KR100730512B1 - Led package of side view type and the method of manufacturing the same - Google Patents

Abstract

A light emitting diode package of side view type and a manufacturing method thereof are provided to improve optical characteristics by employing a transfer molding manner to uniformly distribute phosphors in a transparent resin. A pair of lead frames(129a,129b) are arranged in a line to a longitudinal direction keeping a constant distance from each other. A reflector(120) surrounds the lead frames and includes a slot(128) opened to a preset side and a sidewall surrounding the slot. An LED chip is mounted in the slot and electrically connected to lead frames. Phosphors are uniformly filled in the slot through a transfer molding method, and simultaneously a molding unit coupled to the reflector is formed.

Description

Side light emitting diode package and manufacturing method thereof {LED PACKAGE OF SIDE VIEW TYPE AND THE METHOD OF MANUFACTURING THE SAME}

1 is a front view showing an example of a side light emitting diode package of the prior art.

2 is a cross-sectional view of FIG. 1.

3 is a perspective view of a side light emitting diode package according to a preferred embodiment of the present invention.

4 is a cross-sectional view taken along the line AA ′ of FIG. 3.

5 is a flow chart illustrating a method of manufacturing a side light emitting diode package according to a preferred embodiment of the present invention.

Figure 6 is a perspective view for explaining a molding portion forming process of the side light emitting diode package according to an embodiment of the present invention.

7 is a perspective view illustrating a state in which a mold is coupled to form a molding part of a side light emitting diode package.

8 is a cross-sectional view taken along line BB ′ of FIG. 7.

<Description of the symbols for the main parts of the drawings>

100: side light emitting diode package 120: reflector

124, 126: side wall 128: groove

129: lead frame 130: LED chip

140: molding 150: mold

The present invention relates to a light emitting diode package, and more particularly to a side light emitting diode package.

Light emitting diodes (LEDs) are a type of semiconductor device that converts electrical energy into light energy using characteristics of compound semiconductors, and its application field is continuously expanding. In particular, the light emitting diode package emitting white light is widely used as a light source for a back light of a liquid crystal display (LCD) used in portable electronic products such as mobile phones, camcorders, digital cameras, and personal digital assistants (PDAs). .

The white light emitting diode package is a device that emits white light as a whole by converting part of the light generated from the LED chip into light of a longer wavelength. An LED chip is a semiconductor device that forms a PN junction with a compound such as GaAsP, GaAlAs, GaP, InGaAlP, or GaN, and when a predetermined voltage is applied to the PN junction, electrons or holes move to combine with excess holes or electrons. Is released. The light energy emitted is light of a monochromatic wavelength, and a blue LED chip or an ultraviolet LED chip emits blue light (wavelength between about 440 nm and 475 nm) or ultraviolet light (wavelength between about 350 nm and 410 nm). In addition, the emitted ultraviolet light or blue light is converted into light having a different wavelength by using a phosphor. The phosphor is dispersed in a mold formed of an epoxy resin for protecting the LED chip, and the state in which the phosphor is dispersed in the mold greatly affects the luminance and spectral distribution of the emitted white light.

On the other hand, the side light emitting diode package refers to a device for providing a light source to the side of the light guide plate in the backlight of the liquid crystal display (LCD) of the mobile communication device, the light incident on the side of the light guide plate in the side light emitting diode package to the lower surface of the light guide plate It is reflected upward by a fine reflection pattern or reflective sheet disposed thereon to exit the light guide plate and then provide a backlight to the LCD panel on the light guide plate.

1 and 2, the side light emitting diode package 10 includes a cup-shaped groove 28 accommodating the LED chip 30 therein, and upper and lower thin sidewalls 24a and 24b and the groove 28 surrounding the cup-shaped groove 28. ) Reflectors 20 having relatively thick sidewalls 26a and 26b on either side. The cup-shaped groove 28 is opened forward to guide the light generated from the LED chip 30 to the outside to form an LED window, the molding portion 37 made of a transparent resin therein is the LED chip 30 ) Is sealed from the outside. In addition, a pair of terminals 29a and 29b are installed at both sides of the reflector 20 and bonded to the LED chip 30 and the wire 35 to be electrically connected to an external power source.

The molding part 37 is usually made of a transparent epoxy resin, and phosphors corresponding to the emission color of the LED chip 30 are dispersed in the resin. In general, a liquid epoxy resin is potted or dispensed into the groove 28 by using a dispenser to form a molding part 37 by curing, wherein the phosphor dispersed in the resin according to the time required at the time of curing Precipitation is caused by reducing the brightness of the white light emitted from the side light emitting diode package 10, and there is a problem that the spectral distribution is uneven.

In addition, when the molding part 37 is formed in the above manner, since the transparent resin containing the phosphor is filled only in the groove 28, the opportunity for the light emitted from the LED chip 30 to reach the phosphor is limited. there is a problem.

The present invention has been made to solve the above problems, the present invention is to provide a side light emitting diode package and a method of manufacturing the same that can be evenly dispersed in a transparent resin forming a molding.

In addition, the present invention is to provide a side light emitting diode package and a method for manufacturing the same that can serve as a lens by improving the structure of the molding.

According to an aspect of the present invention, a reflector including a pair of lead frames, a groove surrounding the lead frame and open to one side and a side wall surrounding the groove, and mounted inside the groove and electrically connected to the lead frame. A side light emitting diode package is provided that includes an LED chip connected to the mold, and a molding part charged in the groove and coupled to the reflector to cover an upper end of the sidewall.

Here, the molding part is preferably formed by transfer molding a translucent epoxy resin tablet in which phosphors corresponding to the emission color of the LED chip are mixed.

The molding part may be formed by injection molding a translucent liquid epoxy resin in which phosphors corresponding to the emission color of the LED chip are mixed.

On the other hand, the reflector comprises a plastic material, it is preferably formed by injection. In addition, the LED chip may be electrically connected by wire bonding or flip chip bonding to the lead frame, and a metal reflective layer may be stacked on an inner surface of the sidewall.

According to another aspect of the invention, the step of arranging a pair of lead frame in the longitudinal direction so that one end is spaced apart by a predetermined interval, and the groove surrounding the lead frame, and the sidewall surrounding the groove is opened to one side Injection molding the reflector including, mounting the LED chip in the groove, electrically connecting to the lead frame, and transfer molding a translucent epoxy resin tablet mixed with phosphors corresponding to the emission color of the LED chip A method of manufacturing a side light emitting diode package is provided that includes forming a molding portion coupled to the reflector to fill therein and cover an upper end portion of the sidewall.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the side light emitting diode package and a method of manufacturing the same according to the present invention, in the description with reference to the accompanying drawings, the same or corresponding to the reference numerals Overlapping descriptions of the components will be omitted.

3 is a perspective view of a side light emitting diode package according to a preferred embodiment of the present invention, and FIG. 4 is a cross-sectional view taken along line AA ′ of FIG. 3.

Referring to FIGS. 3 and 4, the side light emitting diode package 100 according to the present exemplary embodiment may have a long groove on both sides of a cup shape surrounding the pair of lead frames 129 and accommodating the LED chip 130 therein. 128, a portion indicated by a dotted line in FIG. 3), and a reflector 120 having thin sidewalls 124a and 124b surrounding it and relatively thick sidewalls 126a and 126b. The reflector 120 is formed on the upper and lower portions of the pair of lead frames 129 and is formed by injecting a general plastic resin.

A pair of strip-shaped lead frames 129a and 129b have one end facing each other at a predetermined interval and are arranged in a straight type as a whole, and the other ends protrude outward from both sides of the reflector 120. And bent downwardly and then bent inward from the bottom thereof, thereby having a structure in which the side light emitting diode package 100 is easily connected to an external power source when mounted on the PCB.

The pair of lead frames 129 has one side as the negative terminal 129a and the other side as the positive terminal 129b. However, the polarity of both terminals can be changed as necessary. In addition, the plastic injection molding constituting the reflector 120 surrounds the lead frame 129 and is connected up and down to stably support the lead frame 129.

In this embodiment, the pair of lead frames 129 is formed by punching a copper (Cu) plate plated with silver (Ag) with a press die, wherein the lead frame 129 is an LED chip 130. The thickness of the side light-emitting diode package 100 to the outside to serve to dissipate was set to 0.2mm.

The LED chip 130 is mounted on the lead frame 129a on one side exposed through the groove 128 of the reflector 120, and the LED chip 130 is bonded to the conductive paste 133, and The lead frame 129b and the gold (Au) wire 135 are bonded and electrically connected to each other.

In addition, instead of bonding the LED chip 130 to the lead frame 129a on one side with the conductive paste 133, the LED chip 130 is bonded to the lead frame 129b on the other side with an Au wire 135. May be attached to the lead frame 129a on one side with a non-conductive paste (not shown) and wire-bonded with the lead frames 129a and 129b on both sides, respectively.

On the other hand, the molding portion is filled from the inside of the groove 128 of the reflector to enclose the LED chip 130 and the gold (Au) wire 135, and covers the upper surface of the side walls (124, 126) to serve as a lens 140 is provided. In the present exemplary embodiment, the molding part 140 has a shape protruding to the upper side of the groove 128 so as to act as a lens. Of course, the protruding shape may be manufactured to have various shapes.

As such, in order to manufacture the molding part 140 to cover the upper shape of the molding part 140 and the upper surfaces of the sidewalls 124 and 126, the manufacturing method of the manufacturing part may be performed by dispensing or potting a liquid epoxy resin as in the related art. There is difficulty. Therefore, it is preferable to manufacture the molding part 140 by injection molding or transfer molding using a mold.

On the other hand, the molding unit 140 is made of a translucent epoxy resin containing a phosphor corresponding to the light emission color of the LED chip 130, to create a white light using the LED chip 130 that emits monochromatic light by the phosphor It becomes possible. Here, the more uniformly distributed, evenly dispersed, the phosphor is in the epoxy resin, the better the optical characteristics such as luminance and spectral distribution.

In this embodiment, in order to have excellent optical properties, a transfer molding method is used. A phosphor powder is mixed with an epoxy mold compound (EMC) powder to make a mixture, and the mixture is transferred by using a mold. The molding part 140 is formed.

Since the transfer molding method has a relatively short curing time of the resin, there is an advantage in that the optical property may be reduced due to the precipitation of the phosphor powder during curing of the resin, which may occur in a method using a liquid epoxy.

In addition, since the mold is used, the upper surface of the reflector 120 may be covered with a predetermined thickness, and the upper shape of the molding part 140 may be variously formed according to a desired purpose, thereby allowing the molding part to simultaneously perform the role of a lens. It is suitable for mass-producing side light emitting diode packages.

In addition, since the molding part 140 covers the upper surface of the reflector 120 to a predetermined thickness and has a shape protruding upward of the groove 128, the light emitted from the LED chip 130 may contact the phosphor. There is also the advantage of increased opportunities.

5 is a flowchart illustrating a method of manufacturing a side light emitting diode package according to an exemplary embodiment of the present invention, and FIG. 6 is a perspective view illustrating a process of forming a molding part of a side light emitting diode package according to an exemplary embodiment of the present invention. 7 is a perspective view illustrating a state in which a mold is coupled to form a molding part of a side light emitting diode package, and FIG. 8 is a cross-sectional view taken along line BB ′ of FIG. 7.

A method of manufacturing the side light emitting diode package according to the present embodiment will be described with reference to FIGS. 5 to 8.

First, in step S1 of providing a lead frame, a unit leadframe frame 129 'including a pair of leadframes 129a and 129b is provided. Here, the pair of lead frames 129a and 129b are spaced apart from each other by predetermined intervals and are generally arranged in a straight line shape (see FIG. 4), and the other ends of the lead frames 129a and 129b are extended to unit lead frame frames. 129 '. In addition, tie bars that protrude from the unit leadframe frame 129 'to both sides of the reflector 120 are formed to stably fix the reflector 120 to be formed later.

Secondly, in the step S2 of forming the reflector, the reflector 120 having the grooves 128 formed on both sides of the cup-shaped open side and surrounding the pair of lead frames 129a and 129b is made of plastic resin. It is formed by injection.

Third, in the step of mounting and wire bonding the LED chip (S3), the conductive paste 133 (see FIG. 8) is exposed on the lead frame 129a exposing the LED chip 130 (see FIG. 8) to the groove 128. The LED chip 130 and the lead frame 129b are bonded with gold (Au) wire 135 (see FIG. 8).

Fourth, in the forming of the molding part covering the reflector by the transfer molding method (S4), as shown in FIGS. 6 and 7, the mold 150 is formed on the unit leadframe frame 129 ′ in which the reflector 120 is formed. ), A phosphor powder is mixed with an epoxy mold compound (EMC) powder to form a mixture (not shown), and the mixture is introduced into the mold 150 to transfer the molding part 140 to a transfer molding method. 8). The mixture introduced into the mold 150 may be made into a tablet, and the transfer molding technique may be omitted by using techniques well known to those skilled in the art.

In the step S4, the molding part is charged from the inside of the groove 128 to encapsulate the LED chip 130 and the gold (Au) wire 135, and covers the upper surface of the reflector 120 to serve as a lens. When the 140 is formed, by adopting a transfer molding method having a short curing time of the resin, it is possible to solve the problem of deterioration of optical properties due to precipitation of the phosphor powder during curing of the resin shown in the prior art.

In addition, since the mold 150 is used, the upper surface of the reflector 120 may be covered with a predetermined thickness, and the upper shape of the molding part 140 may be variously formed according to a desired purpose, thereby causing the molding part to function as a lens. It is suitable for mass-producing side light emitting diode packages that can be performed simultaneously. In addition, since the molding part 140 covers the upper surface of the reflector 120 to a predetermined thickness and protrudes toward the upper side of the groove 128, the light emitted from the LED chip 130 performs a lens role. There is also the advantage of an increased chance of reaching this phosphor.

After the formation of the molding part 140 is completed, the other ends of the tie bars 129'a and 129'b and the leaf frames 129a and 129b are trimmed by the cutting lines C in FIG. After trim, the side protruding portion of the reflector 120 is bent upwardly, that is, formed to form one side light emitting diode package 100 (see FIG. 3).

Meanwhile, in the present embodiment, the unit lead frame frame 129 'having a pair of lead frames has been described as an example for easy description. However, in the actual manufacturing process, a plurality of lead frames are arrayed at the same time. Of course, a case of manufacturing a plurality of side light emitting diode packages may be considered.

Although the preferred embodiments of the present invention have been described above, those skilled in the art may variously modify and modify the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. It will be appreciated that it can be changed.

According to the present invention having the above-described configuration, by adopting a transfer molding method when forming the molding portion, by dispersing the phosphor evenly in the transparent resin constituting the molding portion, a side light emitting diode package and a method of manufacturing the same can be improved Can provide.

In addition, by covering the upper surface of the reflector and the upper surface of the reflector at the same time to implement a variety of shapes, it is possible to provide a side light emitting diode package and a method of manufacturing the molding unit capable of producing a lens at a time.

Claims (7)

A pair of lead frames; A reflector surrounding the lead frame, including a groove open to one side and a side wall surrounding the groove, including a plastic material, and formed by injection; An LED chip mounted in the groove and electrically connected to the lead frame; And a molding portion filled in the groove and coupled to the reflector to cover an upper end portion of the sidewall. The method of claim 1, The molding unit is a side light emitting diode package formed by transfer molding a translucent epoxy resin tablet is mixed with a phosphor corresponding to the light emitting color of the LED chip. The method of claim 1, The molding unit is a side light emitting diode package formed by injection molding a translucent liquid epoxy resin is mixed with a phosphor corresponding to the light emitting color of the LED chip. delete The method of claim 1, The LED chip is wire-bonded or flip chip bonded to the lead frame side light emitting diode package. The method of claim 1, A side light emitting diode package having a metal reflective layer laminated on the inner surface of the side wall. Arranging a pair of lead frames in a longitudinal direction so as to be spaced apart from one end by a predetermined interval; Ejecting and forming a reflector surrounding the lead frame and including a groove open to one side and a sidewall surrounding the groove; Mounting an LED chip inside the groove and electrically connecting the LED chip to the lead frame; Forming a molding part coupled to the reflector to transfer molding a light-transmissive epoxy resin tablet mixed with phosphors corresponding to the emission color of the LED chip to charge the inside of the groove and to cover the upper end of the sidewall; Package manufacturing method.

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