JPH1130553A - Infrared sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the temperature increase by a radiant heat from the outside and heat conduction and to decrease measuring errors by thermal disturbance, by connecting a sensor chip to an MID substrate through a pad member made of metal. SOLUTION: In this infrared sensor 1, a sensor chip 15 is connected to an MID(molded interconnection device) substrate 2 through a pad member 3 made of metal. In the pad member 3, gold is plated on the surface made of copper, nickel or the like, and electric conductivity and thermal conductivity are enhanced. The pad member 3 is connected to the rear surface of the sensor chip 15 with, e.g. solder. Furthermore, the MID substrate 2 is formed of resin, ceramics or the like having low thermal conductivity, and the heat transfer to the sensor chip 15 from the externally mounted parts such as a measuring piece is prevented. Thus, the entire heat capacity including the sensor chip 15 is increased, the temperature increase of the sensor chip 15 by the radiant heat and transfer heat is suppressed and the decrease of measuring errors due to the thermal disturbance is achieved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an infrared sensor used for an ear thermometer which is inserted into, for example, the outer ear of an ear and measures the temperature of a body surface in an eardrum or an ear canal.

[0002]

2. Description of the Related Art In recent years, as one of thermometers for measuring the temperature of a living body, a thermometer for measuring a body temperature in a non-contact manner using an infrared sensor has been marketed.

[0003] Among them, an ear-type thermometer that measures the temperature of the body surface of the eardrum or the external auditory canal near the eardrum by inserting the probe tip of the thermometer into the ear canal of the ear can easily and quickly measure the body temperature. , Its use is spreading.

Many of such ear thermometers use an infrared sensor to measure the amount of infrared rays from the eardrum or the external auditory canal near the eardrum, convert the temperature to a processing device such as a microcomputer, and display the temperature as a body temperature. doing.

[0005] One of the characteristics required of the infrared sensor used in such an ear thermometer is that, first, at the time of measuring the body temperature, a temperature fluctuation of at least about 0.1 ° C can be accurately measured.

However, in the ear-type thermometer, since the measuring element itself is inserted into the ear for measurement, if an infrared sensor is provided at the tip of the measuring element and the amount of infrared light is measured therein, the amount of infrared light is detected. In some cases, the temperature of the sensor itself rises, and accurate temperature measurement cannot be performed.

As a temperature sensor that solves such a problem, for example, in Japanese Patent Application Laid-Open No. H7-178061, a concave portion is provided in a pedestal, and a sensor chip of an infrared sensor is provided in a lower portion of the concave portion. The pedestal itself has good thermal conductivity while making it difficult to receive radiant heat from the surroundings, thereby increasing the overall heat capacity so that the temperature of the infrared sensor itself does not easily rise with some radiant heat.

The structure described in the above publication can be said to be suitable for the purpose of preventing a temperature rise of the infrared sensor itself. However, a complicated process is required to manufacture such a structure itself. Particularly, the tip of the probe inserted into the ear canal has a diameter of about 4 to 5 mm, and the infrared sensor is attached to the tip. In consideration of the above, as described in the above-mentioned publication, flexible wiring is directly attached to the pad of the sensor chip for the wiring, and it is necessary to appropriately route the wiring inside the probe. There is a problem that it becomes complicated and the manufacturing cost increases.

To facilitate the manufacture and assembly of such small parts, MID (Molded Interconnection)
Device) Some use a substrate. For example, JP-A 2-3
No. 03171 discloses an infrared sensor mounted on a MID substrate. When an MID substrate is used, the electrode pads of the sensor chip are wire-bonded to the electrode pads on the MID substrate, or the electrode pads of the sensor chip are directly bump-bonded to each other.
After the board and the sensor chip are integrated, the wiring from the microcomputer of the thermometer main unit or the power supply may be connected to the lead pins and lead pads for drawing out the wiring from the MID board, which facilitates assembly and manufacture. There is such a merit. In addition, since the MID substrate itself can be formed by injection molding or a molding method using a resin, ceramics, or the like, there is also an advantage in that the manufacturing process is facilitated in this respect as well.

[0010]

However, in the infrared sensor described in JP-A-2-303171, the MID substrate itself can be easily formed by injection molding or other various resin molding methods, so that the MID substrate has a high heat conduction. Since a low ceramics or resin molded product is used, the temperature rise of the sensor itself due to conduction of heat from the surroundings can be avoided, but there is a problem that it is difficult to avoid the temperature rise due to radiant heat.

Accordingly, an object of the present invention is to provide an infrared sensor that uses an MID substrate to simplify the assembly and manufacture of the infrared sensor, and that can suppress the temperature rise of the infrared sensor itself due to radiant heat. That is.

[0012]

According to a first aspect of the present invention, there is provided an image pickup apparatus comprising at least two infrared light receiving elements, one of which receives infrared light from a measuring object. In the infrared sensor in which a sensor chip having the other light receiving element functioning as a compensating element is provided on the MID substrate by blocking the incidence of infrared light to the other light receiving element, the infrared light sensor is disposed between the sensor chip and the MID substrate. An infrared sensor having at least a metal pad member in contact with the sensor chip. The present invention uses a MID substrate to facilitate the assembly and manufacture of an infrared sensor, and to increase the heat capacity of a sensor chip by providing a metal pad member in contact with the sensor chip, thereby providing a sensor using radiant heat. This suppresses the temperature rise of the chip.

According to a second aspect of the present invention, in the infrared sensor according to the first aspect, the sensor chip is connected to the MID substrate via the pad member with solder, tin, or the like.
It is characterized by being joined by at least one conductive material selected from the group consisting of gold and a conductive adhesive. This invention electrically and thermally integrates the sensor chip with the MID substrate by joining the sensor chip with a metal pad member using a conductive material such as solder, tin, gold, and a conductive adhesive. is there.

According to a third aspect of the present invention, in the infrared sensor according to the first aspect, a groove is formed on a surface of the MID substrate, and a wiring is provided in the groove. . According to the present invention, the wiring surface is formed at a position deeper than the surface of the MID substrate by providing the wiring in the groove. This makes it possible to avoid contact between the exterior component and the wiring when the infrared sensor is mounted on the thermometer, and prevents heat from the exterior component from being transmitted to the sensor chip through the wiring.

According to a fourth aspect of the present invention, in the infrared sensor according to the first aspect, the MID substrate has a through hole formed therein, and a wiring is provided in the through hole. And According to the present invention, by forming wiring in the through hole, when the infrared sensor is mounted on the thermometer, contact between the exterior component and the wiring is avoided, and heat from the exterior component transmitted through the wiring is prevented from being transmitted to the sensor chip. Is what you do.

The present invention according to claim 5 provides the invention according to claims 1 to
5. In the infrared sensor according to any one of the items 4, the MID substrate is provided with a heat sink, and the heat sink and the metal pad member are connected so as to transfer heat. It is characterized by being. According to the present invention, by providing a heat sink, the heat capacity of the sensor chip is further increased, and the temperature rise of the sensor chip due to radiant heat is suppressed.

The present invention according to claim 6 provides the present invention
5. The infrared sensor according to any one of 5, wherein the MID substrate has a step structure for supporting a reflector for preventing radiant heat from other than the object to be measured from being incident on the sensor chip. Features. The present invention provides a step structure for supporting a reflector for preventing the incidence of unnecessary radiant heat and infrared rays on the MID substrate, so that when the reflector is mounted, the step structure is provided in a lower step portion of the step structure. The reflector can be easily attached simply by fitting the reflector.

The present invention according to claim 7 provides the present invention
5. The infrared sensor according to any one of 5, wherein the MID substrate has a reflector for preventing radiant heat from an object other than the object to be measured from being incident on the sensor chip. It is characterized by being formed integrally. The present invention simplifies the assembly and manufacturing of an infrared sensor having a reflector by integrally molding a reflector for preventing unnecessary radiation heat and infrared rays from entering and an MID substrate.

The present invention according to claim 8 provides the invention according to claims 1 to
5. The infrared sensor according to any one of the items 5, wherein the MID substrate has an electrode pad connected by solder to an electrode provided on the sensor chip, and allows extra solder to escape to the outside of the electrode pad. A solder escape groove is provided. The present invention provides a solder escape groove in the electrode pad of the MID substrate to allow excess solder to escape from the electrode pad, and when there is a large amount of solder, the solder spreads around the electrode pad and the chip body, surrounding electrodes and wiring, etc. This is to prevent short circuit.

According to a ninth aspect of the present invention, the above object is achieved.
According to the invention described above, a sensor chip having an infrared light receiving element is provided on an MID substrate, and an electrode of the sensor chip and the MI
An infrared sensor in which an electrode of the D substrate is connected to the electrode of the MID substrate by solder, wherein the electrode of the MID substrate is provided with a solder escape groove for allowing extra solder to escape to the outside. The present invention provides a solder escape groove in the electrode pad of the MID substrate to allow excess solder to escape from the electrode pad, and when there is a large amount of solder, the solder spreads around the electrode pad and the chip body, surrounding electrodes and wiring, etc. This is to prevent short circuit.

[0021] In order to achieve the above object, a first aspect is provided.
The present invention described in Item 0 is an infrared sensor in which a sensor chip having an infrared light receiving element is provided on an MID substrate, wherein a groove is formed on the surface of the MID substrate, and wiring is provided in the groove. This is an infrared sensor. According to the present invention, by providing a wiring in a groove, the surface of the wiring is MID
It is formed at a place deeper than the surface of the substrate.
This makes it possible to avoid contact between the exterior component and the wiring when the infrared sensor is mounted on the thermometer, thereby preventing transmission of heat from the exterior component to the sensor chip through the wiring.

According to another aspect of the present invention, there is provided an infrared sensor in which a sensor chip having an infrared light receiving element is provided on an MID substrate, wherein a through hole is formed inside the MID substrate. And a wiring is provided in the through hole. According to the present invention, by forming a wiring in a through hole,
When the infrared sensor is mounted on the thermometer, contact between the exterior component and the wiring is avoided, and heat transmitted from the exterior component and transmitted from the exterior component to the sensor chip is prevented.

[0023]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.
An embodiment of the present invention will be described. In the drawings referred to in the embodiments below, members having the same functions are denoted by the same reference numerals, and description thereof will be omitted.

Embodiment 1 FIG. 1 is an exploded perspective view for explaining a structure of an infrared sensor to which the present invention is applied, and FIG. 2 is a cross-sectional view of a center portion of the infrared sensor along line AA. is there.

In the infrared sensor 1, a sensor chip 15 described later is connected to the MID substrate 2 via a metal pad member 3. The metal pad member 3 is, for example, copper, aluminum, nickel, or the like, or a laminated structure of these, or a metal alone or a metal laminated body obtained by applying gold plating to the surface of the metal and the metal laminate to further increase the conductivity and the thermal conductivity. And solder on the back surface of the sensor chip 15,
The pad member 3 is joined to the bottom portion of the MID substrate 2 where the same metal member 51 as the later-described wiring is applied by joining with a tin, gold, conductive paste, or the like.
And joined by solder, tin, gold or conductive paste.

As a result, the overall heat capacity including the sensor chip 15 is increased by the metal pad member 3,
The temperature rise of the sensor chip 15 due to radiant heat is suppressed,
Measurement errors due to thermal disturbances are prevented.

The MID substrate 2 is formed of a resin or a ceramic having low thermal conductivity, and prevents heat transfer from an external component such as a probe to the sensor chip 15. Usually, such an MID substrate 2 is manufactured by injection molding or molding in the case of resin, or by sintering in the case of ceramics. Here, for example, a liquid crystal polymer is suitably used as the MID substrate 2.

On top of the MID substrate 2, a sensor chip 1
5 is provided with an electrode pad 21 for making electrical connection with each pad (described later).
Are formed in the groove 4 formed in the MID substrate 2.
0, the wiring surface is formed so as to be recessed so as not to protrude from the outer surface of the MID substrate 2. Similarly,
The wiring 23 for making an electrical connection with the sensor chip 15 itself is also formed in the groove 41.

As described above, by providing the wirings 22 and 23 for making electrical connection in the grooves formed in the MID substrate 2, the wiring member having high thermal conductivity can be positioned at a position lower than the outer diameter of the MID substrate 2. When the infrared sensor 1 is provided at the tip of the tracing stylus, the wires 22 and 23 do not contact the inner wall of the tracing stylus.
The heat transfer from 23 is prevented.

The sensor chip 15 has a form in which the main body substrate 10 is sandwiched between the front cover 12 and the back cover 11 as shown in FIG.
In FIG. 3, the sensor chip 15 is shown upside down with respect to the case shown in FIGS. 1 and 2 for understanding. Therefore, the front cover 1
2 shows a back cover 11 at the top, and FIGS.
Then, this state is reversed, and the back cover 11 is joined to the MID substrate 2 via the metal pad member 3.

The sensor body 10 has a temperature-sensitive element 104 formed by cross-linked structures 102 and 103 formed of an insulating film on a silicon substrate 101 having a hollow inside.
And the compensating element 105 are supported, and the electric wiring 107 from the thermosensitive element 104 and the compensating element 105 passes through the bridge structures 102 and 103 and the silicon substrate 101.
Drawn over the insulating film 100 formed on the surface,
Connected to pad 106.

The temperature sensing element 104 is an infrared light receiving element for actually detecting infrared light. The compensating element 105 serves as a reference, is also an infrared light receiving element, and has the same characteristics as the temperature sensing element 104. The temperature sensing element 104 and the compensation element 105 form a thermistor bolometer. Here, the temperature sensing element 104 and the compensating element 105 are formed on the same substrate with the same material and the same shape. The sensor chip may be a thermistor bolometer provided with two or more infrared light receiving elements and at least one of them as a compensation element.

A metal film 113 made of copper, aluminum, titanium, tungsten, gold or the like is stretched around the front cover 12 and the back cover 11 in order to prevent the incidence of infrared rays. A part of the front lid 12 located on the surface of the thermosensitive element 104 has an infrared transmitting portion 110 through which infrared light excluding the metal film 113 is transmitted. Infrared rays only hit 104. Therefore, infrared rays do not hit the compensation element 105, and the signal from the compensation element 105 is used as a reference as described above.

The front cover 12 and the back cover 11 are formed of a silicon substrate. The sensor body 10 is sandwiched between the front cover 12 and the back cover 11, and the internal space 114 thereof may be in an atmospheric state, but may be in a vacuum state or slightly. To nitrogen,
It is preferable to have a sealed structure filled with an inert gas such as argon or helium. Front lid 1
2 and the back cover 11 are sealed by, for example, anodic bonding or the like via an insulating film 100 formed on the silicon substrate 101. By sealing the temperature-sensitive element 104 and the compensating element 105 with a vacuum or a small amount of inert gas in this manner, heat transfer to the elements 104 and 105 can be suppressed.

The sensor chip 15 described here
Has the same basic structure as the infrared sensor disclosed in, for example, Japanese Patent Application Laid-Open No. 7-178061, and a detailed description thereof will be omitted.

As described above, the size of the infrared sensor 1 in which the sensor chip 15 is bonded to the MID substrate is about 1.0 to
2.5mm, width (diameter of MID) about 2.8-3.4mm
It is.

FIG. 4 shows that the present invention is applied to M
3 is a diagram showing an example in which an infrared sensor 1 in which a sensor chip 15 is bonded to an ID substrate 2 is used for an ear thermometer 200. As shown in the figure, in this example, the infrared sensor 1 is attached to the tip of the probe 50, and the probe 50 itself is made of a flexible resin, so that it can be easily inserted into the ear canal. Regardless of how the probe 50 itself is deformed, the measurement itself is performed at the tip, so that the temperature of the eardrum or the temperature in the immediate vicinity thereof can be accurately measured. As described above, the infrared sensor 1 of the present invention is very little affected by thermal disturbance even when it is attached to the tip of the tracing stylus and inserted into the ear canal.
Accurate body temperature measurement becomes possible.

Embodiment 2 FIG. 5 is a cross-sectional view for explaining the structure of another embodiment of the infrared sensor to which the present invention is applied.

The infrared sensor 1 has a sensor chip 15
Is connected to the MID substrate 25 via the metal pad member 3, and a heat sink 31 is provided on the central axis of the MID substrate 25 so as to pass through the central axis.
The tip of the heat sink 31 in the MID substrate 25 is directly connected to the metal pad member 3 by solder or conductive paste. The surface structures of the sensor chip 15, the pad member 3, and the MID substrate 25 are the same as those in the first embodiment, and the state of being mounted on the ear thermometer is also the same as that shown in FIG.

Here, the heat sink 31 is made of, for example, copper, aluminum, or the like.
In the lower part of 5, a coil-like form is formed. This is because the infrared sensor 1 is provided by providing the heat sink 31.
Even if the overall size becomes large, the heat sink 31
Is to allow the probe to be freely deformed so as not to hinder the flexibility of the probe, and to have more heat dissipation in an extremely limited space.

The size of the infrared sensor 1 configured as described above is such that the MID substrate 25 and the sensor chip portion are about 1.0 to 2.0 mm in length and horizontal (MI) in the same manner as in the first embodiment.
D) is about 2.8 to 3.4 mm, and about 20 to 60 mm in length including the coil-shaped heat sink 31;
The outer diameter of the coil portion is about 2.8 to 3.4 mm.

By providing the heat dissipating member 31, the heat capacity of the sensor chip 15 is further increased, the temperature rise due to radiant heat is further suppressed, and the measurement error is reduced.

<< Embodiment 3 >> FIG. 6 shows an MI sensor for explaining the structure of another embodiment of the infrared sensor to which the present invention is applied.
FIG. 7 is a perspective view of the D substrate, and FIG. 7 is a cross-sectional view of the entire infrared sensor along the line BB on the MID substrate of FIG.

In the infrared sensor 1, the MID substrate 26
The upper part 26a is made thinner around the lower part 26b than the lower part 26b. As shown in FIG.
A reflector (infrared shielding member) 32 is fitted.

In the third embodiment, as in the second embodiment, the sensor chip 15 is connected to the MID substrate 26 via the metal pad member 3 and the center of the MID substrate 26. A heat sink 31 is provided on the shaft so as to pass through the central axis. Further, the wiring 22 on the MID substrate 26 is provided with a groove 40 on the surface of the MID substrate 26.
Is formed and embedded therein.

Here, the height of the reflector 32 is set so as not to narrow the visual field of the temperature sensing element 104 in the sensor chip 15. The reflector 32 is formed in a cylindrical shape, and is made of, for example, resin or ceramic, or a resin or ceramic coated with an infrared reflecting material such as gold, aluminum, or copper, or a metal such as gold, aluminum, or copper. Materials are suitable.

The sensor chip 15, the pad member 3,
The structure of the wiring on the surface of the MID board 26 is the same as that of the first embodiment, and the state of being attached to the ear thermometer is also the same as that shown in FIG.

As described above, by providing the reflector 32, the sensor chip 15 is less likely to receive unnecessary radiant heat, the temperature rise due to the radiant heat is suppressed, and the measurement error is reduced. In the third embodiment, the diameter of the upper portion 26a of the MID substrate 26 is made slightly larger than the inner diameter of the reflector 32 so that the MID substrate 26
2, the reflector 32 is mounted on the MID substrate 26.
It is good to be held in. This makes it possible to easily assemble the structure to which the reflector 32 is attached without using an adhesive or the like while maintaining accurate mutual positioning.

<< Embodiment 4 >> FIG. 8 shows an MI sensor for explaining the structure of another embodiment of the infrared sensor to which the present invention is applied.
It is a perspective view of D board.

In the fourth embodiment, similarly to the third embodiment, the diameter of the MID board 27 is different between the upper and lower portions so that the reflector 32 (not shown in FIG. 8) can be easily attached. In the fourth embodiment, the through hole 33 is provided inside the MID substrate 27, and the wiring 22 from the electrode pad 21 is formed in the through hole 33.

The sensor chip 15, the pad member 3,
The heat sink 31 and the like are the same as those of the third embodiment, and the state of being attached to the ear thermometer is also the same as that shown in FIG.

By forming the wiring 22 inside the MID board 27 in this manner, the wiring does not come into contact with the inner wall of the probe, so that the transfer of heat from the outside is further suppressed, and the heat to the sensor chip 15 is reduced. Transmission can be reduced.

Fifth Embodiment FIG. 9 shows an MI sensor for explaining the structure of another embodiment of the infrared sensor to which the present invention is applied.
It is a perspective view of D board.

In the fifth embodiment, a reflector is provided as in the third and fourth embodiments, but the reflector portion 28a is formed integrally with the MID substrate 28. In this case, the wiring from the electrode pad 21 is connected to the MID substrate 2 from the electrode pad 21 similarly to the fourth embodiment.
8, a through hole 33 is formed and provided therein.

The sensor chip 15, the pad member 3,
The heat sink 31 and the like are the same as those of the third embodiment, and the state of being attached to the ear thermometer is also the same as that shown in FIG.

By integrally forming the reflector as an MID substrate in this manner, the operation of attaching the reflector can be omitted, and the manufacturing process can be simplified.

<Embodiment 6> FIG. 10 is a diagram illustrating an infrared sensor according to another embodiment of the present invention.
It is a perspective view of an ID board.

In the sixth embodiment, the basic structure of the MID substrate 29 is the same as that of any of the above-described embodiments. However, in the electrode pad portion 21, the MID substrate 29 is deeper than the electrode pad surface and A groove 35 (hereinafter referred to as a solder escape groove) reaching the outer peripheral surface is formed. The solder escape groove 35 is provided in the pad 106 of the sensor chip 15.
When soldering the electrode pad 21 on the MID substrate 29 to the outside, it is for releasing extra solder outside.

At the time of assembling a small component such as an infrared sensor, if the amount of solder is too small, the solder goes around to an unnecessary portion, and if it is worse, short-circuits with adjacent pads or wirings to cause a decrease in yield. However, by providing the solder escape groove 35 in this way, even if the amount of solder is somewhat large, excess solder goes outside through the solder escape groove 35, so that the solder may flow into an unnecessary portion. As a result, it is possible to prevent a short between pads and wiring due to extra solder.

Note that, also in the sixth embodiment, the sensor chip 15, the pad member 3, the heat sink 31, and the like are the same as those in each of the above-described embodiments, and the state of being mounted on the ear thermometer is also shown in FIG. It is the same as the one shown, but the effect of the solder escape groove in the sixth embodiment can be obtained even when a metal pad member or a heat sink is not provided. It is needless to say that the present invention can also be applied to various infrared sensors provided with a sensor chip.

The embodiments of the present invention have been described above. However, the present invention is not limited to these embodiments, and the elements of each of the embodiments described above are naturally combined with each other. Various modifications are possible.

[0062]

According to the present invention described above, the following effects can be obtained for each claim.

According to the first aspect of the present invention, the sensor chip is provided on the MID substrate, and the metal pad member in contact with the sensor chip is provided between the sensor chip and the MID substrate. As a result, assembling and manufacturing as an infrared sensor are facilitated, and the heat capacity of the infrared sensor including the sensor chip is increased by the metal pad member, so that a rise in temperature due to external radiant heat and conductive heat can be suppressed. Will be able to
Measurement errors of the infrared sensor due to thermal disturbance can be reduced.

According to the second aspect of the present invention, since the sensor chip is joined to the MID substrate by means of solder, tin, gold, a conductive adhesive, or the like via a metal pad member, these are joined together. As a result of being electrically and thermally connected to the MID substrate, the heat capacity of the entire infrared sensor is increased, and a rise in temperature due to radiant heat from the outside can be suppressed.

According to the third aspect of the present invention, the wiring formed on the MID substrate is formed in the groove.
In addition to the effect of the configuration according to claim 1, when the infrared sensor is mounted in a measuring element of an ear thermometer, for example, the external parts such as the measuring element do not come into contact with the wiring, and the wiring is performed directly from the external part. Can be prevented from being transmitted to the sensor chip, so that heat from the outside can be prevented from being transmitted to the sensor chip by the wiring.

According to the fourth aspect of the present invention, the wiring formed on the MID substrate is formed in the through-hole provided on the MID substrate. For example, when this infrared sensor is mounted in a measuring element of an ear thermometer, for example, an external component such as a measuring element does not come into contact with the wiring, and heat can be prevented from being directly transmitted from the external component to the wiring. Therefore, it is possible to prevent external heat from being transmitted to the sensor chip by the wiring.

According to the fifth aspect of the present invention, since the heat sink is provided on the MID substrate, the heat capacity of the infrared sensor can be reduced by the heat sink in addition to the effect of any one of the first to fourth aspects. Increase
Further, it is possible to suppress a rise in temperature due to radiant heat from the outside, and it is possible to reduce a measurement error of the infrared sensor due to thermal disturbance.

According to the sixth aspect of the present invention, in the configuration according to any one of the first to fifth aspects, the MID
Since the reflector is supported by providing the step structure on the substrate, the reflector can be easily attached, the assembly process of the infrared sensor can be simplified, and the manufacturing cost can be reduced.

According to the seventh aspect of the present invention, in the configuration according to any one of the first to fifth aspects, the MID
Since the substrate is formed integrally with the reflector, the assembly process of the infrared sensor can be simplified, and the manufacturing cost can be reduced.

According to the eighth aspect of the present invention, in the configuration according to any one of the first to seventh aspects, the MID
Since the solder escape groove is provided in the electrode pad of the board, when the sensor chip and the MID board are connected to each other by soldering, even if the amount of solder is somewhat large, short-circuiting due to extra solder with other surrounding electrodes and wiring occurs. Since it is eliminated, the production yield is improved.

According to the ninth aspect of the present invention, since the solder escape groove is provided in the electrode pad of the MID substrate, even when the amount of solder is somewhat large when the sensor chip and the MID substrate are connected to each other by the solder. Since a short circuit due to extra solder does not occur with other surrounding electrodes and wirings, the production yield is improved.

According to the tenth aspect of the present invention, the MID
Since the wiring formed on the substrate is formed in the groove, when the infrared sensor is mounted in the measuring element of an ear thermometer, for example, the external parts such as the measuring element do not come into contact with the wiring, Since it is possible to prevent heat from being directly transmitted from the exterior component to the wiring, it is possible to prevent external heat from being transmitted to the sensor chip by the wiring.

According to the eleventh aspect of the present invention, the MID
Since the wiring formed on the substrate is formed in a through hole provided between the MID substrates, when this infrared sensor is mounted in a measuring element of an ear thermometer, for example, an external part such as a measuring element and a wiring Can be prevented from coming into contact with each other, so that heat can be prevented from being directly transmitted from the exterior component to the wiring, so that external heat can be prevented from being transmitted to the sensor chip through the wiring.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view illustrating a configuration of an infrared sensor according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of the infrared sensor according to the first embodiment.

FIG. 3 is an exploded perspective view illustrating a configuration of a sensor chip provided in the infrared sensor according to the first embodiment.

FIG. 4 is a drawing showing an example of an ear thermometer using an infrared sensor.

FIG. 5 is a cross-sectional view illustrating a configuration of an infrared sensor according to a second embodiment of the present invention.

FIG. 6 is a perspective view of an MID substrate for describing a configuration of an infrared sensor according to a third embodiment of the present invention.

FIG. 7 is a cross-sectional view illustrating a configuration of an infrared sensor according to the third embodiment.

FIG. 8 is a perspective view of an MID substrate for describing a configuration of an infrared sensor according to a fourth embodiment of the present invention.

FIG. 9 is a perspective view of an MID substrate for describing a configuration of an infrared sensor according to a fifth embodiment of the present invention.

FIG. 10 is a perspective view of an MID substrate for describing a configuration of an infrared sensor according to a sixth embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Infrared sensor 2, 25, 26, 27, 28, 29 ... MID board, 3 ... Pad member 15 ... Sensor chip, 21 ... Electrode pad, 22, 23 ... Wiring, 31 ... Heat sink, 32 ... Reflector, 33 ... Through-hole, 35: Solder escape groove, 40, 41: Groove, 102, 103: Cross-linked structure, 104: Temperature sensitive element, 105: Compensating element, 106: Electrode on sensor chip.

Claims (11)

[Claims] At least two infrared light receiving elements are provided. One of the light receiving elements receives infrared light from an object to be measured, and the other light receiving element cuts off the infrared light. An infrared sensor in which a sensor chip having an element functioning as a compensating element is provided on an MID substrate, comprising, between the sensor chip and the MID substrate, at least a metal pad member in contact with the sensor chip. Infrared sensor. 2. The sensor chip is bonded to the MID substrate via the pad member by at least one conductive material selected from the group consisting of solder, tin, gold, and a conductive adhesive. The infrared sensor according to claim 1, wherein: 3. The infrared sensor according to claim 1, wherein a groove is formed on a surface of the MID substrate, and a wiring is provided in the groove. 4. The infrared sensor according to claim 1, wherein the MID substrate has a through hole formed therein, and a wiring is provided in the through hole. 5. The MID substrate is provided with a heat sink, and is connected so as to transfer heat between the heat sink and the metal pad member. An infrared sensor according to any one of claims 1 to 4. 6. The MID substrate according to claim 1, wherein the MID substrate has a step structure for supporting a reflector for preventing radiant heat other than an object to be measured from being incident on the sensor chip. The infrared sensor according to any one of the above. 7. The MID substrate has a reflector for preventing radiant heat other than an object to be measured from being incident on the sensor chip, and the reflector is formed integrally with the MID substrate itself. Claims 1 to
5. The infrared sensor according to any one of 5. 8. The MID substrate has an electrode pad connected by solder to an electrode provided on the sensor chip, and the electrode pad is provided with a solder escape groove for releasing extra solder to the outside. The infrared sensor according to any one of claims 1 to 7, wherein: 9. A sensor chip having an infrared light receiving element is provided on a MID substrate, and an electrode of the sensor chip and the MID
An infrared sensor in which electrodes of the substrate are connected by solder, wherein the electrodes of the MID substrate are provided with solder escape grooves for allowing extra solder to escape to the outside. 10. An infrared sensor in which a sensor chip having an infrared light receiving element is provided on an MID substrate, wherein a groove is formed on the surface of the MID substrate, and wiring is provided in the groove. Infrared sensor. 11. An infrared sensor in which a sensor chip having an infrared light receiving element is provided on an MID substrate, wherein a through hole is formed inside the MID substrate, and wiring is provided in the through hole. Infrared sensor.