KR100778989B1 - Water-dispersible resin composition for use in boring hole in printed wiring board, sheet comprising the composition, and method for boring hole in printed wiring board using the sheet - Google Patents

Abstract

The present invention provides a water dispersible resin composition for punching a printed wiring board having excellent processing position precision and plating adhesion at the time of punching a printed wiring board, a sheet for drilling using the same, and a method for punching a printed wiring board using the sheet. A water-dispersible resin composition for punching a printed wiring board containing a water-soluble polymer (A) and a polymer compound (B) containing a compound represented by the following formula (1) as a copolymer as a monomer, a sheet for drilling from the composition, and such a punch A method of perforating a printed wiring board using a sheet.

Formula 1

Wherein R is hydrogen or a methyl group and n is an integer from 10 to 22.

Printed wiring board, perforation, precision of processing position, plating adhesion, water dispersible resin composition

Description

Water dispersible resin composition for use in boring hole in printed wiring board, sheet comprising the composition, and method for boring hole in printed wiring board using the sheet}

The present invention relates to a water dispersible resin composition for punching a printed wiring board, which is useful for hole-hole processing for forming a through-hole in a laminated board such as a multilayer printed wiring board, a sheet made of the composition, and such a sheet. It relates to a punching method of the printed wiring board used.

In the punching process for forming the through hole in a laminated substrate such as a printed wiring board, when the hole diameter is large, the drilling is performed by directly drilling the substrate. However, in the case of a general-purpose substrate having a small hole diameter, it is generally used on the substrate. Metal thin films, such as aluminum foil, and various water-soluble compound layers are arrange | positioned, and is made through a drill, an auger, or a puncher.

In the above method, the use of the water-soluble compound film prevents the deviation of the drill bit caused by the unevenness of the substrate surface, accurately sets the drill line end portion at the target through-hole portion, and ultimately secures the machining position accuracy. Used as Further, the use of aluminum foil is the loading of the through-hole part due to the heat generation of the through-hole part generated during the punching together with the prevention of peeling of the copper surface on the substrate and the so-called burr prevention when the drill is pulled out after the completion of the punching of the substrate. In order to avoid the trouble of adhering the cutting residues, through-hole processing is efficiently performed by laminating and using such an aluminum foil / water-soluble compound film. In addition, the water-soluble compound film also has the advantage of being able to be removed from the substrate by washing the substrate after completion of the drilling.

As a well-known document which shows the water-soluble compound used for this purpose, the following documents are mentioned. For example, Japanese Patent Laid-Open No. 4-92488 and Japanese Patent Laid-Open No. 4-92494 disclose the arrangement of polyethylene glycol and polypropylene glycol on one or both surfaces of a substrate. (3) Japanese Laid-Open Patent Publication No. 7-96499 discloses disposing a water-soluble polymer composed of a polyalkylene oxide compound and a polyvalent carboxylic acid and / or a diisocyanate compound. (4) Japanese Laid-Open Patent Publication No. 10-6298 discloses disposing a composition composed of such a water-soluble polymer and a metal compound.

However, in the above-described techniques of ① and ②, stickiness easily occurs on the surface of the water-soluble compound when performing the through-hole drilling operation, and the precision of the processing position of the through-hole portion under watery conditions, especially under high humidity atmosphere, is reduced, Moreover, when using a water-soluble compound in a film form, it has a problem that it is inferior to moldability and it is difficult to shape | mold in a sheet form.                 

Further, even in the above-described techniques of 3 and 4, there is room for improvement in terms of the machining position accuracy in the case where the drill is drilled continuously with a drill having a diameter of 0.15 mm.

Further, any one of the techniques described in (1) to (4) is, of course, improved in plating uniformity, which is one of the more recent high quality requirements, and plating in the through hole.

Disclosure of the Invention

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, as a result of earnestly examining by the present inventors, the water-soluble polymer (A), especially the polyvinyl alcohol-type resin, and the high molecular compound (B) containing the compound represented by following formula (1) as a copolymerization component as a monomer It has been found that the water-dispersible resin composition for perforation of the printed wiring board containing can solve these defects, and has completed the present invention.

(Wherein R is hydrogen or a methyl group and n is an integer from 10 to 22.)

That is, this invention relates to the water-dispersible resin composition for drilling of the printed wiring board containing the water-soluble polymer (A) and the high molecular compound (B) which contains as a monomer the compound represented by following formula (1) as a copolymerization component.

Formula 1

In the above formula, R is hydrogen or a methyl group, n is an integer of 10-22.

It is preferable to contain 10 to 70 weight% of the high molecular compound (B) which contains 30-90 weight% of said water-soluble polymers (A) and the compound represented by the said General formula (1) as a monomer as a copolymerization component.

It is preferable that the said water-soluble polymer (A) is polyvinyl alcohol-type resin.

It is preferable that the hardening degree of the said polyvinyl alcohol-type resin is 65 mol% or more, and the viscosity of 4 weight% aqueous solution is 2.5-100 mPa * s in 20 degreeC.

The present invention also relates to a printed wiring board perforated sheet made of a water dispersible resin composition for printed wiring board perforations.

The present invention also relates to a printed wiring board perforated sheet, comprising a laminate of a water-dispersible resin composition for punching a printed wiring board on a substrate.

The present invention also relates to a method of punching a printed wiring board, wherein the sheet is disposed on the printed wiring board and the substrate is drilled with a drill.

The present invention also relates to a method for punching a printed wiring board, wherein the sheet is arranged so that the substrate surface is in contact with the printed wiring board surface and drilled to the substrate by a drill.

Best Mode for Carrying Out the Invention

The water dispersible resin composition for punching the printed wiring board of the present invention will be described.

The water-dispersible resin composition of this invention mix | blends the high molecular compound (B) which contains the compound represented by the said General formula (1) as a monomer as a water-soluble polymer (A) and a copolymerization component.

As such a water-soluble polymer (A), polyvinyl alcohol-type resin, polyalkylene glycol, starch, sodium polyacrylate, cellulose derivative, casein, sodium alginate, pectin, polyacrylamide, polyethyleneimine, polyethylene oxide, polyvinylpyrrolidone Etc. are illustrated. Especially, polyvinyl alcohol-type resin is preferable at the point which the precision of the processing position at the time of drill drilling is favorable. Hereinafter, the case where polyvinyl alcohol-type resin is used is demonstrated.

As such polyvinyl alcohol-type resin, any of polyvinyl alcohol and modified polyvinyl alcohol may be sufficient, The said polyvinyl alcohol is manufactured by homopolymerizing vinyl acetate and hardening it further. In addition, the modified polyvinyl alcohol is prepared by curing a polymer of vinyl acetate and other unsaturated monomers, or is prepared by post-modifying polyvinyl alcohol.

Examples of the other unsaturated monomers include olefins such as ethylene, propylene, isobutylene, α-octene, α-dodecene and α-octadecene, acrylic acid, methacrylic acid, crotonic acid, maleic acid, maleic anhydride, and ita. Unsaturated acids such as choline acid or salts thereof, or mono or dialkyl esters, such as acrylonitrile and methacrylonitrile, and amides such as acrylamide and methacrylamide, ethylene sulfonic acid, aryl sulfonic acid and metaaryl sulfonic acid. Olefin sulfonic acids or salts thereof, alkyl vinyl ethers, N-acrylamide methyl trimethyl ammonium chloride, aryl trimethyl ammonium chloride, dimethyl aryl vinyl ketone, N-vinylpyrrolidone, vinyl chloride, vinylidene chloride, polyoxyethylene ( Polyoxyalkylene (meth) aryl ethers such as meta) aryl ether and polyoxypropylene (meth) aryl ether, polyoxyethylene (meth) acrylate, poly Polyoxyalkylene (meth) acrylamide, such as polyoxyalkylene (meth) acrylate, polyoxyethylene (meth) acrylamide, polyoxypropylene (meth) acrylamide, such as oxypropylene (meth) acrylate, and polyoxy Ethylene (1- (meth) acryl amide-1,1-dimethylpropyl) ester, polyoxyethylene vinyl ether, polyoxypropylene vinyl ether, polyoxyethylene arylamine, polyoxypropylene arylamine, polyoxyethylene vinyl amine, poly Oxypropylene vinylamine, etc. are mentioned. Among these, ethylene is preferable at the point which hardens easily.

Moreover, as a postmodification method, the method of acetoacetic esterification, acetalization, urethaneization, etherification, grafting, phosphoric acid esterification, oxyalkyleneization, etc. are mentioned.

Among such polyvinyl alcohol-based resins, those having a degree of curing of 65 mol% or more are preferable, and further 70 to 100 mol%, particularly preferably 75 to 99 mol% are advantageous. If the degree of curing is less than 65 mol%, an effort is required for removal by washing with water after drilling, which is not preferable.                 

Further, the viscosity of the 4 wt% aqueous solution is preferably 2.5 to 100 mPa · s at 20 ° C, more preferably 2.5 to 70 mPa · s, particularly 2.5 to 60 mPa · s. When the said viscosity is less than 2.5 mPa * s, when the water-dispersible resin composition of this invention is used in the shape of a film, intensity | strength may fall and breakage of a film may occur at the time of drilling. On the other hand, when it exceeds 100 mPa * s, there exists a tendency for the film forming property to a film or a sheet to fall. In addition, the said viscosity is measured according to JISK6726.

The high molecular compound (B) in the water-soluble resin composition of this invention is demonstrated.

The polymer compound (B) is a copolymer of a compound represented by the following formula (1) with another compound.

Formula 1

In the above formula, R is hydrogen or a methyl group, n is an integer of 10-22.

Although n of the said Formula (1) is 10-22, Preferably it is 15-20, The polymer compound obtained by copolymerizing this compound of n or less is inferior to moldability, On the contrary, in 23 or more, it is water-soluble with the said polymeric compound (B). Low compatibility with the polymer (A) is not preferred.

Specific examples of the compound represented by the formula (1) include stearyl (meth) acrylate, pentadeca (meth) acrylate, palmityl (meth) acrylate, heptadecane (meth) acrylate, and the like. Among these, stearyl (meth) acrylate is preferable at the point of normal temperature crystallinity and high temperature liquefaction fluidity.

In addition, it is not specifically limited as another compound copolymerized with the compound represented by the said General formula (1). Especially, an acryl-type compound is preferable at the point of stability at the time of crystallization, As a specific example, (meth) acrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, and butyl (meth) Acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, hydroxyethyl (meth) Acrylate, hydroxypropyl (meth) acrylate, glycidyl (meth) acrylate, etc. are illustrated. Among these, acrylic acid is preferable at the point of washing property after a punching process.

In obtaining this polymer compound (B) in this invention, it is preferable to make the copolymerization ratio of the compound represented by the said Formula (1) and another compound into the range of 50/50-95/5 (weight ratio), and further 70 / It is the range of 30-90 / 10. If the copolymerization ratio is less than 50/50, reversibility may be lowered when the composition of the present invention is left in a sheet form for a long time, and plating adhesion may be lowered when punctured using the composition. When it exceeds 95/5, there exists a tendency for a gel-like thing to precipitate in a sheet at the time of preservation of a sheet for a perforation.

Copolymerization is usually carried out by solution polymerization, and the obtained high molecular compound (B) may be used as it is, but usually the resin concentration is adjusted and used.                 

As a weight average molecular weight of a high molecular compound (B), it is preferable that it is 1,000-200,000, More preferably, it is 3,000-100,000. If the weight average molecular weight is less than 1,000, the compatibility with the water-soluble polymer (A) may be inferior. If the weight average molecular weight is more than 200,000, the reversibility may decrease when the perforated sheet is produced and left for a long time, which is not preferable.

The commercial item of the said high molecular compound (B) may be provided as a solvent solution, As these, "Banaresin 2203" and "Banaresin 2205" by Shin-Nakamura Chemical Co., Ltd. which are solvent solutions of a stearyl methacrylate / acrylic acid copolymer, "Banaresin 2206", "Banaresin 2207", etc. are mentioned.

About the compounding quantity of the water-soluble polymer (A) and high molecular compound (B) in the water-dispersible resin composition of this invention, the compounding quantity of (A) becomes like this. Preferably it is 30 to 90 weight%, More preferably, it is 30 to 70 weight %, And the compounding quantity of (B) becomes like this. Preferably it is 10-70 weight%, More preferably, it is 30-70 weight%. When the compounding quantity of water-soluble polymer (A) is less than 30 weight%, or when a high molecular compound (B) exceeds 70 weight%, there exists a tendency for the dispersibility of water-dispersible resin composition to fall. When the compounding quantity of a water-soluble polymer (A) exceeds 90 weight%, or when the compounding quantity of a high molecular compound (B) is less than 10 weight%, a drill may lose | delet when carrying out a hole drilling continuously under high humidity.

To the water-dispersible resin composition of the present invention, known additives such as metal powders and inorganic powders may be added to the water-dispersible resin composition as necessary, in addition to stabilizers such as lubricants such as nonionic surfactants, waterproofing agents, and phosphate esters.                 

When using the water-dispersible resin composition of this invention as a printed wiring board perforation sheet (henceforth a perforation sheet), a water-dispersible resin composition as a single film or sheet, or as a laminated sheet which laminated the said composition on the base material Among them, a laminated sheet is preferable in practical use.

The sheet for drilling of this invention is manufactured by the following method, for example.

First, 5-20 weight% aqueous solution of the said water-soluble polymer (A) is prepared. Since the high molecular compound (B) is not soluble in water and soluble in a solvent, the copolymerization reaction solution is used as it is or as appropriate, the resin concentration is adjusted and used as a 30 to 70 wt% solvent solution. The aqueous solution of such a water-soluble polymer (A) and the solvent solution of the polymer compound (B) are dispersed with a stirrer or the like, and the dispersion is adjusted so as to fall within the range of the above-described compounding ratio. As for solid content at this time, 10-40 weight% is preferable. When this solid content is less than 10 weight%, there exists a tendency for film thickness to become defective at the time of film formation, and when it exceeds 40 weight%, there exists a tendency for mixing dispersion defect.

In order to make this dispersion liquid into a single film or sheet | seat, general film forming means, such as the solution softening method, the melt extrusion method in T-dyne inflation, or the calendering method, may be employ | adopted. As thickness of such a perforation sheet, it is preferable to set in 60-1,000 micrometers.

It is preferable to adjust so that the moisture content of the sheet | seat for a perforation obtained by the said method may be 1 to 10 weight%, More preferably, 1 to 7 weight% is preferable.

If the moisture content is less than 1% by weight, cracks are likely to occur at the time of forming the sheet or film, and if it exceeds 10% by weight, the film peelability from the molding machine is poor, which is not preferable. Moreover, although the sheet | seat may contain the solvent used at the time of copolymerization of a high molecular compound (B) a little in this sheet, it is preferable that there are few solvents as much as possible.

When using as a laminated sheet, although it does not specifically limit as a base material, The plastic film and plastic sheet which consist of plastics, such as metal foil, polyethylene terephthalate, cellulose triacetate, polyvinyl alcohol, polystyrene, and polypropylene, are mentioned. Among these, metal foil is preferable at the point of the positional accuracy of a perforation, and the burr prevention of the laminated board with copper, and metal foil, such as aluminum, zinc, iron, is mentioned as this metal foil. As for the thickness of a base material, 50-300 micrometers is preferable normally, More preferably, it is set to 100-250 micrometers. When the thickness of this base material is less than 50 micrometers, there exists a tendency for the curvature according to the stress of the resin film formed on the base material to become large, and when it exceeds 300 micrometers, the load to a drill becomes large and the drill working life tends to become short.

It is preferable to set the thickness of the water dispersible resin composition layer in the said laminated sheet to the range of 10-700 micrometers. In this laminated sheet, when the thickness of the water dispersible resin composition layer is less than 10 µm, the lubricity component given to the drill tends to decrease, and when it exceeds 700 µm, the resin to the drill (base resin, resin of copper-clad laminate) ) Tends to become larger. Although the thickness of the whole sheet for drilling is not specifically limited, It sets to the range of 60-1,000 micrometers.

The laminated sheet is obtained by laminating a water-soluble resin composition on a substrate such as a metal foil, a plastic film, or a plastic sheet. Specifically, the water-soluble polymer (A) is dissolved in water, and a solvent solution of the polymer compound (B) is further added thereto. The dispersion was added and dispersed, and the obtained dispersion was coated on the surface of the substrate, and then, the medium was removed at a temperature of 40 to 100 ° C. to form a water dispersible resin composition layer, or the above water dispersible resin composition alone on the substrate. It is produced by laminating the produced film or sheet by thermal compression method or dry lamination method.

The method of punching the printed wiring board using the punching sheet is performed as follows.

First, a printed wiring board to be used is a substrate in which a metal foil such as copper and an electric insulator are laminated and integrated, for example, a metal thin laminate board such as an epoxy substrate having a metal foil disposed on an outer layer, and a multilayer having a printed wiring circuit on an inner layer. The laminated board, the metal foil laminated board which has a printed wiring circuit in an inner layer, and a metal foil plastic film are mentioned.

The perforated sheet of the present invention is disposed on one or both sides of the substrate, and through the sheet, a through hole having a predetermined size is drilled at a predetermined position of the printed wiring board by a drill or a drill.

In the case where the perforated sheet is a laminated sheet, it is preferable to arrange such that the substrate surface and the printed wiring board surface of the sheet are in contact with each other in order to increase the accuracy of the machining position.

In addition, it is also possible to laminate a plurality of printed wiring boards and perforate at the same time. In this case, the perforated sheet of the present invention (the film or the sheet of the water dispersible resin composition alone) between the uppermost substrate upper surface and each of the substrates. Or a laminated sheet obtained by laminating the composition on a substrate).                 

In addition, the perforated sheet of the present invention may be adhesively applied to the sheet surface in order to prevent lateral rolling between the printed wiring boards during use, or each of the printed wiring boards polymerized prior to dissolution removal by water after perforation. Release processing may be performed for ease of separation at the time of separation.

Further, in order to improve the accuracy of the machining position, satin processing and embossing may be performed on one or both sides of the sheet, and irregularities may be formed on the sheet surface. As the concave-convex shape, lattice shape, hardwood shape, patten shape and rhombus shape can be given. In the case of satin processing, it is practical to make the surface roughness (measured with a laser microscope) of about 1 to 5 µm and the uneven processing to a depth of about 1 to 5 µm (measured by JIS B 0601) at 200 mesh or less.

Hereinafter, the present invention will be described in more detail with reference to Examples, but these Examples do not limit the scope of the present invention.

In addition, "%" and "part" in an example mean a basis of weight unless there is particular notice.

Example 1

11 parts of polyvinyl alcohol-type resins ("Kosenor KM-11" of Nihon Kosei Chemical Co., Ltd. product) of 13 mPa * s were melt | dissolved in 59 parts of water in the viscosity of 78 mol% of hardening degree, and a 4% aqueous solution. 55% toluene / isopropanol (weight ratio 7/3) solution of a copolymer of stearyl methacrylate / acrylic acid (copolymer ratio 85/15) having a weight average molecular weight of 20,000 in the aqueous solution [Banaresin 2206, manufactured by Shin-Nakamura Chemical Co., Ltd.] 30 The part (copolymer content 16.5 parts) was mixed with stirring, and 100 parts of dispersion (solid content 27.5 parts) of water dispersion resin composition were obtained.

The dispersion was coated on an aluminum foil having a thickness of 100 μm using an 35 mil applicator, and dried at 65 ° C. for 96 hours to form a coating film having a thickness of 160 μm, thereby obtaining a sheet for drilling. Toluene and isopropanol were not contained in the water-dispersible resin composition layer of the said sheet | seat, and the moisture content of the sheet was 2%.

Subsequently, two sheets of printed wiring boards having a total thickness of 0.4 mm, in which a copper foil having a thickness of 18 µm was laminated on both sides, were laminated, and the sheet for perforation was placed so that the aluminum foil was in contact with the copper surface. The through hole of 1000 holes penetrated two board | substrates with the drill of 0.15 mm (phi) below. The precision of the processing position of a through hole and plating adhesion were evaluated about the obtained punched board | substrate as follows.

(Processing position precision)

The center of a hole is measured, and the jungle with a predetermined position is measured by a digital measuring instrument ("DR-555-D" by Dainippon Screen Co., Ltd.), and the average value of the 1st, 2nd 500th, and 1,000th holes of the first and second sheets is measured. Was calculated, the standard deviation σ was calculated, the (average value + 3σ) value was calculated, and evaluated as follows.

◎…. Less than 15% of drill diameter

○…. Less than 15-20% of drill diameter

Δ. Less than 20-30% of drill diameter

×… 30% or more of drill diameter                 

(Plating Adhesion)

Copper plating (plating bath: "Kappa figure 125" by Meltex Corporation) was attached to the perforated substrate, and the cross sections of the 750th and 1,000th holes of the first and second sheets of the substrate were confirmed and evaluated as follows.

○…. Copper plating of all holes is uniformly attached.

Δ. The uniformity of copper plating of any one hole is poor.

×… The uniformity of copper plating of two or more holes is poor.

Example 2

Instead of the polyvinyl alcohol-based resin used in Example 1, the water-dispersible resin composition in the same manner as in Example 1 except that a polyvinyl alcohol-based resin having a curing degree of 75 mol% and a 4% aqueous solution viscosity of 7 mPa · s at 20 ° C and Perforated sheets were prepared and evaluated in the same manner.

Example 3

Instead of the polyvinyl alcohol-based resin used in Example 1, the water-dispersible resin composition in the same manner as in Example 1 except that a polyvinyl alcohol-based resin having a curing degree of 88 mol% and a 4% aqueous solution viscosity of 52 mPa · s at 20 ° C and Perforated sheets were prepared and evaluated in the same manner.

Example 4

A water-dispersible resin composition and a sheet for punching were prepared in the same manner as in Example 1 except that instead of the polyvinyl alcohol-based resin used in Example 1, polyethylene glycol having a weight average molecular weight of 20,000 (`` PEG20000 manufactured by Kishida Chemical Co., Ltd.) was used. Was evaluated.

Example 5

55% toluene / isopropanol (weight ratio 7 /) of a copolymer of stearyl methacrylate / acrylic acid (copolymerization ratio 90/10) having a weight average molecular weight of 17,000 instead of “Banaresin 2206” manufactured by Shin-Nakamura Chemical Co., Ltd. used in Example 1 3) A water-dispersible resin composition and a sheet for punching were prepared and evaluated in the same manner as in Example 1, except that the solution was changed to "Banaresin 2203" manufactured by Shin-Nakamura Chemical Company.

Example 6

A water-dispersible resin composition and a sheet for drilling were prepared and evaluated in the same manner as in Example 1 except that the compounding amount of the polyvinyl alcohol-based resin of Example 1 was changed to 22 parts and dissolved in 118 parts of water.

Example 7

The dispersion liquid of the water-dispersible resin composition prepared in Example 1 was poured into a rotating drum of iron adjusted to 93 ° C. to form a film, and dried until no toluene and isopropanol were contained and the water content was 4%. A 240 micrometer perforation sheet was obtained, and this sheet was placed on a substrate in the same manner as in Example 1, and evaluated in the same manner.

Example 8

A perforated sheet was produced and evaluated in the same manner as in Example 1 except that the base material of the aluminum foil having a thickness of 100 μm used in Example 1 was changed to the base material of the polyethylene terephthalate film having a thickness of 30 μm.

Comparative Example 1

Except not having mix | blended the polyvinyl alcohol-type resin aqueous solution of Example 1, the water-dispersible resin composition and the sheet | seat for perforation were produced like Example 1, and it evaluated like Example 1.

The evaluation results of the Examples and Comparative Examples are shown in Table 1 below.

Machining Position Precision Plating adhesion Example 1 ◎ ○ Example 2 ◎ ○ Example 3 ◎ ○ Example 4 ○ ○ Example 5 ◎ ○ Example 6 ◎ ○ Example 7 ◎ ○ Example 8 ◎ ○ Comparative Example 1 ◎ ×

Since the water-dispersible resin composition for drilling a printed wiring board of the present invention contains a water-soluble polymer (A) and a polymer compound (B) containing a specific compound as a copolymerization component, When punching a printed wiring board, the precision of the machining position and the plating adhesion at the time of punching are excellent.

Claims (9)

Water-dispersible resin composition for puncture of a printed wiring board containing 30-90 weight% of water-soluble polymers (A) and 10-70 weight% of polymer compounds (B) which contain as a copolymer a compound represented by following formula (1) as a copolymerization component: Formula 1

In the above formula, R is hydrogen or a methyl group, n is an integer of 10-22. delete The water dispersible resin composition for punching a printed wiring board according to claim 1, wherein the water-soluble polymer (A) is a polyvinyl alcohol-based resin. The water dispersible resin composition for punching a printed wiring board according to claim 3, wherein the polyvinyl alcohol-based resin has a degree of cure of at least 65 mol% and a viscosity of a 4 wt% aqueous solution is 2.5 to 100 mPa · s at 20 ° C. . A sheet for punching a printed wiring board made of the composition according to claim 1. A sheet for punching a printed wiring board, wherein the composition according to claim 1 is laminated on a substrate. A method of punching a printed wiring board, comprising arranging the sheet of claim 5 on the printed wiring board to drill the substrate. A method of punching a printed wiring board, wherein the sheet of claim 6 is disposed on the printed wiring board, and the substrate is drilled with a drill. A method of punching a printed wiring board, comprising arranging the sheet of claim 6 so that the substrate surface is in contact with the printed wiring board surface and punching the substrate.