KR100787595B1 - Sensor network platform - Google Patents

Abstract

The present invention provides a sensor network platform, the sensor network including a sensor disposed to be spaced apart from the sensor network platform to minimize the influence of the operation of the sensor network platform, and a sensor for connecting and supporting the sensor and the sensor network platform. It's about the platform.

According to the present invention, in the process of developing an application or service using the sensor network platform, the same measurement value as the actual data can be obtained through the sensor through a process of reducing or correcting a detection error caused by the sensor network platform environment. More reliable data can be detected in management and academic experiments. In addition, the present invention can be widely used in various sensor network applications such as sensor network platform development, sensor network application, and the like, and are intended to be attached to sensor network platforms such as temperature, humidity, light, vibration, magnetic field, and ultrasonic waves. It is also applicable to sensors, enabling the development of application technologies based on sensor network platforms.

Sensor Network Platform, Single, Multiple, Sensor, Sensing Values, Error Compensation, Temperature

Description

Sensor Network Platform {SENSOR NETWORK PLATFORM}

1 shows the attachment of a sensor network platform and a sensor according to the prior art;

2 is a diagram illustrating a configuration of a sensor network platform according to the present invention.

3 illustrates another configuration of a sensor network platform in accordance with the present invention.

<Description of the symbols for the main parts of the drawings>

100: sensor network platform 110: communication chip

120: control chip 130: sensor

140: battery 200: sensor network platform

200a: sensor network processing platform

200b: sensor platform 210: communication chip

220: control chip 230: sensor

240: connecting portion 250: connecting means

The present invention relates to a sensor network platform, and more particularly, in order to improve an error of a detection value generated by a method of directly attaching a sensor to a sensor network platform in a conventional sensor network platform. By attaching in consideration of error, the present invention relates in particular to a sensor network platform which improves the detection value error due to the temperature rise of the sensor network platform.

Sensor network technology was developed with the goal of delivering the measured values measured by the sensor to the desired destination via the wireless network. The sensor network technology aims to be applied later by trusting the measured value measured by the sensor and transmitting the detected value through the wireless network based on the detected value. However, when a service is developed using a real sensor network, there is a problem that an error may occur between a sensed value measured by a sensor and data in a real environment.

1 is a view showing the attachment of a sensor network platform and a sensor according to the prior art.

As shown in the drawing, when the development of the existing sensor network platform is used, the sensor 130 is directly attached to the sensor network platform 100 (on-board type). The sensor network platform 100 includes various components such as a communication chip 110, a control chip (MCU) 120, or a resistor 140, a capacitor 140, or a battery 140 for power supply although not shown.

When the conventional sensor network platform 100 is in a long operation state, a component mounted on the sensor network platform 100, that is, the communication chip 110 or the control chip 120 or the resistor or the capacitor or the battery 140 ) Will generate heat.

In particular, in the case of a sensor in which the sensor 130 senses a temperature, heat generated from the communication chip 110, the control chip 120, or the resistor, the capacitor, or the battery 140 may affect the detection of the sensor 130. do. That is, when the temperature detected from the temperature sensor 130 directly attached to the sensor network platform 100 at the same position is compared with the actual data value measured by thermometers on the market, the sensor network platform 100 directly The temperature measured from the temperature sensor 130 attached is measured to be about 1 to 2 ° C higher.

The difference in temperature sensing value is used to increase the temperature generated in the communication chip 110 or the control chip 120 attached to the sensor network platform 100 or components such as resistors and capacitors, and especially used for wireless sensor network communication. This is because the conventional sensor network platform 100 does not consider the effect of the temperature rise occurring in the battery 140 for power supply.

Meanwhile, although FIG. 1 illustrates a sensor network processing platform and a single sensor network platform in which a sensor platform is implemented on one board, the sensor network processing platform performing communication functions and a sensor platform for processing values sensed through a sensor are illustrated in FIG. Even in the case of the complex sensor network platform implemented on this separate board, the sensor platform is directly coupled to the sensor network processing platform to configure the sensor network platform 100, and thus, the detection of the sensor in the complex sensor network platform is also performed. There is a problem that the value is due to the temperature rise in the component or battery on the sensor platform or sensor network processing platform, and thus there is a problem that the difference between the sensor and the actual data value.

In addition, in the description with reference to FIG. 1, in particular, the case where the sensor 130 is a temperature sensor for measuring a temperature is described, but other sensing such as humidity sensing, light sensing, magnetic field sensing, ultrasonic sensing, vibration sensing, infrared sensing, etc. Similar problems arise with sensors for. That is, there is a problem in that an error between the detected value measured by the sensor 130 and the actual data may occur due to heat or high frequency components generated during the operation of the sensor network platform 100.

Since the error between the detected value of the sensor and the actual data can increase the possibility of malfunction in the service implementation based on the sensor network, measuring the detected value with more precise and less error is the development of the sensor network and the service using the same. The city has become an important consideration for improving reliability.

It is an object of the present invention, in particular, in the conventional sensor network platform, in order to improve the error of the detection value generated by the method of directly attaching the sensor to the sensor network platform, the sensor and the sensor network platform in consideration of the detection value error by attaching in consideration of the detection value error It is to provide a sensor network platform that improves the detection error caused by the temperature rise of the platform.

In order to achieve the above technical problem, the present invention provides a sensor network platform, by connecting the sensor and the sensor network platform and a sensor disposed spaced apart from the sensor network platform to minimize the influence of the operation of the sensor network platform It provides a sensor network platform comprising a supporting connection.

In the sensor network platform according to the present invention, it is preferable that the sensor protrudes out of the sensor network platform and does not come into contact with the sensor network platform except for a part through the connection part.

In addition, in the sensor network platform according to the present invention, the connection portion may be an "L" shape.

In addition, in the sensor network platform according to the present invention, the sensor may be configured to be connected to the sensor network platform through the connection on the side opposite to the surface on which the components of the sensor network platform are disposed.

In addition, in the sensor network platform according to the present invention, the sensor is preferably a sensor for detecting any one or more of temperature, humidity, light, vibration, magnetic field, ultrasonic waves.

In addition, in the sensor network platform according to the present invention, a corner space for attaching the sensor and the connecting portion is formed in a corner portion of the sensor network platform, the sensor and the connecting portion may be configured to be accommodated in the corner space. .

In addition, in the sensor network platform according to the present invention, an inner space for attachment of the sensor and the connecting portion is formed on a surface portion of the sensor network platform, and the sensor and the connecting portion may be configured to be stored in the inner space. .

In addition, in the sensor network platform according to the present invention, the corner space or the inner space may be configured to be formed on a surface opposite to the surface on which the components of the sensor network platform are disposed.

In addition, in the sensor network platform according to the present invention, the sensor network platform may be implemented using one board.

In addition, in the sensor network platform according to the present invention, the internal space may be configured to be formed in the center portion of the sensor network platform.

In addition, in the sensor network platform according to the present invention, the sensor network platform includes two boards of a sensor platform for processing data sensed by the sensor and a sensor network processing platform for network transmission of data processed by the sensor platform. The corner space or the internal space may be configured to be formed on the sensor platform.

In addition, in the sensor network platform according to the present invention, the corner space or the inner space is formed on a surface opposite to the surface on which the components of the sensor platform are disposed, the sensor platform and the sensor network processing platform is the corner space Alternatively, the sensor platform may be inverted and coupled such that the internal space is not disposed therebetween.

In addition, in the sensor network platform according to the present invention, the internal space may be configured to be formed in the center portion of the sensor platform.

Hereinafter, with reference to the accompanying drawings, the sensor network platform of the present invention will be described in more detail.

2a to 2g show the configuration of a sensor network platform according to the invention, in particular the attachment of a single sensor network platform and a sensor.

As shown in FIG. 2A, in one embodiment of the sensor network platform according to the present invention, the sensor 230 protrudes and is supported on the side of the sensor network platform 200.

In this case, in the conventional sensor network platform 100, the sensor 130 is disposed therein and is sensitive to the influence of temperature increase, but in the case of FIG. 2A, the sensor 230 is connected to the sensor network platform 200. Since only a connection is made through the 240, in particular, the sensor 230 detects the measured value of the sensor 230 due to a temperature increase due to the operation of the sensor network platform 200, in particular, the communication chip 210 or the control chip 220. It can reduce the phenomenon that is different from.

2B illustrates another embodiment of a sensor network platform in accordance with the present invention.

In particular, in the embodiment with reference to FIG. 2A, the sensor 230 protrudes toward the side of the sensor network platform 200, but in the embodiment with reference to FIG. 2B, the sensor 230 is similar to the upper portion of the sensor network platform 200. It is also possible to be configured to protrude to be connected. In this case, the connection part 240 preferably has an “L” shape as shown in order to reliably couple between the sensor 230 and the sensor network platform 200. That is to maximize the contact area with the sensor network platform 200.

Meanwhile, in the embodiment described with reference to FIG. 2B, the part where the sensor 230 is connected to the sensor network platform 200 may be the opposite surface. That is, in order to minimize the influence of the temperature rise due to the operation of the communication chip 210 or the control chip 220, as in the embodiment shown in FIG. 2C, the communication chip 210 or the control chip of the sensor network platform 200, in particular. The sensor 230 may be disposed on the surface opposite to the surface on which the 220 is disposed through the connection part 240. The configuration of the embodiment of FIG. 2C is particularly designed to maximize the distance between the sensor 230 and the heat generating portion such as the communication chip 210 or the control chip 220.

2D or 2E is a diagram illustrating another embodiment of a sensor network platform according to the present invention.

In these embodiments, a corner space for attaching the sensor 230 and the connection unit 240 is formed at a corner portion of the sensor network platform 200. In addition, the sensor 230 and the connection portion 240 is accommodated in the corner space does not protrude to the outside.

That is, in the embodiments of FIGS. 2A to 2C, since the sensor 230 protrudes to the outside of the sensor network platform 200, the sensor 230 node arrangement may be limited. Therefore, in the embodiments of FIG. 2D or 2E, the sensor 230 and the connection unit 240 are attached to the corner space of the sensor network platform 200. Even in this case, the sensor 230 is preferably not in contact with the sensor network platform 200 except for the connection 240.

Also, in the case of the embodiment of FIG. 2E, as in the embodiment of FIG. 2C, a corner space is formed on a surface opposite to the surface on which the communication chip 210 or the control chip 220 of the sensor network platform 200 is disposed. The sensor 230 is disposed through the connection part 240. Therefore, the communication chip 210 or the control chip 220 is indicated by a dotted line to indicate that the sensor chip 230 is disposed on the opposite side of the sensor 230. The communication chip 210 or the control chip 220 to be displayed is disposed on the opposite side to the sensor 230. The configuration of the embodiment of FIG. 2E is particularly to maximize the distance between the sensor 230 and the heat generating portion such as the communication chip 210 or the control chip 220. In addition, when the sensor 230 is connected through an automated task, for example, to avoid interference with the communication chip 210 or the control chip 220.

In the embodiments of FIG. 2D or 2E, the shape of the corner space may be embodied in a quadrangle as shown, for example.

2F or 2G illustrate another embodiment of a sensor network platform in accordance with the present invention.

In these embodiments, an inner space is formed at the surface portion of the sensor network platform 200 to attach the sensor 230 and the connection 240. In addition, the sensor 230 and the connection part 240 are accommodated in the inner space and do not protrude to the outside. Even in this case, the sensor 230 is preferably not in contact with the sensor network platform 200 except for the connection 240.

Also, in the case of the embodiment of FIG. 2G, as in the embodiment of FIG. 2C, an internal space is formed on a surface opposite to the surface where the communication chip 210 or the control chip 220 of the sensor network platform 200 is disposed. The sensor 230 is disposed through the connection part 240, and the configuration of the embodiment of FIG. 2G is particularly maximized for the distance between the sensor 230 and the heating part such as the communication chip 210 or the control chip 220. To space apart. In addition, when the sensor 230 is connected through an automated task, for example, to avoid interference with the communication chip 210 or the control chip 220. The interior space is preferably formed in the center of the sensor network platform 200.

In the embodiments of FIG. 2F or 2G, the shape of the internal space may be implemented in a circular shape as shown, for example, but a triangle, square or other polygonal shape is also possible.

3 is a view showing another configuration of the sensor network platform according to the present invention, in particular the attachment of the sensor network platform and the sensor.

The hybrid sensor network platform uses a two-layer board, for example, to place a sensor network processing platform 200a for network communication at the lower part and a sensor platform 200b for processing data sensed by the sensor at the upper part. And it means to perform the operation by coupling the sensor network processing platform 200a and the sensor platform 200b through a connection means 250, such as a suitable connector.

3A to 3C, the sensor 230 is disposed on the side or the top of the sensor platform 200b or the surface opposite to the surface on which the control chip 220 of the sensor platform 200b is disposed. Since the sensor 230 is disposed in the basic concept is the same as in the embodiment with reference to Figures 2a to 2c, detailed description thereof will be omitted.

Meanwhile, in the embodiment of FIG. 3D, a corner space for attaching the sensor 230 and the connection unit 240 is formed at a corner portion of the sensor platform 200b. In addition, the sensor 230 and the connection portion 240 is accommodated in the corner space does not protrude to the outside. That is, in the embodiment of FIGS. 3A to 3C, since the sensor 230 protrudes out of the sensor platform 200b, there may be a case in which the arrangement of the node of the sensor 230 may be restricted. The sensor 230 and the connection part 240 are attached to the corner space of the 200b. Even in this case, the sensor 230 is preferably not in contact with the sensor platform 200b except for the connection 240. In addition, it is a configuration to form a corner space on the surface opposite to the surface on which the control chip 220 of the sensor platform 200b is disposed and to arrange the sensor 230 through the connecting portion 240, such as in the embodiment of Figure 3d In particular, the configuration is to maximize the distance between the sensor 230 and the heating part such as the control chip 220 as much as possible. In addition, for example, in order to avoid interference with the control chip 220 when the sensor 230 is connected through an automated operation.

Meanwhile, in the embodiment described with reference to FIG. 3E, an inner space for attaching the sensor 230 and the connection unit 240 is formed on the surface portion of the sensor platform 200b. In addition, the sensor 230 and the connection part 240 are accommodated in the inner space and do not protrude to the outside.

That is, in the embodiment of FIGS. 3A to 3C, since the sensor 230 protrudes to the outside of the sensor platform 200b, there may be a limitation in the arrangement of the node of the sensor 230. In the embodiment of FIG. 3E, the sensor platform The sensor 230 and the connection part 240 are attached to the internal space of the 200b. Even in this case, the sensor 230 is preferably not in contact with the sensor platform 200b except for the connection 240. In addition, it is a configuration to form a corner space on the surface opposite to the surface on which the control chip 220 of the sensor platform 200b is disposed and to arrange the sensor 230 through the connecting portion 240, such as in the embodiment of Figure 3e In particular, the configuration is to maximize the distance between the sensor 230 and the heating part such as the control chip 220 as much as possible. In addition, in order to avoid interference with the control chip 220 when the sensor 230 is connected through, for example, an automated operation. In addition, the inner space is preferably formed in the center portion of the sensor platform 200b.

In order to minimize the measurement error measurement value of the sensor that may be caused by attaching the sensor component directly on the sensor network platform in the development of the conventional sensor network platform, in particular to minimize the effect of the temperature rise, with reference to Figures 2a to 3e In the sensor network platform according to the present invention, a method of arranging a sensor on the sensor platform has been described in detail through various embodiments.

However, these examples are only for illustrating the present invention, and the protection scope of the present invention is not limited thereto.

For example, there may be a variety of ways to determine the attachment location of a sensor while maintaining RF communication capabilities on the sensor network platform, and the most optimized sensor attachment location on a single sensor network platform or on a complex sensor network platform is the sensor network. Depending on the design of the platform, for example, the shape, size, length, component placement of the sensor network platform can be changed.

However, such a change is carried out without changing the technical spirit of the present invention and falls within the scope of the technical spirit of the present invention, and thus the protection scope of the present invention is determined by the description of the claims rather than by the above-described embodiments. Lose.

As described above, according to the present invention, through the process of reducing or correcting a detection error caused by the sensor network platform environment in the application or service development process using the sensor network platform, the same measurement value as the actual data can be obtained through the sensor. In particular, it is possible to detect more reliable data, especially in hospital blood management and academic experiments. In addition, the present invention can be widely used in various sensor network applications such as sensor network platform development, sensor network application, and the like, and are intended to be attached to sensor network platforms such as temperature, humidity, light, vibration, magnetic field, and ultrasonic waves. It can also be applied to sensors, enabling the development of precise application technologies based on sensor network platforms.

Claims (13)

As a sensor network platform, A sensor spaced apart from the sensor network platform to minimize the influence of the operation of the sensor network platform; Connection portion for connecting and supporting the sensor and the sensor network platform Sensor network platform comprising a. The method of claim 1, The sensor network platform protruding out of the sensor network platform such that the sensor is not in contact with the sensor network platform except for portions via the connection. The method of claim 1, And the connecting portion is shaped like an "L". The method of claim 1, The sensor network platform being connected to the sensor network platform via the connection on a side opposite to the side on which the components of the sensor network platform are disposed. The method of claim 1, The sensor is a sensor for sensing any one or more of temperature, humidity, light, vibration, magnetic field, ultrasonic waves. The method of claim 1, A corner space for attachment of the sensor and the connection portion is formed at a corner portion of the sensor network platform. And the sensor and the connection portion are received in the corner space. The method of claim 1, In the surface portion of the sensor network platform is formed an internal space for attachment of the sensor and the connection, And the sensor and the connection portion are received in the internal space. The method according to claim 6 or 7, The edge space or the inner space is formed on a surface opposite to a surface on which components of the sensor network platform are disposed. The method according to claim 6 or 7, The sensor network platform is implemented using one board. The method of claim 7, wherein The inner space is formed at the center of the sensor network platform. The method according to claim 6 or 7, The sensor network platform is implemented using two boards, a sensor platform for processing data sensed by the sensor and a sensor network processing platform for network transmission of data processed by the sensor platform. The edge space or the inner space is formed in the sensor platform. The method of claim 11, The corner space or the inner space is formed on a surface opposite to the surface on which the components of the sensor platform are disposed, And the sensor platform and the sensor network processing platform are coupled upside down so that the edge space or the internal space is not disposed therebetween. The method of claim 11, The inner space is formed at the center of the sensor platform.

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