KR100813633B1 - LED package of side view type - Google Patents

Abstract

A side view light emitting diode package is disclosed. A reflector comprising a plurality of sidewalls defining a concavely mounted mounting space, a pair of lead frames coupled to the reflecting portion, the portion of which is exposed to the bottom surface of the mounting space, and a mounting surface on the bottom surface of the mounting space; And an LED chip electrically connected to the lead frame by a bonding wire, and a lens unit charged in the mounting space to cover the LED chip and the wire, wherein the sidewalls include the height of the LED chip from the bottom surface of the mounting space and the LED chip. And the height of the bonding wire from the highest point of the wire and the coating thickness of the lens portion from the highest point of the wire. The side view light emitting diode package, which is inserted into the projecting portion and protrudes outward from the reflecting portion, has a tapered shape that becomes narrower toward the end portion. By increasing the total amount of light emitted from the ED chip, when the side view light emitting diode package is mounted in the backlight device, it is possible to minimize darkening and improve the overall brightness of the backlight.

Side view LED package, Sawing, lead frame

Description

Side view light emitting diode package {LED package of side view type}

1 is a cross-sectional view for explaining the problem of the LED of the prior art applied to the LCD backlight device.

Figure 2 is a front view showing an example of the LED of the prior art.

Figure 3 is a cross-sectional view for explaining another problem of the LED of the prior art applied to the LCD backlight device.

4 is a plan view of a side view light emitting diode package of the prior art arrayed in an LCD backlight device;

Figure 5 is a flow chart schematically showing a method of manufacturing a side view light emitting diode package according to a preferred embodiment of the present invention.

6 is a plan view showing a lead frame according to a preferred embodiment of the present invention.

7 is a plan view illustrating a state in which a reflector is formed on the lead frame of FIG. 6.

8 is a cross-sectional view taken along the line AA ′ of FIG. 7.

9 is a cross-sectional view taken along the line BB ′ of FIG. 7.

10 is a cross-sectional view of a state in which an LED chip is mounted and wire bonded.

Figure 11 is a perspective view of a side view light emitting diode package manufactured according to an embodiment of the present invention.

12 is a perspective view of a side view light emitting diode package according to another exemplary embodiment of the present invention.

FIG. 13 is a cross-sectional view taken along line C-C 'in FIG. 12 for explaining the arrangement of lead frames; FIG.

FIG. 14 is a cross-sectional view taken along line D-D 'of FIG. 12 with a sidewall of a reflector at a typical height h ₁ ;

FIG. 15 is a cross-sectional view taken along line D-D 'of FIG. 12 with a sidewall of the reflector at a preferred height h ₂ ;

16 is a cross-sectional view taken along the line E-E 'of FIG.

FIG. 17 is a perspective view illustrating an example in which the side view LED package of FIG. 12 is applied to an LCD backlight device; FIG.

18 is a top view of FIG. 17.

<Description of the symbols for the main parts of the drawings>

100: side view light emitting diode package 110: lead frame plate

111 (111a, 111b): Lead frame 113: Connecting piece

115: cutting groove 120: reflecting unit

121 (121a, 121b, 123a, 123b): side wall C: Sawing line

130: LED chip 133: conductive paste

135 gold (Au) wire 137: lens unit

The present invention relates to a side view light emitting diode package. Referring to FIGS. 1 and 2, a backlight device of a liquid crystal display (LCD) of a mobile communication device is generally configured as shown in FIG. 1. That is, in the backlight device 10, a flat light guide plate 14 is disposed on the substrate 12, and a side view light emitting diode, that is, LED 20, is disposed on the side of the light guide plate 14. Typically, a plurality of LEDs 20 are arranged in an array form. The light L incident from the LED 20 to the light guide plate 14 is reflected upward by a minute reflection pattern or a reflective sheet 16 disposed on the bottom surface of the light guide plate 14 and exited from the light guide plate 14. (14) The backlight is provided to the upper LCD panel 18.

FIG. 2 is a front view showing an example of the LED 20 of the prior art as shown in FIG. Referring to FIG. 2, the LED 20 has a cup-shaped mounting space 28 accommodating the LED chip 22 (see FIG. 1) therein, and upper and lower thin sidewalls 24 and the mounting space 28 that surround the mounting space 28. It has a package body 22 having a relatively thick sidewall 26 of. The cup-shaped mounting space 28 is opened to the front of the drawing to guide the light generated from the LED chip 22 to the outside to form an LED window, the inside is filled with a transparent resin to seal the LED chip from the outside do. On the other hand, the resin may contain a fluorescent material or the like to convert the monochromatic light generated from the LED chip into white light. In addition, a pair of terminals 29 are installed at both sides of the package main body 22 to electrically connect the LED chip 22 to an external power source.

In this configuration, since the terminal 29 does not overlap the mounting space 28, the thickness of the entire LED 20 can be reduced.

In particular, since the thickness reduction of the LCD backlight device is required in recent years, the thickness reduction of the LED is advantageous to the thickness reduction of the backlight device. Currently, a side light emitting diode (LED) for an LCD backlight device requires a thickness of approximately 0.6 mm or less, and is expected to require a thickness of 0.5 mm or less in the future.

However, it is difficult to secure a package thickness of 0.5 mm or less, that is, a mounting height, with the LED 20 having the structure of FIGS. 1 and 2 described above. This is because the opening of the mounting space 28, i.e., the LED window, is required to have a width greater than or equal to a certain dimension to guide the light generated from the LED chip 22 to the outside. This is because a thickness of more than a predetermined dimension is required, and it is difficult to thin the thickness below a predetermined value only by the manufacturing method of the injection method.

To describe another problem of the LED of the related art applied to the LCD backlight device, the LED window, which is an opening of the mounting space 28, is moved upward from the bottom of the light guide plate 14 by the thickness t _h of the lower side wall 24. Are spaced apart. Accordingly, the light L generated by the LED chip 22 and downwardly emitted to the outside of the mounting space 28 travels by a predetermined length and reaches the reflective sheet 16 under the light guide plate 14. In this case, the first arm part 33 in which the light L is dim is present in the reflective sheet 16, which may reduce the efficiency of the entire LCD backlight device.

Meanwhile, with the miniaturization of mobile communication devices in which the LCD backlight device is mounted, the thickness of the light guide plate of the LCD backlight device also decreases. That is, the thickness of the light guide plate is reduced to 0.5 mm or less.

In this case, the LCD backlight device employing the LED of the prior art has the following problems, which will be described with reference to FIG. As shown in FIG. 3, when the thickness of the light guide plate 14a is 0.5 mm or less, the LED 20a becomes larger than the light guide plate 14a. In this case, since a considerable amount of light generated from the LED chip 22a inside the LED 20a does not enter the light guide plate 14a, light loss occurs. Therefore, in order to prevent this, the LCD backlight device 10a installs a reflector 36 on the upper side of the light guide plate 14a to guide the corresponding light into the light guide plate 14a to prevent light loss.

However, since the configuration of the LCD backlight device 10a becomes more complicated and its manufacturing process is complicated, there is a problem in that the work time and cost increase accordingly.

In addition, as shown in FIG. 4, a plurality of side view light emitting diode packages, that is, LEDs 20, are arranged in an array form on the side of the light guide plate 14 on the substrate 12. The second arm part 36 in which the light generated by the light is faint is present, and this also causes a problem of lowering the efficiency of the entire LCD backlight device.

Furthermore, since the depth of the mounting space 28 of the LED 20 (that is, the distance from the surface of the terminal 29 on which the LED chip 22 is mounted to the top surface of the side wall 24) is usually 0.6 mm or more, the LED chip There is a problem in that light loss increases due to the number of times that light emitted from 22 is reflected between the inner surfaces of the side walls 24.

The present invention has been made to solve the above problems, by minimizing the height of the side wall forming the reflector and the bottom surface of the mounting space of the LED chip, by increasing the angle of the inclined surface of the mounting space, the total emitted from the LED chip It is to provide a side view light emitting diode package that can improve the amount of light and minimize the formation of dark areas when mounted on the backlight device of the LCD.

In addition, the present invention simplifies the manufacturing process by forming a straight type electrode without additional processes such as bending and bending at the time of forming the lead frame, and provides a cutting mounting space on the lead frame (end of the lead frame) to provide a side view. When mounting a light emitting diode package on a PCB, it is to provide a side view light emitting diode package that improves the efficiency of electrical contact and electrical supply between the lead frame and the conductive pattern on the PCB.

According to the trend that the thickness of the light guide plate of the backlight device is reduced to 0.5 mm or less, the side view light emitting diode package having a total thickness of 0.5 mm or less and a method of manufacturing the same by providing a side wall thickness of 0.04 mm to 0.05 mm at a low cost will be.

According to an aspect of the present invention, a reflector comprising a plurality of side walls for partitioning the recessed recessed mounting space, a pair of lead frames coupled to the reflecting portion, the portion of which is exposed to the bottom surface of the mounting space; And an LED chip mounted on the bottom surface of the mounting space and electrically connected to the lead frame by a bonding wire, and a lens unit charged in the mounting space to cover the LED chip and the wire, wherein the side wall is a bottom surface of the mounting space. And a height corresponding to the sum of the height of the LED chip, the height of the bonding wire from the LED chip, and the coating thickness of the lens portion from the highest point of the wire, the side view light emitting diode package is provided.

The bottom surface of the mounting space is preferably formed to have a width corresponding to the width of the LED chip.

The side wall is formed with an inclined surface so that the width of the mounting space becomes wider from the bottom surface of the mounting space toward the inlet of the mounting space, and the inclined surface of the side wall is formed so that the width of the inlet of the mounting space is widened in a range where the height of the side wall is maintained. It is desirable to be.

In addition, the pair of lead frames may be inserted into the reflecting portion from the outside so as to penetrate the side wall in the form of a strip, and the portion protruding outward of the reflecting portion may have a tapered shape that becomes narrower toward the end portion.

In addition, the lens unit may be formed by curing a liquid epoxy (Epoxy) containing a fluorescent material corresponding to the emission color of the LED chip.

According to another aspect of the invention, step (a) of providing a lead frame comprising a cathode terminal and a cathode terminal; (B) forming a reflecting part surrounding the lead frame such that a part of the negative electrode terminal and the positive electrode terminal protrude from both sides, and including a sidewall surrounding the recessed recessed mounting space opened upwardly and the recessed recessed mounting space; Steps; (C) die attaching the LED chip onto the lead frame in the recessed mounting space; (D) bonding the LED chip to the cathode terminal or the anode terminal with a conductive wire; (E) forming a lens unit by dispensing a liquid cured resin into the recessed mounting space; A method of manufacturing a side view light emitting diode package is provided, comprising the step (f) of sawing the side walls facing each other using a sawing machine such that the thickness on the top surface is 0.04 mm to 0.05 mm. .

Here, the lead frame is formed by punching a copper (Cu) plate plated with silver (Ag) with a press mold, and the lead frame includes cutting grooves at both sides of the outer end of the negative electrode terminal and the positive electrode terminal. desirable.

On the other hand, the reflector is preferably formed by a plastic injection method so that the width of the mounting space is 0.3 to 0.35 mm. In addition, the inclined surface of the side wall is preferably formed to have a predetermined inclination angle with respect to the bottom surface.

Any one of the steps (b) to (d) may further include coating a reflective material or bonding a metal reflective plate to the inclined surface of the sidewall.

The liquid curing resin may include a mixture of a fluorescent material in a liquid epoxy corresponding to the color of the LED chip.

According to still another aspect of the present invention, a reflector includes a pair of lead frames, and a side wall surrounding the lead frame and including a recessed recessed mounting space opened upward and a recessed recessed mounting space. Wow; An LED chip mounted in the recessed mounting space and electrically connected to the lead frame by wire bonding; A side view light emitting diode package is provided, including a lens unit filled in the recessed mounting space, wherein the sidewalls facing each other have a thickness of 0.04 mm to 0.05 mm on an upper surface thereof.

The pair of lead frames may have a band shape, and each of the opposing lead frames may be disposed in a straight line at a predetermined interval, and a part of the lead frames may protrude outward from the reflecting portion. Here, it is preferable that a part of the lead frame protruding to the outside of the reflecting portion has a tapered shape that becomes narrower toward the end portion. On the other hand, the height of the side wall is preferably 0.25 mm to 0.35 mm.

And, according to another aspect of the invention, a pair of lead frame; A reflecting portion surrounding the lead frame and including a concave recessed mounting space opened upwardly and a side wall surrounding the recessed recessed mounting space; An LED chip mounted in the recessed mounting space and electrically connected to the lead frame by wire bonding; A side view light emitting diode package including a lens unit filled in the recessed recessed mounting space and having a height of 0.25 mm to 0.35 mm is provided. The reflection part may include a plastic material, and may be formed by injection, and the inclined surface of the sidewall may be formed to have a predetermined inclination with respect to the bottom surface of the recessedly embedded mounting space.

The lens unit may be formed by curing a liquid epoxy including an fluorescent material corresponding to the emission color of the LED chip.

On the other hand, the pair of lead frames is in the form of a band, each of the opposing lead frame is arranged in a straight line spaced apart a predetermined interval, a portion thereof is preferably protruded to the outside of the reflecting portion. Here, it is preferable that a part of the lead frame protruding to the outside of the reflecting portion has a tapered shape that becomes narrower toward the end portion.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the side view light emitting diode package and a method for manufacturing the same according to the present invention, in the description with reference to the accompanying drawings the same or not Corresponding components are given the same reference numerals and redundant description thereof will be omitted.

5 is a flowchart schematically illustrating a method of manufacturing a side view light emitting diode package according to a preferred embodiment of the present invention. In the manufacturing method of the side view light emitting diode package according to the present embodiment with reference to FIG. 5, each step will be described in detail with reference to FIGS. 6 to 11.

6 is a plan view illustrating a lead frame according to an exemplary embodiment of the present invention, FIG. 7 is a plan view illustrating a state in which a reflector is formed on the lead frame of FIG. 6, and FIG. 8 is A-A of FIG. 7. 9 is a cross-sectional view of the line 'B-B' of FIG. 7, FIG. 10 is a cross-sectional view of a state in which the LED chip is mounted and wire bonded, and FIG. 11 is a side manufactured according to a preferred embodiment of the present invention. A perspective view illustrating a view light emitting diode package.

First, a lead frame 110 (see FIG. 6) is provided (S1).

In this embodiment, a copper (Cu) plate material plated with silver (Ag) was punched with a press die to form a lead frame plate 110 as shown in FIG. The thickness of the chip is 0.2mm so that the heat generated from the LED chip can be dissipated to the outside of the package.

A pair of strip-shaped lead frames 111 are disposed so that the opposite ends of the inner side are spaced apart by a predetermined interval G, and the outer ends thereof are connected to both sides thereof by connecting pieces 113. The pair of lead frames 111 may be the cathode terminal 111a on one side and the anode terminal 111b on the other side.

On the other hand, the cutting mounting space 115 is formed in the outer portion of the portion where the outer end portion and the connecting piece of the lead frame meet. The role of the cutting groove 115 will be described later.

Secondly, a reflective part 120 (see FIGS. 7 to 9) is formed on the lead frame plate 110 (S2).

It surrounds a pair of long recessed recessed mounting space 125 to both sides of the cup-shaped to surround the pair of lead frame 111 so that one end portion protrudes on both left and right sides and accommodates the LED chip 130 (see FIG. 10) therein. Reflectors 22 having upper and lower sidewalls 121a and 121b and relatively thick sidewalls 123a and 123b to the left and right of the mounting space 125 are formed. The reflector 120 is formed on the upper and lower portions of the pair of lead frames 111 and is formed by a general plastic injection method.

In this embodiment, the thicknesses of the upper and lower sidewalls 121a and 121b are 0.2 mm, respectively, and the distance between the inner surfaces of the upper and lower sidewalls 121a and 121b on the bottom surface of the mounting space 125 is 0.3 mm (LED chip is seated). Thickness on the bottom surface).

However, the plastic injection method cannot make the sidewalls, especially the upper and lower thin sidewalls 121a and 121b less than 0.07 mm thick, and as the thickness thereof decreases, the manufacturing cost increases, and the thickness of the sidewalls is 0.07 at high cost. Even if the reflector is manufactured in mm, the overall thickness of the side-view LED package is greater than 0.5 mm, so that the thickness of the light guide plate 14a (see FIG. 3) does not meet the trend of requiring 0.5 mm or less. You still have problems, such as the need to use it. The technical solution of this problem is made by Sawing (S6, see Fig. 5) of the lead frame and side wall, which is the final step of the manufacturing method of the side view light emitting diode package according to the present invention. Detailed description thereof will be described later.

On the other hand, the side wall has an inclined surface so that the width of the mounting space becomes wider from the bottom surface of the mounting space toward the entrance of the mounting space. That is, the inner wall surfaces of the sidewalls 121a, 121b, 121a and 121b are inclined in consideration of the luminous efficiency of the side view light emitting diode package, and a reflective material is coated on the inner wall surfaces 121a, 121b, 121a and 121b of the sidewall. Or a reflective plate made of metal.

Third, die attach the LED chip 130 (see FIG. 9) (S3).

In this embodiment, the LED chip 130 is attached onto the lead frame 111a in the mounting space 125 using the conductive paste 135, and the LED chip 130 having a size of 0.24 × 0.48 × 0.1 mm is used. It was.

Fourth, the LED chip 130 is bonded with the lead frame 111b by the conductive wire 135 (see FIG. 10) (S4). In this embodiment, gold (Au) wire 135 is used.

In the present embodiment, the LED chip 130 is attached to the lead frame 111a on one side with the conductive paste 133 and then bonded to the lead frame 111b on the other side with an Au wire 135 to be electrically connected thereto. However, the LED chip is attached to the injection of the reflecting portion 120 between the opposite ends of the inner side of the pair of lead frames 111a and 111b with a non-conductive paste (not shown), and the lead frames 111a, Wire bonding with 111b) may also be considered.

Fifth, the lens unit is formed in the mounting space 125 of the reflector (S5).

The lens unit 137 is formed by dispensing liquid epoxy in which the fluorescent material is mixed in the mounting space 125 to correspond to the color of the LED chip 130.

Meanwhile, in the present embodiment, the lens unit 137 is formed by mixing the fluorescent material with the liquid epoxy, but after potting the fluorescent material on the LED chip 130, the cured resin such as the liquid epoxy is reflected. A method of forming the lens unit 137 by injecting into the negative mounting space 125 may also be considered.

Finally, the lead frame plate and the side wall are cut (S6).

Sawing both side walls 121a and 121b facing each other using a sawing machine using a blade along a cutting line C (see FIGS. 7 and 8) so that the thickness on the top surface is 0.04 mm, respectively. By doing so, the side view light emitting diode package 100 and the manufacturing method thereof according to the present embodiment are completed.

As described above, there is a problem that the thickness of the side wall is less than 0.07 mm by the injection method. To solve this problem, in the present embodiment, the thickness of the side walls 121a and 121b using a sawing machine using a blade ( t ₂ ) is 0.04 mm, and the upper width t ₃ of the mounting space 125 of the reflector is 0.32 mm so that the total thickness (t, see FIG. 11) of the side view light emitting diode package is 0.4 mm. It becomes possible.

By dramatically reducing the overall thickness of the side view light emitting diode package without incurring high cost, it is possible to reduce the thickness of the LCD backlight device employing the side view light emitting diode package in response to the trend of using a light guide plate of 0.5 mm or less. .

In addition, when the side view light emitting diode package according to the present invention is applied to the LCD backlight device by minimizing the first arm portion 33 (see FIG. 1) by reducing the thickness t2 of the side walls 121a and 121b to 0.04 mm, respectively. The luminous efficiency can be improved.

Meanwhile, when the lead frame 110 (refer to FIG. 7) and the reflector 120 are cut along the cutting line C, the pair of lead frames 111a and 111b may be formed due to the cutting groove 115. The taper shape becomes narrower toward each end, thereby forming an end without cutting.

Therefore, the lead frame uses a silver plated copper (Cu) plate material, so that the plated silver (Ag) falls off from the copper (Cu) plate material at the time of cutting, so that the PCB of the side view LED package is viewed. Solving the problem that the electrical contact between the lead frame and the conductive pattern on the PCB and the efficiency of the electrical supply is reduced when mounted on.

12 is a perspective view of a side view light emitting diode package for improving the total amount of emitted light according to another exemplary embodiment of the present invention, and FIG. 13 is a cross-sectional view taken along line C-C 'of FIG. 12 for explaining an arrangement of a lead frame. FIG. 14 is a cross-sectional view taken along line D-D 'of FIG. 12 with the sidewall of the reflector at a typical height h1, and FIG. 15 is a side view of FIG. 12 with the sidewall of the reflector at a preferred height h2 in accordance with a preferred embodiment of the present invention. D-D 'sectional drawing and FIG. 16 is E-E' sectional drawing of FIG.

12 and 13, both sides of a cup shape are formed to surround a pair of lead frames 111 ′ so that one end portion protrudes from both left and right sides and accommodate the LED chip 130 ′ (see FIGS. 14 to 16) therein. Reflection with recessed recessed mounting space 125 'and upper and lower sidewalls 121'a and 121'b surrounding it and relatively thick sidewalls 123'a and 123'b to the left and right of mounting space 125'. Section 120 '. The reflector 120 'is formed on the upper and lower portions of the pair of lead frames 111', and is generally formed by a general plastic injection method.

As shown in FIG. 13, the pair of lead frames 111 ′ in the form of a strip are disposed in a straight type without the curved or bent surface as a whole at opposite ends of the inner facing ends. The pair of lead frames 111 ′ is a cathode terminal 111 ′ a on one side and a cathode terminal 111 ′ b on the other side. The polarity of both terminals can be changed as needed.

In addition, a part of the inner side of the lead frame 111 'is formed so that the plastic injection-molded part forming the reflector 120' may surround the lead frame 111 'and connect the upper and lower parts thereof to stably support the lead frame 111'. The width was formed narrower than the outer both ends.

In the present embodiment, the pair of lead frames 111 'is formed by punching a copper (Cu) sheet plated with silver (Ag) with a press die, where the lead frames 111' are generated in the LED chip. The thickness was set to 0.2 mm to serve to radiate heat to the outside of the side view LED package.

Moreover, it is preferable that each outer edge part of a pair of lead frame 111'a, 111'b has a taper shape which becomes narrower toward an edge part.

This is because the pair of lead frames 111'a and 111'b are shaped as described above when the lead frame plate made of copper (Cu) plated with silver (Ag) is cut. Therefore, the plated silver (Ag) from the copper (Cu) plate material can be solved, and the side view light emitting diode package 100 'according to the present invention is mounted between the PCB and the end of the lead frame when mounting the PCB. By providing a space for solder, the efficiency of electrical contact with the conductive pattern on the PCB can be improved, and the side view light emitting diode package can be completely adhered to the PCB, thereby improving heat dissipation efficiency through the lead frame. Will be.

Referring to FIG. 16, an LED chip 130 ′ (0.24 × 0.48 × 0.1 mm) is formed on a lead frame 111 ′ a exposed through the interior of the mounting space 125 ′ of the reflector 120 ′. The LED chip 130 'is bonded to the conductive paste 133' and bonded to the other lead frame 111'b and the gold (Au) wire 135 'to be electrically connected thereto.

In addition, after the LED chip 130 'is attached to the lead frame 111'a on one side with the conductive paste 133', gold (Au) wire 135 'is attached to the lead frame 111'b on the other side. Instead of bonding, it is also conceivable to attach the LED chip to the lead frame 111'a on one side with a non-conductive paste (not shown) and wire bond with the lead frames 111'a and 111'b on both sides, respectively. have.

In the mounting space 125 ′ of the reflecting unit, a lens unit 137 ′ protecting the LED chip 130 ′ and the gold (Au) wire 135 ′ is provided. In the present exemplary embodiment, the lens unit 137 ′ is formed by dispensing a liquid epoxy mixed with a fluorescent material corresponding to the color of the LED chip 130 ′. Monochromatic light can be produced using the LED chip 130 ′ that emits monochromatic light by the fluorescent material.

Meanwhile, in the present embodiment, the lens unit 137 'is formed by mixing the fluorescent material with the liquid epoxy, but after curing the fluorescent material on the LED chip 130', the cured resin such as the liquid epoxy It may also be considered to form the lens unit 137 'by injecting the light into the mounting space 125' of the reflecting unit.

Hereinafter, the shape of the mounting space 125 ′ of the reflecting portion will be described with reference to FIGS. 14 to 18, and in particular, the preferred embodiment of the present invention is compared with the case where the side wall of the reflecting portion has a normal height h1. Therefore, the reason why the luminous efficiency and the total light amount in the case where the side wall of the reflector is made the preferred height h2 is improved.

The shape of the mounting space 125 'of the reflector has a great influence on the improvement of the luminous efficiency and the total light quantity of the side view light emitting diode package, and the shape thereof is very important, and the height of the side wall 121' is the height of the mounting space 125 '. The height of the LED chip 130 'mounted on the package from the bottom surface, the height of the bonding wire 135' (see FIG. 16) electrically connecting the LED chip 130 'and the lead frame, and the highest of the wire 135'. The minimum height is preferably limited to the sum of the coating thicknesses of the lens parts from the high point.

In addition, the bottom surface of the mounting space 125 ′ may be formed to have a minimum width in consideration of the width of the LED chip 130 ′ mounted in the package and manufacturing errors required for die attaching the LED chip 130 ′.

On the other hand, the shape of the side wall 121 'has a sloped surface such that the width of the mounting space becomes wider from the bottom surface of the mounting space toward the entrance of the mounting space, and the height of the side wall 121' determined as described above is maintained. It is desirable to make the inlet of the mounting space as wide as possible. In this way, the overall thickness (t, see FIG. 11) of the side view light emitting diode package can be reduced, and θv (View Angle) representing the angle of light emitted to the side can be increased.

FIG. 14 illustrates the light emitted from the LED chips 130 'and 0.24 × 0.48 × 0.1 mm when the height of the sidewall 121' dividing the mounting space 125 'of the reflector is 0.6 mm (h ₁ ). Reflective characteristics are shown.

The width t ₂ ′ of the bottom surface of the mounting space 125 ′ is 0.24 mm in width of the LED chip 130 ′ and a manufacturing error of 0.06 mm (0.03 mm from the bottom surface of the mounting space to the side wall of the LED chip. the thickness t ₁ ′ on the top of the side wall 121 'is 0.1 mm in consideration of the structural stability and the injection method. Here, the inclined surface of the side wall 121 'has an inclination for the reflection of light, the inclination angle is θ ₁ .

At this time, the light L ₁ emitted from the LED chip 130 ′ is reflected four times on the inclined surface of the side wall 121 ′, and when the reflection of the light particles occurs, a predetermined amount of light particles collides with the inclined surface of the side wall 121 ′. Energy is lost.

FIG. 15 shows reflection characteristics of light emitted from the LED chip 130 'when the height of the side wall 121' dividing the mounting space 125 'of the reflector is 0.3 mm (h ₂ ).

Gold (Au) wire 135 'which electrically bonds the lead frame 111' from the LED chip 130 'when the thickness of the LED chip 130' is 0.1 mm, which is a typical value. The height of the peak is usually 0.15 to 0.2 mm, and the coating thickness of the lens portion 137 '(see FIG. 16) for encapsulating and protecting it is preferably in the range of 0.25 to 0.35 mm, so that the sidewall 121 is considered in consideration of structural stability. The height of ') was 0.3 mm (h ₂ ).

At this time, the inclination angle of the inclined surface of the side wall 121 'becomes θ ₂ under the condition that t ₁ ′, t ₂ ′, and t' are the same as in FIG. 14, and θ ₂ increases compared to θ ₁ . As such, the reflection characteristic of light emitted from the LED chip 130 ′ also changes as the θ ₂ increases.

The number of reflections on the inclined surface of the side wall 121 'of the light L ₂ emitted from the LED chip 130' is reduced to one at four times (the number of reflections of L ₁ , see FIG. 14) and at the same time, The amount of energy lost by the impact of particles of light due to collision with the inclined surface of the side wall 121 'is also reduced, thereby improving the total amount of light emitted from the side view light emitting diode package 100' according to the present invention.

On the other hand, the side wall is formed with an inclined surface so that the width of the mounting space becomes wider from the bottom surface of the mounting space toward the inlet of the mounting space, the inclined surface of the side wall is as wide as possible the inlet width of the mounting space in the range that the height of the side wall is maintained It is preferable to form so as to make the inclination angle θ ₂ large.

In this embodiment, considering the recent trend of requiring the thickness of the light guide plate to be 0.5 mm or less, reducing t ₁ has a manufacturing method or a cost problem, and reducing t ₂ has a limitation depending on the size of the LED chip. By reducing the height of the side wall partitioning the mounting space of the reflector to 0.3 mm under the conditions, the inclination angle of the inclined surface of the side wall is increased to effectively improve the total amount of emitted light of the side view light emitting diode package.

FIG. 16 is a cross-sectional view taken along the line E-E 'of FIG. 12, wherein the heights of the side walls 123'a and 123'b are 0.6 mm (h ₁ ), which is a typical height in the prior art, and 0.3, which is a preferred height of the present invention. In order to compare the effect difference in the case of mm (h ₂ ), the former is shown by the dotted line.

As shown in FIG. 16, the heights of the sidewalls 123'a and 123'b are set at 0.6 mm (h ₁ ) under the condition that the thickness t ₃ 'on the upper surfaces of the sidewalls 123'a and 123'b is constant. By lowering to 0.3 mm (h ₂ ), it can be seen that θv (View Angle) representing the angle of light emitted to the side increases from θv ₁ to θv ₂ .

17 is a perspective view illustrating an example in which the side view LED package 100 ′ of FIG. 12 is applied to an LCD backlight device, and FIG. 18 is a plan view of FIG. 17.

17 and 18, a plurality of side view light emitting diode packages 100 ′ are disposed in an array on a substrate 112 adjacent to one side of the light guide plate 114.

Here, according to the present invention, as described above with reference to FIG. 16, θv (View Angle) is increased, and accordingly, the area of the arm part 136 generated on the light guide plate 114 between the plurality of side view light emitting diode packages 100 ′. As compared with the second arm part (refer to FIG. 4) when the conventional side view LED package is mounted, the problem of reducing the efficiency of the conventional LCD backlight device is solved.

Hereinafter, a comparative experiment example according to the shape of the mounting space of the reflector will be described with reference to FIGS. 14 and 15.

The total thickness (t ') of the side view light emitting diode package used in the experiment was 0.425 mm, the thickness (t ₁ ') on the top surface of the side wall was 0.042 mm, and the bottom of the mounting space where the LED chip 130 'was seated. The width (t ₂ ') of the surface was 0.3 mm, and the blue chip (0.24 x 0.48 x 0.1 mm) was used for the LED chip 130', and the clear type (DX-20-4) was used as the die bonding paste. Bonded with lead frame 111'b on one side using 1mil gold wire (135 ') of 1mil standard, and lens unit (137') is a phosphor in liquid epoxy (YE 1205 A / B Epoxy) of YESMTECH (30%) was mixed and dispensed to allow white light to be emitted. In addition, the applied voltage per LED chip 130 'was 20 mA.

As the measurement equipment, CAS 140B, a German instrument company, which is widely used as an initialization (data calibration) equipment in the LED industry, was used, and the measurement position was 100 mm from the LED chip 130 '.

Under the above conditions, the luminance of the emitted light is compared when the height of the side wall 121 'partitioning the mounting space 125' of the reflector is set to 0.57 mm (a) and 0.3 mm (b). It was.

As shown in Table 1, the results of the comparative experiments show that the total amount of light emitted in the side view light emitting diode package having a height of 0.3 mm compared to a case where the height of the side wall 121 'is 0.57 mm (i.e., , Brightness) increased by about 10%.

No. (a) When the height of the side wall 121 is 0.57 mm (b) When the height of the side wall 121 is 0.3 mm Luminance (mcd) Wavelength (nm) Luminance (mcd) Wavelength (nm) One 1.05 456.83 1.17 455.67 2 1.08 456.25 1.14 455.75 3 1.07 455.18 1.19 454.27 4 1.07 454.66 1.19 454.50 5 1.07 455.07 6 1.06 455.80 Min. 1.05 454.66 1.14 454.27 Max. 1.08 456.83 1.19 454.75 Avg. 1.07 456.63 1.17 455.05

<Table 1: Comparison data of luminance according to side wall height>

Although the preferred embodiments of the present invention have been described above, those skilled in the art may variously modify and modify the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. It will be appreciated that it can be changed.

According to the present invention having the above configuration, by increasing the total amount of light emitted from the LED chip, when mounting the side view light emitting diode package to the backlight device it is possible to minimize the dark portion formation and improve the overall brightness of the backlight.

A side view light emitting diode package having a total thickness of 0.5 mm or less and a method of manufacturing the same may be provided by cutting the injection molding surrounding the lead frame forming the reflector using a blade such that the thickness of the sidewall thereof is 0.04 mm to 0.05 mm. .

In addition, the present invention can simplify the manufacturing process by forming a straight type electrode without additional processes such as bending and bending at the time of forming the lead frame, by providing a cutting mounting space on the lead frame (end of the lead frame) When mounting on a PCB, it is possible to provide a side view light emitting diode package and a method of manufacturing the same, wherein the efficiency of electrical contact and electrical supply between the lead frame and the conductive pattern on the PCB is improved.

In addition, by minimizing the height of the side wall forming the reflector and the bottom surface of the mounting space of the LED chip, the angle of the inclined surface of the mounting space is increased, thereby improving the total amount of light emitted from the LED chip and the dark portion when mounted on the backlight device of the LCD. A side view light emitting diode package capable of minimizing formation can be provided.

Claims (6)

A reflector including a plurality of sidewalls defining a concavely embedded mounting space; A pair of lead frames coupled to the reflecting unit and partially exposed to the bottom surface of the mounting space; An LED chip mounted on a bottom surface of the mounting space and electrically connected to the lead frame by a bonding wire; A lens part charged in the mounting space to cover the LED chip and the wire, The side wall is formed to a height corresponding to the sum of the height of the LED chip from the bottom surface of the mounting space, the height of the bonding wire from the LED chip, and the coating thickness of the lens portion from the highest point of the wire. , The pair of lead frames may have a tapered shape in which a portion thereof is inserted into the reflecting portion from the outside so as to penetrate the side wall in a strip shape, and the portion protruding out of the reflecting portion becomes narrower toward the end portion. Side view light emitting diode package. The method of claim 1, The bottom surface of the mounting space is a side view light emitting diode package, characterized in that formed in a width corresponding to the width of the LED chip. The method of claim 2, The side wall is a side view light emitting diode package, characterized in that formed with an inclined surface such that the width of the mounting space becomes wider from the bottom surface of the mounting space toward the inlet of the mounting space. The method of claim 3, The inclined surface of the side wall is a side view light emitting diode package, characterized in that the width of the inlet of the mounting space is widened in the range that the height of the side wall is maintained. delete The method of claim 1, The lens unit is a side view light emitting diode package, characterized in that formed by curing a liquid epoxy (Epoxy) containing a fluorescent material corresponding to the emission color of the LED chip.

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