KR100832483B1 - A base plate transfer method - Google Patents

A base plate transfer method Download PDF

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KR100832483B1
KR100832483B1 KR1020070067743A KR20070067743A KR100832483B1 KR 100832483 B1 KR100832483 B1 KR 100832483B1 KR 1020070067743 A KR1020070067743 A KR 1020070067743A KR 20070067743 A KR20070067743 A KR 20070067743A KR 100832483 B1 KR100832483 B1 KR 100832483B1
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South Korea
Prior art keywords
lift
substrate
substrates
transfer rail
transfer
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KR1020070067743A
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Korean (ko)
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신계철
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주식회사 인아텍
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1679—Programme controls characterised by the tasks executed
    • B25J9/1682—Dual arm manipulator; Coordination of several manipulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A method for transferring a substrate is provided to reduce the standby time by transferring simultaneously the plural substrates by two lifts operated alternately. A first and a second lift(100,200) comprise a moving up/down supporter which can come and go to a fixing up/down supporter. And the lifts can be transferred along a first and second elevating guide(150,250), and rotated about the elevating guides, also the lifts can carry more than two substrates. The first lift is located at a first position, and the second lift is located at a second position, so that the substrates may be transferred by elevating the lifts alternately.

Description

기판 이송방법{A base plate transfer method}Substrate transfer method {A base plate transfer method}

본 발명은 작업 대상물인 기판의 이송방법에 관한 것으로써, 특히 기판을 상부 작업부로부터 하부작업부로 또는 하부작업부로부터 상부작업부로 이송시킬때 이송시간을 단축시키고 협소공간에서도 기판을 이송시킬 수 있도록 한 기판 이송방법에 관한 것이다.The present invention relates to a method of transferring a substrate that is a work object, and in particular, to reduce the transfer time and transfer the substrate even in a narrow space when transferring the substrate from the upper working part to the lower working part or from the lower working part to the upper working part. It relates to a substrate transfer method.

예컨대, 평판디스플레이(FPT;flat panel display), 반도체 웨이퍼, LCD 글라스 등에 사용되는 기판은 증착, 에칭, 스트립, 세정, 린스등의 일련의 공정을 거치면서 처리된다.For example, a substrate used for a flat panel display (FPT), a semiconductor wafer, an LCD glass, or the like is processed through a series of processes such as deposition, etching, stripping, cleaning, and rinsing.

이러한 일련의 기판 처리공정은 기판이송장치에 의해 이송되어 기판의 공급, 처리, 배출의 과정이 하나의 순환싸이클을 이루게 된다.Such a series of substrate processing processes are transferred by a substrate transfer device so that a process of supplying, processing, and discharging the substrate forms one circulation cycle.

일 예로서의 기판 이송방법을 나타낸 도 1 내지 도 3을 참조하면, 이는 상부작업대(10)로부터 하부작업대(20)로 기판(1)(2)을 이송시키고, 다시 하부작업대(20)로부터 상부작업대(10)로 기판(1)(2)을 이송하여 배출시키는 구조를 가진다.1 to 3 showing a substrate transfer method as an example, which transfers the substrate 1, 2 from the upper work platform 10 to the lower work platform 20, and again from the lower work platform 20 to the upper work platform ( It has a structure to transfer and discharge the substrate (1) (2) to 10.

즉, 도 1에서와 같이, 상부작업대(10)의 공급 및 배출부(15)를 통하여 기판(1)이 공급되어서, 상부작업대(10)의 일정구간에서 제1기판(1)에 대한 자외선세정이 행하여지고, 자외선세정이 완료된 제1기판(1)은 공급측리프트(11)로 이동되어서 도 2 및 도 3에서와 같이 하강되어 하부작업대(20)로 제1기판(1)이 이동되고, 하부작업대(20)에서 세정수에 의한 세정작업등의 공정이 이루어진다.That is, as shown in FIG. 1, the substrate 1 is supplied through the supply and discharge portions 15 of the upper working platform 10, so that the UV cleaning is performed on the first substrate 1 in a certain section of the upper working platform 10. After this, the first substrate 1, which has been cleaned with ultraviolet rays, is moved to the supply side lift 11 and lowered as shown in FIGS. 2 and 3 to move the first substrate 1 to the lower work bench 20, In the work bench 20, a process such as washing with washing water is performed.

이와 같이 하부작업대(20)에서의 공정이 완료된 후에는 배출측리프트(21)로 제1기판(1)이 이동되고, 상승되어서 상부작업대(10)의 공급 및 배출부(15)를 통하여 제1기판(1)이 배출되게 된다.After the process at the lower work platform 20 is completed, the first substrate 1 is moved to the discharge side lift 21, and ascended, the first substrate 1 is supplied to the upper work platform 10 through the supply and discharge portions 15. The substrate 1 is discharged.

그러나 이와 같은 기판 이송방법은 제1기판(1)이 공급측리프트(11)에 탑재되어서 상부작업대(10)로부터 하부작업대(20)로 이송되는 동안, 도 2에서와 같이 상부작업대(10)에서 자외선세정공정이 완료된 제2기판(2)이 대기하여야 하고 이에 따라 공급 및 배출부(15)를 통한 다른 기판의 공급이 지연되므로 생산성이 저하되는 문제점이 있다.However, this substrate transfer method, while the first substrate 1 is mounted on the supply side lift 11 and transferred from the upper work platform 10 to the lower work platform 20, the ultraviolet light in the upper work platform 10 as shown in FIG. Since the second substrate 2 having the cleaning process is completed, the second substrate 2 should wait, and thus, the supply of the other substrate through the supply and discharge portions 15 is delayed, which leads to a problem that productivity is lowered.

본 발명은 상기와 같은 문제점을 해결하기 위하여 창출된 것으로써, 기판의 대기시간을 최소화하여 작업시간을 단축시키고 기판의 이송공간을 최소화할 수 있도록 한 기판 이송방법을 제공하는 데 그 목적이 있다.The present invention has been made to solve the above problems, an object of the present invention is to provide a substrate transfer method that can minimize the waiting time of the substrate to shorten the working time and minimize the transfer space of the substrate.

상기 목적을 달성하는 본 발명 기판의 이송방법은 제1위치로 공급된 기판을 제2위치의 높이로 기판을 이송시키고, 제2위치로 이송된 기판을 이송레일에 이송시 키는 기판 이송방법에 있어서,The substrate transfer method of achieving the above object is a substrate transfer method for transferring the substrate supplied to the first position to the height of the second position, and the substrate transferred to the second position to the transfer rail In

상기 이송레일의 마주보는 양측에 제1위치로부터 제2위치에 이르는 구간에 각각 제1,2승강가이드를 마련하고;Providing first and second elevating guides in sections extending from a first position to a second position on opposite sides of the transfer rail;

상기 제1,2승강가이드를 따라 이동가능하고 상기 제1,2승강가이드에 대해 회동가능하며 각각 적어도 2장 이상의 기판을 상하로 탑재시킬 수 있고 각각 상/하고정지지대에 출몰가능한 상/하이동지지대를 구비하는 제1,2리프트를 구비하여서;Up and down movable paper movable along the first and second lifting guides, rotatable with respect to the first and second lifting guides, each of which can mount at least two or more substrates up and down, respectively With first and second lifts having a rent;

상기 제1위치에 상기 제1리프트를 위치시키고 상기 제2위치에 상기 제2리프트를 위치시키며;Position the first lift in the first position and position the second lift in the second position;

a) 상기 제1위치에서 상기 제1리프트를 제1승강가이드에 대해 회동시키고 기판을 탑재시킬 수 있도록 상기 제1리프트의 상/하고정지지대로부터 상/하이동지지대를 돌출시키는 단계와;a) projecting the upper / lower moving support from the upper / fixing support of the first lift to rotate the first lift with respect to the first lifting guide in the first position and to mount the substrate;

b) 상기 돌출된 제1리프트의 상/하이동지지대 및 상/하고정지지대에 기판들을 탑재시키는 단계와;b) mounting substrates on the upper / lower moving support and the upper / fixed support of the protruding first lift;

c) 상기 기판이 탑재된 제1리프트를 상기 제1승강가이드를 따라 제2위치로 하강시키는 단계와;c) lowering the first lift on which the substrate is mounted to a second position along the first lifting guide;

d) 상기 제2위치로 하강된 제1리프트의 최하단에 탑재된 기판을 상기 이송레일에 안착시켜 배출시키고, 이어서 제1리프트를 점차 하강시키면서 최하단의 기판 상부에 위치되는 기판들을 순차적으로 이송레일에 안착시켜 배출시키고, 제1리프트의 상/하이동지지대들을 상/하고정지지대에 진입시키고 제1리프트를 하방향으로 회동시켜서 접는 단계와;d) The substrate mounted on the lowermost end of the first lift lowered to the second position is seated on the transfer rail and discharged. Subsequently, the substrates positioned on the lowermost substrate are sequentially transferred to the transfer rail while the first lift is gradually lowered. Seating and discharging, entering the upper / lower moving supports of the first lift into the upper / fixed support and rotating the first lift downward;

e) 상기 d)단계를 수행하는 동안 상기 제2리프트를 상기 제2위치에서 제1위치로 이동시키고, 상기 제1위치에서 상기 제2리프트의 상/하고정지지대로부터 상/하이동지지대를 돌출시키고 기판을 탑재시키는 단계와;e) moving the second lift from the second position to the first position during the step d) and protruding an upper / lower movement support from the upper / fixed support of the second lift at the first position; And mounting the substrate;

f) 상기 기판을 탑재한 제2리프트를 제1위치로 이동시키고 제2리프트의 최하단에 탑재된 기판을 상기 이송레일에 안착시켜 배출시키고, 이어서 제2리프트를 점차 하강시키면서 최하단의 기판 상부에 위치되는 기판들을 순차적으로 이송레일에 안착시켜 배출시키고, 제2리프트의 상/하이동지지대들을 상/하고정지지대에 진입시키고 제2리프트를 하방향으로 회동시켜서 접는 단계와;f) The second lift on which the substrate is mounted is moved to the first position, and the substrate mounted at the lowermost end of the second lift is seated on the transfer rail and discharged, and then positioned on the uppermost lower substrate while the second lift is gradually lowered. Placing and discharging the substrates sequentially on the transfer rails, folding the upper / lower moving supports of the second lift into the upper / fixed support and rotating the second lift downward;

g) 상기 f)단계를 수행하는 동안 상기 제1리프트를 상기 제1위치로 이동시키고 상기 a)단계에서와 같이 기판을 탑재시키는 단계;를 포함하여서,g) moving the first lift to the first position during the step f) and mounting the substrate as in step a);

상기 a)단계로부터 g)단계를 반복적으로 수행하는 것을 특징으로 한다.Characterized in that the step a) to step g) is repeatedly performed.

또한, 본 발명 이송방법은 상기 이송레일을 일방향으로 경사지게 하고, 상기 제1위치에서 상기 제1,2리프트에 각각 기판들을 탑재시킨 다음, 각 제1,2리프트를 상기 이송레일의 경사각도에 대응되는 각도로 경사지게 하여 이송시키는 것을 특징으로 한다.In addition, according to the present invention, the conveying rail is inclined in one direction, and the substrates are mounted on the first and second lifts at the first position, and then the first and second lifts correspond to the inclination angle of the conveying rails. It is characterized by the inclination at an angle to be transferred.

상기 본 발명의 특징에 의하면, 본 발명은 제1리프트가 기판을 제2위치로 이송시키는 동안 제2리프트가 제1위치로 이송되어 다른 기판을 이송시킬 수 있도록 함으로써 기판의 이송시간을 단축시켜 작업공정시간을 단축시킬 수 있도록 한다.According to the above characteristics of the present invention, the present invention allows the second lift to be moved to the first position to transfer another substrate while the first lift transfers the substrate to the second position, thereby shortening the transfer time of the substrate. The process time can be shortened.

또한, 제1,2리프트들이 출몰가능한 이동지지대를 구비함으로써 제1,2리프트를 회동시켜 접을때 공간협소문제와 모멘트를 줄여주는 것을 가능하게 한다. In addition, the first and second lifts are provided with a movable support, which makes it possible to reduce the space narrowing problem and the moment when the first and second lifts are pivoted.

상술한 바와 같은 본 발명은 제1,2리프트(100)(200)가 각각 제1위치와 제2위치 사이를 교대로 승강되면서 복수의 기판을 동시에 이송시키게 되므로 하부작업부에서 공정이 완료될때 까지 대기하여야 하는 대기시간을 줄임으로써 이송시간 및 공정시간을 단축시킬 수 있게 한다.In the present invention as described above, since the first and second lifts 100 and 200 are alternately elevated between the first position and the second position, respectively, the plurality of substrates are simultaneously transferred until the process is completed in the lower work part. By reducing the waiting time to wait, it is possible to shorten the transfer time and the process time.

또한, 제1,2리프트(100)(200)들을 회동가능하게 하고 출몰가능한 상/하부이동지지대들을 구비함으로써 좁은공간에서의 설치를 가능하게 하고, 제1,2리프트를 회동시켜 접을때 모멘트를 줄여주는 것을 가능하게 한다. In addition, by allowing the first and second lifts 100 and 200 to be rotatable and having a movable upper and lower supporters, installation in a narrow space is possible, and when the first and second lifts are pivoted and folded, Makes it possible to reduce.

이하 첨부된 도면을 참조하면서 본 발명에 따른 바람직한 실시예를 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

본 발명 실시예에 적용되는 기판 이송방법은 예컨대, LCD 글라스와 같은 기판을 증착, 에칭, 스트립, 세정, 린스등의 일련의 공정을 거칠 수 있도록 자동이송시키는 기판 이송라인에서, 각 공정간에 기판을 이송/대기시키는 버퍼(buffer)구간에 적용된다. 즉, 도 1에서와 같이, 상부작업대로부터 하부작업대로 또는 그 반대로 기판을 이송시키는 기판의 공급 및 배출과 퍼버구간에 적용된다.Substrate transfer method applied to the embodiment of the present invention, for example, in a substrate transfer line for automatically transferring a substrate such as LCD glass to a series of processes such as deposition, etching, strip, cleaning, rinse, etc. Applies to buffer sections to be transported / queued. That is, as shown in Figure 1, it is applied to the supply and discharge of the substrate to transfer the substrate from the upper workbench to the lower workbench and vice versa section.

이와 같은 일련의 기판 처리공정은 기판이송시스템에 의해 이송되어 기판의 공급, 처리, 배출의 과정이 대기시간없이 최소한의 시간으로 하나의 순환사이클을 이루게 된다.Such a series of substrate processing processes are transferred by a substrate transfer system so that the process of supplying, processing, and discharging the substrate forms a circulation cycle with a minimum time without waiting time.

종래에는 일련의 공정소요시간이 종래 리프터의 작동시간보다 짧아져서 문제 가 되었는데, 본 발명은 리프터의 처리속도를 향상시켜서 공정소요시간보다 빠르게 하여 다음 기판공급준비를 가능하게 한다.In the related art, a series of process time is shorter than the operation time of the conventional lifter, but the present invention improves the processing speed of the lifter, making it possible to prepare the next substrate supply faster than the process time.

본 발명 실시예의 기판 이송방법을 개략적 개념작동도로 나타낸 도 4 내지 도 12를 참조하면,이는 제1위치(상부위치)로 공급된 기판(30)(40)을 제2위치(하부위치)의 높이로 이송시키고, 제2위치로 이송된 기판을 이송레일(300)에 이송시켜 배출시키도록 한다.4 to 12 showing the schematic diagram of the substrate transfer method according to the embodiment of the present invention, this is the height of the second position (lower position) of the substrate 30, 40 supplied to the first position (upper position) The substrate is transferred to the second position, and is transferred to the transfer rail 300 to be discharged.

먼저, 상기 이송레일(300)의 마주보는 양측에 제1위치로부터 제2위치에 이르는 구간에 각각 제1,2승강가이드(150)(250)를 마련하고, 제1,2승강가이드(150)(250)에 제1,2리프트(100)(200)를 승강가능하게 지지시킨다. 이때 승강구조는 체인,로우프, 타이밍벨트, 볼스크류 또는 유압실린더에 의해서 가능하게 구성될 수 있다.First, first and second elevating guides 150 and 250 are respectively provided in sections extending from the first position to the second position on opposite sides of the transfer rail 300, and the first and second elevating guides 150 are provided. The first and second lifts 100 and 200 are supported by 250 to be liftable. At this time, the lifting structure may be configured by a chain, a rope, a timing belt, a ball screw or a hydraulic cylinder.

또한, 상기 제1,2리프트(100)(200)는 상기 제1,2승강가이드(150)(250)에 대해 힌지축(130)(230)을 중심으로 상하로 회동가능하게 구성하고, 각각 2장 이상의 기판을 상하로 탑재시킬 수 있도록 한다. In addition, the first and second lifts 100 and 200 are configured to be rotatable up and down about the hinge shafts 130 and 230 with respect to the first and second lifting guides 150 and 250, respectively. Two or more boards can be mounted vertically.

제1리프트(100)는 제1상/하고정지지대(110)(120)에 출몰가능한 제1상/하이동지지대(111)(121)를 구비한다.The first lift 100 includes first phase / high movable supports 111 and 121 which can be mounted on the first phase / fixed support 110 and 120.

마찬가지로 제2리프트(200)는 제2상/하고정지지대(210)(220)에 출몰가능한 제2상/하이동지지대(211)(221)를 구비한다.Similarly, the second lift 200 includes second phase / high movable supports 211 and 221 which can be mounted on the second phase / fixed support 210 and 220.

상기 제1,2리프트(100)(200)의 이동지지대(111,121)(211,221)들은 고정지지대(110,120)(210,220)에 유압작동에 의해서 출몰되어질 수 있다.The moving supports 111, 121, 211, 221 of the first and second lifts 100, 200 may be mounted on the fixed supports 110, 120, 210, 220 by hydraulic operation.

또한, 상기 이동지지대(111,121)(211,221)들은 고정지지대(110,120)(210,220)에 대해 힌지점을 중심으로 회동가능하게 하여 접혀지거나 펼쳐지게 구성할 수도 있다.In addition, the movable support (111, 121) (211, 221) may be configured to be folded or unfolded by pivoting about the hinge point with respect to the fixed support (110, 120, 210, 220).

한편, 상기 이송레일(300)은 도시된 바와 같이 일방향으로 경사지게 구성하여서, 각 제1,2리프트(100)(200)로부터 이동된 기판들이 자중(自重) 또는 모터(미도시)구동에 의해서 배출되어질 수 있도록 한다.On the other hand, the conveying rail 300 is configured to be inclined in one direction as shown, the substrates moved from each of the first and second lift 100, 200 is discharged by self-weight or motor (not shown) driving It can be done.

또한, 경사진 이송레일(300)은 기판으로부터 세정액 또는 에칭액과 같은 공정수행중 처리액의 배출을 원할하게 한다.In addition, the inclined transfer rail 300 facilitates the discharge of the processing liquid during the process such as cleaning liquid or etching liquid from the substrate.

한편, 이송레일(300)은 복수의 수평지지봉이 일정간격으로 마련된 구조를 가짐으로써, 제1리프트(100)와 제2리프트(200)들의 고정지지대(110,120)(210,220)와 이동지지대(111,121)(211,221)들이 이송레일(300)의 수평지지봉 사이사이로 통과될 수 있도록 되어 있다.Meanwhile, the transfer rail 300 has a structure in which a plurality of horizontal support rods are provided at predetermined intervals, so that the fixing supports 110, 120, 210, 220 of the first lift 100 and the second lift 200 and the moving supports 111, 121 are provided. 211 and 221 may be passed between the horizontal support rods of the transfer rail 300.

먼저, 도 4에서와 같이, 상기 제1위치에 상기 제1리프트(100)를 위치시키고 상기 제2위치에 상기 제2리프트(200)를 위치시키며, 상기 제1위치에서 상기 제1리프트(100)가 수평상태를 유지하도록 제1승강가이드(150)에 대해 힌지축(130)을 중심으로 회동시키고, 제1리프트(100)의 제1상/하고정지지대(110)(120)로부터 제1상/하이동지지대(111)(121)를 돌출시킨다.First, as shown in FIG. 4, the first lift 100 is positioned at the first position, the second lift 200 is positioned at the second position, and the first lift 100 is positioned at the first position. ) Rotates about the hinge shaft 130 with respect to the first lifting guide 150 to maintain the horizontal state, and the first phase / fixing support 110 (120) of the first lift 100 from the first Protrudes the upper and lower movable support (111, 121).

이어서 상기 제1리프트(100)의 제1상/하이동지지대(111)(121) 및 제1상/하고정지지대(110)(120)에 기판(30)(40)들을 로봇(미도시)등으로 탑재시키고, 도 5에서와 같이 힌지축(130)을 중심으로 상방향으로 제1리프트(100)를 회동시킨다. 이때 제1리프트(100)의 경사각도는 상기 이송레일(300)의 경사각도에 대응된다.Subsequently, the substrates 30 and 40 are robots (not shown) on the first phase / high support 111 and 121 and the first phase / fixation support 110 and 120 of the first lift 100. The first lift 100 is rotated upward with respect to the hinge shaft 130 as shown in FIG. 5. At this time, the inclination angle of the first lift 100 corresponds to the inclination angle of the transfer rail 300.

이어서 도 6에서와 같이, 상기 기판(30)(40)이 탑재된 제1리프트(100)를 상기 제1승강가이드(150)를 따라 제2위치로 하강시키고, 동시에 제2리프트(120)를 제2승강가이드(250)를 따라 제1위치로 상승시킨다.Subsequently, as shown in FIG. 6, the first lift 100 on which the substrates 30 and 40 are mounted is lowered to the second position along the first lifting guide 150, and at the same time, the second lift 120 is moved. Ascends to the first position along the second lifting guide 250.

이어서 도 7에서와 같이, 제1위치로 상승된 상기 제2리프트(200)의 제2상/하고정지지대(210)(220)로부터 제2상/하이동지지대(211)(221)를 돌출시킨후, 로봇(미도시)으로부터 기판을 공급받을 준비한다.Subsequently, as shown in FIG. 7, the second phase / high supporters 211 and 221 protrude from the second phase / fixation supports 210 and 220 of the second lift 200 which are raised to the first position. After the preparation, the substrate is prepared to be supplied from a robot (not shown).

이어서 도 8에서와 같이, 상기 제2위치로 하강된 제1리프트(100)의 최하단에 탑재된 기판(40)을 상기 이송레일(300)에 안착시켜 배출시키고, 제1리프트(100)를 점차 하강시키면서 상부에 위치되는 기판(30)들을 순차적으로 이송레일(300)에 안착시켜 배출시킨다.Subsequently, as shown in FIG. 8, the substrate 40 mounted on the lowermost end of the first lift 100 lowered to the second position is seated on the transfer rail 300 and discharged, and the first lift 100 is gradually discharged. While descending, the substrates 30 positioned on the upper portion are sequentially seated on the transfer rail 300 and discharged.

이와 같이 제1리프트(100)로부터 기판(30)(40)들을 이송레일(300)에 배출시키는 동안, 도 9에서와 같이 제2리프트(200)에 기판(50)(60)들을 로봇에 의해 탑재시키고 힌지축(230)을 중심으로 하방향으로 제2리프트(200)를 회동시켜서 이송레일(300)과 같은 경사각도를 유지시킨다.As described above, while discharging the substrates 30 and 40 from the first lift 100 to the transfer rail 300, the substrates 50 and 60 are mounted on the second lift 200 by a robot as shown in FIG. 9. The second lift 200 is rotated downward with respect to the hinge shaft 230 to maintain the same inclination angle as that of the feed rail 300.

한편, 기판(30)(40)이 이송레일(300)로 배출된 제1리프트(100)는 도 11에서와 같이 힌지축(130)을 중심으로 하방으로 회동시켜 접고, 제1위치로 제1리프트(100)를 이동시킨다.Meanwhile, the first lift 100 having the substrates 30 and 40 discharged to the transfer rail 300 pivots downwardly around the hinge shaft 130 as shown in FIG. 11 and folds the first lift 100 to the first position. Move the lift 100.

제1리프트(100)가 제1위치로 복귀되는 동안, 상기 기판(50)(60)을 탑재한 제2리프트(200)를 제2위치로 이동시켜서, 상기 제1리프트(100)의 기판(30)(40)을 이 송레일(300)에 배출시키는 방법과 같은 방법으로 기판(50)(60)을 이송레일(300)을 통하여 배출시킨다.While the first lift 100 is returned to the first position, the second lift 200 on which the substrates 50 and 60 are mounted is moved to the second position so that the substrate of the first lift 100 ( The substrates 50 and 60 are discharged through the transfer rail 300 in the same manner as the 30 and 40 are discharged to the transfer rail 300.

이와 같이 제2리프트(200)로부터 이송레일(300)로 기판(50)(60)을 배출시키는 동안, 제1위치에 위치한 제1리프트(100)는 힌지축(130)을 중심으로 도 4에서와 같이 회동시키고 제1상하이동지지대(111)(121)를 돌출시켜서 또 다른 기판을 공급받는다.As described above, while discharging the substrates 50 and 60 from the second lift 200 to the transfer rail 300, the first lift 100 positioned at the first position is illustrated in FIG. 4 about the hinge shaft 130. As described above, the first vertical movement support members 111 and 121 protrude to receive another substrate.

이때 제2위치에서 이송레일(300)에 기판(50)(60)을 배출시킨 제2리프트(200)는 힌지축(230)을 중심으로 하방으로 회동시켜 접음과 동시에, 제2상/하이동지지대(211)(221)들을 제2상/하고정지지대(210)(220)에 진입시킨다.At this time, the second lift 200 which discharged the substrates 50 and 60 to the transfer rail 300 at the second position rotates downwardly about the hinge axis 230 and folds at the same time. The zones 211 and 221 enter the second phase / fixation support 210 and 220.

상기와 같이 제1위치에서 또 다른 기판을 탑재한 제1리프트(100)는 다시 제2위치로 이동되어 상기와 같은 방법으로 이송레일(300)에 배출시키고, 그리고 제2위치에서 제1위치로 제2리프트(200)를 이동시켜 또 다른 기판을 공급받는다.As described above, the first lift 100 having another substrate mounted at the first position is moved back to the second position and discharged to the transfer rail 300 in the same manner as described above, and from the second position to the first position. The second lift 200 is moved to receive another substrate.

상술한 바와 같이, 본 발명 실시예의 기판 이송방법은 출몰가능한 상/하부이동지지대들을 갖는 제1,2리프트(100)(200)를 제1,2위치에서 상호 교대로 승강시키면서 기판을 이송시킬 수 있도록 하며, 제1,2리프트(100)(200)들을 회동가능하게 하고 출몰가능한 상/하부이동지지대들을 구비함으로써 협소공간에서도 기판들을 상하로 이송시킬 수 있도록 한다.As described above, the substrate transfer method according to the embodiment of the present invention can transfer the substrate while lifting the first and second lifts 100 and 200 having the wanderable upper and lower movable supports alternately at the first and second positions. In addition, the first and second lifts 100 and 200 are rotatable and provided with movable upper and lower movable supports so that the substrates can be moved up and down even in a narrow space.

상술한 바와 같은 본 발명은 상기 본원의 정신과 범위를 이탈함이 없이 상기 실시예에 한정되지 아니하고 많은 변형을 가하여 실시될 수 있다.The present invention as described above is not limited to the above embodiments without departing from the spirit and scope of the present application can be practiced with a number of modifications.

도 1 내지 도 3은 종래 기판 이송장치 및 방법을 설명하는 개념도,1 to 3 is a conceptual diagram illustrating a conventional substrate transfer apparatus and method,

도 4 내지 도 11은 본 발명 실시예의 기판 이송방법을 설명하는 동작개념도,4 to 11 is an operation conceptual diagram illustrating a substrate transfer method of an embodiment of the present invention,

도 12는 본 발명 이송방법을 구현하는 이송장치를 설명하기 위한 개략 사시도이다.12 is a schematic perspective view for explaining a transfer apparatus implementing the transfer method of the present invention.

Claims (2)

제1위치로 공급된 기판을 제2위치의 높이로 기판을 이송시키고, 제2위치로 이송된 기판을 이송레일에 이송시키는 기판 이송방법에 있어서,In the substrate transfer method for transferring the substrate supplied to the first position to the height of the second position, the substrate transferred to the second position to the transfer rail, 상기 이송레일(300)의 마주보는 양측에 제1위치로부터 제2위치에 이르는 구간에 각각 제1,2승강가이드(150)(250)를 마련하고;First and second lifting guides 150 and 250 are respectively provided in sections extending from the first position to the second position on opposite sides of the transfer rail 300; 상기 제1,2승강가이드(150)(250)를 따라 이동가능하고 상기 제1,2승강가이드(150)(250)에 대해 회동가능하며 각각 적어도 2장 이상의 기판을 상하로 탑재시킬 수 있고 각각 상/하고정지지대에 출몰가능한 상/하이동지지대를 구비하는 제1,2리프트(100)(200)를 구비하여서;Are movable along the first and second elevating guides 150 and 250, and rotatable with respect to the first and second elevating guides 150 and 250, and each of at least two or more substrates may be mounted vertically. First and second lifts (100, 200) having upper and lower movable supports which can be mounted on the upper and fixed supports; 상기 제1위치에 상기 제1리프트(100)를 위치시키고 상기 제2위치에 상기 제2리프트(200)를 위치시키며;Position the first lift (100) in the first position and position the second lift (200) in the second position; a) 상기 제1위치에서 상기 제1리프트(100)를 제1승강가이드(150)에 대해 회동시키고 기판을 탑재시킬 수 있도록 상기 제1리프트의 상/하고정지지대로부터 상/하이동지지대를 돌출시키는 단계와;a) protruding the upper / lower moving support from the upper / fixed support of the first lift to rotate the first lift 100 with respect to the first lifting guide 150 at the first position and to mount the substrate; Making a step; b) 상기 돌출된 제1리프트의 상/하이동지지대 및 상/하고정지지대에 기판들을 탑재시키는 단계와;b) mounting substrates on the upper / lower moving support and the upper / fixed support of the protruding first lift; c) 상기 기판이 탑재된 제1리프트(100)를 상기 제1승강가이드(150)를 따라 제2위치로 하강시키는 단계와;c) lowering the first lift (100) on which the substrate is mounted to a second position along the first lifting guide (150); d) 상기 제2위치로 하강된 제1리프트(100)의 최하단에 탑재된 기판을 상기 이송레일(300)에 안착시켜 배출시키고, 이어서 제1리프트(100)를 점차 하강시키면서 최하단의 기판 상부에 위치되는 기판들을 순차적으로 이송레일에 안착시켜 배출시키고, 제1리프트(100)의 상/하이동지지대들을 상/하고정지지대에 진입시키고 제1리프트(100)를 하방향으로 회동시켜서 접는 단계와;d) The substrate mounted on the lowermost end of the first lift 100 lowered to the second position is seated on the transfer rail 300 and discharged, and then the upper surface of the lowermost substrate is gradually lowered while the first lift 100 is gradually lowered. Placing the substrates on the transfer rail in order to be discharged, entering the upper / lower moving supports of the first lift 100 into the upper / fixed support, and folding the first lift 100 by rotating downward; ; e) 상기 d)단계를 수행하는 동안 상기 제2리프트(200)를 상기 제2위치에서 제1위치로 이동시키고, 상기 제1위치에서 상기 제2리프트(200)의 상/하고정지지대로부터 상/하이동지지대를 돌출시키고 기판을 탑재시키는 단계와;e) while moving the second lift 200 from the second position to the first position during the step d), the image from the upper / stationary support of the second lift 200 in the first position / Protruding the high movement support and mounting the substrate; f) 상기 기판을 탑재한 제2리프트(200)를 제2위치로 이동시키고 제2리프트(200)의 최하단에 탑재된 기판을 상기 이송레일(300)에 안착시켜 배출시키고, 이어서 제2리프트(200)를 점차 하강시키면서 상부에 위치되는 기판들을 순차적으로 이송레일에 안착시켜 배출시키고, 제2리프트(200)의 상/하이동지지대들을 상/하고정지지대에 진입시키고 제2리프트(200)를 하방향으로 회동시켜서 접는 단계와;f) The second lift 200 on which the substrate is mounted is moved to a second position, and the substrate mounted at the lowermost end of the second lift 200 is seated on the transfer rail 300 and then discharged. While gradually lowering the 200, the substrates positioned on the upper part are sequentially seated on the transfer rail and discharged, and the upper / lower moving supports of the second lift 200 enter the upper / fixed support and the second lift 200 is moved. Pivoting in a downward direction; g) 상기 f)단계를 수행하는 동안 상기 제1리프트(100)를 상기 제1위치로 이동시키고 상기 a)단계에서와 같이 기판을 탑재시키는 단계;를 포함하여서,g) moving the first lift 100 to the first position during the step f) and mounting the substrate as in step a); 상기 a)단계로부터 g)단계를 반복적으로 수행하는 것을 특징으로 하는 기판 이송방법.Substrate transfer method characterized in that to perform the step a) to step g) repeatedly. 제 1 항에 있어서, 상기 이송레일(300)을 일방향으로 경사지게 하고, 상기 제1위치에서 상기 제1,2리프트(100)(200)에 각각 기판들을 탑재시킨 다음, 각 제1,2리프트(100)(200)를 상기 이송레일(300)의 경사각도에 대응되는 각도로 경사 지게 하여 이송시키는 것을 특징으로 하는 기판의 이송방법.The method of claim 1, wherein the transfer rail 300 is inclined in one direction, and the substrates are mounted on the first and second lifts 100 and 200 at the first position, respectively, and then the first and second lifts 100) (200) is a substrate transfer method, characterized in that for conveying by inclining at an angle corresponding to the inclination angle of the transfer rail (300).
KR1020070067743A 2007-07-05 2007-07-05 A base plate transfer method KR100832483B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200200837Y1 (en) 2000-05-29 2000-10-16 주식회사한송하이테크 Automatic Unloading Device of Board
KR20020040414A (en) * 2000-11-24 2002-05-30 정문술 Surface mounting device and method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200200837Y1 (en) 2000-05-29 2000-10-16 주식회사한송하이테크 Automatic Unloading Device of Board
KR20020040414A (en) * 2000-11-24 2002-05-30 정문술 Surface mounting device and method thereof

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