CN215952783U - Temperature sensor packaging structure and temperature detection device - Google Patents
Temperature sensor packaging structure and temperature detection device Download PDFInfo
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- CN215952783U CN215952783U CN202121270588.4U CN202121270588U CN215952783U CN 215952783 U CN215952783 U CN 215952783U CN 202121270588 U CN202121270588 U CN 202121270588U CN 215952783 U CN215952783 U CN 215952783U
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Abstract
The utility model provides a temperature sensor packaging structure and a temperature detection device; the temperature sensor packaging structure comprises a temperature sensing element and a packaging shell for packaging the temperature sensing element, wherein the packaging shell comprises a heat conduction part, a side wall arranged around the heat conduction part and a bottom opposite to the heat conduction part, at least one of the side wall and the bottom is provided with a heat insulation layer, and the temperature sensing element is packaged in the packaging shell and is in contact with the heat conduction part. Therefore, the original sensing mode of the temperature sensing element and the external temperature is changed, the temperature of the temperature sensing element is rapidly increased, and the temperature of the target object is monitored more easily. In addition, the mode of arranging the heat insulation layer is applied, the temperature loss is reduced, the temperature of the temperature sensing element is enabled to be close to the temperature of the target object in a shorter time, and the heat balance is achieved quickly.
Description
Technical Field
The utility model relates to the field of detection, in particular to a temperature sensor packaging structure and a temperature detection device.
Background
With the increasing development of domestic and foreign industries, the temperature detection technology has also been continuously improved. The contact temperature detector is a measuring device with high precision, and achieves a state of thermal equilibrium with a measured object through heat conduction or convection, so that the temperature value of the contact temperature detector can directly represent the temperature of the measured object.
However, the conventional contact temperature detector receives the temperature of the target object and also dissipates heat, so that the temperature rise rate is slow, and the time for reaching the thermal equilibrium is generally 1 to 10 minutes. Therefore, the problem of low temperature measurement efficiency is brought.
SUMMERY OF THE UTILITY MODEL
The utility model provides a temperature sensor packaging structure which can monitor the temperature of a target object more quickly.
In order to solve the technical problems, the utility model adopts the technical scheme that: a temperature sensor package structure comprising a temperature sensing element and a package case for packaging the temperature sensing element, characterized in that: the packaging shell comprises a heat conduction part, a side wall and a bottom, wherein the side wall is arranged around the heat conduction part, the bottom is opposite to the heat conduction part, at least one of the side wall and the bottom is provided with a heat insulation layer, and the temperature sensing element is packaged in the packaging shell and is in contact with the heat conduction part.
Optionally, the side wall and/or the bottom is constituted by the insulation layer.
Furthermore, a control chip is arranged outside the packaging shell, the control chip is close to the heat insulation layer, and the control chip is electrically connected with the temperature sensing element.
Optionally, the side wall and/or the bottom comprise the thermal insulation layer and at least one outer shell layer, respectively; the inner surface of the heat insulation layer is close to the temperature sensing element, and the outer shell layer is arranged on the outer surface of the heat insulation layer.
Furthermore, a control chip is further arranged inside the packaging shell, the control chip is located between the heat insulation layer and the outer shell layer, and the control chip is electrically connected with the temperature sensing element.
The heat insulation layer is provided with a wire passing hole, and the control chip is electrically connected with the temperature sensing element through a lead penetrating through the wire passing hole.
Optionally, the heat conducting part is a plane or a cambered surface; and/or the bottom is a plane or an arc surface.
Wherein the side wall is formed by a plurality of planes and/or at least one cambered surface.
Wherein, the temperature sensing element is a contact temperature sensing element.
Specifically, the contact temperature sensing element is a nanocarbon temperature sensing element or a thermistor.
A second aspect of the present application provides a temperature detection apparatus, including the temperature sensor package structure of the first aspect.
The utility model has the beneficial effects that: receiving the temperature of the target object through the heat-conducting portion so that the heat of the target object is received as much as possible; meanwhile, the mode of arranging the heat insulation layer is applied, the loss of temperature is reduced, the temperature of the temperature sensing element is close to the temperature of the target object in a shorter time, and the heat balance is quickly achieved. Therefore, the temperature sensing element is quickly heated, and the temperature measuring efficiency is improved. In addition, due to the existence of the heat insulation layer, even if the target object is in an environment with high temperature, the influence of the environment temperature on the temperature sensing element can be better prevented, and therefore the temperature of the target object can be more accurately monitored.
Drawings
The detailed structure of the utility model is described in detail below with reference to the accompanying drawings
FIG. 1 is an overall block diagram of one embodiment of a temperature sensor package structure of the present invention;
FIG. 2 is an exploded perspective view of one embodiment of a temperature sensor package structure of the present invention;
FIG. 3 is an overall block diagram of another embodiment of the temperature sensor package structure of the present invention;
FIG. 4 is an exploded perspective view of another embodiment of a temperature sensor package structure of the present invention;
FIG. 5 is an overall block diagram of another embodiment of the temperature sensor package structure of the present invention;
fig. 6 is an overall structural view of another embodiment of the temperature sensor package structure of the present invention.
Description of reference numerals:
100-a heat conducting portion; 200-a side wall; 300-bottom; 400-a substrate; 500-temperature sensing element.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1 and 2, in an embodiment of the present application, a temperature sensor package structure is provided, the temperature sensor package structure includes a temperature sensing element 500 and a package housing for packaging the temperature sensing element 500, the package housing includes a heat conduction portion 100, a side wall 200 disposed around the heat conduction portion 100, and a bottom 300 opposite to the heat conduction portion 100, wherein at least one of the side wall 200 and the bottom 300 has a thermal insulation layer, and the temperature sensing element 500 is packaged inside the package housing and in contact with the heat conduction portion 100.
The heat conducting part 100 may include a heat conducting material, and the heat conducting material may be a heat sensitive material. The thermosensitive material can be a nano carbon material, including a single-walled carbon nanotube, a multi-walled carbon nanotube, a nano carbon fiber or a composite thereof. The heat conduction part 100 is used to transfer the temperature of the target object to the temperature sensing element 500, so that the temperature sensing element 500 quickly detects the temperature of the target object.
The heat insulation layer is made of a material with poor heat conductivity, and can be a porous material, a heat reflection material or a vacuum material. For example, the thermal insulation layer can be made of porous silica materials, and the gaps of the silica particles can be filled with gas to further enhance the thermal insulation performance.
The present application is advantageous in that the temperature of the target object is received by the heat conductive part 100 so that the heat of the target object is received and transferred to the temperature sensing element 500 as much as possible; meanwhile, the mode of arranging the thermal insulation layer is applied, so that the loss of the temperature is reduced, the temperature of the temperature sensing element 500 approaches the temperature of the target object in a shorter time, and the thermal balance is quickly achieved. Therefore, the temperature sensing element 500 is heated up rapidly, and the temperature measurement efficiency is improved. In addition, due to the existence of the heat insulation layer, even if the target object is in an environment with high temperature, the influence of the environment temperature on the temperature sensing element can be better prevented, and therefore the temperature of the target object can be better monitored.
In some embodiments, at least a portion of sidewall 200 and/or bottom 300 is comprised of an insulation layer. For example, sidewall 200 is formed of an insulating layer and bottom 300 is a non-insulating material; alternatively, both the sidewall 200 and the bottom 300 are formed of insulating layers; alternatively, the side wall 200 is made of a non-heat insulating material, and the bottom 300 is made of a heat insulating layer.
The shape and number of the side walls may also differ due to the shape of the package. For example, packaging a material in the shape of a polyhedron requires the provision of a plurality of side walls, whereas in the shape of a cylinder or a truncated cone, there is only one curved side wall in addition to the upper and lower bottom surfaces. When one side wall is provided, the heat insulation layer can be a part of the side wall or the whole side wall; when a plurality of side walls are provided, the insulating layer may be a part of one or more side walls, or may be one or more side walls. Thus, a particular sidewall configuration can be selected based on factors such as the temperature change of the target object, the volume of the temperature, and the like.
It should be understood that, for different target objects or temperature measurement modes, a heat conducting material may be disposed on a portion of the side wall 200 or the bottom, and specifically, a principle of disposing a heat conducting material on a surface to be contacted with a target object to be measured and disposing a heat insulating layer on the remaining surfaces may be followed. For example, if a specific side wall 200 is required to be in contact with the target object in addition to the heat conductive portion 100 when the temperature sensor is used, a heat conductive layer may be provided on the side wall, and a heat insulating layer may be provided on the remaining side walls.
Optionally, a control chip is further disposed outside the package housing in this embodiment, the control chip is disposed near the thermal insulation layer, and the control chip is electrically connected to the temperature sensing element 500. The control chip is arranged close to the heat insulation layer, so that the temperature rise of the control chip during working can be prevented from affecting the temperature sensing element 500, and the accuracy of the temperature sensing element 500 is guaranteed. The control chip can be an ADC chip, an MCU chip or any other kind of chip. The control chip may be electrically connected to the temperature sensing element 500 through a wire, for example, a wire hole may be formed on the package housing, and a wire may penetrate through the wire hole, so as to connect the temperature sensing element 500 inside the package housing and the control chip outside the package housing.
In this embodiment, the control chip may directly convert the temperature parameter into a digital signal, so as to obtain the temperature value. Alternatively, the control chip may be an analog-to-digital converter (ADC) chip; or, the control chip may also be an MCU chip, including an independent processor, an I/O (Input/Output) device, a memory, and the like; in addition, the control chip can also be a plurality of special integrated circuit chips.
The control chip and the packaging shell have various connection modes, and a chip-on-board process can be selected or a flip chip process can be adopted. The chip-on-board process comprises various modes such as hot-press welding, ultrasonic welding, gold wire welding and the like, and the packaging modes are low in price and can save space; the flip chip technology comprises the schemes of bonding technology, soldering paste flip chip assembling technology and the like, so that the connection cost can be reduced, and the speed and the reliability are improved. In addition, the control chip can be directly attached to the outside of the packaging shell.
It should be understood that, no structure may be disposed between the control chip and the package housing, the control chip may be directly disposed on the outer surface of the package housing, or other components, such as a separate protection structure and a buffer structure, may be disposed between the control chip and the package housing.
In some embodiments, at least a portion of side wall 200 and/or bottom 300 includes an insulating layer and at least one outer shell layer, respectively; the inner surface of the insulation layer is adjacent to the temperature sensing element 500 and the outer shell layer is disposed on the outer surface of the insulation layer. The shell layer can protect the heat insulation layer from being damaged, and the service life of the sensor is prolonged.
Optionally, in this embodiment, a control chip is further disposed inside the package housing, the control chip is located between the thermal insulation layer and the outer shell layer, and the control chip is electrically connected to the temperature sensing element 500. Therefore, the control chip is protected by the outer shell layer, and the control chip is not easy to be damaged in the whole process of delivery, transportation and use, so that the yield is increased. Meanwhile, as the heat insulation layer is arranged between the control chip and the temperature sensing element 500, the mutual influence between the control chip and the temperature sensing element 500 is small.
Specifically, the thermal insulation layer is provided with a wire through hole, and the control chip is electrically connected to the temperature sensing element 500 through a wire penetrating through the wire through hole. By using this connection method, the influence between the control chip and the temperature sensing element 500 is further reduced, and the connection between the control chip and the temperature sensing element is more reliable and has better stability.
It is understood that the heat conduction portion 100 may be a plane or a curved surface; the bottom 300 may also be flat or curved. It should be understood that the shape of the package housing, including the shapes of the heat conducting portion 100 and the bottom portion 300, is mainly determined by the contact area or the contact shape with the target object, wherein the target object may be a human body, an animal or some non-living body. For example, when the temperature sensor is designed to measure the temperature of the wrist of a human body, the heat-conducting portion needs to be in contact with the wrist of the target object, and since the wrist is relatively flat, the heat-conducting portion can be designed to be flat; when the temperature sensor is designed to measure the temperature of the armpit of a human body, the heat conducting part needs to be clamped under the armpit of a target object, the whole packaging shell can be designed to be in a long and narrow cylindrical shape, and the heat conducting part and the bottom can be designed to be in an arc shape.
In some usage scenarios, if the bottom 300 of the temperature sensor package structure is disposed on a circuit board with a special shape, the bottom 300 needs to be disposed in a corresponding shape. The special-shaped circuit board comprises various non-rectangular circuit boards, such as a circuit board with an arc-shaped surface, a bendable circuit board and the like.
Referring to fig. 3-6, in some embodiments, the sidewall 200 is formed of a plurality of flat surfaces and/or at least one curved surface. The sidewall 200 of the temperature sensor package structure may have any shape, and the shape of the sidewall 200 may be determined by the target object and the heat dissipation method thereof, or may be determined by the shape of the package substrate 400. In most cases, the bottom 300 of the temperature sensor package structure is disposed on the package substrate 400, but in some special cases, the sidewall 200 may be packaged on the substrate 400.
The temperature sensing element 500 is a contact temperature sensing element. Therefore, the heat balance is achieved through conduction, the temperature of the measured object is directly represented, and the measurement accuracy is high. The temperature distribution in the object can be measured in a certain temperature measuring range.
The contact temperature-sensing element can be a nano-carbon temperature-sensing element or a thermistor. Because the nano-carbon temperature sensing element uses the nano-carbon material, the heat conduction speed is higher, and the temperature transmission efficiency can be ensured; on the other hand, the thermistor can also be used to achieve corresponding technical effects.
A second aspect of the present application provides a temperature detection apparatus, including the temperature sensor package structure of any of the above embodiments.
In conclusion, the temperature detection device can rapidly measure the temperature, and experiments show that the temperature of the target object can be measured in about 3-5 s, and the temperature detection device is simple to apply and has wide application prospect.
The meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" and including either A or B or both A and B.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (11)
1. A temperature sensor package structure comprising a temperature sensing element and a package case for packaging the temperature sensing element, characterized in that: the packaging shell comprises a heat conduction part, a side wall and a bottom, wherein the side wall is arranged around the heat conduction part, the bottom is opposite to the heat conduction part, at least one of the side wall and the bottom is provided with a heat insulation layer, and the temperature sensing element is packaged in the packaging shell and is in contact with the heat conduction part.
2. The temperature sensor package structure of claim 1, wherein: at least part of the side walls and/or the bottom is formed by the thermally insulating layer.
3. The temperature sensor package structure of claim 2, wherein: the packaging structure is characterized in that a control chip is further arranged outside the packaging shell, the control chip is close to the heat insulation layer, and the control chip is electrically connected with the temperature sensing element.
4. The temperature sensor package structure of claim 1, wherein: at least part of the side wall and/or the bottom comprises the heat insulation layer and at least one outer shell layer respectively; the inner surface of the heat insulation layer is close to the temperature sensing element, and the outer shell layer is arranged on the outer surface of the heat insulation layer.
5. The temperature sensor package structure of claim 4, wherein: the packaging shell is characterized in that a control chip is further arranged inside the packaging shell, the control chip is located between the heat insulation layer and the outer shell layer, and the control chip is electrically connected with the temperature sensing element.
6. The temperature sensor package structure of claim 3 or 5, wherein: the heat conduction part or the heat insulation layer is also provided with a wire passing hole, and the control chip is electrically connected with the temperature sensing element through a lead penetrating through the wire passing hole.
7. The temperature sensor package structure of any one of claims 1-5, wherein: the heat conducting part is a plane or an arc surface; and/or the presence of a gas in the gas,
the bottom is a plane or an arc surface.
8. The temperature sensor package structure of any one of claims 1-5, wherein: the side wall is formed by a plurality of planes and/or at least one cambered surface.
9. The temperature sensor package structure of any one of claims 1-5, wherein: the temperature sensing element is a contact temperature sensing element.
10. The temperature sensor package structure of claim 9, wherein: the contact temperature sensing element is a nano carbon temperature sensing element or a thermistor.
11. A temperature detection device comprising the temperature sensor package according to any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121270588.4U CN215952783U (en) | 2021-06-07 | 2021-06-07 | Temperature sensor packaging structure and temperature detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121270588.4U CN215952783U (en) | 2021-06-07 | 2021-06-07 | Temperature sensor packaging structure and temperature detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215952783U true CN215952783U (en) | 2022-03-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121270588.4U Active CN215952783U (en) | 2021-06-07 | 2021-06-07 | Temperature sensor packaging structure and temperature detection device |
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| Country | Link |
|---|---|
| CN (1) | CN215952783U (en) |
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2021
- 2021-06-07 CN CN202121270588.4U patent/CN215952783U/en active Active
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