CN217424566U - Infrared sensing packaging structure and electronic equipment - Google Patents
Infrared sensing packaging structure and electronic equipment Download PDFInfo
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- CN217424566U CN217424566U CN202220687538.4U CN202220687538U CN217424566U CN 217424566 U CN217424566 U CN 217424566U CN 202220687538 U CN202220687538 U CN 202220687538U CN 217424566 U CN217424566 U CN 217424566U
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Abstract
The infrared sensing packaging structure comprises a shell with a packaging cavity, an integrated circuit chip and an infrared sensing element, wherein the integrated circuit chip and the infrared sensing element are installed in the packaging cavity; through the mode, the temperature sensing element is integrated on the integrated circuit chip, and the integrated circuit chip and the infrared sensing element are stacked, so that the size of the packaging structure is reduced, the miniaturization of the packaging structure is facilitated, the distance between the temperature sensing element and the infrared sensing element is reduced, and the reduction of the thermal resistance of the temperature sensing element and the infrared sensing element is facilitated.
Description
Technical Field
The application relates to the technical field of infrared sensors, in particular to an infrared sensing packaging structure and electronic equipment.
Background
At present, most of common infrared sensors adopt a thermopile measuring principle, and when the target temperature is obtained, the thermopile only needs to measure the temperature difference of the actual temperature of the target relative to the ambient temperature of the infrared sensor, so that an ambient temperature sensing element is required to be additionally arranged to measure the ambient temperature, and the actual temperature can be finally calculated. In the prior art, the ambient temperature sensing element, the thermopile and the integrated circuit chip in the infrared sensor are arranged on the substrate at intervals to be packaged into the infrared sensor, and the placing mode is not beneficial to the miniaturization of the packaging structure.
SUMMERY OF THE UTILITY MODEL
An object of the application is to provide an infrared sensing packaging structure and electronic equipment to be unfavorable for the miniaturized technical problem of packaging structure among the solution prior art.
The technical scheme of the application is as follows: the utility model provides an infrared sensing packaging structure, including the casing that has the encapsulation cavity, install in integrated circuit chip and infrared sensing element in the encapsulation cavity, the casing is including being used for the installation integrated circuit chip's base plate and with the base plate encloses and establishes the formation the shell of encapsulation cavity, integrated circuit chip is including dorsad the temperature sensing element that the base plate set up, infrared sensing element folds and locates integrated circuit chip dorsad base plate one side.
Optionally, the infrared sensing element is in contact with the temperature sensing element.
Optionally, a projection of the temperature sensing element on the substrate in a stacking direction of the infrared sensing element and the integrated circuit chip has an overlapping portion with a projection of the infrared sensing element on the substrate in the stacking direction.
Optionally, a projection of the temperature sensing element on the substrate along the stacking direction is located within a projection range of the infrared sensing element on the substrate along the stacking direction.
Optionally, the infrared sensing element comprises at least one thermopile.
Optionally, the infrared sensing element further includes a main body portion provided with the thermopile, a support portion for supporting the main body portion, and a back cavity extending from one side of the support portion away from the main body portion to the main body portion, and the thermopile is provided on one side of the main body portion away from the support portion.
Optionally, a projection of the temperature sensing element on the substrate along the stacking direction is located within a projection range of the support portion on the substrate along the stacking direction.
Optionally, the infrared sensing package structure further includes a metal line electrically connecting the integrated circuit chip and the infrared sensing element.
Optionally, the housing is provided with a light hole, and the light hole is opposite to the infrared sensing element; the infrared sensing packaging structure further comprises an infrared filtering lens arranged in the light hole.
Optionally, the infrared sensing package structure further includes a condenser lens, and the condenser lens is disposed opposite to the light hole.
Optionally, the housing is made of a metal material.
Another technical scheme of the application is as follows: an electronic device is provided, which includes the infrared sensing package structure.
The infrared sensing packaging structure comprises a shell with a packaging cavity, an integrated circuit chip and an infrared sensing element, wherein the integrated circuit chip and the infrared sensing element are installed in the packaging cavity; through the mode, the temperature sensing element is integrated in the integrated circuit chip, and the integrated circuit chip and the infrared sensing element are stacked, so that the size of the packaging structure is reduced, and the miniaturization of the packaging structure is facilitated. Meanwhile, the distance between the temperature sensing element and the infrared sensing element is reduced, so that the thermal resistance of the temperature sensing element and the infrared sensing element is favorably reduced, and the measurement accuracy is improved.
Drawings
Fig. 1 is a schematic structural diagram of an infrared sensing package structure according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of another infrared sensing package structure according to an embodiment of the present application;
fig. 3 is a view of an infrared sensing element in the infrared sensing package structure shown in fig. 2;
fig. 4 is a schematic structural diagram of an electronic device according to another embodiment of the present application.
Detailed Description
The present application will be further described with reference to the accompanying drawings and embodiments.
In the following, many aspects of the present application will be better understood with reference to the drawings. The components in the drawings are not necessarily to scale. Instead, emphasis is placed on clearly illustrating the components of the present application. Moreover, in the several views of the drawings, like reference numerals designate corresponding parts.
Referring to fig. 1, an infrared sensing package structure 100 includes a housing 10 having a package cavity 10a, an integrated circuit chip 20 mounted in the package cavity 10a, and an infrared sensing element 30.
The housing 10 includes a substrate 11 and a casing 12, the substrate 11 is used for mounting the integrated circuit chip 20, and the casing 12 and the substrate 11 together enclose to form a package cavity 10 a.
The integrated circuit chip 20 comprises, inter alia, a temperature sensing element 22 arranged opposite the substrate 11. In an alternative embodiment, the integrated circuit chip 20 further includes a circuit main body 21 disposed on the substrate 11, the temperature sensing element 22 is integrated on the circuit main body 21, and the temperature sensing element 22 is disposed on a side of the circuit main body 21 opposite to the substrate 11.
The infrared sensor element 30 is stacked on the side of the integrated circuit chip 20 opposite to the substrate 11.
The integrated circuit chip 20 is electrically connected to the infrared sensor element 30, and is configured to receive analog signals output by the infrared sensor element 30 and the temperature sensor element 22, perform analog-to-digital conversion and process the analog signals, and output digital signals.
In the present embodiment, an infrared sensing area 30a is disposed on a side of the infrared sensing element 30 away from the circuit main body 21, and the infrared sensing area 30a receives infrared rays radiated by a measurement target and generates a first measurement signal, which is used for representing a temperature difference between an actual temperature of the measurement target and an ambient temperature of the infrared sensing element 30. The temperature sensing element 22 is used to measure the ambient temperature and generate a second measurement signal indicative of the ambient temperature. The temperature sensing element 22 may be, for example, an integrated temperature sensor built into the integrated circuit chip 20, and may include one or more bipolar transistors and/or MOS transistors. Further, the integrated circuit chip 20 receives the first measurement signal and the second measurement signal, respectively, and obtains the actual temperature of the measurement target according to the first measurement signal and the second measurement signal.
In the present embodiment, integrating the temperature sensing element 22 in the integrated circuit chip 20, for example, integrating the temperature sensing element 22 with the circuit main body 21, and stacking the infrared sensing element 30 on the integrated circuit chip 20, reduces the volume of the infrared sensing package structure 100. In addition, since the infrared sensor element 30 is stacked on the integrated circuit chip 20, the distance between the temperature sensor element 22 and the infrared sensor element 30 is reduced, which is advantageous for reducing the thermal resistance of the temperature sensor element 22 and the infrared sensor element 30.
In some embodiments, to further reduce the thermal resistance of the temperature sensing element 22 and the infrared sensing element 30, and to improve the accuracy of the measurement, the temperature sensing element 22 and the infrared sensing element 30 are in contact. That is, the infrared sensor element 30 may be stacked on the temperature sensor element 22 so that the infrared sensor element 20 and the temperature sensor element 22 have surfaces that can be contacted.
In some embodiments, in order to increase the contact area of the two, the projection of the temperature sensing element 22 onto the substrate 11 in the stacking direction S1 of the infrared sensing element 30 and the integrated circuit chip 20 has an overlap with the projection of the infrared sensing element 30 onto the substrate 11 in the stacking direction S1. Wherein the stacking direction S1 is perpendicular to the substrate 11. The contact area of the temperature sensing element 22 and the infrared sensing element 30 can be smaller than the area of the temperature sensing element 22, so that the temperature sensing element 22 can obtain more accurate ambient temperature, and the accuracy of the target temperature measured by the infrared sensing packaging structure can be improved.
In some embodiments, in order to further increase the contact area between the temperature sensing element 22 and the substrate 11, the projection of the temperature sensing element 22 on the substrate 11 along the stacking direction S1 is located within the projection range of the infrared sensing element 30 on the substrate 11 along the stacking direction S1, and when the area of the temperature sensing element 22 is smaller than or equal to the area of the infrared sensing element 30, the contact area between the temperature sensing element 22 and the infrared sensing element 30 may be equal to the area of the temperature sensing element 22, so that the ambient temperature obtained by the temperature sensing element 22 is consistent with the ambient temperature obtained by the infrared sensing element 30, and the accurate target temperature is obtained after processing by the integrated circuit chip 20.
In some embodiments, referring to fig. 2 and 3, at least one thermopile 33 is disposed on a side of the infrared sensing element 30 away from the integrated circuit chip 20, the thermopile 33 is disposed in an infrared sensing region 30a of the infrared sensing element 30, and the infrared sensing region 30a can absorb infrared rays incident to the infrared sensing region 30a by using a thermal electromotive force (seebeck effect) and measure a temperature difference generated in the infrared sensing element 30 by the infrared rays (i.e., a heat flux) entering the package cavity 10a to generate and output an electrical signal.
The thermopile 33 includes a plurality of thermocouples (not shown) connected in series and an electrode (not shown) for detecting an output signal of the thermopile 33. Further, the infrared sensing element 30 further includes a main body portion 31, a supporting portion 32 and a back cavity 34, the infrared sensing element 30 is manufactured by a semiconductor manufacturing process, the main body portion 31 is a portion formed on a silicon substrate, the supporting portion 32 is a portion of the silicon substrate, the back cavity 34 extends from a side of the supporting portion 32 away from the main body portion 31 to the main body portion 31, and the back cavity 34 is formed by etching from a side of the silicon substrate facing away from the main body portion 31. The thermopile 33 is disposed on a side of the main body 31 away from the support portion 32, and an area of the main body 31 where the thermopile 33 is located is the infrared sensing area 30a, so that the main body 31 is also called a hot end of the infrared sensing element 30, the support portion 32 is also called a cold end of the infrared sensing element 30, and a temperature of the cold end of the infrared sensing element 30 (i.e., a temperature of the support portion 32) is an ambient temperature of the infrared sensing element 30.
In order to further reduce the thermal resistance of the infrared sensing element 30 and the temperature sensing element 22 and improve the accuracy of the measurement of the ambient temperature by the infrared sensing packaging structure 100, the temperature sensing element 22 is in sufficient contact with the supporting portion 32, that is, the temperature sensing element 22 is in sufficient contact with the cold end of the infrared sensing element 30. The projection of the temperature sensing element 22 on the substrate 11 along the stacking direction S1 is located within the projection of the support 32 on the substrate 11 along the stacking direction S1, and this arrangement enables the ambient temperature measured by the cold end of the infrared sensing element and the ambient temperature measured by the temperature sensing element 22 to be consistent, which greatly improves the accuracy of the target temperature output by the final infrared sensing package structure 100.
In some embodiments, referring to fig. 1 and fig. 2, the infrared sensing package structure 100 further includes metal wires (not shown) electrically connecting the integrated circuit chip 20 and the infrared sensing element 30, and during the fabrication process of the package structure, the integrated circuit chip 20 provided with the temperature sensing element 22 and the infrared sensing element 30 may be first assembled in a stacked manner, the electrical connection between the infrared sensing element 30 and the integrated circuit chip 20 is respectively established through the metal wires, and finally, the housing 10 is formed by using a packaging material, which is convenient to fabricate.
In this embodiment, the Integrated Circuit chip 20 may be an ASIC (Application Specific Integrated Circuit) chip, and the temperature sensing element 22 is Integrated on the ASIC chip.
The metal wires are bonding wires, which may be aluminum wires or gold wires, and the metal wires may be fixed to the infrared sensor element 30 and the integrated circuit chip 20 by soldering, respectively.
In some embodiments, the substrate 11 is provided with a connection line, and the infrared sensing package 100 further includes a first connection line 41 electrically connecting the integrated circuit chip 20 and the substrate 11 and a second connection line 42 electrically connecting the infrared sensing element 30 and the substrate 11. The first connection line 41 and the second connection line 42 may be aluminum lines or gold lines, etc. for establishing electrical connection with the connection lines of the substrate 11. The substrate 11 is also used for carrying the integrated circuit chip 20, and when the package structure is manufactured, the integrated circuit chip 20 including the temperature sensing element 22 and the infrared sensing element 30 may be sequentially stacked on the substrate 11, and then the housing 12 is formed on the substrate 11, so that each component can be packaged in the housing 10.
In this embodiment, the substrate 11 may be a Circuit substrate, for example, a Printed Circuit Board (PCB), and the material of the base 11 may be a resin substrate, a plastic substrate, a ceramic substrate, or other substrates.
In some embodiments, referring to fig. 1 and 2, the housing 12 has a light hole opposite to the infrared sensor element 30, and the infrared sensor package 100 further includes an infrared filter lens 50 disposed in the light hole. The relative position of the light-transmitting hole and the infrared sensing element 30 may mean that the light-transmitting hole is opposite to the sensing surface 30a of the infrared sensing element 30, the infrared filter lens 50 is embedded in the light-transmitting hole and used for filtering incident light in a non-infrared band and transmitting infrared light in a certain wavelength range to the sensing surface 30a, the infrared sensing element 30 absorbs the infrared light incident to the sensing surface 30a and generates and outputs an electrical signal, the influence of the non-infrared light can be eliminated through filtering by the infrared filter lens 30, and the accuracy of temperature measurement is improved.
In some embodiments, the ir sensing package structure 100 further includes a condenser lens 51, and the condenser lens 51 is disposed opposite to the light hole, wherein the condenser lens 51 is disposed opposite to the light hole, which may mean that after the light hole is disposed opposite to the ir filter lens 50, in order to make the sensing surface 30a of the ir sensing device 30 receive as much infrared light as possible, the accuracy of temperature measurement is improved, and as an embodiment, the condenser lens 51 may be disposed between the ir filter lens 50 and the ir sensing device 30. In another embodiment, the condensing lens 51 may be disposed between the infrared filter lens 50 and the light transmitting hole, and may perform a function of adjusting the angle of view while condensing light.
In some embodiments, the housing 12 is made of a metal material having a high thermal conductivity to reduce the effect of IR interference on the IR sensing element 30. Further, the housing 12 is made of a metal material with a small emissivity, which can further reduce external thermal interference, especially interference above the infrared sensing area 30a of the infrared sensing element 30, for example, the housing 12 can be made of a metal material with an emissivity less than 0.6.
Referring to fig. 4, the electronic device 300 includes an infrared sensing package structure 100, and the infrared sensing package structure 100 is specifically referred to the above embodiments of the infrared sensing package structure 100, which is not described in detail herein.
In some embodiments, the electronic device 300 may be a wearable device or a mobile terminal, for example, a wearable device including, but not limited to, a smart watch, a smart bracelet, a smart garment, a smart headset, and the like. If the wearable device is a smart watch, the infrared sensing package structure 100 is used to detect infrared radiation from the wrist skin of the wearer. As another example, the wearable device is a TWS (True Wireless Stereo) headset, and the infrared sensing package 100 is used for detecting infrared radiation radiated from the skin of the ear of the wearer.
While the foregoing is directed to embodiments of the present application, it will be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims.
Claims (12)
1. The utility model provides an infrared sensing packaging structure, its characterized in that, including the casing that has the encapsulation cavity, install in integrated circuit chip and infrared sensing element in the encapsulation cavity, the casing is including being used for the installation integrated circuit chip's base plate and with the base plate encloses establishes and forms the shell of encapsulation cavity, integrated circuit chip is including dorsad the temperature sensing element that the base plate set up, infrared sensing element folds and locates integrated circuit chip dorsad base plate one side.
2. The infrared sensing package of claim 1, wherein the infrared sensing element is in contact with the temperature sensing element.
3. The infrared sensing package structure of claim 2, wherein a projection of the temperature sensing element onto the substrate along a stacking direction of the infrared sensing element and the integrated circuit chip has an overlap with a projection of the infrared sensing element onto the substrate along the stacking direction.
4. The infrared sensing package structure of claim 3, wherein a projection of the temperature sensing element onto the substrate along the stacking direction is within a projection range of the infrared sensing element onto the substrate along the stacking direction.
5. The infrared sensing package of claim 3, wherein the infrared sensing element comprises at least one thermopile.
6. The infrared sensing package structure as claimed in claim 5, wherein the infrared sensing element further includes a main body portion provided with the thermopile, a support portion for supporting the main body portion, and a back cavity extending from a side of the support portion away from the main body portion to the main body portion, and the thermopile is disposed on a side of the main body portion away from the support portion.
7. The infrared sensing package structure of claim 6, wherein a projection of the temperature sensing element on the substrate along the stacking direction is within a projection range of the support portion on the substrate along the stacking direction.
8. The infrared sensing package of any one of claims 1 to 7, further comprising metal lines electrically connecting the integrated circuit chip and the infrared sensing element.
9. The infrared sensing package as claimed in any one of claims 1 to 7, wherein the housing is provided with a light-transmissive hole, the light-transmissive hole being opposite to the position of the infrared sensing element; the infrared sensing packaging structure further comprises an infrared filtering lens arranged in the light hole.
10. The infrared sensing package structure of claim 9, further comprising a condenser lens, wherein the condenser lens is disposed opposite to the light hole.
11. The infrared sensing package structure according to any one of claims 1 to 7, wherein the housing is made of a metal material.
12. An electronic device, comprising the infrared sensing package structure of any one of claims 1 to 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220687538.4U CN217424566U (en) | 2022-03-28 | 2022-03-28 | Infrared sensing packaging structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220687538.4U CN217424566U (en) | 2022-03-28 | 2022-03-28 | Infrared sensing packaging structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217424566U true CN217424566U (en) | 2022-09-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220687538.4U Active CN217424566U (en) | 2022-03-28 | 2022-03-28 | Infrared sensing packaging structure and electronic equipment |
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| Country | Link |
|---|---|
| CN (1) | CN217424566U (en) |
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- 2022-03-28 CN CN202220687538.4U patent/CN217424566U/en active Active
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