KR100820216B1 - The process of the partial gilting for back ferrule - Google Patents

The process of the partial gilting for back ferrule Download PDF

Info

Publication number
KR100820216B1
KR100820216B1 KR1020070054989A KR20070054989A KR100820216B1 KR 100820216 B1 KR100820216 B1 KR 100820216B1 KR 1020070054989 A KR1020070054989 A KR 1020070054989A KR 20070054989 A KR20070054989 A KR 20070054989A KR 100820216 B1 KR100820216 B1 KR 100820216B1
Authority
KR
South Korea
Prior art keywords
plating
heat
treated
partial
heat treatment
Prior art date
Application number
KR1020070054989A
Other languages
Korean (ko)
Other versions
KR20070097373A (en
Inventor
이정걸
Original Assignee
이정걸
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이정걸 filed Critical 이정걸
Priority to KR1020070054989A priority Critical patent/KR100820216B1/en
Publication of KR20070097373A publication Critical patent/KR20070097373A/en
Application granted granted Critical
Publication of KR100820216B1 publication Critical patent/KR100820216B1/en

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00Coating not provided for in groups C23C2/00 - C23C24/00
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16BDEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B35/00Screw-bolts; Stay-bolts; Screw-threaded studs; Screws; Set screws
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16BDEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B37/00Nuts or like thread-engaging members

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

본 발명은 표면 경화를 위한 부분 열처리를 하기 위하여 부분적으로 열처리 되는 부분에만 도금층이 형성되지 않도록 하는 부분 도금 방법에 관한 것으로, 소재부품을 전체 도금 후 열처리 되는 부분만의 도금층을 제거하거나, 열처리 되는 부분에 캡을 씌운 후 도금을 행함으로써, 열처리 되는 부분에 도금층이 형성되지 않도록 하여 도금층에 의해 표면경화가 되지 않는 것을 활용하여, 관이음쇠의 후방쇄기링, 각종 볼트와 너트류, 장신구 등 산업용 부품에 다양하게 적용할 수 있도록 한 부분 도금 방법에 관한 것이다.The present invention relates to a partial plating method in which a plating layer is not formed only on a part heat-treated in order to perform a partial heat treatment for surface hardening. By coating the cap on the plate, the plated layer is not formed on the heat-treated portion, and the surface layer is not hardened by the plated layer. The present invention relates to a partial plating method for various applications.

본 발명에 따르면, 소재부품을 도금하는 단계; 산성 액이 포함된 흡습포에 열처리될 부분만을 접촉시켜 도금층을 박피하는 단계; 소재부품을 열처리하는 단계;를 포함하여 구성된 후방 쇄기링의 부분 도금 방법이 제공된다.According to the invention, the step of plating the material component; Peeling the plating layer by contacting only the portion to be heat-treated to the absorbent fabric including the acidic liquid; It is provided with a partial plating method of the back wedge ring configured to include the step of heat-treating the raw material parts.

열처리, 도금, 관연결구, 후방쇄기링, 페룰, 부분도금 Heat Treatment, Plating, Pipe End Connections, Back Ring Rings, Ferrules, Partial Plating

Description

후방 쇄기링의 부분 도금 방법{The process of the partial gilting for back ferrule}The process of the partial gilting for back ferrule}

도 1은 부분 도금되는 부품소재의 일례인 후방쇄기링의 예시도1 is an illustration of a back chain ring that is an example of a part material to be partially plated

도 2는 소재부품의 일례인 후방쇄기링의 열처리 부분을 도시한 단면도2 is a cross-sectional view showing a heat treatment portion of the rear chain ring which is an example of a material part;

도 3은 전체 도금 후 부분 열처리될 부분의 도금층을 제거하는 상태도3 is a state diagram for removing a plating layer of a portion to be partially heat treated after the entire plating;

도 4는 부분 열처리될 부분에는 도금이 되지 않도록 캡을 씌운 상태도Figure 4 is a state capped so as not to plate the portion to be partially heat treated

도 5는 본 발명에 의하여 소재부품이 부분 도금된 상태도5 is a state in which the material part is partially plated by the present invention

※ 도면의 주요 부분에 대한 부호의 설명※ Explanation of codes for main parts of drawing

1 : 소재부품 2 : 열처리부분1: Material Part 2: Heat Treatment Part

3 : 도금층 4 : 흡습포3: plating layer 4: moisture absorption cloth

5 : 캡 6 : 작업대5: cap 6: worktable

본 발명은 표면 경화를 위한 부분 열처리를 하기 위하여 부분적으로 열처리 되는 부분에만 도금층이 형성되지 않도록 하는 부분 도금 방법에 관한 것으로, 소 재부품을 전체 도금 후 열처리 되는 부분만의 도금층을 제거하거나, 열처리 되는 부분에 캡을 씌운 후 도금을 행함으로써, 열처리 되는 부분에 도금층이 형성되지 않도록 하여 도금층에 의해 표면경화가 되지 않는 것을 활용하여, 관이음쇠의 후방쇄기링, 각종 볼트와 너트류, 장신구 등 산업용 부품에 다양하게 적용할 수 있도록 한 부분 도금 방법에 관한 것이다.The present invention relates to a partial plating method in which a plating layer is not formed only on a part heat-treated in order to perform a partial heat treatment for surface hardening. By plating after capping the part, it is possible to prevent the surface layer from being hardened by the plated layer so that the plated layer is not formed on the heat treated part. The present invention relates to a partial plating method for various applications.

산업용 기계장치를 비롯하여 다양한 부분에 사용되는 볼트, 너트, 관이음쇠, 장신구 등의 소재부품들은 높은 강도를 요하기도 하고, 필요에 따라 연성이 요구되기도 한다. 그리고 사용 목적이나 사용처에 따라 소재부품 하나에 강도와 연성을 동시에 요구되기도 한다.Material parts such as bolts, nuts, fittings, and jewelry used in various parts, including industrial machinery, require high strength and, in some cases, require ductility. In addition, depending on the purpose of use or the purpose of use, strength and ductility may be required for one material part at the same time.

특히 강도와 연성을 동시에 요구하는 부품은 강도를 요하는 부분이 일부분에 국한되므로, 전체를 열처리하지 않고 높은 강도를 요구하는 일부분만을 열처리하여 강도를 높일 필요성이 있다.In particular, parts requiring strength and ductility at the same time are limited to a portion requiring strength, so there is a need to increase the strength by heat-treating only a portion requiring high strength without heat-treating the whole.

소재부품의 일례인 후방쇄기링은 관연결구의 부품으로 사용된다. 튜브를 연결하는 관연결구는 전방쇄기링(front ferrule)과 후방쇄기링(back ferrule)이 결합되어 튜브를 피팅바디에 연결하는 구조를 가진다. 여기서 후방쇄기링은 연성이 있어 어느 정도의 범위에서 휘어지는 성질이 있어야 함과 동시에, 전방쇄기링과 접촉되는 부분에서는 높은 강도를 가져야만 한다.An example of a material part is a backlash ring which is used as a part of a pipe connector. The tube connector connecting the tube has a structure in which a front ferrule and a back ferrule are coupled to connect the tube to the fitting body. Here, the back chain ring should be flexible and bend in a certain range, and at the same time, it should have a high strength in contact with the front chain ring.

이와 같은 후방쇄기링은 관 이음쇠 연결시 팩킹의 역할을 하는 것으로, 반도체, 항공기, 고분자 화학, 원자로, 고급 산업기계 등에 유체나 매체 등을 통과시키는 관의 접속에 있어 중요한 기능을 한다. 따라서 후방쇄기링과 같은 소재부품은 일부분만의 강성을 요하게 되므로, 전체의 중 전방쇄기링과의 접촉부만을 열처리하여야 하는 필요성이 있게 된다.Such back-chain ring serves as a packing when connecting pipe fittings, and plays an important role in connecting pipes through which fluids or media pass through semiconductors, aircraft, polymer chemistry, reactors, and high-end industrial machinery. Therefore, the raw material parts such as the rear chain ring requires only a portion of the rigidity, there is a need to heat only the contact portion with the front chain ring of the whole.

소재부품은 내식성 및 내구성을 위하여 구리, 니켈 등 다양한 금속 종류로 도금되어 사용된다. 그러나 도금된 소재부품은 열처리로 강성을 높일 수가 없다. 즉, 열처리가 되지 않는 구리 또는 비철금속으로 도금된 소재부품은 표면 경화 열처리가 이루어지지 않으므로, 열처리 되는 부분에는 도금층이 형성되지 않도록 하는 부분 도금의 방법이 절실히 요구되고 있다.Material parts are plated with various metals such as copper and nickel for corrosion resistance and durability. However, plated material parts cannot increase their rigidity by heat treatment. That is, since the surface part heat treatment is not performed for the material parts plated with copper or nonferrous metal that is not heat treated, there is an urgent need for a method of partial plating in which a plating layer is not formed on the heat treated portion.

본 발명의 목적은 도금된 소재부품의 일부분만을 열처리할 수 있도록 소재부품을 부분 도금하는 방법을 제공함에 있다. 즉 소재부품 전체가 도금되어야 하고, 이의 일부만을 강성을 높이기 위하여 열처리하는 경우로서, 열처리하여야 할 일부분의 도금층을 박피한 후 열처리를 행하거나, 도금시에 부분 열처리할 부분을 캡으로 씌운 후 도금을 행하여 열처리 될 부분이 도금되지 않도록 하는 부분 도금 방법을 제공함에 있다.An object of the present invention is to provide a method of partially plating a material part so that only a part of the plated material part can be heat treated. That is, the whole material part should be plated, and only part of it is heat treated to increase the rigidity.The part of the plating layer to be heat-treated is peeled off and then heat-treated, or at the time of plating, the part to be heat-treated is covered with a cap. The present invention provides a partial plating method in which a portion to be heat treated is not plated.

본 발명에 의한 부분 도금 방법은 소재부품(1) 중 열처리부분(2)을 제외한 나머지 부분에만 도금층(3)을 형성시키는 방법으로, 도금을 행하고 열처리부분(2)을 박피하거나, 열처리부분(2)만은 도금되지 않도록 도금한 후 열처리하는 방법 등 다양한 실시예를 가질 수 있다.The partial plating method according to the present invention is a method of forming the plating layer 3 only in the remaining parts of the raw material part 1 except for the heat-treated part 2, and performing plating and peeling the heat-treated part 2, or the heat-treated part 2 ) May have various embodiments such as a method of heat treatment after plating so as not to be plated.

제1실시예는 소재부품(1)을 전체 도금하는 단계; 산성 액이 포함된 흡습포(4)에 소재부품(1)의 일부분인 열처리부분(2)만을 접촉시켜 도금층(3)을 박피하는 단계; 소재부품(1)을 열처리 하는 단계;를 포함하여 구성된다.The first embodiment comprises the steps of: totally plating the raw material component (1); Peeling the plating layer 3 by contacting only the heat-treated portion 2 which is a part of the material part 1 to the absorbent fabric 4 containing the acidic liquid; It comprises a; heat treatment of the material component (1).

상기의 흡습포(4)는 상온과 같은 온도를 유지시키는 것도 가능하나, 효과적인 박피를 위하여 70~80℃의 온도로 유지시키는 것이 바람직하다.The absorbent fabric 4 may be maintained at the same temperature as room temperature, but is preferably maintained at a temperature of 70 ~ 80 ℃ for effective peeling.

제2실시예는 소재부품(1)의 열처리부분(2)에만 캡(5)을 씌우는 단계; 캡(5)이 씌워진 상태로 소재부품(1)을 도금하는 단계; 캡(5)을 제거하는 단계; 소재부품(1)을 열처리 하는 단계;를 포함하여 구성된다.The second embodiment includes the step of covering the cap 5 only on the heat treatment portion 2 of the raw material component 1; Plating the raw material part 1 with the cap 5 covered; Removing the cap 5; It comprises a; heat treatment of the material component (1).

이하 각 실시예에 따라 본 발명을 설명하고, 소재부품(1)으로서는 관연결구에 사용되는 후방쇄기링(back ferrule)을 예로 하고, 구리로 도금하는 것으로 하여 설명하고자 한다. 그리고 상기의 후방 쇄기링은 그 제품 용도의 특성상 내산성이 있어야 하고, 후 공정에서 산성 용액에서 도금을 박피하는 과정이 있으므로, 재질은 SUS 316 또는 SUS 316L과 같은 내산성이 높은 스테인레스 스틸이 바람직하다. 그리고 후방 쇄기링은 그 직경이 1.5~25mm 정도의 아주 정밀한 부품이고, 특히 강성이 요구되는 기밀부인 접촉부는 그 표면 조도가 다듬질 기호로 ▽▽▽▽로서, Rmax = 0.8s, Rz = 0.8z, Ra = 0.2a의 거칠기를 가지는 아주 정밀한 부품이다. 따라서 후방 쇄기링은 아주 정밀하게 제조되어야 한다.Hereinafter, the present invention will be described according to each embodiment, and as the material part 1, a back ferrule used for a pipe fitting is used as an example, and it will be described by plating with copper. In addition, the back chain ring should be acid-resistant due to the characteristics of the use of the product, and since there is a process of peeling the plating from the acidic solution in a subsequent process, the material is preferably stainless steel having high acid resistance such as SUS 316 or SUS 316L. The rear wedge ring is a very precise part with a diameter of 1.5 ~ 25mm, and especially the contact part, which is an airtight part, which requires rigidity, has the surface roughness as ▽▽▽▽, Rmax = 0.8s, Rz = 0.8z, It is a very precise part with a roughness of Ra = 0.2a. The rear wedge ring must therefore be manufactured with great precision.

제1실시예는 소재부품(1) 전체를 도금하고, 열처리부분(2)만을 산성 액으로 박피하는 방법이다. 이하 본 발명에서의 도금은 열처리가 되지 않는 구리 등의 비철금속으로 도금된 것을 의미하는 것으로 한다. 즉, 비철금속으로 도금된 경우는 도금에 의하여 표면 경화 열처리가 되지 않기 때문에, 소재부품(1)의 일부를 열처리하고자 하는 경우는 도금을 박피하여야 한다.The first embodiment is a method in which the entire material part 1 is plated, and only the heat treated part 2 is peeled off with an acidic liquid. Hereinafter, the plating in the present invention means to be plated with a non-ferrous metal such as copper which is not heat treated. That is, since the surface hardening heat treatment is not performed by plating when the non-ferrous metal is plated, in order to heat-treat a part of the raw material part 1, the plating should be peeled off.

산성 액은 질산(HNO3), 염산(HCl), 황산(H2SO4) 등으로 도금층(3)을 박피할 수 있는 것이면 된다. 그리고 산성 액을 포함하는 흡습포(4)는 거즈 등의 직물류, 종이류, 가죽 등 흡수성 소재이면 되고, 두께는 열처리부분(2)의 높이보다 높으면 된다.The acidic liquid may be any one capable of peeling the plating layer 3 with nitric acid (HNO 3 ), hydrochloric acid (HCl), sulfuric acid (H 2 SO 4 ), or the like. The absorbent fabric 4 containing the acidic liquid may be an absorbent material such as fabrics such as gauze, paper or leather, and the thickness may be higher than the height of the heat treated portion 2.

따라서 도 3에 도시된 바와 같이 전체 도금된 소재부품(1) 중 열처리할 부분인 열처리부분(2)만을 흡습포(4)의 상부에 얹고 눌러서, 열처리부분(2)의 표면이 흡습포(4)와 접촉되도록 한다.Therefore, as shown in FIG. 3, only the heat-treated portion 2, which is a portion to be heat-treated, of the whole plated material part 1 is placed on the upper portion of the moisture absorbing cloth 4, and the surface of the heat-treated portion 2 is absorbed by the absorbent cloth 4. ) In contact with

흡습포(4)에는 산성 액이 포함되어 있으므로, 흡습포(4)의 하부 작업대(6)는 산에 녹지 않는 재질로 이용하면 된다. 즉, 유리판, 세라믹, 자기 등으로 작업대(6)를 제작하고, 이와 같은 작업대(6)의 상부에 흡습포(4)를 얹어 사용하면 된다.Since the absorbent fabric 4 contains an acidic liquid, the lower worktable 6 of the absorbent fabric 4 may be used as a material which does not dissolve in acid. That is, what is necessary is just to produce the work bench 6 with glass plate, ceramic, a porcelain, etc., and to use the moisture absorbent cloth 4 on the upper part of such work bench 6, and to use it.

흡습포(4)에 흡수되어 있는 산성 액은 도금층(3)과 접촉되어 도금층(3)을 박피하게 되고, 흡습포(4)가 소재부품(1)에 의해 눌려 곡선으로 왜곡된 부분은 완전하게 소재부품(1)과 접촉되지 않게 되나, 산성 액이 모세관 현상 등에 의해 도금층(3)의 표면을 따라 상부로 이동하게 되므로 적정 치수의 박피를 얻을 수 있게 된다.The acidic liquid absorbed by the absorbent cloth 4 comes into contact with the plating layer 3 to peel off the plating layer 3, and the absorbent cloth 4 is pressed by the material component 1 to completely distort the curved portion. Since the material part 1 is not in contact with the raw material component 1, the acidic liquid moves upward along the surface of the plating layer 3 by capillary action or the like, thereby obtaining a peeling of an appropriate dimension.

그리고 산성 액의 농도와 흡습포(4)의 쿠션 정도에 따라 도금층(3)의 박피 높이를 조정할 수도 있다.And the peeling height of the plating layer 3 can also be adjusted according to the density | concentration of acidic liquid and the cushion degree of the moisture absorption cloth 4.

또한 박피의 효율을 높이기 위하여 산성 액 또는 흡습포(4)의 온도를 높일 수도 있는데, 흡습포(4)의 하부에 설치된 작업대(6)의 온도를 높이면 된다. 즉, 작업대(6)의 하부에 히터, 가열되는 물 등을 위치시키면 되고, 간단한 예로서는 히터로 물을 가열하는 물통의 구조가 있으며, 열원이 어떠한 구조를 가지더라도 흡습 포(4)의 온도를 70~80℃ 정도로 하면 된다.In addition, in order to increase the efficiency of the peeling may increase the temperature of the acidic liquid or the absorbent cloth 4, it is only necessary to increase the temperature of the work table 6 installed in the lower portion of the absorbent cloth (4). That is, a heater, water to be heated, etc. may be placed below the worktable 6, and a simple example is a structure of a bucket for heating water with a heater, and the temperature of the moisture absorbent cloth 4 is 70 even if the heat source has any structure. What is necessary is just about -80 degreeC.

상기와 같은 단계로 부분 도금을 행하면 도 5와 같이 열처리부분(2)에는 도금층(3)이 제거되어, 부분 도금이 완성된다.
상기와 같이 열처리할 부분인 열처리부분(2)이 박피되면, 열처리를 행한다. 열처리는 소재부품(1)에서 박피된 부분만의 강도를 높이는 것이고, 열처리의 방법 등의 기술적 사항은 공지공용의 것이므로 상세한 설명은 생략한다.
When partial plating is performed in the above-described steps, the plating layer 3 is removed from the heat treatment portion 2 as shown in FIG. 5, thereby completing partial plating.
When the heat treatment portion 2, which is a portion to be heat treated as described above, is peeled, heat treatment is performed. The heat treatment is to increase the strength of only the part peeled from the material part 1, and technical details such as the method of heat treatment are for the public use, and thus detailed description thereof will be omitted.

제2실시예는 도금층(3)을 박피하지 않고, 열처리부분(2)이 도금되지 않도록 캡(5)으로 씌운 후 부분 도금을 행하는 방법이다. 이후에 캡(5)을 제거하여 열처리를 행하면 된다.In the second embodiment, the plating layer 3 is not peeled off, and the heat treatment portion 2 is covered with the cap 5 so as not to be plated, followed by partial plating. Thereafter, the cap 5 may be removed to perform heat treatment.

도 4는 소재부품(1)의 예로서 후방쇄기링이 사용된 예시이고, 소재부품(1)의 열처리부분(2)을 캡(5)으로 씌운다. 물론 열처리부분(2)의 형상에 따라 캡(5)의 형상도 달라지며, 예로 사용된 후방쇄기링의 경우는 캡(5) 또한 링의 형상을 가진다.4 shows an example in which a back chain ring is used as an example of the work piece 1, and covers the heat-treated portion 2 of the work piece 1 with the cap 5. Of course, the shape of the cap 5 also varies according to the shape of the heat treatment portion 2, and in the case of the back-stretch ring used as an example, the cap 5 also has the shape of a ring.

따라서 캡(5)이 씌워진 상태로 유산동이나 청화동으로 소재부품(1)을 도금하게 되면, 캡(5)이 씌워진 열처리부분(2)은 도금이 되지 않고, 나머지 부분에만 도금이 행해진다. 상기의 캡(5)은 고무, 우레탄, 기타 수지류 등으로 제조될 수 있는 것으로 재질에는 제한이 없다.Therefore, when the raw material part 1 is plated with lactic acid copper or cyanide copper while the cap 5 is covered, the heat treatment portion 2 covered with the cap 5 is not plated, and plating is performed only on the remaining portions. The cap 5 may be made of rubber, urethane, other resins, and the like, and the material is not limited.

상기의 단계에 의하여 열처리부분(2)은 캡(5)에 의해 도금이 되지 않고, 도금 후에 캡(5)을 제거하면, 도 5와 같이 부분 도금이 완성된다.
따라서 열처리 될 부분이 캡(5)에 의해 도금이 되지 않으므로, 이후에 소재부품(1)을 열처리하게 되면, 도금되지 않은 열처리부분(2)만이 열처리되어 강도가 향상된다.
By the above step, the heat treatment portion 2 is not plated by the cap 5, and when the cap 5 is removed after plating, partial plating is completed as shown in FIG.
Therefore, since the portion to be heat-treated is not plated by the cap 5, when the material part 1 is subsequently heat-treated, only the unplated heat-treated portion 2 is heat-treated to improve strength.

이와 같이 본 발명은 열처리부분(2)에는 도금층(3)이 형성되지 않으므로, 소재부품(1)이 도금됨과 동시에 특정 부분에 강성을 높이는 열처리가 가능하게 되어, 반도체, 항공기, 고분자 화학, 원자로, 고급 산업기계 등에 유체나 매체 등을 통과 시키는 관의 접속에 있어 중요한 기능을 하는 관연결구의 후방쇄기링을 비롯하여 산업 전반에 걸쳐 사용되는 다양한 소재부품(1)들을 사용목적에 따라 도금과 열처리를 동시에 행할 수 있게 된다.As described above, in the present invention, since the plating layer 3 is not formed in the heat treatment portion 2, the material part 1 is plated, and at the same time, the heat treatment to increase the rigidity is possible, and the semiconductor, aircraft, polymer chemistry, nuclear reactor, Plating and heat treatment of various material parts (1) used throughout the industry at the same time, including back-chain rings of pipe connectors that play an important role in the connection of pipes through which fluids or media pass through high-grade industrial machines, etc. It becomes possible to do it.

Claims (3)

소재부품(1)을 도금하는 단계; 소재부품(1)의 열처리 될 부분인 열처리부분(2)의 도금층(3)을 박피하는 단계; 소재부품(1)을 열처리하는 단계;를 포함하여 구성된 후방 쇄기링(back ferrule)의 부분 도금 방법에 있어서, 상기 열처리부분(2)의 도금층(3)을 박피하는 단계는 산성 액이 포함된 흡습포(4)에 열처리부분(2)만을 접촉시켜 도금층(3)을 박피함을 특징으로 하는 후방 쇄기링의 부분 도금 방법.Plating the raw material component (1); Peeling the plating layer (3) of the heat treatment portion (2) which is a portion to be heat treated of the material component (1); In the partial plating method of the back ferrule (back ferrule) configured to include a heat treatment of the material component (1), the step of peeling the plating layer (3) of the heat treatment portion (2) is hygroscopic containing acidic liquid A method of partial plating of a back wedge ring, characterized in that the plating layer (3) is peeled by contacting the fabric (4) with only the heat treatment portion (2). 삭제delete 삭제delete
KR1020070054989A 2007-06-05 2007-06-05 The process of the partial gilting for back ferrule KR100820216B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070054989A KR100820216B1 (en) 2007-06-05 2007-06-05 The process of the partial gilting for back ferrule

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070054989A KR100820216B1 (en) 2007-06-05 2007-06-05 The process of the partial gilting for back ferrule

Publications (2)

Publication Number Publication Date
KR20070097373A KR20070097373A (en) 2007-10-04
KR100820216B1 true KR100820216B1 (en) 2008-04-08

Family

ID=38803721

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070054989A KR100820216B1 (en) 2007-06-05 2007-06-05 The process of the partial gilting for back ferrule

Country Status (1)

Country Link
KR (1) KR100820216B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101166673B1 (en) 2012-04-20 2012-07-24 주식회사 비엠티 Ferrule protect device for part heat treatment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5767193A (en) 1980-10-09 1982-04-23 Hitachi Ltd Mask for partial plating and partial plating method
JPS6141761A (en) * 1984-07-31 1986-02-28 Seikosha Co Ltd Method for partially hardening surface of carbon steel
JPH05345911A (en) * 1992-06-12 1993-12-27 Dai Ichi High Frequency Co Ltd Partial nonhardening treatment for member to be hardened
US6165597A (en) * 1998-08-12 2000-12-26 Swagelok Company Selective case hardening processes at low temperature

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5767193A (en) 1980-10-09 1982-04-23 Hitachi Ltd Mask for partial plating and partial plating method
JPS6141761A (en) * 1984-07-31 1986-02-28 Seikosha Co Ltd Method for partially hardening surface of carbon steel
JPH05345911A (en) * 1992-06-12 1993-12-27 Dai Ichi High Frequency Co Ltd Partial nonhardening treatment for member to be hardened
US6165597A (en) * 1998-08-12 2000-12-26 Swagelok Company Selective case hardening processes at low temperature

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101166673B1 (en) 2012-04-20 2012-07-24 주식회사 비엠티 Ferrule protect device for part heat treatment

Also Published As

Publication number Publication date
KR20070097373A (en) 2007-10-04

Similar Documents

Publication Publication Date Title
WO2000009773A9 (en) Selective case hardening processes at low temperature
KR100820216B1 (en) The process of the partial gilting for back ferrule
TW200705595A (en) Holder manufacturing method for loading substrate of semiconductor manufacturing device, batch type boat having holder, loading/unloading method of semiconductor substrate using same, and semiconductor manufacturing device having the same
EP1283446B1 (en) Workpiece stage of a resist curing device
CN105063571A (en) Preparation method for three-dimensional graphene on stainless steel substrate
KR101429456B1 (en) Low Temperature Salt Bath Partial Heat-Treatment Method
CN111618415A (en) Diffusion welding method
JP2007332953A (en) High-pressure fuel injection tube having connecting head portion and bend portion, and method for producing the same
JP2016119332A (en) Manufacturing method of recovery instrument, recovery method of metal impurity, and analysis method of metal impurity
JP5761870B2 (en) Steam generator tube sheet having corrosion prevention layer and method of manufacturing the same
CN106086893B (en) For showing the corrosive agent and method of low-alloy high-strength steel welding heat affected zone subregion
JP6374178B2 (en) Manufacturing method of machine parts
JP5675734B2 (en) Decontamination waste liquid treatment method
WO2000009776A1 (en) Selective case hardening for metal articles
Ngoh et al. Effect of stress state on growth of interfacial intermetallic compounds between Sn-Ag-Cu solder and Cu substrates coated with electroless Ni immersion Au
CN100473760C (en) Method for producing metal material having formed thereon chromium oxide passive film
CN106637170A (en) Stainless steel passivation technology
JP2011140147A (en) Method for manufacturing fluororesin molded object, resin container for analysis and element analytical method
CN104073846B (en) The corronil sheet part preparation method of a kind of electrodeposited resin, atmosphere reduction
CN109811295A (en) A kind of 750 DEG C of low temperature carburizations of vacuum cementation furnace of precision component
US9738964B2 (en) Method for the nitro carburization of a deep-drawn part or a stamped-bent part made of austenitic stainless steel
KR101983557B1 (en) Rivet partial copper plating method for preventing of carburizing heat treatment
CN107622936A (en) Method for solar silicon wafers cleaning
CN214193345U (en) Cold-sealed autoclave rapid quenching tank
US20220010452A1 (en) Electroless plating process

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E902 Notification of reason for refusal
G15R Request for early opening
E90F Notification of reason for final refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20110401

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20140203

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20160401

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee