KR100835818B1 - Anisotropic conductive film composition and anisotropic conductive film prepared therefrom - Google Patents

Abstract

An anisotropic conductive film composition is provided to have excellent long-term reliance because the composition shows high adhesiveness by heating and pressing and retains good adhesion even under a severe condition of high temperature and high humidity. An anisotropic conductive film composition includes 20-60wt% of a cross-linkable rubber resin, 36-76wt% of a radically polymerizable material, 0.8-4.0wt% of a radical initiator combination comprising at least one first radical initiator selected from the group containing diacylperoxide, peroxydicarbonate, and peroxyester, and at least one second radical initiator selected from peroxyketal and dialkylperoxide, and 0.2-20wt% of conductive particles.

Description

Anisotropic conductive film composition and anisotropic conductive film manufactured therefrom {ANISOTROPIC CONDUCTIVE FILM COMPOSITION AND ANISOTROPIC CONDUCTIVE FILM PREPARED THEREFROM}

The present invention relates to an anisotropic conductive film composition and an anisotropic conductive film produced therefrom, and more particularly an anisotropic conductive, characterized in that the long-term reliability is improved, including a combination of a crosslinkable rubber resin and a radical initiator expressing a complex curing reaction It relates to a film composition and an anisotropic conductive film produced therefrom.

Anisotropic conductive film (hereinafter referred to as "ANF") is a film that exhibits anisotropy with respect to conductivity, while maintaining insulation on the x-y plane of the film, while exhibiting conductivity on the z-axis. Anisotropic conductive films are generally prepared by dispersing conductive particles such as metal particles or polymer particles coated with a metal in an insulating adhesive. When the anisotropic conductive film is placed between the circuits to be connected and thermally compressed, conductive particles are contacted and electrically connected between the upper and lower circuit terminals, and an insulating adhesive resin is filled in the spaces between the left and right adjacent circuits, thereby providing high insulating properties. Will be given.

With the recent trend toward larger and thinner display devices, the pitch between electrodes and circuits is also becoming smaller. As one of wiring mechanisms for connecting such fine circuit terminals, an anisotropic conductive film plays a very important role. As a result, anisotropic conductive films are in the limelight as connection materials, such as chip on glass mounting and chip on film mounting.

Existing anisotropic conductive films include an epoxy type in which an epoxy or phenolic resin and a hardened portion made of a curing agent are mixed in a binder resin portion which acts as a matrix for forming a film, and a (meth) acrylic oligomer, monomer and radical initiation in the binder resin portion. There is the (meth) acrylate type which mixed the hardening part which consists of agents.

However, since the polymer resin of low glass transition temperature is mainly used as the binder portion of the conventional anisotropic conductive film, the binder portion not only plays a role as a film former and does not significantly contribute to initial adhesive force or connection reliability, but also within the connection structure. Shrinkage and expansion are repeated and there is a limit that cannot guarantee long term connection and adhesion reliability.

Existing epoxy type anisotropic conductive film is difficult to temporarily fix to the connection layer because it is not sticky, poor workability, very high reaction temperature, difficult process control and maintenance of the connection device, and lack of long-term reliability have.

In addition, the (meth) acrylate type anisotropic conductive film has a large flow rate in the connection layer due to the difference in rheological properties of the binder resin portion and the hardened portion when the reaction rate is slowly adjusted to ensure contact between the conductive particles and the circuit. There is a problem that can not guarantee the long-term reliability by the bubbles generated, on the contrary, when the reaction rate is quickly controlled, there is a problem that the conductive particles do not make sufficient contact with the circuit and thus can not ensure good connection reliability.

The anisotropic conductive film prepared by mixing the thermoplastic resin in the binder portion to compensate for this problem has a low connection resistance and high adhesion, but the water resistance (weak water resistance) weak delamination over time under severe conditions such as high temperature and high humidity There is a problem that can occur as a significantly lower reliability due to the occurrence of such properties, and also hard to exhibit physical properties at low temperatures can act as a inhibiting factor of the curing reaction.

 The present invention is to overcome the above-mentioned problems of the prior art, one object of the present invention is a combination of a crosslinkable rubber resin excellent in adhesion and high adhesive strength by heating pressure and a radical initiator expressing a complex curing reaction It is to provide an anisotropic conductive film composition excellent in long-term reliability, including an anisotropic conductive film produced therefrom.

Another object of the present invention is to provide an anisotropic conductive film capable of completing a circuit connection by a short heating and pressing process time and improving productivity.

One aspect of the present invention for achieving the above object is

(a) crosslinkable rubber resins;

(b) radically polymerizable materials;

(c) at least one first radical initiator selected from the group consisting of diacylperoxides, peroxydicarbonates and peroxyesters;

(d) at least one second radical initiator of peroxyketal and dialkylperoxide, and

(e) Electroconductive particle is included, It is related with the anisotropic conductive film composition.

The anisotropic conductive film composition of the present invention

20 to 60% by weight of crosslinkable rubber resin;

36 to 76% by weight radically polymerizable material;

0.8 to 4.0 wt% of the first radical initiator and the second radical initiator;

It may contain 0.2 to 20% by weight of the conductive particles.

In the anisotropic conductive film composition according to the present invention, the crosslinkable rubber resin is an olefin resin, butadiene resin, acrylonitrile butadiene copolymer, carboxyl terminal acrylonitrile butadiene copolymer, polyvinyl butyral resin, phenoxy resin, and any of these. It may be used selected from the group consisting of a mixture of.

In the present invention, the radically polymerizable material may use an acrylate type, and may further include monomers, oligomers, and phosphate esters capable of radical polymerization.

The half-life 10 hour temperature of the second radical initiator comprising at least one of peroxyketal and dialkylperoxide in the present invention is the first radical selected from diacylperoxide, peroxydicarbonate, peroxyester and mixtures thereof It is preferable that it is 10 degreeC phase higher than the half-life temperature of the initiator for 10 hours.

Another aspect of the present invention for achieving the above object relates to an anisotropic conductive film formed by coating and drying the anisotropic conductive resin composition of the present invention on a sheet for peeling.

Hereinafter, the present invention will be described in more detail.

The anisotropic conductive film composition of this invention is characterized by including the crosslinkable rubber resin which is excellent in adhesiveness, and exhibits high pressure adhesiveness, and the complex radical initiator system which expresses low temperature hardening property and an aging effect.

In one aspect, the anisotropic conductive film composition of an embodiment of the invention

(a) crosslinkable rubber resins;

(b) radically polymerizable materials;

(c) at least one first radical initiator selected from the group consisting of diacylperoxides, peroxydicarbonates and peroxyesters;

(d) at least one second radical initiator of peroxyketal and dialkylperoxide, and

(e) It is characterized by including electroconductive particle.

The crosslinkable rubber resin used in the present invention is selected from olefin resin, butadiene resin, acrylonitrile butadiene copolymer, carboxyl terminal acrylonitrile butadiene copolymer, polyvinyl butyral resin, phenoxy resin and mixtures thereof Can be used. Since such a crosslinkable rubber resin exhibits high pressure adhesiveness, it is possible to provide good connection of circuit terminals by exhibiting excellent adhesive force and adhesiveness by the heating and pressing circuit connection process of the anisotropic conductive film.

In the anisotropic conductive film composition of the present invention, the content of the crosslinkable rubber resin is 20 to 60% by weight, preferably 30 to 50% by weight. When the content of the crosslinkable rubber resin is less than 20% by weight, there is a fear that the expression of adhesion is insufficient, and when it exceeds 60% by weight, the curing performance may be deteriorated due to the lack of radical curing reaction.

In addition, in the present invention, the crosslinkable rubber resin may have a weight average molecular weight in the range of 10,000 to 1,000,000. When the weight average molecular weight of the crosslinkable rubber resin is less than 10,000, the film strength is not expressed, the adhesiveness may be excessive, and the film may not be properly formed. When the molecular weight exceeds 1,000,000, the miscibility deteriorates and the anisotropic conductive film Phase separation may occur during the preparation of the composition.

In the present invention, a radical polymerizable material is used as a hardening part to cause a curing reaction to ensure adhesion and connection reliability between the connection layers. The radically polymerizable material usable in the present invention is not particularly limited, and any radical polymerizable material can be used. Examples of radically polymerizable materials include, but are not necessarily limited to, acrylates, methacrylates, maleimide compounds, and mixtures thereof. As a radically polymerizable substance, not only a polymer but also a monomer or an oligomer can be used alone or a monomer and an oligomer can be used together.

In addition, the anisotropic conductive film composition of the present invention may contain 0.5 to 8% by weight of phosphate ester as a radical polymerizable material in order to improve the adhesive strength and room temperature stability. Examples of radically polymerizable materials having a phosphate ester structure include, but are not necessarily limited to, 2-methacryloyloxyethyl acid phosphate, 2-acryloyloxyethyl phosphate, and the like.

Specific examples of acrylates (methacrylates) include methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate and trimetholpropane triacrylate. , Tetramethylol methane tetraacrylate, 2-hydroxy-1,3-diacryloxypropane, 2,2-bis [4- (acryloxypolymethoxy) phenyl] propane, 2,2-bis [4- (Acryloxypolyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, tris (acryloyloxyethyl) isocyanorate is used alone Or a combination of two or more thereof.

As a maleimide compound, what contains at least 2 maleimide group in a molecule | numerator can be used. As such a maleimide compound, 1-methyl-2, 4-bismaleimide benzene, N, N'-m-phenylene bismaleimide, N, N'-p-phenylene bismaleimide, N, N'- m-toylene bismaleimide, N, N'-4,4- biphenylene bismaleimide, N, N'-4,4- (3,3'- dimethyl biphenylene) bismaleimide, N, N'-4,4- (3,3'- dimethyl diphenyl methane) bismaleimide, N, N'-4,4- (3,3'- diethyl diphenyl methane) bismaleimide, N, N '-4,4-diphenylmethanebismaleimide, N, N'-4,4-diphenylpropanebismaleimide, N, N'-4,4-diphenyletherbismaleimide, N, N'- 3,3'- diphenyl sulfone bis maleimide, 2, 2-bis (4- (4-maleimide phenoxy) phenyl) propane, 2, 2-bis (3-s-butyl- 4-8 (4-) Maleimide phenoxy) phenyl) propane, 1,1-bis (4- (4-maleimide phenoxy) phenyl) decane, 4,4'- cyclohexylidene bis (1- (4 maleimide phenoxy)- 2-cyclohex One kind selected from the group consisting of real benzene, 2,2-bis (4- (4 maleimidephenoxy) phenyl) hexafluoropropane may be used alone or in combination of two or more kinds thereof.

In the present invention, the radically polymerizable material may be used in an amount ranging from 36 to 76% by weight. If the content of the radically polymerizable substance is less than 36% by weight, reliability and overall flowability are lowered due to the lowering of the curing density after the heating and pressing process, and the contact between the conductive particles and the circuit substrate during adhesion becomes worse, and the connection resistance is increased or This may cause a problem that the connection reliability is lowered. On the other hand, when the amount of the radically polymerizable material exceeds 80% by weight, it may be difficult to form an anisotropic conductive film and a problem may occur in that the adhesive property is lowered.

In the present invention, a radical initiator system expressing a complex curing reaction is used to maintain adhesion due to an aging effect even under severe conditions of high temperature and high humidity. The radical initiator is an organic peroxide that generates free radicals by heating, and in the anisotropic conductive film composition of the present invention, two kinds of radical initiators are used, and the first radical initiator is diacyl peroxide, peroxydicarbonate, peroxy ester And mixtures thereof, and the second radical initiator includes either or both of peroxyketal and dialkylperoxide.

In the present invention, the half-life 10 hours temperature of the second radical initiator is preferably 10 ° C. or more higher than the half-life 10 hours temperature of the first radical initiator. The half-life of a radical initiator is an indicator of the rate of decomposition of a radical initiator and refers to the time it takes for the amount of free radicals that a radical initiator can generate to be half of its initial value by decomposition at a certain temperature. This is compared to the radical initiator by indexing the temperature at which the half-life is 10 hours for commercial convenience. In the present invention, by using a first radical initiator and a second radical initiator having a half-life temperature of 10 hours higher than the first radical initiator by 10 ° C. together to implement a complex curing reaction, the anisotropic conductive film prepared from the composition of the present invention is a high temperature and high humidity Excellent long-term reliability can be maintained even under severe conditions.

Specific examples of the first initiator in the present invention are isobutyryl peroxide, 3,5,5-trimethylhexanoyl peroxide, lauroyl peroxide, stearoyl peroxide, succinic peroxide, m-toluoyl / benzoyl Peroxide, benzoyl peroxide, di-n-propyl peroxy dicarbonate, diisopropyl peroxy dicarbonate, bis (4-t-butylcyclohexyl) peroxy dicarbonate, di-2-ethoxyethyl Peroxy dicarbonate, di-2-ethylhexyl peroxy dicarbonate, dimethoxybutyl peroxy dicarbonate, bis (3-methyl-3-methoxybutyl) peroxy dicarbonate, t-butyl peroxy Pivalate, t-butyl peroxy-2-ethylhexanoate, t-butyl peroxyisobutyrate, t-butyl peroxylaurate, t-butyl peroxy isopropyl monocarbonate, t-butyl peroxy 2 Ethylhexyl monocarbonate, t-butyl peroxy acetate , T-butyl peroxy benzoate, α, α'-bis (neodecanoyl peroxy) diisopropyl benzene, cumyl peroxy neodecanoate, 1,1,3,3-tetramethyl butyl peroxy neo Decanoate, 1-cyclohexyl-1-methyl ethyl peroxy neodecanoate, t-hexyl peroxy neodecanoate, t-hexyl peroxy pivalate, 1,1,3,3-tetramethyl butyl per Oxy 2-ethylhexanoate, 2,5-dimethyl-2,5-bis (2-ethylhexanoyl peroxy) hexane, 1-cyclohexyl-1-methylethyl peroxy-2-ethyl hexanonate, t -Hexyl peroxy-2-ethyl hexanoate, t-hexyl peroxy isopropyl monocarbonate, t-butyl peroxy-3,5,5-trimethyl hexanoate, 2,5-dimethyl-2,5 Bis (m-toluoyl peroxy) hexane, t-hexyl peroxy benzoate, 2,5-dimethyl-2,5-bis (benzoyl peroxy) hexane and the like, but are not necessarily limited thereto.

Examples of second radical initiators include 1,1-bis (t-hexyl peroxy) -3,3,5-trimethyl cyclo hexane, 1,1-bis (t-hexyl peroxy) cyclo hexane, 1,1-bis (t-butyl peroxy) -3,3,5-trimethyl cyclohexane, 1,1-bis (t-butyl peroxy) cyclohexane, n-butyl-4,4-bis (t-butyl peroxy) baler Late, α, α'-bis (t-butyl peroxy) diisopropyl benzene, dicumyl peroxide, t-butyl cumyl peroxide, di-t-butyl peroxide, 2,5-dimethyl-2,5- Bis (t-butyl peroxy) hexin-3 and the like, but are not necessarily limited thereto.

In the anisotropic conductive film composition of the present invention, the content of the total radical initiator in which the two kinds of radical initiators are combined is controlled in a range that balances the low-temperature hardening performance and storage stability of the anisotropic conductive film, and in the present invention, 0.8 to 4.0 wt% The range is desirable. In addition, it is preferable to make the content of the first radical initiator more than the content of the second radical initiator for the stable expression of the low temperature hardening performance. In the present invention, if the content of the total radical initiator is less than 0.8% by weight, the curing reaction rate is low, and thus the low-temperature curing property is lowered. The problem may arise that the anisotropic conductive film is not completely removed upon rework.

The anisotropic conductive film composition of this invention contains electroconductive particle in order to improve electroconductive performance. Examples of the conductive particles include metal particles including Au, Ag, Ni, Cu, lead, and alloys thereof; carbon; Conductive polymers including polyethylene, polypropylene, polyester, polystyrene, polyvinyl alcohol, and the like; One or more kinds of conductive polymers surface-coated with metals such as Au, Ag, Ni, Cu, and lead, and insulated conductive particles coated by adding insulating particles thereon may be used. The size of the said electroconductive particle can be selected and used according to a use in the range of 1-30 micrometers by the pitch of the circuit applied, and can also mix and use 2 or more types of particle of a different size.

In the present invention, the amount of the conductive particles is preferably in the range of 0.2 to 20% by weight. Here, when the conductive particle content is less than 0.2% by weight, the conductive performance improvement is insufficient, and when the conductive particle content is more than 20% by weight, it is difficult to obtain anisotropic conductivity.

The anisotropic conductive film composition of the present invention may include other additives such as coupling agents, polymerization inhibitors, antioxidants, heat stabilizers and the like to further improve the physical properties without inhibiting the basic physical properties of the anisotropic conductive film composition.

In the anisotropic conductive film composition of the present invention as a coupling agent to improve the connection reliability by improving the adhesion between the surface of the inorganic material such as copper, glass and the resin of the anisotropic conductive film when the composition is blended and improve the heat resistance and moisture resistance Silane coupling agents may further be included. As the polymerization inhibitor, those selected from the group consisting of hydroquinone, hydroquinone monomethyl ether, p-benzoquinone, phenothiazine and mixtures thereof can be used. In addition, antioxidants such as phenolic or hydroxy cinnamate-based substances, which have been prepared for the purpose of preventing oxidation reaction and imparting thermal stability to the composition induced by heat, may be added. For example, tetrakis- (methylene- (3,5-di-t-butyl-4-hydro cinnamate) methane, 3,5-bis (1,1-dimethylethyl) -4-hydroxy benzene propanoic acid thiol di-2,1-ethane Diyl esters, octadecyl 3,5-di-t-butyl-4-hydroxy hydrocinnamate, 2,6-di-tertiary-p-methylphenol, etc. These other additives are each used alone or It can be used by mixing 2 or more types The addition amount of such other additives can be adjusted by those skilled in the art to which this invention belongs in the range which does not impair the physical property of a basic anisotropic conductive film composition.

Another aspect of this invention relates to the anisotropic conductive film formed by apply | coating and drying the anisotropically conductive resin composition of this invention mentioned above to the sheet | seat for peeling. The anisotropic conductive film of this invention can be manufactured easily using the anisotropic conductive film composition of this invention, without a special apparatus or installation. For example, after dissolving the composition of the present invention in an organic solvent such as toluene and liquefying, the conductive particles are stirred for a predetermined time within a range in which the conductive particles are not pulverized, and then applied to a release sheet at a thickness of 10 to 50 μm, followed by constant By drying for a time and evaporating a solvent such as toluene, an anisotropic conductive film having a single layer structure can be obtained. In the present invention, an anisotropic conductive film having a multilayer structure of two or more layers may be obtained through a lamination process.

In the present invention, the release sheet may be a release treated polyester film, but is not necessarily limited thereto.

The anisotropic conductive film can be widely used for the electrical connection of the LCD panel, COF film, TCP film (Tape Carrier Package), or printed circuit board and COF film, TCP film.

Hereinafter, the present invention will be described in more detail with reference to examples, but these examples are for illustrative purposes only and are not intended to limit the scope of the present invention.

Example 1

100 g of carboxyl terminal acrylonitrile butadiene copolymer (1072CGX, Zeon Chemicals) was dissolved in a solvent in which toluene / methylethylketone was mixed at a weight ratio of 50/50 to prepare a solution having a solid content of 25%. 90 g of epoxy acrylate polymer (SP1509, Shohwa polymer) as radically polymerizable resin, 20 g of (meth) acrylate monomer (TMPTMA, listed by Miwon Corporation), 6 g of 2-methacryloyloxyethyl acid phosphate, benzoyl peroxide 5 g, 2 g of dicumyl peroxide, and 10 g of Ni particles were added to obtain an anisotropic conductive film composition.

Example 2

The anisotropic conductive film composition was obtained in the same manner as in Example 1 except that 45 g of a phenoxy resin (YP50, dopability) was dissolved in methyl ethyl ketone to prepare a solution having a solid content of 40%.

Comparative Example 1

The anisotropic conductive film composition was obtained in the same manner as in Example 1 except that only 5 g of benzoyl peroxide was used as the radical initiator.

Comparative Example 2

100 g of an ethylene vinyl acetate copolymer (EVA 700, Bayer) was dissolved in a mixed solvent of toluene / methyl ethyl ketone 2: 1 to prepare a solution having a solid content of 35%. 90 g of epoxy acrylate polymer (SP1509, Shohwa polymer), 20 g of (meth) acrylate monomer (TMPTMA), 6 g of 2-methacryloyloxyethyl acid phosphate as radical polymerizable resin, 5 g of benzoyl peroxide as a radical initiator, Ni 10 g of particles were added to obtain an anisotropic conductive film composition.

Preparation of Anisotropic Conductive Film

The anisotropic conductive film compositions obtained in Examples 1-2 and Comparative Examples 1-2 were stirred at room temperature (25 ° C.) for 60 minutes within a speed range in which the conductive particles were not crushed. The composition was formed into a 45 μm thick film on a silicone release surface treated polyethylene base film. At this time, a casting knife was used for film formation, and the drying time of the film was 5 minutes at 80 ° C. The circuit connection performance was evaluated by slitting this to a width of 1.5 mm.

Evaluation of Adhesion and Connection Resistance of Anisotropic Conductive Film

PCB and COF film were used to evaluate the circuit connection performance of the anisotropic conductive film manufactured from the above example. To this end, each film was left at room temperature for 1 hour and then press-bonded under conditions of 80 ° C., 1 second, and 1.0 MPa to remove the release film, and connected under normal compression conditions of 3.0 ° C. at 160 ° C. for 10 seconds. The initial connection resistance and 90 ° adhesion were measured using the specimens prepared as described above, and the connection resistance and adhesion were measured after standing at 250 ° C. and 500 hours at 85 ° C. and 85% RH, respectively. 1 is shown.

Adhesive force (gf / cm) Connection resistance (Ω) Early 250 hours 500 hours Early 250 hours 500 hours Example 1 987 1011 1148 1.08 1.14 1.45 Example 2 845 941 923 1.13 1.23 1.37 Comparative Example 1 862 605 543 1.21 1.97 4.57 Comparative Example 2 654 347 284 1.26 1.58 3.13

In general, an anisotropic conductive film having a width of 1.5 mm is required to have an adhesive strength of 600 gf / cm or more, and there should be no significant decrease in adhesive strength even after being left in harsh conditions such as high temperature and high humidity. Example 1 and Example 2 of the present invention, by applying a cross-linking rubber resin, a radical polymerizable resin, a radical initiator expressing a complex curing reaction, not only high initial adhesive force but also to the aging effect under the harsh conditions of high temperature and high humidity. It can be seen that the adhesive strength is excellent by this. Accordingly, the reliability of the connection resistance was also 2 Ω or less to ensure sufficient conductivity.

On the other hand, in Comparative Example 1, the initial adhesive strength and electrical resistance were good by applying a crosslinkable rubber resin, but the adhesive strength was greatly reduced under severe conditions of high temperature and high humidity, and the connection resistance was poor at 500 hours. In Comparative Example 2, the adhesion was poor under high temperature and high humidity conditions, and the delamination phenomenon appeared at 500 hours.

Although a preferred embodiment of the present invention has been described in detail above, those skilled in the art will be able to carry out various modifications or changes without departing from the spirit and scope of the present invention. Therefore, all such possible modifications or variations should be understood to fall within the protection scope of the present invention.

According to the present invention, by using a crosslinkable rubber resin having excellent adhesion and a radical initiator system expressing a complex curing reaction, it exhibits high adhesion by heating and exerts an aging effect even under severe conditions of high temperature and high humidity. Since the adhesive force is excellent in retention, the anisotropic conductive film composition and the anisotropic conductive film excellent in long-term reliability can be obtained.

Further, the anisotropic conductive film of the present invention can complete the circuit connection by a short heating and pressing process time, and thus high productivity can be obtained.

Claims (12)

(a) 20 to 60 wt% of the crosslinkable rubber resin; (b) 36 to 76 weight percent of radically polymerizable material; (c) at least one first radical initiator selected from the group consisting of diacyl peroxides, peroxydicarbonates and peroxyesters, and (d) at least one second radical initiator of peroxyketals and dialkylperoxides 0.8 To 4.0 weight percent; And (e) 0.2-20 weight% of electroconductive particle, The anisotropic conductive film composition characterized by the above-mentioned. delete According to claim 1, wherein the crosslinkable rubber resin is composed of an olefin resin, butadiene resin, acrylonitrile butadiene copolymer, carboxyl terminal acrylonitrile butadiene copolymer polyvinyl butyral resin, phenoxy resin and mixed resin thereof Anisotropic conductive film composition, characterized in that selected from the group to be. The anisotropic conductive film composition according to claim 1, wherein the crosslinkable rubber resin has a weight average molecular weight of 10,000 to 1,000,000. The anisotropic conductive film composition of claim 1, wherein the radical polymerizable material is selected from the group consisting of monomers, oligomers, polymers, and mixtures thereof. The anisotropic conductive film composition according to claim 1, wherein the radically polymerizable material is selected from the group consisting of acrylates, methacrylates, maleimide compounds, and mixtures thereof. The anisotropic conductive film composition according to claim 1, wherein the composition comprises 0.5 to 8% by weight of phosphate ester as a radical polymerizable material. 2. The anisotropic conductive film composition according to claim 1, wherein the half-life 10 hour temperature of the second radical initiator is at least 10 ° C higher than the half-life temperature of the first radical initiator. The method of claim 1, wherein the conductive particles are gold, silver, nickel, copper, lead and metal particles selected from the group consisting of alloys thereof; carbon; Conductive polymers; Conductive polymers surface-coated with a metal; And insulated conductive particles and mixtures thereof. The anisotropic conductive film composition according to claim 1, wherein the average particle diameter of the conductive particles is 1 to 30 µm. The anisotropic conductive film composition according to claim 1, wherein the composition further comprises a silane coupling agent or a radical polymerization inhibitor. The anisotropic conductive film formed by apply | coating and drying the anisotropic conductive film composition of any one of Claims 1 and 3 to the sheet | seat for peeling.