the wafer and the clamp. Sticking occurs.

후자의 경우 웨이퍼 후면에 파티클(Particle)이 발생되는 단점과 처킹력(Chucking Force)이 약한 곳에서는 웨이퍼와 하부 플레이트가 접촉할 정도로 웨이퍼 휨이 일어나지 않으므로 공정상 에러의 원인이 되는 요인를 갖고 있다.In the latter case, there are disadvantages in that particles are generated on the back surface of the wafer, and in the case where the chucking force is weak, wafer bending does not occur enough to contact the wafer and the lower plate, thereby causing a process error.

본 발명은 상기한 문제점을 해결하기 위하여 안출된 것으로, 흡착물체가 흡착물체 고정부와 직접적인 접촉이 없이 기류흐름을 이용한 압력차이에 의하여 흡착물체가 부양된 상태로 고정되는 장치를 제공하는 데 그 목적이 있다.The present invention has been made to solve the above problems, to provide an apparatus in which the adsorbent is fixed in a suspended state by the pressure difference using the airflow without direct contact with the adsorbent fixed part. There is this.

상기한 목적을 달성하기 위한 본 발명은 상측으로 관통 형성되는 제 1유로(60)와 상기 제 1유로(60)의 일단부와 연결되고 축선방향에 대하여 상부로 경사지게 상측부로 관통 형성되는 다수개의 제 2유로(70)를 포함하는 고정부(30); 상기 제 1유로(60)의 내경을 상기 다수개의 제 2유로(70)의 내경의 합보다 크게 형성함으로, 상기 제 2유로(70)를 통해 상기 고정부(30)의 상측부로 토출된 공기압이 대기압보다 작은 저기압으로 형성하도록 상기 제 1유로(60)의 일단부에 연결되어 공기를 공급하는 공기공급부(50); 및 상기 공기공급부(50)에 연결되어 공기의 유량을 조절하는 유량조절밸브(40)를 포함하는 기류 흐름을 이용한 고정장치이다.The present invention for achieving the above object is connected to the first passage 60 and the one end of the first passage 60 is formed to penetrate upwards and a plurality of agents formed to penetrate upwardly inclined upward with respect to the axial direction A fixed part 30 including two euros 70; Since the inner diameter of the first passage 60 is formed to be larger than the sum of the inner diameters of the plurality of second passages 70, the air pressure discharged to the upper portion of the fixing part 30 through the second passage 70 is reduced. An air supply unit 50 connected to one end of the first flow path 60 to supply air to form a low pressure smaller than atmospheric pressure; And a flow rate control valve 40 connected to the air supply unit 50 to adjust the flow rate of air.

상기 고정부(30)의 제 2유로(70)중 어느 하나의 상단부를 통해 토출되는 공 기의 흐름이 인접한 다른 제 2유로(70)의 상단부를 통해 토출되는 공기의 흐름과 겹치도록 상기 제 2유로(70)는 나선형으로 형성되는 것을 특징으로 한다.The flow of air discharged through the upper end of any one of the second flow paths 70 of the fixed portion 30 overlaps with the flow of air discharged through the upper end of another adjacent second flow path 70. The flow path 70 is characterized in that it is formed in a spiral.

본 발명은 베르누이(Bernoulli)의 원리를 적용하여, 기류 흐름에 의해 발생되는 기압차를 이용한 흡착물체 고정장치이다.The present invention is applied to the Bernoulli (Bernoulli) principle, the device for fixing the adsorption body using the pressure difference generated by the air flow.

상기 베르누이(Bernoulli)의 원리를 보면, 유체의 위치에너지와 운동에너지의 합이 항상 일정하다는 성질을 이용하고, 유체의 속도와 유체의 정압은 반비례하는 관계를 알 수 있다.From Bernoulli's principle, it is possible to use the property that the sum of potential energy and kinetic energy of a fluid is always constant, and the relationship between the velocity of the fluid and the static pressure of the fluid is inversely proportional.

유속이 상대적으로 빠른 곳은 순간적으로 저기압이 되고, 주변의 고기압 부분과 순간적으로 저기압이 된 부분은 상호간에 압력을 평형하게 유지하려는 작용으로 인하여, 고기압 부분에서 순간적으로 저기압이 된 부분으로 유체가 빨려들어가는 현상이 발생한다.The place where the flow velocity is relatively high becomes instantaneously low pressure, and the surrounding high pressure part and the instantaneous low pressure part suck the fluid from the high pressure part to the instantaneously low pressure part due to the action to balance the pressure between each other. Entering phenomenon occurs.

이러한 베르누이(Bernoulli)의 원리를 적용하여, 실생활에서는 비행기 날개의 형상을 볼 수 있다. 비행기 날개의 상측은 유선형, 하측은 직선형의 형상을 적용하여 유체의 흐르는 속도에 따른 기압차를 이용한 실례라 볼 수 있다.Applying Bernoulli's principle, we can see the shape of an airplane wing in real life. The upper side of the plane wing is a streamlined shape, the lower side is an example using a barometric pressure difference according to the flow rate of the fluid is applied.

이하, 본 발명을 실시예 및 도면을 통하여 상세히 설명한다.Hereinafter, the present invention will be described in detail through examples and drawings.

도 1은 본 발명의 적용에 따른 기류 흐름을 이용한 고정장치에 있어서, 상기 공기공급부(50)로부터 공기가 공급되기 전의 흡착물체(10)와 상기 고정부(30)를 도시한 개략도이다.1 is a schematic diagram showing an adsorption body 10 and the fixing unit 30 before the air is supplied from the air supply unit 50 in the fixing apparatus using the air flow according to the application of the present invention.

본 발명에서 상기 흡착물체는 반도체 제작재료인 웨이퍼를 생각해 볼 수 있 다.In the present invention, the adsorbent may be considered a wafer that is a semiconductor manufacturing material.

상기 흡착물체는 로더(20)에 의해 상기 고정부(30) 상측으로 이동되고, 상기 흡착물체(10)와 상기 고정부(30) 상부 사이의 거리는 d0을 유지한다.The adsorbent is moved above the fixed part 30 by the loader 20, and the distance between the adsorbed object 10 and the upper part of the fixed part 30 maintains d 0 .

도 2는 본 발명의 적용에 따른 기류 흐름을 이용한 고정장치에 있어서, 상기 공기공급부(50)로부터 공기가 공급된 후의 흡착물체(10), 상기 고정부(30) 및 기류흐름을 도시한 개략도이다.Figure 2 is a schematic diagram showing the adsorption object 10, the fixing part 30 and the airflow flow after the air is supplied from the air supply unit 50 in the fixing device using the air flow according to the application of the present invention. .

상기 제 1유로(60)의 내경을 상기 다수개의 제 2유로(70)의 내경의 합보다 크게 형성함으로 상기 제 2유로(70)를 통해 공기는 고속으로 토출된다.By forming the inner diameter of the first passage 60 to be greater than the sum of the inner diameters of the plurality of second passages 70, the air is discharged at high speed through the second passage 70.

공기는 직선으로 형성되는 상기 제 1유로(60)을 통하고, 나선형으로 형성되는 상기 제 2유로(70)을 통하여 상기 고정부(30) 상측부로 토출된다. 이때의 토출속도는 주변의 기압변화에 영향을 미칠 정도의 이동속도를 가진다.Air is discharged to the upper portion of the fixed portion 30 through the first flow path 60 formed in a straight line, and through the second flow path 70 formed in a spiral form. The discharge speed at this time has a moving speed that affects the change in the atmospheric pressure.

상기 제 2유로(70)을 통하여 토출되는 고속의 기류흐름으로 인하여, 상기 고정부(30) 상단부는 순간적으로 저기압이 형성된다.Due to the high speed airflow discharged through the second flow path 70, the upper end of the fixed part 30 is instantaneously formed with low pressure.

로더(20)에 의해 이동된 상기 흡착물체(10)의 하단부는 상기 저기압이 형성된 부분을 향하여 홀딩력을 갖게 되고, 상기 흡착물체(10)와 상기 고정부(30) 사이는 d1의 거리를 유지하며 상기 흡착물체(10)는 고정된다.The lower end of the adsorbent object 10 moved by the loader 20 has a holding force toward a portion where the low pressure is formed, and maintains a distance d 1 between the adsorbent object 10 and the fixed part 30. And the adsorbent body 10 is fixed.

도 3은 본 발명의 적용에 따른 기류 흐름을 이용한 고정장치에 있어서, 상기 도 2의 평면상에서의 기류흐름을 도시한 것이다.3 is a view showing the airflow on the plane of FIG. 2 in the fixing device using the airflow according to the application of the present invention.

상기 제 2유로(70)는 나선형으로 다수개가 형성되며, 상기 제 1유로(60) 및 제 2유로(70)를 통하여 상기 고정부(30) 상단부로 토출될 때는 상기 도 3처럼 선회형상의 기류흐름을 형성한다.A plurality of the second flow path 70 is formed spirally, and when discharged to the upper end of the fixed portion 30 through the first flow path 60 and the second flow path 70 as shown in FIG. To form a flow.

상기 제 2유로(70)중 어느 하나의 상단부를 통해 토출되는 공기의 토출로는 인접한 다른 제 2유로(70)의 상단부를 통해 토출되는 공기의 토출로와 중첩되게 하여서 상기 고정부(30)의 상측 공기층에 외부 공기가 유입되는 것을 차단시키는 것을 특징으로 한다. (도 4참조)The discharge path of the air discharged through the upper end of any one of the second flow paths 70 overlaps with the discharge path of the air discharged through the upper end of the other adjacent second flow path 70. It is characterized by blocking the outside air flows into the upper air layer. (See Fig. 4)

도 3의 빗금친 영역은 상기 고정부(30) 상측부의 외부 공기가 유입되지 않는 영역을 표현한 것으로서, 상기 빗금친 부분에는 상기 흡착물체(10)의 하단부에서 상기 고정부(30)의 상측부로 흡인력이 발생되는 영역이라고 볼 수 있다.The hatched area of FIG. 3 represents an area where external air does not flow in the upper part of the fixing part 30, and the suction power is applied to the upper part of the fixing part 30 from the lower end of the adsorption object 10 to the hatched part. This can be regarded as the generated area.

이로 인해, 상기 흡착물체(10)의 하단부가 상기 고정부(30)와 직접 접촉하지 않은 상태로 상기 흡착물체(10)를 처킹(Chucking)하는 것이 가능하다.For this reason, it is possible to chuck the adsorption object 10 in a state where the lower end portion of the adsorption object 10 does not directly contact the fixing part 30.

본 발명을 통하여 웨이퍼와 웨이퍼 고정부 사이에 직접적인 접촉이 없이 상기 웨이퍼를 고정시킬수 있으므로, 상기 웨이퍼와 웨이퍼 고정부 사이에 발생하는 스티킹(Sticking) 현상을 방지할 수 있다.According to the present invention, since the wafer can be fixed without direct contact between the wafer and the wafer holding portion, sticking phenomenon between the wafer and the wafer holding portion can be prevented.

그리고, 웨이퍼 표면에 발생하던 치핑(Chipping) 및 스크래칭(Scratching)등이 사라져 불량을 감소시킬 수 있다.In addition, chipping and scratching, which have occurred on the wafer surface, may be eliminated to reduce defects.

Claims (2)

상측으로 관통 형성되는 제 1유로(60)와 상기 제 1유로(60)의 일단부와 연결되고 축선방향에 대하여 상부로 경사지게 상측부로 관통 형성되는 다수개의 제 2유로(70)를 포함하는 고정부(30);Fixed portion including a plurality of second flow paths (70) connected to one end of the first flow path (60) formed through the upper side and the upper portion inclined upwardly with respect to the axial direction. 30; 상기 제 1유로(60)의 내경을 상기 다수개의 제 2유로(70)의 내경의 합보다 크게 형성함으로, 상기 제 2유로(70)를 통해 상기 고정부(30)의 상측부로 토출된 공기압이 대기압보다 작은 저기압으로 형성하도록 상기 제 1유로(60)의 일단부에 연결되어 공기를 공급하는 공기공급부(50); 및Since the inner diameter of the first passage 60 is formed to be larger than the sum of the inner diameters of the plurality of second passages 70, the air pressure discharged to the upper portion of the fixing part 30 through the second passage 70 is reduced. An air supply unit 50 connected to one end of the first flow path 60 to supply air to form a low pressure smaller than atmospheric pressure; And 상기 공기공급부(50)에 연결되어 공기의 유량을 조절하는 유량조절밸브(40)를 포함하고, Is connected to the air supply unit 50 includes a flow control valve 40 for adjusting the flow of air, 상기 고정부(30)의 제 2유로(70)중 어느 하나의 상단부를 통해 토출되는 공기의 흐름이 인접한 다른 제 2유로(70)의 상단부를 통해 토출되는 공기의 흐름과 겹치도록 상기 제 2유로(70)는 나선형으로 형성되는 기류 흐름을 이용한 고정장치.The second flow path such that the flow of air discharged through the upper end of any one of the second flow paths 70 of the fixed portion 30 overlaps with the flow of air discharged through the upper end of the other adjacent second flow path 70. 70 is a fixing device using a flow of air flow formed in a spiral. 삭제delete
KR1020070048300A 2007-05-17 2007-05-17 Fixing device using air current flow KR100840713B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070048300A KR100840713B1 (en) 2007-05-17 2007-05-17 Fixing device using air current flow

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070048300A KR100840713B1 (en) 2007-05-17 2007-05-17 Fixing device using air current flow

Publications (1)

Publication Number Publication Date
KR100840713B1 true KR100840713B1 (en) 2008-06-23

Family

ID=39772256

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070048300A KR100840713B1 (en) 2007-05-17 2007-05-17 Fixing device using air current flow

Country Status (1)

Country Link
KR (1) KR100840713B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109817556A (en) * 2017-11-21 2019-05-28 台湾积体电路制造股份有限公司 Transfer approach and transmission device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980077347A (en) * 1997-04-18 1998-11-16 윤종용 Contamination Prevention Baking Apparatus and Baking Method on Backside of Wafer
JP2003282668A (en) 2002-03-26 2003-10-03 Dainippon Screen Mfg Co Ltd Non-contact substrate holding device
KR20060059057A (en) * 2004-11-26 2006-06-01 가부시끼가이샤가이죠 Chuck for supporting substrate
JP2007073876A (en) 2005-09-09 2007-03-22 V Technology Co Ltd Work stage and exposure device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980077347A (en) * 1997-04-18 1998-11-16 윤종용 Contamination Prevention Baking Apparatus and Baking Method on Backside of Wafer
JP2003282668A (en) 2002-03-26 2003-10-03 Dainippon Screen Mfg Co Ltd Non-contact substrate holding device
KR20060059057A (en) * 2004-11-26 2006-06-01 가부시끼가이샤가이죠 Chuck for supporting substrate
KR100624882B1 (en) * 2004-11-26 2006-09-18 가부시끼가이샤가이죠 Chuck for supporting substrate
JP2007073876A (en) 2005-09-09 2007-03-22 V Technology Co Ltd Work stage and exposure device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109817556A (en) * 2017-11-21 2019-05-28 台湾积体电路制造股份有限公司 Transfer approach and transmission device
US11251063B2 (en) 2017-11-21 2022-02-15 Taiwan Semiconductor Manufacturing Company, Ltd. Article transporter in semiconductor fabrication
CN109817556B (en) * 2017-11-21 2022-02-25 台湾积体电路制造股份有限公司 Transmission method and transmission device

Similar Documents

Publication Publication Date Title
US8851133B2 (en) Method and apparatus of holding a device
JP2006216710A (en) Semiconductor manufacturing equipment
US9741596B2 (en) Bonding apparatus and bonding process method
CN108878341B (en) Wafer processing method
JP2008509024A5 (en)
WO2009075196A1 (en) Two-sided adhesive tape for semiconductor processing and tape for semiconductor processing
JP2010129845A (en) Electrostatic chuck and method for manufacturing the same
JP2019058981A (en) Holding tool and holding system
CN106469658B (en) Sheet adhesion device and adhesion method
JP6765751B2 (en) Work piece holding mechanism and processing equipment
KR100840713B1 (en) Fixing device using air current flow
TWI738888B (en) Vacuum bonding device for bonding devices
JP5530968B2 (en) Flow path parts
JP2014203904A (en) Vacuum suction device and suction plate
JP2006229027A (en) Wafer transfer device
KR20200114577A (en) Micro element absorption picker
CN102668059B (en) Vacuum chuck
JP6505762B2 (en) Gripping tool, gripping system, and method of manufacturing gripping portion
JP5250864B2 (en) Transport device
JP2014175541A (en) Wafer sticking method
JP2018129395A (en) Substrate processing device, control method of substrate processing device and program
CN108878340B (en) Wafer processing method
US9748140B1 (en) Method of manufacturing semiconductor devices
JP6255546B1 (en) Vacuum bonding equipment for bonding devices
KR100876965B1 (en) Chip pick-up tool for manufacturing semiconductor package

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130531

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20140602

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20150602

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20160610

Year of fee payment: 9

FPAY Annual fee payment

Payment date: 20180516

Year of fee payment: 11

FPAY Annual fee payment

Payment date: 20190509

Year of fee payment: 12