CN220084209U - Temperature measuring device and wearable equipment - Google Patents
Temperature measuring device and wearable equipment Download PDFInfo
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- CN220084209U CN220084209U CN202321147024.0U CN202321147024U CN220084209U CN 220084209 U CN220084209 U CN 220084209U CN 202321147024 U CN202321147024 U CN 202321147024U CN 220084209 U CN220084209 U CN 220084209U
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Abstract
The utility model provides a temperature measuring device which comprises a first temperature sensor, a substrate and a chip packaging structure, wherein the first temperature sensor is used for measuring the temperature of a measured position, the substrate is used for leading out an electrical interface of the temperature sensor, an external pin or a welding interface used for connecting the temperature measuring device is formed, a heat insulation layer is arranged in the chip packaging structure and used for isolating heat transfer between the measured position and the environment, and the chip packaging structure is used for protecting the first temperature sensor and the heat insulation layer. Through set up the insulating layer in the chip packaging structure, keep apart the heat transfer between position and the environment of being measured, block the heat flow measurement passageway between the two, reduced the influence of the heat from the environment to first temperature sensor in measuring the temperature of being measured position, improved temperature measuring device's precision. The utility model further provides the wearable device.
Description
Technical Field
The utility model relates to the technical field of temperature detection, in particular to a temperature measuring device and wearable equipment.
Background
Along with the rapid development of temperature measurement detection technology, the application field of the temperature measurement technology is more and more, and the temperature measurement technology is widely applied to the fields of epidemic prevention and control, human vital sign monitoring and the like.
Because the safety and the convenience of the electronic temperature measuring device are higher, most of household temperature measuring devices are electronic temperature measuring devices. Electronic temperature measuring devices typically include an electrically connected circuit board and a temperature sensor that detects the temperature of an object under test. The intelligent wearable equipment with the temperature measuring function such as the intelligent bracelet and the intelligent watch is provided with the temperature measuring device, the volume of the temperature measuring device is small, the structure is compact, the circuit board is easy to generate heat after being powered on, and heat is directly conducted to the temperature sensor, so that the measurement accuracy of the temperature sensor is affected.
The foregoing description is provided for general background information and does not necessarily constitute prior art.
Disclosure of Invention
Therefore, the utility model aims to provide a temperature measuring device and a wearable device, which solve the technical problem that the heat of a circuit board in the prior art affects the measurement accuracy of a temperature sensor.
In a first aspect, the utility model provides a temperature measuring device, which comprises a first temperature sensor, a substrate and a chip packaging structure, wherein the first temperature sensor is used for measuring the temperature of a measured position, the substrate is used for leading out an electrical interface of the temperature sensor and is provided with an external pin or a welding interface used for connecting the temperature measuring device, a heat insulation layer is arranged in the chip packaging structure and is used for isolating heat transfer between the measured position and the environment, and the chip packaging structure is used for protecting the first temperature sensor and the heat insulation layer.
In an embodiment, the chip packaging structure includes a tube shell, an initial cavity is formed by surrounding the tube shell and the substrate, the initial cavity is used as the heat insulation layer, the first temperature sensor is accommodated at the top of the tube shell, and the initial cavity is arranged between the first temperature sensor and the substrate.
In an embodiment, the initial cavity is a vacuum cavity, the vacuum cavity is a cavity with sealed periphery, and the internal space is vacuum.
In one embodiment, an insulating material is disposed within the initial cavity.
In one embodiment, the tube shell comprises a flat plate and a frame which are connected, the initial cavity is formed by enclosing the flat plate, the frame and the substrate, and the first temperature sensor is accommodated on the flat plate.
In an embodiment, a bottom plate is disposed between the tube shell and the base plate, and the initial cavity is formed by enclosing the tube shell, the bottom plate and the base plate.
In one embodiment, a getter is disposed in the insulating layer, the getter being used to maintain the vacuum of the insulating layer.
In an embodiment, the chip packaging mechanism further comprises a plastic sealing layer coated outside the first temperature sensor and the tube shell, wherein the first temperature sensor and the tube shell are completely coated inside the plastic sealing layer, and the bottom of the periphery of the plastic sealing layer is connected with the substrate.
In an embodiment, further comprising:
the circuit board is arranged on one side of the substrate far away from the first temperature sensor and is connected with the substrate;
the second temperature sensor is arranged on one side, far away from the first temperature sensor, of the circuit board, and the second temperature sensor is used for measuring the ambient temperature.
In a second aspect, the present utility model provides a wearable device comprising:
a housing;
the display screen is connected with the shell and is positioned at the top of the wearable device;
the temperature measuring device of any one of the first aspects, connected to the housing and located at a bottom position of the wearable apparatus, the temperature measuring device having an outwardly protruding sensing surface for abutting against the skin of the tester.
According to the temperature measuring device provided by the utility model, the heat insulation layer is arranged in the chip packaging structure, so that heat transfer between the measured position and the environment is isolated, a heat flow measuring passage between the measured position and the environment is blocked, the influence of heat from the environment on the temperature of the first temperature sensor at the measured position is reduced, and the accuracy of the temperature measuring device is improved.
In addition, the embodiment of the utility model also provides an atomizer and a cartridge, which have the heating component structure and also have various technical effects of the heating component structure.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a temperature measuring device according to a first embodiment of the present utility model;
FIG. 2 is a schematic diagram of a temperature measuring device and a circuit board according to a first embodiment of the present utility model;
FIG. 3 is a schematic diagram of another structure of the temperature measuring device and the circuit board according to the first embodiment of the present utility model;
FIG. 4 is a schematic diagram of a temperature measuring device according to a second embodiment of the present utility model;
FIG. 5 is a cross-sectional view taken along line A-A of FIG. 4;
FIG. 6 is a bottom view of the temperature measuring device of FIG. 4;
FIG. 7 is a schematic diagram illustrating the dimensions of a temperature measuring device according to a second embodiment of the present utility model;
FIG. 8 is a schematic view of the back of a smart watch according to a third embodiment of the present utility model;
FIG. 9 is a schematic diagram of the front of a smart watch according to a third embodiment of the present utility model;
fig. 10 is a schematic side view of a smart watch according to a third embodiment of the present utility model.
In the figure:
100. a temperature measuring device; 101. a heat insulating chamber; 11. a plastic sealing layer; 12. a bonding wire; 13. a substrate; 14. a first temperature sensor; 15. a tube shell; 151. a flat plate; 152. a frame; 153. a bottom plate; 16. a welding member; 17. a getter; 18. a circuit board; 19. a second temperature sensor;
200. an epidermis and subcutaneous fat layer;
300. deep part of human body;
400. a smart watch; 401. a sensing surface; 41. a housing; 42. a heat generating device; 43. and a display screen.
Detailed Description
Specific embodiments of the present utility model will be described in detail below with reference to the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art without making any inventive effort, are intended to be within the scope of the present utility model.
In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "disposed," "mounted," "connected," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms described above will be understood to those of ordinary skill in the art in a specific context.
The terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," and the like are used as references to orientations or positional relationships based on the orientation or positional relationships shown in the drawings, or the orientation or positional relationships in which the inventive product is conventionally disposed in use, merely for convenience of description and simplicity of description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore are not to be construed as limiting the utility model.
The terms "first," "second," "third," and the like, are merely used for distinguishing between similar elements and not necessarily for indicating or implying a relative importance or order.
The terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a list of elements does not include only those elements but may include other elements not expressly listed.
The temperature measuring device is generally divided into a contact type temperature measuring device and a non-contact type temperature measuring device, the temperature measuring device such as a thermometer needs to be directly contacted with the skin, the oral cavity, the rectum and other parts of a human body to measure the temperature, and the non-contact type temperature measuring device such as an infrared electronic temperature measuring gun and the like can be separated from a measured object by a distance, receive the radiation heat or illumination intensity or optical wavelength of the measured object and convert the radiation heat or illumination intensity or optical wavelength into corresponding temperature. Compared with a contact type temperature measuring device, the non-contact type temperature measuring device is high in use convenience, but is easily influenced by environmental factors such as lamplight, measuring distance, ambient temperature, an external heat source and the like, and the accuracy of a measuring result is poor.
In the related art, intelligent wearable equipment such as intelligent bracelet, intelligent wrist-watch integrate and have the temperature measurement function, install electron temperature measuring device in intelligent wearable equipment to set up temperature measuring element such as temperature measurement probe, contact with human skin through temperature measuring element, and with heat conduction to temperature sensor, can measure human body surface temperature more accurately.
Because intelligent wearable equipment such as intelligent bracelet, intelligent wrist-watch are limited in volume, install the electronic temperature measuring device in intelligent wearable equipment less in volume and compact structure, electronic temperature measuring device's circuit board is integrated with a large amount of impedance elements that can generate heat after the power up, leads to temperature sensor measuring temperature to be higher easily. In addition, in order to avoid deformation of the circuit board during welding or to improve current carrying capacity and anti-interference capacity of the circuit board, or when the number of layers of the circuit board is two or more, a ground (copper) paving process is generally adopted for designing the circuit board, the impedance of the circuit board after ground paving is generally higher, a large amount of heat is easily generated during power connection, and the measurement accuracy of the temperature sensor is easily affected by integrating the ground paved circuit board in the temperature measuring device.
The mode of the Chinese patent document CN 106414090A adopts external blackbody radiation for calibration, and solves the problem of inaccurate measurement caused by aging of a thermometer and the like. The disadvantage of this solution is that calibration measures need to be taken with knowledge of the misalignment, which cannot be automatically provided. But also requires a separate external verification device.
The mode of the Chinese patent document CN114719991A adopts ambient temperature compensation, and the scheme has the defects that the infrared temperature measuring device has larger volume and cannot be applied to small-size equipment with higher size requirements, is not portable, and has large size limiting the application field.
The mode of the Chinese patent document CN191092A adopts the ambient temperature compensation to solve the influence caused by the ambient temperature. The disadvantage of this solution is that it is greatly affected by the distance of the non-contact measurement, and if the ear thermometer is far from the subject, it will not be possible to provide accurate compensation.
The Chinese patent document CN217880023U discloses a smart watch with a temperature measuring function, which is designed to enable a temperature measuring plate to be closely attached to a human body part, so that the human body temperature can be monitored in real time. The scheme is that the temperature measuring plate is large in area and volume, and is difficult to widely apply to the intelligent watch.
The Chinese patent document CN214474460U discloses a smart watch with a temperature measuring function, which is designed with two thermosensitive temperature sensors, can measure the temperature of the wrist of a human body, can measure the temperature of the environment to compensate the temperature of the wrist of the human body, and further improves the testing precision. The disadvantage of this solution is that the first temperature sensor is easily disturbed by the heating of the internal battery circuit of the watch, affecting its test accuracy.
First embodiment
As shown in fig. 1 to 3, the present embodiment provides a temperature measuring device 100, which includes a first temperature sensor 14, a substrate 13 and a plastic layer 11, wherein the first temperature sensor 14 is used for measuring the temperature of a measured position, the substrate 13 is used for leading out an electrical interface of the temperature sensor, an external pin or a welding interface for connecting the temperature measuring device 100 is formed, a heat insulation layer is arranged inside a chip packaging structure, the heat insulation layer is used for isolating heat transfer between the measured position and the environment, and the chip packaging structure is used for protecting the first temperature sensor 14 and the heat insulation layer.
In the temperature measuring device 100 provided by the utility model, the heat insulation layer is arranged in the chip packaging structure and used for isolating heat transfer between the measured position and the environment and blocking a heat flow measuring passage between the measured position and the environment, so that the influence of heat from the environment on the temperature of the first temperature sensor 14 at the measured position is reduced, and the accuracy of the temperature measuring device 100 is improved.
In an embodiment, as shown in fig. 1 and 2, the chip packaging structure includes a package 15, an initial cavity 101 is formed by connecting the package 15 with a substrate 13, the initial cavity 101 is used as a heat insulation layer, the first temperature sensor 14 is accommodated at the top of the package 15, and the initial cavity 101 is disposed between the first temperature sensor 14 and the substrate 13. The envelope 15 may be a hollow cylindrical structure, a hollow cube structure, a hollow cuboid structure, or other hollow polyhedral structure, etc.
The initial cavity 101 is a vacuum cavity, the vacuum cavity is a cavity with sealed periphery, the internal space is vacuum, and the heat transfer between the first temperature sensor 14 and the substrate 13 is isolated by utilizing the characteristic that the vacuum cavity does not conduct heat, so that a heat flow measurement path between a measured position and the substrate 13 is blocked, the influence of heat from the substrate 13 is reduced, and the accuracy of the temperature measuring device 100 is improved.
In one embodiment, the package 15 is a cap structure, which includes a flat plate 151 and a frame 152 connected to each other, the first temperature sensor 14 is accommodated on the flat plate 151, a through hole is formed in the middle of the frame 152, the flat plate 151 is connected to the frame 152 and covers one end of the through hole, one end of the frame 152 away from the flat plate 151 is connected to the substrate 13, and the initial cavity 101 is formed by enclosing the flat plate 151, the frame 152 and the substrate 13.
The shell 15 may be a cap structure formed by an integral molding process such as stamping, wire cutting, etching, sintering, or a cap structure formed by connecting the plate 151 and the frame 152 by means of gluing, fastening, bonding, pressing, hot melting, welding, bonding, or the like. The envelope 15 may be a hollow cylindrical structure, a hollow cube structure, a hollow cuboid structure, or other hollow structures, etc.
In another embodiment, as shown in fig. 3, a bottom plate 153 is disposed between the tube housing 15 and the base plate 13, and an initial cavity is formed by enclosing the tube housing 15, the bottom plate 153 and the base plate 13. The envelope 15 is a cap structure including a plate 151 and a frame 152, the plate 151 is connected with the first temperature sensor 14, the bottom plate 153 is connected with the substrate 13, a through hole is formed in the middle of the frame 152, the plate 151 and the bottom plate 153 are respectively connected with the frame 152 and shield two ends of the through hole, and the initial cavity 101 is formed by enclosing the plate 151, the frame 152 and the bottom plate 153.
In an embodiment, the initial cavity 101 is filled with heat insulation materials such as asbestos, glass fiber or porous aerogel, so that the vacuum degree requirement of the vacuum cavity can be reduced, the reliability of the vacuum cavity is improved, and the heat insulation layer is guaranteed to have good heat insulation performance.
The first temperature sensor 14 can be fixedly connected with the upper end face of the tube shell 15 through a wire bonding or flip chip and other process modes, the base plate 13 is arranged at the lower end of the tube shell 15 and is connected with the tube shell 15, the tube shell 15 can be connected to the base plate 13 through a clamping, bonding, pressing, hot melting, welding, bonding and other modes, the tube shell 15 can be made of metal, glass, ceramic or silicon dioxide and other materials with good air tightness, the base plate 13 is made of insulating materials such as resin, ceramic or glass, and current conduction between the circuit board 18 and the tube shell 15 can be prevented after the base plate 13 is connected with the circuit board 18.
The tube 15 may be manufactured by an integral molding process such as stamping, wire cutting, etching, sintering and forming, or may be assembled by a process such as welding, bonding or bonding the flat plate 151, the frame 152 and the bottom plate 153, so that the tube 15 has good mechanical strength and supporting performance. The welding process includes, but is not limited to, reflow, nitrogen sealing, vacuum sealing, parallel sealing, vacuum parallel sealing, eutectic welding, arc welding, pressure welding, and the like.
The tube shell 15 and the substrate 13 can be welded and fixed through a vacuum sealing process, and the tube shell 15 provided with the blind groove is spliced with the substrate 13 in a vacuum environment instead of directly manufacturing a vacuum cavity in the tube shell 15, and the blind groove is shielded through the substrate 13 to form the initial cavity 101, so that the process difficulty and the process cost are lower than those of the integrated forming processes such as vacuum casting, the flexibility of the shape and the structure of the temperature measuring device 100 is improved, and the temperature measuring device is convenient to be applied to a large number of industrial production.
When the tube shell 15 and the substrate 13 are fixedly connected in a bonding, bonding or welding mode, during the connection process of the tube shell 15 and the substrate 13, the protective gas in the air needs to be pumped out first to change the installation environment into a vacuum environment, and then when the tube shell 15 and the substrate 13 are connected in a reinforcing mode, the installation environment can be filled with the protective gas to change into a clean environment, wherein the protective gas comprises one or more gases of nitrogen, helium, neon, argon, krypton, xenon and radon.
In an embodiment, as shown in fig. 3, a groove with a size matching with the outer wall of the tube housing 15 is provided on the base plate 13, so that the base plate 13 forms a sinking structure, and the thickness of the temperature measuring device 100 can be further reduced, so that the volume of the temperature measuring device 100 is smaller. In addition, after the substrate 13, the bottom plate 153 and the tube shell 15 are assembled to form the initial cavity 101, a filler can be arranged in a gap between the outer wall of the tube shell 15 and the wall of the groove, and the filler can be obtained by welding metal or filling glue or molten glass so as to improve the air tightness and vacuum degree of the initial cavity 101 and effectively improve the heat insulation effect of the tube shell 15.
In another embodiment, the housing 15 may be an integral structure formed by an integral molding process such as vacuum casting, and the initial cavity 101 is integrally formed during the process of manufacturing the housing 15. The envelope 15 may be connected to the plate-like bottom plate 153 to form the initial cavity 101, and then the envelope 15 may be fixedly connected to the base plate 13.
As shown in fig. 2 and 3, a getter 17 is provided in the initial chamber 101, and the getter 17 is used to maintain the vacuum degree of the initial chamber 101. The getter 17 comprises a metal compound such as one or more metals or metal alloys of zirconium, pickaxe, titanium, germanium, vanadium, iron, rhenium. The vacuum agent may be attached to the inner wall of the envelope 15 by means of adhesion, evaporation, plating, deposition, etc. The getter 17 may be activated by applying an electric current or heating, etc., so that the getter 17 chemically reacts with the gas remaining in the initial chamber 101 or newly generated in the initial chamber 101, thereby maintaining the vacuum degree of the chamber in which the getter 17 is located.
In another embodiment, a large amount of getter 17 may be disposed in the package 15, then the package 15 is connected with the substrate 13 in a non-vacuum environment to form the initial cavity 101, and finally the getter 17 is activated to make the gas in the initial cavity 101 react chemically, so as to increase the vacuum degree of the initial cavity 101.
In an embodiment, the first temperature sensor 14 and the tube shell 15 are coated with the plastic sealing layer 11, the first temperature sensor 14 and the tube shell 15 are completely coated with the plastic sealing layer 11, and the bottom of the periphery of the plastic sealing layer 11 is connected with the substrate 13, so that the temperature measuring device 100 is in a high-stability integrated structure. The plastic layer 11 can be made of resin material and wraps the first temperature sensor 14 and the tube shell 15, so that the first temperature sensor 14 and the tube shell 15 are not affected and damaged by the outside, and the service life of the temperature measuring device 100 is effectively prolonged.
Preferably, the first temperature sensor 14 is connected to the package 15 or the substrate 13 by a bonding wire 12, the bonding wire 12 being completely enclosed by the plastic layer 11. The first temperature sensor 14 is installed in a wire bonding mode, the cost is low, and the bonding wire 12 is completely wrapped by the plastic layer 11, so that the stability of connection between the bonding wire 12 and the first temperature sensor 14, the tube shell 15 or the substrate 13 can be improved.
In another embodiment, a bump is arranged at one end of the first temperature sensor connected with the tube shell, and the bump is used for welding or bonding the first temperature sensor with the tube shell. The welding salient points can be manufactured by adopting modes such as vapor plating, electroplating, printing or solder transferring, and the like, the first temperature sensor is arranged on the tube shell in a back-off mode, and the first temperature sensor is connected with the tube shell in a welding way under the conditions of heating and pressurizing. The first temperature sensor is connected with the tube shell by adopting a flip-chip technology, so that the stability and reliability of the first temperature sensor in working can be improved, and the risk of short circuit is reduced.
In addition, the temperature measuring device 100 manufactured by adopting the chip packaging process is thinner, so that the thickness of the whole temperature measuring device 100 is reduced, for example, in the thickness direction, the thickness of the substrate 13 is 0.2mm, the thickness of the tube shell 15 is 0.9mm, the thickness of the plastic layer 11 on the tube shell 15 is 0.4mm, the total thickness can reach 1.5mm, and the temperature measuring device 100 with small size can be manufactured, thereby being convenient to be assembled in intelligent devices such as the intelligent watch 400, the intelligent bracelet, the intelligent earphone, the intelligent electronic tag, the intelligent clothing and the like.
In an embodiment, after the first temperature sensor 14 and the package 15 are wrapped with the plastic layer 11, a soldering member 16 such as a pad, a solder ball, or a solder may be disposed on a surface of the substrate 13 away from the first temperature sensor 14, so as to facilitate subsequent soldering of the circuit board 18. The thickness of the solder balls was about 0.4mm.
In an embodiment, the first temperature sensor 14 is disposed directly above the thermal insulation layer, and the orthographic projection area of the thermal insulation layer on the substrate 13 is larger than the orthographic projection area of the first temperature sensor 14 on the substrate 13. The orthographic projection area of the initial cavity 101 on the substrate 13 can be larger than the orthographic projection area of the first temperature sensor 14 on the substrate 13, and the vacuum cavity or the heat insulation material arranged in the initial cavity 101 can block the heat flow measuring passage between the first temperature sensor 14 and the substrate 13 in the direction perpendicular to the substrate 13, so that the accuracy of the temperature measuring device 100 in measuring temperature is improved.
Second embodiment
The temperature measuring device 100 of the present embodiment is based on the temperature measuring device 100 of the first embodiment, and the temperature measuring device 100 of the present embodiment is of a split type design, and is different in that:
as shown in fig. 4 to 7, the temperature measuring device 100 of the present embodiment is provided with a circuit board 18 on a side far from the first temperature sensor 14 and is connected to the substrate 13, and a second temperature sensor 19 on a side far from the first temperature sensor 14 and is connected to the circuit board 18, where the second temperature sensor 19 is used for detecting an ambient temperature outside the temperature measuring device 100, and the first temperature sensor 14 is calibrated by introducing the ambient temperature to eliminate interference caused by the ambient temperature to the first temperature sensor 14, so that the temperature measured by the temperature measuring device 100 is more accurate.
The circuit board 18 may be connected to the substrate 13 by soldering, bonding, or the like, and the second temperature sensor 19 may be connected to the circuit board 18 by soldering, bonding, or the like.
Through the temperature measuring device 100 designed by the discrete scheme, the first temperature sensor 14 and the second temperature sensor 19 can be combined to obtain a deep temperature detection module, the second temperature sensor 19 is used as an anti-interference design of the chip, the measured internal environment temperature is used for calibrating test data of the temperature measuring device, environmental noise can be reduced for later data processing, and the environment temperature obtained through the second temperature sensor 19 is used for calibrating the test data of the temperature measuring device, so that the influence of the environment temperature is eliminated, and an accurate temperature measurement value is obtained.
In an embodiment, the second temperature sensor 19 is located directly under the thermal insulation layer in a direction perpendicular to the substrate 13, and the orthographic projection area of the thermal insulation layer on the substrate 13 is larger than the orthographic projection area of the second temperature sensor 19 on the substrate 13.
When calculating the thermal resistance between the first temperature sensor 14 and the second temperature sensor 19, the thickness of each element between the first temperature sensor 14 and the second temperature sensor 19 can be directly used as an accurate value and brought into a formula to calculate, a large number of tests are not needed, deviation parameters are introduced to calibrate, and the measurement accuracy of the temperature measuring device 100 is improved to a certain extent.
In another embodiment, the orthographic projection of the first temperature sensor 14 on the second end surface intersects with or does not intersect with the orthographic projection of the second temperature sensor 19 on the second end surface, so that the first temperature sensor 14 and the second temperature sensor 19 are arranged in a dislocation manner in the thickness direction, and when calculating the thermal resistances of the first temperature sensor 14 and the second temperature sensor 19, deviation parameters can be introduced for calibration.
As shown in fig. 7, the present embodiment provides a specific method for measuring the temperature T of the deep portion 300 of the human body d In the case of (1), the temperature measured by the first temperature sensor 14 is T in the thickness direction of the temperature measuring device 100 S The measured temperature of the second temperature sensor 19 is T R The calculation formula is as follows:
wherein R is S R is the thermal resistance of the plastic sealing layer 11 on the epidermis and subcutaneous fat layer 200 and the tube shell 15 of the human body P Is the thermal resistance between the first temperature sensor 14 and the second temperature sensor 19.
Wherein:
wherein A is the unit sectional area of each element along the thickness direction, and the sizes of the elements are equal to each other and are A; d, d 1 Is the thickness d of the epidermis and subcutaneous fat layer 200 of the human body 2 Thickness d of plastic seal layer 11 on tube shell 15 3 For the thickness d of the first temperature sensor 14 4 Is the thickness d of the tube shell 15 5 Is the thickness d of the substrate 13 6 Is the thickness of the circuit board 18; lambda (lambda) 1 Is the heat conductivity coefficient lambda of the epidermis and subcutaneous fat layer 200 of the human body 2 Is the heat conductivity coefficient lambda of the plastic layer 11 3 Is the heat conductivity coefficient lambda of the first temperature sensor 14 4 Is the heat conductivity coefficient lambda of the tube shell 15 5 Is the heat conductivity coefficient lambda of the substrate 13 6 Is the thermal conductivity of the circuit board 18.
And (3) finishing to obtain:
the temperature measuring device 100 of the present embodiment calibrates the first temperature sensor 14 by introducing the ambient temperature to eliminate the interference caused by the ambient temperature to the first temperature sensor 14, so that the temperature measured by the temperature measuring device 100 is more accurate.
Third embodiment
As shown in fig. 8 to 10, the present embodiment provides a wearable device based on the temperature measuring apparatus 100 of the first embodiment or the second embodiment.
The wearable apparatus of the present embodiment is described with the smart watch 400 carrying the temperature measuring device 100 as an example, but it should be understood that the wearable apparatus of the present embodiment should not be limited to the smart watch 400.
The smart watch 400 comprises a shell 41 and a display screen 43, wherein the display screen 43 is connected with the shell 41 and is located at the top position of the wearable device, the temperature measuring device 100 is connected with the shell 41 and is located at the bottom position of the wearable device, the temperature measuring device 100 is provided with a sensing surface 401 protruding outwards, and the sensing surface 401 is used for being clung to the skin of a tester. When the smart watch 400 is worn, the temperature measuring element can be closely attached to the skin of the wrist of the tester, so that the influence of the external environment temperature is reduced, and the accuracy of measuring the wrist temperature is improved.
The temperature sensor further comprises a digital-to-analog converter and a processor, wherein the digital-to-analog converter is electrically connected with the first temperature sensor 14 and can receive an analog signal transmitted by the first temperature sensor 14, the digital-to-analog converter is used for converting the analog signal into a digital signal, and the processor is connected with the digital-to-analog converter and receives the digital signal.
When the smart watch 400 is worn, the sensing surface 401 of the temperature measuring device 100 is always in contact with the skin of the user, so that the temperature data of the user can be continuously acquired and a temperature analog signal can be generated, the digital-analog converter can receive the temperature analog data and convert the temperature analog data into a temperature digital signal, the processor can receive the temperature digital signal and perform related processing, for example, the data can be compared with preset normal body temperature data to detect whether the body temperature of the user is in a normal body temperature range, the effect of real-time monitoring is realized, the body temperature data can also be sent to the display screen 43, and the user can directly observe the measured body temperature data through the display screen 43.
The first temperature sensor 14 and the second temperature sensor 19 may use an NTC thermistor temperature sensor or a PN junction temperature sensor, which output temperature analog signals, and the digital-to-analog converter uses an ADC digital-to-analog converter, which can convert the temperature analog signals into temperature digital signals. Multiplexing unit switching acquisition of the first temperature sensor 14 and the second temperature sensor 19 can be increased to reduce the number of ADC digital-to-analog converters. A sensor die with a digital interface having an I2C digital interface may also be used to couple the first temperature sensor 14 and the second temperature sensor 19 or other sensors to one bus by way of a serial bus.
In addition, as shown in fig. 8, other heating devices 42 are installed on the casing 41, and if the heating device 42 in this embodiment is an LED lamp, the LED lamp and the photoelectric sensor cooperate to realize functions such as heart rate and electrocardiograph monitoring, so as to further improve the intelligent effect of the intelligent watch 400.
It should be noted that, in the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described as different from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other.
The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present utility model should be included in the present utility model. Accordingly, the scope of the utility model should be assessed as that of the appended claims.
Claims (10)
1. The utility model provides a temperature measuring device, includes first temperature sensor, base plate and chip packaging structure, first temperature sensor is used for measuring the temperature of measured position, the base plate is used for drawing forth temperature sensor's electrical interface to be formed with and be used for connecting temperature measuring device's outside pin or welding interface, its characterized in that, the inside insulating layer that is equipped with of chip packaging structure, the insulating layer is used for keeping apart the heat transfer between measured position and the environment, chip packaging structure is used for protecting first temperature sensor with the insulating layer.
2. The temperature measurement device of claim 1, wherein:
the chip packaging structure comprises a tube shell, an initial cavity is formed by surrounding the tube shell and the substrate, the initial cavity is used as the heat insulation layer, the first temperature sensor is accommodated at the top of the tube shell, and the initial cavity is arranged between the first temperature sensor and the substrate.
3. The temperature measuring device of claim 2, wherein:
the initial cavity is a vacuum cavity, the vacuum cavity is a cavity with sealed periphery, and the inner space of the vacuum cavity is vacuum.
4. The temperature measuring device of claim 2, wherein:
and a heat insulation material is arranged in the initial cavity.
5. The temperature measurement device of any one of claims 2-4, wherein the cartridge comprises a plate and a frame connected, the initial cavity being defined by the plate, the frame and the substrate, the first temperature sensor being received on the plate.
6. The temperature measurement device of claim 2, wherein a bottom plate is disposed between the housing and the base plate, and the initial cavity is defined by the housing, the bottom plate, and the base plate.
7. The temperature measuring device according to any one of claims 2-4, wherein:
and a getter is arranged in the heat insulation layer and is used for maintaining the vacuum degree of the heat insulation layer.
8. The temperature measuring device of claim 2, wherein:
the chip packaging structure further comprises a plastic sealing layer which is coated outside the first temperature sensor and the tube shell, wherein the first temperature sensor and the tube shell are completely coated inside the plastic sealing layer, and the bottom of the periphery of the plastic sealing layer is connected with the substrate.
9. The temperature measurement device of claim 1, further comprising:
the circuit board is arranged on one side of the substrate far away from the first temperature sensor and is connected with the substrate;
the second temperature sensor is arranged on one side, far away from the first temperature sensor, of the circuit board, and the second temperature sensor is used for measuring the ambient temperature.
10. A wearable device, comprising:
a housing;
the display screen is connected with the shell and is positioned at the top of the wearable device;
the temperature measuring device of any one of claims 1-9, connected to the housing and located at a bottom position of the wearable apparatus, the temperature measuring device having an outwardly protruding sensing surface for abutting the skin of the tester.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321147024.0U CN220084209U (en) | 2023-05-11 | 2023-05-11 | Temperature measuring device and wearable equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321147024.0U CN220084209U (en) | 2023-05-11 | 2023-05-11 | Temperature measuring device and wearable equipment |
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| Publication Number | Publication Date |
|---|---|
| CN220084209U true CN220084209U (en) | 2023-11-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321147024.0U Active CN220084209U (en) | 2023-05-11 | 2023-05-11 | Temperature measuring device and wearable equipment |
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| Country | Link |
|---|---|
| CN (1) | CN220084209U (en) |
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2023
- 2023-05-11 CN CN202321147024.0U patent/CN220084209U/en active Active
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