KR100819176B1 - 대면적 기판 공정 챔버 시스템 - Google Patents
대면적 기판 공정 챔버 시스템 Download PDFInfo
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- KR100819176B1 KR100819176B1 KR1020060138169A KR20060138169A KR100819176B1 KR 100819176 B1 KR100819176 B1 KR 100819176B1 KR 1020060138169 A KR1020060138169 A KR 1020060138169A KR 20060138169 A KR20060138169 A KR 20060138169A KR 100819176 B1 KR100819176 B1 KR 100819176B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (7)
- 복수의 공정챔버;진공상태와 상압상태로 전환 가능한 버퍼;상기 상압상태로 전환된 버퍼에서 상기 카세트로부터 기판을 상기 버퍼로 이송하거나 공정처리된 기판을 역으로 카세트로 이송하는 제3로봇;상기 진공상태로 전환된 버퍼에서 상기 기판을 할당된 공정챔버로 이송하거나 공정처리된 기판을 역으로 버퍼로 이송하는 제1로봇 및 제2로봇;을 포함하고,상기 버퍼는 상기 제1로봇과 제2로봇 사이로 배치되는 것을 특징으로 하는 대면적 기판 공정 챔버 시스템.
- 제1항에 있어서, 상기 버퍼의 후방에 위치하며, 기판을 정렬시키는 얼라이너를 추가로 포함하는 것을 특징으로 하는 대면적 기판 공정 챔버 시스템.
- 제1항 또는 제2항에 있어서, 상기 버퍼는 복수의 기판을 상하로 보관할 수 있는 것을 특징으로 하는 대면적 기판 공정 챔버 시스템.
- 제2항에 있어서,상기 제1로봇의 후방 및 좌측에는 제1공정챔버 및 제2공정챔버가 각각 위치하고, 상기 제2로봇의 후방 및 우측에는 제3공정챔버 및 제4공정챔버가 각각 위치하는 것을 특징으로 하는 대면적 기판 공정 챔버 시스템.
- 제2항에 있어서, 상기 얼라이너 및 하부에 공정을 마친 기판을 냉각시키기 위한 냉각부가 구비되는 것을 특징으로 하는 대면적 기판 공정 챔버 시스템.
- 제2항에 있어서,상기 제1로봇, 제2로봇, 제1공정챔버, 제2공정챔버, 제3공정챔버, 제4공정챔버, 버퍼, 얼라이너는 모두 동일한 진공공간에 위치하는 것을 특징으로 하는 대면적 기판 공정 챔버 시스템.
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Application Number | Priority Date | Filing Date | Title |
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KR1020060138169A KR100819176B1 (ko) | 2006-12-29 | 2006-12-29 | 대면적 기판 공정 챔버 시스템 |
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KR1020060138169A KR100819176B1 (ko) | 2006-12-29 | 2006-12-29 | 대면적 기판 공정 챔버 시스템 |
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KR100819176B1 true KR100819176B1 (ko) | 2008-04-04 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100980276B1 (ko) | 2008-01-10 | 2010-09-06 | 주식회사 뉴파워 프라즈마 | 버퍼 챔버를 구비한 고속 기판 처리 시스템 |
KR101124485B1 (ko) * | 2010-04-09 | 2012-03-16 | (유)에스엔티 | 기판 처리 시스템 |
US9269578B2 (en) | 2013-01-10 | 2016-02-23 | Samsung Electronics Co., Ltd. | Method of forming an epitaxial layer on a substrate, and apparatus and system for performing the same |
CN108735625A (zh) * | 2017-04-13 | 2018-11-02 | 三星显示有限公司 | 基板处理系统及基板搬送方法 |
KR20210010386A (ko) * | 2019-07-19 | 2021-01-27 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 반송 방법 |
CN112840446A (zh) * | 2018-09-11 | 2021-05-25 | 川崎重工业株式会社 | 基板移载装置及其控制方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1079412A (ja) | 1996-09-02 | 1998-03-24 | C Bui Res:Kk | 半導体製造装置 |
KR20040084650A (ko) * | 2003-03-25 | 2004-10-06 | 다다모토 다마이 | 진공용기의 내외로 처리대상물을 반출입할 수 있는진공처리장치 |
KR20060088909A (ko) * | 1998-11-17 | 2006-08-07 | 동경 엘렉트론 주식회사 | 진공 처리 시스템 |
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2006
- 2006-12-29 KR KR1020060138169A patent/KR100819176B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1079412A (ja) | 1996-09-02 | 1998-03-24 | C Bui Res:Kk | 半導体製造装置 |
KR20060088909A (ko) * | 1998-11-17 | 2006-08-07 | 동경 엘렉트론 주식회사 | 진공 처리 시스템 |
KR20040084650A (ko) * | 2003-03-25 | 2004-10-06 | 다다모토 다마이 | 진공용기의 내외로 처리대상물을 반출입할 수 있는진공처리장치 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100980276B1 (ko) | 2008-01-10 | 2010-09-06 | 주식회사 뉴파워 프라즈마 | 버퍼 챔버를 구비한 고속 기판 처리 시스템 |
KR101124485B1 (ko) * | 2010-04-09 | 2012-03-16 | (유)에스엔티 | 기판 처리 시스템 |
US9269578B2 (en) | 2013-01-10 | 2016-02-23 | Samsung Electronics Co., Ltd. | Method of forming an epitaxial layer on a substrate, and apparatus and system for performing the same |
US9589795B2 (en) | 2013-01-10 | 2017-03-07 | Samsung Electronics Co., Ltd. | Method of forming an epitaxial layer on a substrate, and apparatus and system for performing the same |
CN108735625A (zh) * | 2017-04-13 | 2018-11-02 | 三星显示有限公司 | 基板处理系统及基板搬送方法 |
CN112840446A (zh) * | 2018-09-11 | 2021-05-25 | 川崎重工业株式会社 | 基板移载装置及其控制方法 |
CN112840446B (zh) * | 2018-09-11 | 2024-05-28 | 川崎重工业株式会社 | 基板移载装置及其控制方法 |
KR20210010386A (ko) * | 2019-07-19 | 2021-01-27 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 반송 방법 |
KR102362524B1 (ko) | 2019-07-19 | 2022-02-11 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 반송 방법 |
US11348812B2 (en) | 2019-07-19 | 2022-05-31 | SCREEN Holdings Co., Ltd. | Substrate treating apparatus and substrate transporting method |
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