JP2007073876A - Work stage and exposure device - Google Patents

Work stage and exposure device Download PDF

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Publication number
JP2007073876A
JP2007073876A JP2005261982A JP2005261982A JP2007073876A JP 2007073876 A JP2007073876 A JP 2007073876A JP 2005261982 A JP2005261982 A JP 2005261982A JP 2005261982 A JP2005261982 A JP 2005261982A JP 2007073876 A JP2007073876 A JP 2007073876A
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Prior art keywords
substrate
work stage
pressure
gas
substrate support
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JP2005261982A
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JP4535972B2 (en
Inventor
Koichi Kajiyama
Yoshio Watanabe
康一 梶山
由雄 渡辺
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V Technology Co Ltd
株式会社ブイ・テクノロジー
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Abstract

<P>PROBLEM TO BE SOLVED: To perform uniform exposure by suppressing straining of a substrate surface. <P>SOLUTION: A work stage is equipped with a substrate support 12 which has its top surface 8 formed flatly, and has many blowoff holes 2 and many suction holes 3 bored in the top surface 8 to blow off compressed air to the outside and to suck external air respectively to support a substrate 4 without contacting; supply pipe 13 which supply the compressed air to the many blowoff holes 2 of the substrate support 12;, and a discharge pipe 14 which discharges the air sucked through the many suction holes 3 of the substrate support 12. The air is blown off to the substrate 4 on the substrate support 12, and the air is sucked to form an air layer 9 of specified thickness between the top surface 8 of the substrate support 12 and the substrate 4 to float the substrate 4. Further, the work stage is equipped with a valve 15 which is provided halfway in the discharge pipe 14 to control the flow rate of the discharged air and also introduce the external air, and a pressure control unit 16 which controls the valve 15 to control the amount of introduction of the external air and maintain the pressure in the suction holes 3 at specified pressure. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention allows a gas to be blown from the upper surface to a substrate supported above, and simultaneously sucks the gas to balance the blowing and sucking of the gas to generate a predetermined gas layer between the upper surface and the substrate. More specifically, the present invention relates to a work stage and an exposure apparatus that enable uniform exposure by suppressing generation of distortion on the substrate surface.

As shown in FIG. 4, the conventional work stage includes a box-shaped chamber 1, and a gas blowing hole 2 and a suction hole 3 are formed in the chamber 1. An air blower is connected to the blowout hole 2 via a pipe line (not shown), and when the air blower is driven based on a command from a control unit (not shown), the gas fed through the pipe is pumped. Is blown out from the blowout hole 2 toward the lower surface 4a of the substrate 4 to float the substrate 4, and an intake blower is connected to the suction hole 3 via a pipe line (not shown), from the control device. When the intake blower is driven based on the command, the suction force acts on the substrate 4 so that the substrate 4 is attracted downward (see, for example, Patent Document 1).
Japanese Patent Laying-Open No. 2005-154040 (FIG. 4)

  However, in such a conventional work stage, the pressure inside the suction hole 3 cannot be kept constant. For example, as shown in FIG. When it was conveyed in the direction and gradually covered from the edge of the suction hole 3, the flow rate of the outside air indicated by the arrow B sucked into the suction hole 3 decreased, and the pressure inside the suction hole 3 decreased. Therefore, the differential pressure between the inside of the suction hole 3 and the outside air is increased, and the edge 4b of the substrate 4 passing over the suction hole 3 may be pulled and distorted inside the suction hole 3. Therefore, when such a conventional work stage is used in an exposure apparatus as a stage for supporting the substrate 4 coated with a photosensitive material, the substrate 4 is distorted and the surface is undulated, and uniform exposure is performed. There was a risk of not being able to.

  In view of the above, an object of the present invention is to provide a work stage and an exposure apparatus that can cope with such problems and enable uniform exposure by suppressing the occurrence of distortion on the substrate surface.

  In order to achieve the above object, the work stage according to the first aspect of the present invention has a flat upper surface, a large number of blowing holes that open to the upper surface and blow compressed gas to the outside, and a large number of sucking gases from the outside. A substrate support that supports the substrate in a non-contact manner by providing a suction hole, a supply pipe that supplies compressed gas to a number of blowing holes of the substrate support, and a gas sucked through the number of suction holes of the substrate support A gas pipe having a predetermined thickness between the upper surface of the substrate support and the substrate by blowing out gas to the substrate on the substrate support and sucking the gas. And a work stage for levitating the substrate, which is provided in the middle of the exhaust pipe, adjusts the exhaust flow rate and allows introduction of outside air, and controls the valve to adjust the introduction amount of outside air, Inside the suction hole A pressure adjustment unit to maintain a force at a predetermined pressure, those having a.

  With such a configuration, the substrate support is provided by supplying compressed gas to the blowout holes of the substrate support provided with a large number of blowout holes and a large number of suction holes by opening on the upper surface of the flat substrate. A gas is blown out to the upper substrate, the gas is sucked from the suction hole and exhausted by the exhaust pipe, and a valve provided in the middle of the exhaust pipe is controlled by the pressure adjustment unit to adjust the amount of outside air introduced, The exhaust flow rate of the exhaust pipe is adjusted to maintain the pressure inside the suction hole at a predetermined pressure, thereby generating a gas layer having a predetermined thickness between the upper surface of the substrate support and the substrate, and Make it rise.

  Further, the substrate support body is provided with a sintered body having a large number of fine pores continuous in the vertical direction inside the box body whose upper part is opened, closing the upper part of the box body, The air hole is used as the blowout hole, and a hole penetrating the sintered body in the vertical direction is formed as the suction hole. As a result, a compressed gas is blown out using a large number of fine pores continuous in the vertical direction of the sintered body provided by closing the upper portion of the box body inside the box body with the upper part opened, and the sintered body A hole penetrating in the vertical direction is drilled in to suck out external gas as a suction hole.

  Further, the supply pipe is connected to the box, and the exhaust pipe is connected to a suction hole formed in the sintered body. Compressed gas is supplied to the blowout hole by a supply pipe connected to the box, and external gas sucked from the suction hole is exhausted by an exhaust pipe connected to a suction hole formed in the sintered body.

  The pressure adjustment unit includes a pressure sensor that detects a pressure inside the suction hole, a storage unit that stores a target value of pressure determined by measurement in advance, an output of the pressure sensor, and a target of the storage unit The calculation unit includes a calculation unit that calculates a deviation amount from the value and a drive unit that opens and closes the valve so that the deviation amount falls within a predetermined range. Thereby, the target value of the pressure determined in advance by the storage means is stored, the pressure inside the suction hole is detected by the pressure sensor, the output of the pressure sensor and the target value read from the storage means by the calculation unit, And the valve is driven to open and close so that the amount of deviation falls within a predetermined range by the drive unit, and the pressure inside the suction hole is set to a predetermined pressure.

  An exposure apparatus according to a second aspect of the present invention is provided on a substrate transport path of a substrate that holds both ends of a substrate coated with a photosensitive material and conveys the substrate in a predetermined direction at a constant speed. Provided with a plurality of blowing holes for opening compressed air to the outside by opening on the flat upper surface and a plurality of suction holes for sucking gas from the outside, and maintaining the pressure inside the suction hole at a predetermined pressure. A work stage that generates a gas layer having a predetermined thickness between the upper surface and the substrate transported by the transport means to float the substrate, and is disposed above the work stage and is not in contact with the work stage. And an exposure optical system for forming a predetermined exposure pattern by irradiating the substrate transported in step (b) with exposure light through a photomask.

  With such a configuration, the both ends of the substrate coated with the photosensitive material are held by the transfer means and transferred at a constant speed in a predetermined direction, and are arranged on the transfer path of the substrate of the transfer means and formed flat. The work surface provided with a large number of blowing holes that open to the upper surface and blow out compressed gas to the outside and a large number of suction holes that suck the gas from the outside maintain the pressure inside the suction holes at a predetermined pressure, and A gas layer having a predetermined thickness is generated between the substrate transported by the transport means and the substrate is levitated, and a photomask is applied to the substrate coated with the photosensitive material transported on the work stage by the exposure optical system. A predetermined exposure pattern is formed by irradiating with exposure light.

  Furthermore, the work stage is provided with a through-hole penetrating in the vertical direction in a portion corresponding to an exposure light irradiation region by the exposure optical system so that the exposure light transmitted through the substrate passes downward. . The exposure light transmitted through the substrate is released downward through a through hole provided in a vertical direction in a portion corresponding to an exposure light irradiation region by the exposure optical system.

  According to the work stage of the first aspect, the pressure inside the suction hole can be kept constant even when the substrate passes over the suction hole that opens on the upper surface of the substrate support. It is possible to suppress the occurrence of distortion on the substrate surface without being pulled inside the hole.

  Moreover, according to the invention which concerns on Claim 2, many fine void | holes continued to the up-down direction which the sintered compact originally has inside can be utilized as a blowing hole. Therefore, gas can be blown uniformly over the entire upper surface of the substrate support. In this case, since the blowout holes are fine, the gas blowout power can be reduced. Therefore, the thickness of the gas layer between the upper surface of the substrate support and the substrate can be easily reduced.

  Furthermore, according to the invention which concerns on Claim 3, compressed gas can be supplied uniformly to many holes of a sintered compact. Therefore, gas can be blown uniformly over the entire upper surface of the substrate support.

  And according to the invention which concerns on Claim 4, it can adjust automatically so that the pressure inside a suction hole may be maintained at a predetermined pressure. Therefore, it is easy to adjust the pressure inside the suction hole in order to suppress the occurrence of distortion of the substrate surface.

  According to the exposure apparatus of the fifth aspect, the pressure inside the suction hole can be kept constant even when the substrate passes over the suction hole opened on the upper surface of the substrate support. Is not pulled inside the suction hole, and the occurrence of distortion of the substrate surface can be suppressed. Therefore, the photosensitive material applied to the substrate surface can be uniformly exposed. Thereby, an exposure pattern can be formed with high accuracy.

  According to the sixth aspect of the present invention, when the substrate is transparent, the exposure light transmitted through the substrate is diffusely reflected on the upper surface of the work stage and returns to the substrate side to expose portions other than the predetermined region. There is no fear of it. Therefore, the exposure pattern can be formed with higher accuracy.

  Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a front view showing an embodiment of an exposure apparatus according to the present invention. This exposure apparatus forms a predetermined exposure pattern by irradiating a substrate coated with a photosensitive substance with exposure light through a photomask. A conveying means 5, a work stage 6, and an exposure optical system 7 are used. It consists of.

  The conveying means 5 holds both ends of the substrate 4 coated with a photosensitive material and conveys the substrate 4 at a constant speed in the direction indicated by the arrow A in FIG. It is provided on both sides in the direction orthogonal to the (A direction). A specific example is, for example, a plurality of transport rollers arranged in the transport direction as shown in FIG. In this case, the transport means 5 sinks downward by a predetermined amount due to the weight of the substrate 4 and the suction force by the suction holes 3.

  A work stage 6 is provided on the transfer path of the transfer means 5. The work stage 6 is provided with a plurality of blowing holes that open to a flat upper surface 8 and blow out compressed gas to the outside, and a large number of suction holes that suck the gas from the outside. 1 to generate a gas layer 9 having a predetermined thickness between the upper surface 8 and the substrate 4 transported by the transport means 5 to float the substrate 4 in the direction of arrow A shown in FIG. The substrate 4 can be conveyed by contact. Furthermore, a through hole 10 penetrating in the vertical direction is provided in a portion corresponding to an exposure light irradiation region by an exposure optical system 7 to be described later, so that the exposure light transmitted through the substrate 4 can go downward through the through hole 10. I have to. Specifically, as shown in FIG. 2, the unit work stages 11 whose upper surfaces are rectangular are arranged in a quadrangular shape, and the pair of unit work stages 11 are conveyed by the arrow A in the longitudinal direction in the figure. A pair of unit work stages 11 are arranged in parallel to the conveying direction outside the both ends of the pair of unit work stages 11 so as to be orthogonal to each other at a predetermined distance. . Each unit work stage 11 includes a substrate support 12, a supply pipe 13, an exhaust pipe 14, a valve 15, and a pressure adjustment unit 16, as shown in FIG. 3.

  The substrate support 12 includes a rectangular parallelepiped sintered body 18 having a large number of fine pores continuous in the vertical direction inside a rectangular parallelepiped box 17 having an open top. The upper portion of the box body 17 is closed so that a portion 17a is formed, and a large number of holes of the sintered body 18 are used as the blowout holes 2, and penetrates the sintered body 18 in the vertical direction. The suction hole 3 is formed by making a hole to be formed. In this case, as shown in FIG. 2, a large number of suction holes 3 are formed in, for example, three rows along the longitudinal direction of the sintered body 18.

  At least one supply pipe 13 is provided on the bottom 17 b of the box 17 of the substrate support 12. This supply pipe 13 supplies compressed gas, for example, clean air, to a number of blowout holes 2, one end of which is connected to the hollow portion 17 a of the box body 17, and the other end is an air supply blower (not shown). It is connected to the.

  A single exhaust pipe 14 is connected to the suction hole 3 formed in the sintered body 18 of the substrate support 12. The exhaust pipe 14 exhausts the gas sucked through a large number of suction holes 3, and one end side branches as a branch pipe 14 a in accordance with the number of the suction holes 3, and the respective end parts thereof are suction holes 3. The other end is connected to an intake blower (not shown).

  A valve 15 is provided in the middle of the exhaust pipe 14. The valve 15 is an electromagnetic valve that adjusts the exhaust gas flow rate and allows outside air to be introduced. For example, the valve 15 is an electromagnetic valve that opens and closes in response to an electrical signal.

  A pressure adjusting unit 16 is connected to the valve 15 by a signal line L. The pressure adjusting unit 16 controls the valve 15 to adjust the amount of outside air introduced, and maintains the pressure inside the suction hole 3 at a predetermined pressure. The pressure adjusting unit 16 includes a pressure sensor 19, a memory 20, and a calculation unit. The unit 21 and the drive unit 22 are included.

  The pressure sensor 19 is provided inside the portion where the branch pipe 14a of the exhaust pipe 14 joins, and detects the internal pressure. The memory 20 stores the best pressure (target value) found by measurement in advance and serves as storage means. Further, the calculation unit 21 compares the output value of the pressure sensor 19 with the output value of a pressure sensor that detects the pressure of outside air provided separately to obtain the differential pressure, and reads the differential pressure from the memory 20. The amount of deviation from the target value is calculated. The drive unit 22 opens and closes the valve 15 so that the deviation from the target value is within a predetermined range (preferably substantially zero) based on the calculation result of the calculation unit 21. The predetermined range is an allowable range of deviation from the target value such that the amount of deflection of the edge 4b of the substrate 4 shown in FIG. 5 falls within the allowable value. It is determined by size and rigidity.

  An exposure optical system 7 is disposed above the work stage 6 as shown in FIG. The exposure optical system 7 forms a predetermined exposure pattern by irradiating exposure light through a photomask 23 onto a substrate 4 coated with a photosensitive material conveyed on the upper surface 8 of the work stage 6. A light source 24, a mask stage 25, and a condenser lens 26.

  The light source 24 emits exposure light including ultraviolet rays, and is, for example, an ultrahigh pressure mercury lamp, a xenon lamp, an ultraviolet laser oscillator, or the like. Further, the mask stage 25 is disposed in the vicinity of the upper surface 8 of the work stage 6. The mask stage 25 holds the strip-shaped photomask 23 in a plane parallel to the upper surface 8 so that the longitudinal direction thereof is orthogonal to the transport direction (arrow A direction). The photomask 23 is formed with a plurality of mask patterns 27 arranged along the longitudinal direction. Further, a condenser lens 26 is disposed between the light source 24 and the mask stage 25. The condenser lens 26 is used to vertically irradiate the exposure light emitted from the light source 24 onto the photomask 23 held on the mask stage 25, and the focal position thereof is a condensing point of the light source 24. It is located in the vicinity.

Next, the operation of the exposure apparatus configured as described above will be described.
First, the transport means 5 is activated, and the substrate 4 having a photosensitive material coated on the surface is held by the transport means 5 and transported in the direction of arrow A shown in FIG. At this time, for example, clean air of compressed gas supplied through the supply pipe 13 is blown out from the blow hole 2 of the work stage 6 shown in FIG. 3 onto the upper surface 8, and gas is sucked from the suction hole 3. Yes.

  When the substrate 4 transported by the transport means 5 reaches the upper surface 8 of the work stage 6, the compressed gas blown from the blowout holes 2 is blown onto the lower surface 4 a of the substrate 4, so that the substrate 4 is placed on the upper surface 8 of the work stage 6. Surface. On the other hand, since the blown-out gas is sucked from the suction hole 3, the substrate 4 that has floated is attracted to the upper surface 8 side of the work stage 6. At this time, if the gas suction by the suction hole 3 is adjusted to be stronger than the gas blown from the blow hole 2, a thin gas layer 9 is formed between the lower surface 4 a of the substrate 4 and the upper surface 8 of the work stage 6. As a result, the substrate 4 floats and is transported on the work stage 6 in a non-contact manner.

  In this case, the edge 4 b of the substrate 4 gradually covers the suction hole 3 on the upper surface 8 of the work stage 6 as the substrate 4 moves. At the same time, the outside air sucked into the suction hole 3 indicated by the arrow B in FIG. 3 decreases, and the pressure inside the suction hole 3 decreases.

  At this time, as shown in FIG. 3, the pressure drop in the suction hole 3 is detected by the pressure sensor 19 of the pressure adjustment unit 16, and the output is sent to the calculation unit 21. The calculation unit 21 compares the input pressure signal with a value of a pressure sensor that detects an external air pressure provided separately to obtain a differential pressure, and reads a target value of the pressure that is measured in advance and stored in the memory 20. Compare the two. Then, the drive unit 22 is driven to open the valve 15 so that the amount of deviation from the target value is within a predetermined range (preferably substantially zero), and the outside air is exhausted from the exhaust pipe as indicated by an arrow C in FIG. 14 and the exhaust flow rate is made constant. As a result, the pressure inside the junction part of the branch pipe 14a of the exhaust pipe 14, that is, the pressure inside the suction hole 3 becomes constant, the differential pressure between the inside of the suction hole 3 and the outside air is kept constant, and the edge 4b of the substrate 4 is sucked. The amount of distortion caused by being pulled inside the hole 3 is in an allowable range. Therefore, the surface of the substrate 4 is kept uniform or substantially uniform.

  Next, exposure light is radiated from the light source 24 shown in FIG. 1, and this exposure light is converted into parallel light by the condenser lens 26 and irradiates the photomask 23 held on the mask stage 25 vertically. Further, the exposure light that has passed through the photomask 23 irradiates the upper surface 8 of the work stage 6 vertically onto the substrate 4 that is conveyed in the direction of arrow A shown in FIG. As a result, the mask pattern 27 formed on the photomask 23 is transferred to the photosensitive material applied to the surface of the substrate 4. In this case, the exposure light transmitted through the substrate 4 passes through a through hole 10 provided on the work stage 6 in the vertical direction downward. Therefore, the exposure light that has passed through the substrate 4 is not diffusely reflected, for example, at the edge of the suction hole 3 on the upper surface 8 and returned to the substrate 4 side, so that a portion different from the predetermined region is not exposed. If a light absorber is provided below the through hole 10, the exposure light transmitted through the substrate 4 can be absorbed and removed.

  In the above description, although the case where the through hole 10 is provided in the work stage 6 has been described, the present invention is not limited thereto, and the through hole 10 may not be provided. Further, the conveying means 5 is not limited to the one in which the conveying rollers are arranged, and any means may be used as long as it can convey while holding both ends of the substrate. Furthermore, the work stage 6 is not limited to that used in the exposure apparatus.

It is a front view which shows embodiment of the exposure apparatus by this invention. It is a top view which shows the principal part of the said exposure apparatus. It is explanatory drawing of the work stage shown in the cross section of XX in FIG. It is sectional drawing which shows the principal part of the conventional work stage. It is explanatory drawing which shows the state in which the edge part of the board | substrate was distorted in the conventional work stage.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 ... Outlet 3 ... Suction hole 4 ... Substrate 5 ... Conveying means 6 ... Work stage 7 ... Exposure optical system 8 ... Upper surface 9 ... Gas layer 10 ... Through-hole 11 ... Unit work stage 12 ... Substrate support 13 ... Supply pipe 14 ... exhaust pipe 15 ... valve 16 ... pressure adjusting unit 17 ... box 17a ... hollow part 18 ... sintered body 19 ... pressure sensor 20 ... memory (memory means)
21 ... Calculation unit 22 ... Drive unit 23 ... Photomask

Claims (6)

  1. A substrate support that has a flat upper surface, and is provided with a plurality of blowing holes that open to the upper surface and blow compressed gas to the outside and a plurality of suction holes that suck the gas from the outside to support the substrate in a non-contact manner;
    A supply pipe for supplying a compressed gas to a plurality of outlet holes of the substrate support;
    An exhaust pipe for exhausting the gas sucked through a plurality of suction holes of the substrate support;
    A workpiece that blows out gas to the substrate on the substrate support and sucks the gas to generate a gas layer having a predetermined thickness between the upper surface of the substrate support and the substrate to float the substrate Stage,
    A valve provided in the middle of the exhaust pipe to adjust the exhaust flow rate and to introduce outside air;
    A pressure adjusting unit that controls the valve to adjust the amount of outside air introduced, and maintains the pressure inside the suction hole at a predetermined pressure;
    Work stage characterized by having
  2.   The substrate support is provided with a sintered body having a large number of fine vacancies continuous in the vertical direction inside the box with the upper part open, with the upper part of the box closed, and the cavities of the sintered body 2. The work stage according to claim 1, wherein the suction hole is formed as a suction hole by forming a hole penetrating in the vertical direction in the sintered body.
  3.   3. The work stage according to claim 2, wherein the supply pipe is connected to the box and the exhaust pipe is connected to a suction hole formed in the sintered body.
  4.   The pressure adjustment unit includes a pressure sensor for detecting the pressure inside the suction hole, storage means for storing a target value of pressure determined by measurement in advance, an output of the pressure sensor, and a target value of the storage means. 4. The method according to claim 1, further comprising: a calculation unit that calculates a deviation amount of the first valve, and a drive unit that drives the valve to open and close so that the deviation amount falls within a predetermined range. Work stage.
  5. Conveying means for holding both ends of the substrate coated with the photosensitive material and conveying the substrate in a predetermined direction at a constant speed;
    The suction means is provided on the transport path of the substrate of the transport means, and is provided with a plurality of blowing holes that open on a flatly formed upper surface and blow out compressed gas to the outside, and a plurality of suction holes that suck the gas from the outside. A work stage for maintaining the pressure inside the hole at a predetermined pressure and generating a gas layer having a predetermined thickness between the upper surface and the substrate transported by the transport means to float the substrate;
    An exposure optical system which is disposed above the work stage and forms a predetermined exposure pattern by irradiating exposure light through a photomask to the substrate which is conveyed in a non-contact manner on the work stage;
    An exposure apparatus comprising:
  6. The work stage is provided with a through-hole penetrating in a vertical direction in a portion corresponding to an exposure light irradiation region by the exposure optical system, so that the exposure light transmitted through the substrate passes downward through the through-hole. 6. An exposure apparatus according to claim 5, wherein:





JP2005261982A 2005-09-09 2005-09-09 Work stage and exposure apparatus Active JP4535972B2 (en)

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007145072A1 (en) * 2006-06-14 2007-12-21 Nsk Ltd. Supporting apparatus
KR100840713B1 (en) 2007-05-17 2008-06-23 로체 시스템즈(주) Fixing device using air current flow
JP2008300412A (en) * 2007-05-29 2008-12-11 Tokyo Electron Ltd Gas treatment apparatus
JP2008310163A (en) * 2007-06-15 2008-12-25 Nsk Ltd Proximity scanning exposure apparatus and its illuminance control method
JP2008310249A (en) * 2007-06-18 2008-12-25 Nsk Ltd Proximity scanning exposure apparatus and its control method
JP2009080042A (en) * 2007-09-26 2009-04-16 Oht Inc Circuit pattern inspection device
JP2011044712A (en) * 2009-08-20 2011-03-03 Nikon Corp Object moving device, object processing device, exposure device, object inspection device, and method for manufacturing device
JP2011238927A (en) * 2010-05-11 2011-11-24 Asml Netherlands Bv Apparatus and method for contactless handling of object
CN104495391A (en) * 2014-11-07 2015-04-08 江苏科技大学 Air floatation conveyer
CN108996242A (en) * 2018-08-17 2018-12-14 通彩智能科技集团有限公司 A kind of contactless air bearing jaw arrangement

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002181714A (en) * 2000-12-19 2002-06-26 Ishikawajima Harima Heavy Ind Co Ltd Thin plate inspection device
JP2004262608A (en) * 2003-03-03 2004-09-24 Orbotech Ltd Air flotation device
JP2005154040A (en) * 2003-11-21 2005-06-16 Ishikawajima Harima Heavy Ind Co Ltd Substrate conveying apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002181714A (en) * 2000-12-19 2002-06-26 Ishikawajima Harima Heavy Ind Co Ltd Thin plate inspection device
JP2004262608A (en) * 2003-03-03 2004-09-24 Orbotech Ltd Air flotation device
JP2005154040A (en) * 2003-11-21 2005-06-16 Ishikawajima Harima Heavy Ind Co Ltd Substrate conveying apparatus

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007145072A1 (en) * 2006-06-14 2007-12-21 Nsk Ltd. Supporting apparatus
KR100840713B1 (en) 2007-05-17 2008-06-23 로체 시스템즈(주) Fixing device using air current flow
JP2008300412A (en) * 2007-05-29 2008-12-11 Tokyo Electron Ltd Gas treatment apparatus
JP4714185B2 (en) * 2007-05-29 2011-06-29 東京エレクトロン株式会社 Gas processing equipment
JP2008310163A (en) * 2007-06-15 2008-12-25 Nsk Ltd Proximity scanning exposure apparatus and its illuminance control method
JP2008310249A (en) * 2007-06-18 2008-12-25 Nsk Ltd Proximity scanning exposure apparatus and its control method
JP2009080042A (en) * 2007-09-26 2009-04-16 Oht Inc Circuit pattern inspection device
JP2011044712A (en) * 2009-08-20 2011-03-03 Nikon Corp Object moving device, object processing device, exposure device, object inspection device, and method for manufacturing device
JP2011238927A (en) * 2010-05-11 2011-11-24 Asml Netherlands Bv Apparatus and method for contactless handling of object
CN104495391A (en) * 2014-11-07 2015-04-08 江苏科技大学 Air floatation conveyer
CN108996242A (en) * 2018-08-17 2018-12-14 通彩智能科技集团有限公司 A kind of contactless air bearing jaw arrangement

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