KR100799553B1 - Dam encap type led package or module and methode the same - Google Patents

Abstract

The present invention relates to an LED package and a method of manufacturing the LED package to form an encap after forming a dam (DAM) on the substrate through a simple process of dispensing method, a ceramic material, a synthetic resin material, a printed circuit board ( A method of forming an LED package, comprising: forming a metal pattern through which electricity can pass on a planar substrate made of one of the following PCBs, and mounting a chip to emit visible light on the metal pattern; Discharging transparent silicon and epoxy through a dispenser at a predetermined distance from the center to form a ring-shaped or polygonal dam portion having a predetermined height on the metal pattern; And (2) forming an encap portion in a plane or dome shape on the ring portion or the polygonal dam portion.

LED, Package, Dispensing, Ring Shape, Polygon Shape, Dam, Encap

Description

DAM ENCAP TYPE LED PACKAGE OR MODULE AND METHODE THE SAME}

1 is a cross-sectional view of one embodiment of an LED package according to the prior art,

2 is a plan view of another embodiment of an LED package according to the prior art,

3 is a side view of FIG.

Figure 4 is a view showing a metal pad and lead made of a closed curve on top of a flat substrate applied to the LED package according to the present invention,

5 is a bottom view of the LED package,

6 is a perspective view of an LED package according to Embodiment 1 of the present invention;

7 is a cross-sectional view of FIG.

8 is a partially exploded perspective view of an LED package according to Embodiment 2 of the present invention;

9 is a cross-sectional view of FIG. 8;

10 is a partially exploded perspective view of an LED package according to Embodiment 3 of the present invention;

11 is a cross-sectional view of FIG.

12 is a cross-sectional view of a modular LED package.

*** Explanation of symbols on main parts of drawing ***

100: LED package

101: ceramic substrate

103: metal pattern

105: chip

107: dam section

109: encapsulation

The present invention relates to a method of manufacturing an LED package and LED module by dam formation.

More specifically, the present invention relates to a method of manufacturing an LED package and an LED module for forming an encap after forming a dam on the substrate through a simple dispensing process.

In general, chip LEDs are used for display devices, backlights, and lighting, and recently, the use of chip LEDs is increasing in cell phones and landscape lighting.

Such a display element, a backlight (back light) and an LED package for lighting have to vary the divergence angle of light according to the intended use, and in some applications, a wide divergence angle of light is required. The conventional chip LED is a method of raising a lens in a cup method, as shown in FIG. 3, to form a cup-shaped depression 13 in the center of the substrate 11, and inside the depression 13. The chip LED package 10 is made by filling the encap material 17 inside the cup-shaped depression or by placing the lens 16 on the upper part of the encap material 17 after fixing the chip 15. .

In the case of the chip LED package 10 as described above, since the light exit angle of the chip LED is limited by each corner of the depression 13, the light exit angle is reduced and the light extraction efficiency of the LED chip is lowered. There was a difficulty in fixing the molded lens 17.

In addition, in the related art, a method of forming a rectangular chip LED package by injecting a solid white epoxy mold compound (EMC) into a mold through a transfer mold.

That is, the conventional chip LED has a metal pad (PAD) 2 through which electricity can pass on top of the printed circuit board (PCB) 1 to emit visible light having a specific wavelength, as shown in FIGS. 1 to 3. After forming, the chip 3 emitting visible light is mounted thereon.

The chip 3 is connected to the lead 5 using a gold wire 4.

Thereafter, by applying a transfer mold to heat 170 ~ 180 ℃ to convert the solid phase into a liquid phase and then injected into a mold to mold a certain amount of solid mold epoxy, as shown in Figures 1 and 2 a flat lens is formed A columnar chip LED package 6 is made.

Here, although the structure in which one rectangular chip LED package is formed on the printed circuit board 1 is illustrated, the printed circuit board 1 has a structure in which a plurality of (eg, 798) chips 3 are arranged. Have

However, the solid mold for making the package of the display device and the backlight used in the conventional chip LED is a solid state, and since the change in the physical properties of the material is narrow due to additives and compounding ratios, the process is complicated and a mold is required. There is a problem that the viewing angle is limited in a planar manner.

The present invention has been made to solve the problems of the prior art as described above, the object of the present invention is to form an encap (Encap) after forming a transparent dam (DAM) on the upper surface of the flat substrate through a simple process of dispensing method The outgoing angle of visible light emitted by the chip is freely adjusted according to the height of the dam and the height of the encap, and minimizes the trapped light, thereby minimizing the trapped light. It is to provide a manufacturing method.

In addition, another object of the present invention is to reduce the mold cost to be transferred to the transfer mold process and to provide a simple LED package and LED module and its manufacturing method.

One embodiment of the present invention proposed to solve the above technical problem, after forming a metal pattern through which electricity can pass on a flat substrate made of one of a ceramic material, a synthetic resin material, a printed circuit board (PCB) In the LED package molding method comprising the step of mounting a chip that emits visible light on the metal pattern, (1) by dispensing silicon and epoxy through a dispenser at a predetermined distance from the chip to a predetermined height Forming a ring-shaped or polygonal-shaped dam having an upper portion of the metal pattern; And (2) forming an encap portion on the ring portion or the polygonal dam portion.

In addition, another embodiment of the present invention, in the LED package molding method comprising the step of mounting a chip for emitting visible light on the metal pattern after forming a metal pattern through which electricity can pass through the planar substrate, 1) attaching and fixing a ring-shaped or polygonal-shaped dam portion injection-molded at a position spaced apart from the chip by using an adhesive member; And (2) forming an encap portion on the ring portion or the polygonal dam portion.

In addition, another embodiment of the present invention in the LED package molding method comprising the step of mounting a chip for emitting visible light on the metal pattern after forming a metal pattern through which electricity can pass through the flat substrate, ( 1) forming a ring at a predetermined distance from the chip; (2) inserting and fixing a ring-shaped or polygonal-shaped dam portion formed outside the pattern on which the ring is formed; (3) characterized in that it comprises the step of forming an encap portion on the ring portion or the polygonal dam portion.

It is preferable that the height of the said dam-shaped dam part or polygonal shape is 25 micrometers-3000 micrometers.

The metal pattern is a closed curve circuit.

In addition, another embodiment of the present invention, in the LED package, a metal pattern printed on the flat substrate formed of one of a ceramic material, a synthetic resin material, a printed circuit board (PCB); A chip for emitting visible light mounted on the metal pattern; A dam portion having a ring shape or a polygonal shape formed at a predetermined distance from the chip; And an encap portion formed on the ring portion or the polygonal dam portion.

In addition, another embodiment of the present invention, an LED package, a groove formed flat substrate; A metal pattern printed on the flat substrate; A chip for emitting visible light mounted on the metal pattern; A ring portion or a polygonal dam portion inserted into and fixed to the groove; And an encap formed on the ring portion or the polygonal dam portion.

The ring portion or the polygonal dam portion and the encap portion may be formed by dispensing silicon by a dispenser.

The ring portion or the polygonal dam portion is characterized in that the injection molding.

The metal pattern is a closed curve circuit.

Hereinafter, an LED package will be described in detail with reference to the accompanying drawings.

Example 1

Embodiment 1 of the LED package 100 according to the present invention is a planar substrate 101 made of one of a ceramic material, a synthetic resin material, a printed circuit board (PCB) and the plane as shown in the accompanying drawings A metal pattern 103 printed and formed on the substrate 101, a chip 105 emitting visible light mounted on the metal pattern 103, and a position spaced apart from the chip 105 by a predetermined interval. It is composed of a ring-shaped dam portion 107 formed in the upper portion, and an encap portion 109 formed on the ring-shaped dam portion 107.

The ring-shaped dam 107 is formed by dispensing silicon or epoxy on the metal pattern 103 by a dispenser.

The encap unit 109 is formed by dispensing transparent silicon on the ring-shaped dam unit 107 by a dispenser.

When the dam is formed by dispensing as in the present embodiment, the height of the dam unit 107 is preferably about 50 μm to 1000 μm when formed by dispensing.

The metal pattern 103 is formed of a closed curve circuit as shown in FIG. 3, and when the metal pattern 103 is formed, the thickness of the pattern is preferably 70 μm or more.

Referring to the LED package forming method configured as described above are as follows.

5 and 6, a metal pattern 103 formed of a closed curve circuit through which electricity can pass through an upper portion of a flat substrate 101 formed of a ceramic material, a synthetic resin material, or a printed circuit board (PCB). To form.

A chip 105 emitting visible light is mounted on the metal pattern 103, and the chip 105 is connected to a lead 113 formed of a closed curve circuit by a wire 111.

A dam portion 107 having a ring shape or a polygonal shape is formed by dispensing transparent silicon through a dispenser at a position spaced apart from the chip 105 at a predetermined interval, that is, up to the lead 113. Let's do it.

In addition, the encapsulation unit 109 is formed by dispensing transparent silicon through the dispenser on the ring-shaped dam unit 107.

5 is a bottom view of the LED package 100 according to the present invention.

Example 2

Embodiment 2 of the LED package according to the present invention is a planar substrate 101, a metal pattern 103 is formed and printed on the planar substrate 101, the metal pattern ( 103) Chip 105 for emitting visible light mounted on the upper portion, a ring-shaped dam portion 107 is bonded and fixed by a bonding member at a position spaced apart from the chip 105 by a predetermined interval, and the ring-shaped It consists of an encap 109 formed on the dam 107 of the.

The ring-shaped dam 107 is a transparent injection molding formed using a synthetic resin of solidified silicon or epoxy, and is attached to the upper portion of the metal pattern 103 by an adhesive member.

When the dam is formed of an injection molding as in the present embodiment, the dam height is preferably formed to about 500 ~ 3000 ㎛.

The encapsulation unit 109 is formed by dispensing transparent silicon on the ring-shaped dam unit 107 by a dispenser.

Referring to the LED package forming method configured as described above are as follows.

As shown in FIGS. 7 and 8, a metal pattern 103 formed of a closed curve circuit through which electricity can pass is formed on an upper surface of one of a ceramic material, a synthetic resin material, and a printed circuit board (PCB).

A chip 105 emitting visible light is mounted on the metal pattern 103, and the chip 105 is connected to a lead 113 formed of a closed curve circuit by a wire 111.

A ring-shaped dam portion 107, which is an injection molding made of transparent silicon or a synthetic resin solidified at a position spaced apart from each other by a predetermined interval, that is, the lead 113, is positioned on the metal pattern 103. Attach and fix with adhesive.

In addition, the encapsulation unit 109 is formed by dispensing transparent silicon through the dispenser on the ring-shaped dam unit 107.

Example 3

Embodiment 3 of the LED package according to the present invention is a planar substrate 101, the groove 115 is formed as shown in the accompanying drawings, Figures 9 and 10, and the metal pattern is formed printed on the planar substrate 101 (103), a chip (105) for emitting visible light mounted on the metal pattern (103), a ring or polygonal dam portion (107) inserted and fixed in the groove (115), and the ring shape Or it consists of an encap 109 formed on the dam 107 of the polygonal shape.

The ring portion or polygonal dam portion 107 is an injection molding made of solidified transparent silicone or transparent synthetic resin material.

The encapsulation unit 109 is formed by dispensing transparent silicon on an upper portion of the dam 107 having a ring shape or a polygonal shape by a dispenser.

The chip 105 and the lead 113 are included in the groove 115.

Referring to the LED package forming method configured as described above are as follows.

9 and 10, the groove 115 is formed on the planar substrate 101, and the metal pattern 103 is formed of a closed curve circuit through which electricity can pass. To form.

A chip 105 emitting visible light is mounted on the metal pattern 103, and the chip 105 is connected to a lead 113 formed of a closed curve circuit by a wire 111.

In addition, the groove 115 is inserted into and fixed to a ring portion or a polygonal dam portion 107, which is an injection molded product made of solid silicone or synthetic resin material.

In this case, an adhesive is applied to a lower end of the ring portion or polygonal dam portion 107 that is the groove 115 or the injection molding to fix the dam portion 107 on the flat substrate 101 by the adhesive as well as the groove 115. .

The encapsulation unit 109 is formed by dispensing transparent silicon on the ring or polygonal dam unit 107 using a dispenser.

Example 4

Meanwhile, as shown in FIG. 12, in the present invention, a plurality of LEDs formed by bonding the chip 105 and the metal pattern to the wire 111 are formed and modularized on the planar substrate 101 as in the previous embodiment. A dam-shaped or polygonal dam portion 107 is formed around the edge of the formed area, and the encapsulation portion 109 is formed by dispensing the plurality of LEDs in the upper portion of the inner portion from the dam portion 107 at once. Modular LED package 100 may be provided.

The present invention is not limited to the above embodiments, and various modifications and changes can be made by those skilled in the art, which are included in the spirit and scope of the present invention included in the appended claims.

The present invention having the above-described configuration, operation, and preferred embodiments forms a transparent dam (DAM) on the flat substrate through a simple process of dispensing, so that an encap is formed, and then put into a transfer mold process. It can reduce the mold cost and make the encap process of LED package and LED module efficient.

In addition, the present invention has the effect that the emission angle of the visible light emitted by the chip can be freely adjusted and widened according to the height and shape of the dam (DAM) and the encap (Encap) and the light extraction efficiency is increased.

Claims (8)

Forming a metal pattern through which electricity can pass on a planar substrate made of one of ceramic, synthetic resin, and printed circuit board (PCB), and mounting a chip for emitting visible light on the metal pattern In the manufacturing method, (1) A ring-shaped or polygonal dam portion having a predetermined height by dispensing transparent silicon through a dispenser at a predetermined distance from the chip, and having a height of 50 μm to 1000 μm above the metal pattern. Forming with; And (2) forming an encap portion on the ring or polygonal dam portion; Method for manufacturing a dam encapsulated LED package, characterized in that consisting of. A method of manufacturing an LED package, comprising: forming a metal pattern through which electricity can pass through a ceramic substrate, and mounting a chip to emit visible light on the metal pattern; (1) attaching a 500 μm to 3000 μm ring-shaped or polygonal dam portion injection-molded with a light-transmitting material at a position spaced apart from the chip by using an adhesive member to the upper portion of the metal pattern; Fixing; And (2) forming an encap portion on the ring or polygonal dam portion; Method for manufacturing a dam encapsulated LED package, characterized in that consisting of. The method of claim 1 or 2, wherein the metal pattern, Dam encapsulated LED package manufacturing method characterized in that the closed curve circuit. In the LED package, A metal pattern printed on the ceramic substrate; A chip for emitting visible light mounted on the metal pattern; A dam portion having a ring shape or a polygonal shape formed at a predetermined distance from the chip; And An encap formed on the ring portion or the polygonal dam portion; Dam encapsulated LED package, characterized in that provided including. The method of claim 4, wherein the ring portion or polygonal dam portion, Dam encapsulated LED package, characterized in that the silicon is dispensed by the dispenser to form a height of 50㎛ ~ 1000㎛. The method of claim 4, wherein the ring portion or polygonal dam portion, A dam-in capped LED package, which is injection molded from a light-transmissive material, but formed at a height of 500 μm-3 mm. The metal pattern of any one of claims 4 to 6, Dam-in cap type LED package, characterized in that the closed curve circuit. Module formed by gathering a plurality of LEDs on a flat substrate to form a ring-shaped or polygon-shaped dam around the modularized area, and dispensing the plurality of LEDs at once in the upper direction from the dam to form an encap part. Type LED package.

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