CN109990942A - A kind of high-pressure common-rail pressure sensor - Google Patents
A kind of high-pressure common-rail pressure sensor Download PDFInfo
- Publication number
- CN109990942A CN109990942A CN201910358465.7A CN201910358465A CN109990942A CN 109990942 A CN109990942 A CN 109990942A CN 201910358465 A CN201910358465 A CN 201910358465A CN 109990942 A CN109990942 A CN 109990942A
- Authority
- CN
- China
- Prior art keywords
- pressure
- shell
- chip
- pedestal
- matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 45
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 45
- 239000010703 silicon Substances 0.000 claims abstract description 45
- 239000011159 matrix material Substances 0.000 claims abstract description 33
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000012528 membrane Substances 0.000 claims abstract description 25
- 239000003921 oil Substances 0.000 claims abstract description 23
- 238000005245 sintering Methods 0.000 claims abstract description 10
- 239000011521 glass Substances 0.000 claims abstract description 8
- 238000009529 body temperature measurement Methods 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000000428 dust Substances 0.000 abstract description 3
- 238000002955 isolation Methods 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 239000000446 fuel Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000000295 fuel oil Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
- G01K13/026—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow of moving liquids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Nonlinear Science (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The present invention relates to car force sensor technical fields, more particularly, to a kind of high-pressure common-rail pressure sensor, it include matrix, shell and electrical plug, described matrix is provided with oil pressure chamber along the center line of itself, described matrix is located at the intracavitary one end of oil pressure and is provided with integrally formed metallic membrane, pedestal is installed in the shell, the Silicon pressure chip being bonded on metallic membrane is provided in the pedestal, the Silicon pressure chip is connected with circuit board, insulating glass layer is provided between the Silicon pressure chip and metallic membrane, the circuit board is electrically connected by pin set and electrical plug, adding on the Silicon pressure chip is having vacuum protection cover, the present invention, Silicon pressure chip is after high temperature sintering, so that its high-temperature behavior enhances, the vacuum protection cover protection circuit plate and Silicon pressure chip and greasy dirt, dust, corrosion Property the isolation such as gas, avoid the performance for reducing sensor.
Description
Technical field
The present invention relates to car force sensor technical fields, more particularly, to a kind of high-pressure common-rail pressure sensor.
Background technique
High-pressure common-rail pressure sensor function is measurement fuel oil real-time pressure, and measurement result is transferred to ECU (electronics control
Device processed) feedback control signal as oil pressure in fuel dispensing tube, high-pressure common-rail pressure sensor, generallys use metal at present
Foil gauge and Silicon pressure chip.
Had the disadvantage that using the high-pressure common-rail pressure sensor of metal strain plate: a, sensitivity are low, metal strain chip
Pressure sensor coefficient of strain GF is only 1.5 or so;B, metal strain plate generally uses organic binder to be pasted onto stainless steel bomb
Property body on form mechanics sensing element, this results in sensing element vulnerable to environmental influences such as temperature, humidity, and at any time
Variation leads to the problem of that aging, null offset, sluggish increase etc. are a series of to reduce sensor performance.
Using Silicon pressure chip there are the shortcomings that have: be between pressure drag measuring cell in Silicon pressure chip by PN junction be isolated
, the relationship between cut-off current and temperature is exponential relationship, and PN junction isolation will fail.High-pressure common-rail pressure sensor peace
In high pressure co-rail system, working environment is in hot environment, so that traditional Silicon pressure chip performance, which reduces, even to be made
Sensor failure.And this pressure chip requires compared with when temperature is increased to 150 DEG C use environment, high, corrosivity gas
Body, dust granule and greasy dirt will be greatly reduced the performance of sensor.
Engine ECU maintains engine according to the integrated informations such as revolving speed, speed, gear, control oil pump pump oil into rail
If normal power exports common rail fuel pressure signal because mistake occurs in electromagnetic interference, it will result directly in Engine ECU and issue mistake
Pump oil instruction accidentally.
Summary of the invention
The purpose of the present invention is to provide a kind of high-pressure common-rail pressure sensor, with solve to mention in existing background technique
Technical problem.
A kind of high-pressure common-rail pressure sensor includes matrix, shell and electrical plug, and described matrix is along in itself
Heart line is provided with oil pressure chamber, and described matrix is located at the intracavitary one end of oil pressure and is provided with integrally formed metallic membrane, the shell
It is socketed on matrix, pedestal is installed in the shell, one end of the pedestal is mounted on one where the metallic membrane of matrix
It holds, is provided with the Silicon pressure chip being bonded on metallic membrane in the pedestal, the Silicon pressure chip is connected with circuit board, institute
It states and is provided with insulating glass layer between Silicon pressure chip and metallic membrane, the circuit board is electrical by pin set and electrical plug
It connects, adding on the Silicon pressure chip is having vacuum protection cover.
Preferably, the Silicon pressure chip passes through high temperature sintering, and the front circuit of the circuit board is Wheatstone bridge, favour
Several nodes of stone electric bridge are electrically connected with low-pass filter circuit.
Preferably, the Silicon pressure chip sintering range is 400 degree~600 degree, and Silicon pressure chip uses SOI substrate
Pressure chip, the resistance in the Silicon pressure chip are separated by silica.
Preferably, described matrix is provided with annular groove close to one end of metallic membrane, and the shell includes to be welded on ring
Clutch disk and shell in shape slot, the edge of the clutch disk are provided with external screw thread, are provided on the inside of described shell one end
The internal screw thread being threadedly coupled with external screw thread.
Preferably, the other end of the middle section of the pedestal and shell is clamped, and pedestal is arranged useful close to metallic membrane one end
In the groove of evacuation circuit board, the one end fits of the groove and matrix form a closed cavity, and the clutch disk is rank
Sealing ring is arranged in scalariform and clutch disk, the position that middle section and the shell of the pedestal are clamped, which is located on the inside of shell, to be also provided with
There is sealing ring.
Preferably, several temperature measurement modules are additionally provided in the groove, the temperature measurement module includes to be bonded in matrix
The thermistor and temperature measuring circuit board of one end.
Preferably, the pin set includes grounding pin ,+5V pin and signal pins, and the temperature measuring circuit board is wrapped
Grounding pin ,+5V pin and signal pins are included, the grounding pin of the circuit board and the grounding pin of temperature measuring circuit board close
And.
Preferably, the pedestal is provided with connection cavity and extraneous pressure compensation opening.
First, of the invention, Silicon pressure chip enables its high-temperature behavior at -40~200 DEG C after high temperature sintering
Use temperature range is not affected by temperature completely.
Silicon pressure chip and glass paste are by forming one layer of insulation after 400-600 degree high temperature sintering, on Silicon pressure chip
Glassy layer so that Silicon pressure chip can be with high temperature resistant, therefore does not have sensor in the use temperature environment of rail pressure system completely
Problem.
Second, of the invention, the deformation that Silicon pressure chip is generated by pressure is without mechanical injuries, while also without fatigue and old
Change, the mean free error time is long, and stability and reliability are all high.
Third, it is of the invention, there are one layer of insulating glass layer, insulating glass layer due to being isolated between metallic membrane (pressure-bearing film)
Thickness at 1-20 microns, so that insulating glass layer can bear at least 500VAC voltge surge.
Fourth, of the invention, the vacuum protection cover protection circuit plate and Silicon pressure chip and greasy dirt, dust, corrosivity gas
The isolation such as body avoids the performance for reducing sensor.
Fifth, low-pass filter circuit of the invention can eliminate common rail fuel pressure signal because mistake occurs in electromagnetic interference.
Oil temperature is detected fifth, temperature measurement module can play, improves the detection efficiency to engine, it also can be to biography
Sensor itself carries out temperature detection.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is schematic diagram of the three-dimensional structure;
Fig. 2 is front view of the invention;
Fig. 3 is the cross-sectional view in Fig. 2 along line A-A;
Fig. 4 is the cross-sectional view in Fig. 2 along line B-B;
Fig. 5 is the schematic perspective view of matrix of the present invention, shell and pedestal;
Fig. 6 is the circuit diagram of Wheatstone bridge of the present invention;
Fig. 7 is that Wheatstone bridge of the present invention and low-pass filter circuit are electrically connected schematic diagram;
Fig. 8 is the circuit diagram of temperature measurement circuit of the present invention;
Appended drawing reference: matrix 1, oil pressure chamber 11, metallic membrane 12, annular groove 13, shell 2, clutch disk 21, shell 22,
Electrical plug 3, pedestal 4, Silicon pressure chip 41, circuit board 42, pin set 43, groove 44, pressure compensation opening 45, Wheatstone bridge
5, low-pass filter circuit 6, capacitor 61, thermocouple 62, zener diode 63, thermistor 7, amplifier 8, temperature measurement module 9.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.
The component for the embodiment of the present invention for usually describing and showing in attached drawing here can be with a variety of different configurations
To arrange and design.Therefore, the detailed description of the embodiment of the present invention provided in the accompanying drawings is not intended to limit below and is wanted
The scope of the present invention of protection is sought, but is merely representative of selected embodiment of the invention.
Based on the embodiments of the present invention, those of ordinary skill in the art are obtained without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can
To be mechanical connection, it is also possible to be electrically connected;It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
In conjunction with shown in Fig. 1 to Fig. 8, it to include matrix that the embodiment of the invention provides a kind of high-pressure common-rail pressure sensors
1, shell 2 and electrical plug 3, described matrix 1 are provided with oil pressure chamber 11 along the center line of itself, and described matrix 1 is located at oil pressure
One end in chamber 11 is provided with integrally formed metallic membrane 12, and the shell 2 is socketed on matrix 1, installation in the shell 2
There is pedestal 4, one end of the pedestal 4 is mounted on one end where the metallic membrane 12 of matrix 1, is provided in the pedestal 4 viscous
The Silicon pressure chip 41 on metallic membrane 12 is tied, the Silicon pressure chip 41 is connected with circuit board 42, the Silicon pressure chip
Insulating glass layer is provided between 41 and metallic membrane 12, the circuit board 42 is electrically connected by pin set 43 and electrical plug 3
It connects, adding on the Silicon pressure chip 41 is having vacuum protection cover, makes metallic membrane 12 generate deformation according to oil pressure, so that silicon
Resistance in pressure chip 41 causes four resistance for forming Wheatstone bridge 5 that pressure drag effect occurs with 12 deformation of metallic membrane
It answers, a millivolt level voltage output signal in a linear relationship with pressure can be generated under the action of driving voltage, thus by bavin
Oil pressure becomes electricity output, and the electric quantity signal of output is millivolt signal, through the integrated amplifier in oversampling circuit, by signal
+ 1V~+4V standard voltage signal is converted to, ECU is finally transferred to.
High-pressure common rail (CommonRail) electric jet technology refers in high-pressure oil pump, pressure sensor and electronic control unit
(ECU) in the closed-loop system formed, by the generation and course of injection of spraying pressure a kind of fuel system completely separate from each other.
It is that high pressure fuel is transported to common feeder line (Rail) by high-pressure oil pump, passes through the oil pressure in common feeder line
It realizes accurate control, keeps high pressure pipe pressure (Pressure) size unrelated with the revolving speed of engine, can significantly reduce bavin
The degree that oil machine charge oil pressure changes with engine speed.
The Silicon pressure chip 41 passes through high temperature sintering, and the front circuit of the circuit board 42 is Wheatstone bridge 5, Hui Si
Several nodes of energization bridge 5 are electrically connected with low-pass filter circuit 6, and low-pass filter circuit 6 can carry out voltage signal
Filtering, filter out the electromagnetic interference source coupling effect generation sensitive equipments such as common mode interference and vehicle influences to signal bring,
Increase low-pass filter circuit 6 on electric bridge, between common rail pressure signal and earth polar to 43 input+5V power supply of pin set, output,
Increase appropriate filter capacitor 61, filters out the spurious signal of high frequency section, increase parallel voltage-stabilizing after thermocouple 62 and the filtering of capacitor 61
Diode 63, so that supply voltage is more steady, due to the effect of zener diode 63, the excessive characteristic that power supply connects moment is obtained
To improve, to enhance stability of the input voltage with output signal.
41 sintering range of Silicon pressure chip is 400 degree~600 degree, and Silicon pressure chip 41 uses SOI substrate pressure
Power chip, the resistance in the Silicon pressure chip 41 are separated by silica, and Silicon pressure chip 41 is due to that will pass through 500 DEG C
High temperature sintering, so that its high-temperature behavior is especially strong, generally between -40~350 DEG C, performance is basically unchanged, it is all for -40~
200 DEG C of use temperature range absolutely not problem.
Described matrix 1 is provided with annular groove 13 close to one end of metallic membrane 12, and the shell 2 includes to be welded on annular
Clutch disk 21 and shell 22 in slot 13, the edge of the clutch disk 21 are provided with external screw thread, in described 22 one end of shell
Side is provided with the internal screw thread being threadedly coupled with external screw thread, general matrix 1 and clutch disk 21 be it is integrally formed, on lathe plus
Work comes out, and 21 diameter of clutch disk is much larger than the diameter of matrix 1, wastes very much material in this way, single by clutch disk 21 and matrix 1
Solely processing, can save raw material.
The middle section of the pedestal 4 and the other end of shell 22 are clamped, and pedestal 4 is provided with close to 12 one end of metallic membrane and is used for
The groove 44 of circuit board 42 is avoided, the one end fits of the groove 44 and matrix 1 form a closed cavity, the clutch disk
21 is are arranged with sealing ring on ladder-like and clutch disk 21, the position that the middle section of the pedestal 4 and shell 22 are clamped is located at outer
Sealing ring is also equipped on the inside of shell 22, such structure improves matrix 1 and 2 installation strength of shell and leakproofness.
Several temperature measurement modules 9 are additionally provided in the groove 44, the temperature measurement module 9 includes to be bonded in matrix 1 one
The thermistor 7 and temperature measuring circuit board 42 at end, according to the change in resistance of thermistor 7, temperature measuring circuit board 42 passes temperature signal
Be defeated by ECU, while can be realized the detection to oil pressure, oil temperature detected, also can to the temperature of sensor internal, into
Row detection.
The pin set 43 includes grounding pin ,+5V pin and signal pins, and the temperature measuring circuit board 42 includes
Grounding pin ,+5V pin and signal pins, the grounding pin of the circuit board 42 and the grounding pin of temperature measuring circuit board 42 close
And the occupied space of hardware can be reduced, the temperature measuring circuit board 42 includes the thermometric being electrically connected with thermistor 7RT
Circuit, the pole amplifier 8+ in the temperature measurement circuit is as the continually changing voltage transmission of 7 resistance value of thermistor is to ECU.
The pedestal 4, which is provided with, is connected to cavity and extraneous pressure compensation opening 45, guarantees the intracorporal pressure of chamber and the external world
Pressure is identical, improves the accuracy of Silicon pressure chip 41.
The working principle of the invention: so that the resistance in Silicon pressure chip 41 causes to form with 12 deformation of metallic membrane
Piezoresistive effect occurs for four resistance of Wheatstone bridge 5, can generate one under the action of driving voltage and linearly close with pressure
The millivolt level voltage output signal of system, so that diesel pressure is become electricity output, the electric quantity signal of output is millivolt signal,
Through the integrated amplifier in oversampling circuit ,+1V~+4V standard voltage signal is converted a signal into, ECU is finally transferred to.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations;To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement;And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (8)
1. a kind of high-pressure common-rail pressure sensor, which is characterized in that include matrix (1), shell (2) and electrical plug (3), institute
It states matrix (1) to be provided with oil pressure chamber (11) along the center line of itself, one end that described matrix (1) is located in oil pressure chamber (11) is set
It is equipped with integrally formed metallic membrane (12), the shell (2) is socketed on matrix (1), is equipped with pedestal in the shell (2)
(4), one end of the pedestal (4) is mounted on one end where the metallic membrane (12) of matrix (1), setting in the pedestal (4)
There is the Silicon pressure chip (41) being bonded on metallic membrane (12), the Silicon pressure chip (41) is connected with circuit board (42), institute
It states and is provided with insulating glass layer between Silicon pressure chip (41) and metallic membrane (12), the circuit board (42) passes through pin set
(43) it is electrically connected with electrical plug (3), adding on the Silicon pressure chip (41) is having vacuum protection cover.
2. a kind of high-pressure common-rail pressure sensor according to claim 1, which is characterized in that the Silicon pressure chip (41)
By high temperature sintering, the front circuit of the circuit board (42) is Wheatstone bridge (5), several sections of Wheatstone bridge (5)
Point is electrically connected with low-pass filter circuit (6).
3. a kind of high-pressure common-rail pressure sensor according to claim 2, which is characterized in that the Silicon pressure chip (41)
Sintering range is 400 degree~600 degree, and Silicon pressure chip (41) uses SOI substrate pressure chip, the Silicon pressure chip
(41) resistance in is separated by silica.
4. a kind of high-pressure common-rail pressure sensor according to claim 1, which is characterized in that described matrix (1) is close to gold
The one end for belonging to diaphragm (12) is provided with annular groove (13), and the shell (2) includes the connection circle being welded in annular groove (13)
Disk (21) and shell (22), the edge of the clutch disk (21) are provided with external screw thread, setting on the inside of described shell (22) one end
There is the internal screw thread being threadedly coupled with external screw thread.
5. a kind of high-pressure common-rail pressure sensor according to claim 4, which is characterized in that the middle section of the pedestal (4)
It is clamped with the other end of shell (22), pedestal (4) is provided with close to metallic membrane (12) one end for avoiding circuit board (42)
Groove (44), one end fits one closed cavity of formation of the groove (44) and matrix (1), the clutch disk (21) is rank
Sealing ring is arranged in scalariform and clutch disk (21), the position that the middle section and shell (22) of the pedestal (4) are clamped is located at outer
Sealing ring is also equipped on the inside of shell (22).
6. a kind of high-pressure common-rail pressure sensor according to claim 1, which is characterized in that also set in the groove (44)
Several temperature measurement modules (9) are equipped with, the temperature measurement module (9) includes to be bonded in the thermistor (7) of matrix (1) one end and survey
Circuit temperature plate (42).
7. a kind of high-pressure common-rail pressure sensor according to claim 6, which is characterized in that the pin set (43) includes
There are grounding pin ,+5V pin and signal pins, the temperature measuring circuit board (42) includes grounding pin ,+5V pin and signal
The grounding pin of pin, the circuit board (42) merges with the grounding pin of temperature measuring circuit board (42).
8. a kind of high-pressure common-rail pressure sensor according to claim 7, which is characterized in that the pedestal (4) is provided with
It is connected to cavity and extraneous pressure compensation opening (45).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910358465.7A CN109990942A (en) | 2019-04-30 | 2019-04-30 | A kind of high-pressure common-rail pressure sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910358465.7A CN109990942A (en) | 2019-04-30 | 2019-04-30 | A kind of high-pressure common-rail pressure sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109990942A true CN109990942A (en) | 2019-07-09 |
Family
ID=67135573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910358465.7A Pending CN109990942A (en) | 2019-04-30 | 2019-04-30 | A kind of high-pressure common-rail pressure sensor |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109990942A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111982332A (en) * | 2020-07-15 | 2020-11-24 | 东风电驱动系统有限公司 | Common rail pressure and temperature sensor of diesel engine |
CN115014440A (en) * | 2022-06-10 | 2022-09-06 | 广东科源电气股份有限公司 | Oil-immersed transformer state monitoring device |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06148016A (en) * | 1992-11-05 | 1994-05-27 | Tokin Corp | Capacitive pressure sensor |
CN102023066A (en) * | 2010-05-31 | 2011-04-20 | 昆山双桥传感器测控技术有限公司 | Universal pressure sensor of automobile |
CN102661822A (en) * | 2012-04-28 | 2012-09-12 | 无锡永阳电子科技有限公司 | Silicon strain foil metallic packaging sensor |
CN204128731U (en) * | 2014-09-26 | 2015-01-28 | 深圳瑞德感知科技有限公司 | A kind of MEMS oil-filled pressure transducer |
CN105973525A (en) * | 2015-10-14 | 2016-09-28 | 北京强度环境研究所 | High-reliability piezoresistive pressure sensor |
JPWO2017073274A1 (en) * | 2015-10-28 | 2018-08-09 | 日立オートモティブシステムズ株式会社 | Pressure detection device |
-
2019
- 2019-04-30 CN CN201910358465.7A patent/CN109990942A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06148016A (en) * | 1992-11-05 | 1994-05-27 | Tokin Corp | Capacitive pressure sensor |
CN102023066A (en) * | 2010-05-31 | 2011-04-20 | 昆山双桥传感器测控技术有限公司 | Universal pressure sensor of automobile |
CN102661822A (en) * | 2012-04-28 | 2012-09-12 | 无锡永阳电子科技有限公司 | Silicon strain foil metallic packaging sensor |
CN204128731U (en) * | 2014-09-26 | 2015-01-28 | 深圳瑞德感知科技有限公司 | A kind of MEMS oil-filled pressure transducer |
CN105973525A (en) * | 2015-10-14 | 2016-09-28 | 北京强度环境研究所 | High-reliability piezoresistive pressure sensor |
JPWO2017073274A1 (en) * | 2015-10-28 | 2018-08-09 | 日立オートモティブシステムズ株式会社 | Pressure detection device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111982332A (en) * | 2020-07-15 | 2020-11-24 | 东风电驱动系统有限公司 | Common rail pressure and temperature sensor of diesel engine |
CN115014440A (en) * | 2022-06-10 | 2022-09-06 | 广东科源电气股份有限公司 | Oil-immersed transformer state monitoring device |
CN115014440B (en) * | 2022-06-10 | 2024-01-05 | 广东科源电气股份有限公司 | Oil immersed transformer state monitoring device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6130598B2 (en) | Mechanical quantity measuring device and pressure sensor using the same | |
EP2568270B1 (en) | Packaged sensor with multiple sensors elements | |
CN103558415B (en) | With the mems accelerometer of temperature-compensating | |
CN105466625B (en) | Physical amount measuring device | |
EP2012097B1 (en) | Intake air mass flow measurement device | |
US20060037404A1 (en) | Humidity sensor and composite sensor having humidity detecting function | |
CN105547126A (en) | Eddy current displacement sensor | |
JP6371012B2 (en) | Mechanical quantity measuring device and pressure sensor using the same | |
CN109990942A (en) | A kind of high-pressure common-rail pressure sensor | |
WO2021027847A1 (en) | Pressure sensor | |
US20160153861A1 (en) | Device for detecting the combution chamber pressure in an internal combustion engine | |
CN209166695U (en) | A kind of three backup pressure sensors | |
US20140366614A1 (en) | Sensor for Detecting the Mass Flow Rate and the Temperature of a Fluid Flow | |
CN108089027A (en) | Sensor and navigation attitude instrument based on MEMS capacitive micro-acceleration gauge | |
US8549914B2 (en) | Sensor structure | |
CN105044439A (en) | Tunnel magnetoresistance current sensor | |
CN202814504U (en) | Oil level sensor based on magnetoresistive effect | |
CN209605999U (en) | A kind of high-pressure common rail sensor for capableing of electromagnetism interference | |
JP5672138B2 (en) | Fuel injection device | |
CN210625922U (en) | Pressure sensor | |
US20180274964A1 (en) | Physical quantity sensor subassembly and physical quantity measuring device | |
CN102384810A (en) | Pressure transmitter | |
US8365605B2 (en) | Jointless pressure sensor port | |
WO2015033669A1 (en) | Mechanical quantity measuring device and pressure sensor using same | |
JP5652318B2 (en) | Sensor module |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190709 |