KR100777649B1 - Laser apparatus for forming pattern on inside of workpiece - Google Patents

Abstract

A laser machining apparatus is provided to make it possible to form predetermined high quality patterns on the inside of a workpiece using a laser beam, and a double laser machining apparatus is provided to reduce production cost and make it possible to reduce a pattern-forming time. A double laser apparatus(200) is characterized in that: the apparatus comprises a laser light source part(210), a beam splitter(240), a first reflection mirror(260), a first lens(250), and a second lens(270); the laser light source part generates a laser beam; the beam splitter divides the generated laser beam into a first laser beam(LS1) and a second laser beam(LS2) to proceed the first laser beam to the first lens and proceed the second laser beam to the reflection mirror; the first reflection mirror reflects the second laser beam to the second lens; and the first and second lenses positioned in one of workpieces(12) to form patterns on the inner surface of the workpiece by projecting the first and second laser beams onto an inner surface of the workpiece.

Description

LASER APPARATUS FOR FORMING PATTERN ON INSIDE OF WORKPIECE

1 is a view illustrating a cylinder block of a general engine and a piston inserted therein.

Figure 2 shows the friction of the piston block bore surface with the honed cylinder block bore.

3 shows the roughness curve and the load curve of the cylinder block bore surface.

4 is a diagram showing the configuration of a laser processing apparatus for forming a fine pattern on the inner surface of the object to be processed according to the first embodiment of the present invention.

5 is a view for explaining the rotational movement of the laser processing apparatus for forming a fine pattern on the inner surface of the object to be processed according to the first embodiment of the present invention.

FIG. 6 is a diagram illustrating vertical movement of a laser processing apparatus for forming a fine pattern on an inner surface of a workpiece according to a first embodiment of the present invention.

7 is a view showing a dual laser processing apparatus according to a second embodiment of the present invention.

8 is a diagram illustrating a detailed structure of a beam expander according to a second embodiment of the present invention.

9 is a view showing a dual laser processing apparatus according to a third embodiment of the present invention.

10 shows a process for generating a laser honing pattern on a cylinder block bore surface.

The present invention relates to a laser processing apparatus, and more particularly, to a laser processing apparatus for performing a fine pattern processing on the inner surface of the object to be processed.

1 is a view illustrating a cylinder block 11 of a general engine and a piston 13 inserted therein.

The engine 10 of FIG. 1 includes a cylinder block 11, a cylinder block bore surface that is a workpiece 12, a piston 13, and a piston ring 14.

The cylinder block 11 consists of the several cylinder in which the piston 13 which reciprocates in the axial direction inside the cylinder block is arrange | positioned.

The piston 13 receives a gas pressure of high temperature and high pressure to reciprocate in the cylinder block to rub against the surface of the cylinder block bore, which is the object to be processed 12.

The piston ring 14 is a ring disposed above the piston. The oil ring prevents oil from entering the combustion chamber from the surface of the cylinder block bore, which is the object to be processed 12, and the compression ring, which prevents the combustion gas from leaking. Ring) The compression ring maintains airtightness during compression and expansion, transfers the high heat received by the piston to the cylinder block, and scrapes off a minimum film of oil to prevent oil from entering the combustion chamber. The oil ring serves to uniformly lubricate oil on the surface of the cylinder block bore, the object to be processed 12, and scrape off excess oil.

2 shows the frictional movement of the honed cylinder block bore surface and the piston ring 14.

When the piston ring 14 rubs against the cylinder bore surface, which is the object to be machined 12 during reciprocating motion, the cylinder bore surface must have a mesh in the form of a mesh with an appropriate angle of intersection. This can move smoothly. Without this mesh, the surface becomes excessively smooth, so that a lubricant film is not formed, which is likely to cause a piston stripping phenomenon. That is, the mesh in the form of a mesh having a suitable pier is called the honing pattern (15), which serves as an oil groove to perform the function of the sump.

The bore surface of today's mainstream Recipro Engine, especially considering tribological performance, especially frictional performance, Proof of Tribology, considering reciprocating sliding with piston 13 / piston ring 14 seizure) performance is important. In consideration of such surface function, an oil groove for performing the function of the sump is formed on the surface of a general cylinder block bore by the method of honing.

Honing is a kind of precision finishing that processes the inner surface of a cylinder. In detail, a honing tool is a tool called a horn, in which an abrasive stick is inserted around the cylinder. It is a method of precision machining by lightly contacting movement. The honing pattern 15 is related to the friction performance and the scissor performance between the piston 13 and the engine cylinder bore surface, which is the object to be processed 12, and therefore has an important influence on the engine performance.

3 shows the roughness curve and the load curve of the cylinder block bore surface.

Surface roughness refers to the degree of minute unevenness occurring on the surface when the metal surface is finished. No matter what method of production is adopted, it is practically impossible to machine geometrically ideal perfect surfaces. Magnified photographs show that the machined surface looks like a mountain with many peaks and valleys. In indicating the degree of roughness, the surface is cut into a plane perpendicular to the workpiece and the cross section shows a curve. A statistical value representing the degree of roughness is called a roughness parameter.

The roughness curve shown in FIG. 3 may distinguish the cross section of the cylinder bore surface by the roughness parameters of peak R _pk , central surface R _k , and valley R _vk .

M _r1 of the load curve of FIG. 3 means the ratio of peak to the entire cylinder bore surface, and M _r2 means the ratio of Valley to the entire cylinder bore surface.

R _pk is the peak of roughness, meaning the highest point of cylinder bore surface roughness. Therefore R _pk Is the most prone to wear when the piston 13 / piston ring 14 reciprocates. R _k is the central portion of the cylinder bore surface roughness, which can be viewed as the average roughness of the entire section. R _vk Is the depth of the valley, which is an indication of the oil groove in which the lubricant is maintained.

Therefore, excessive R _pk or R _vk may adversely affect the frictional motion of the piston and the engine cylinder bore surface, it can be seen the importance of the honing processing technology for processing the cylinder bore surface.

Conventional honing processing method has a problem that it is difficult to form a certain quality machining pattern due to the wear of the grindstone during cutting and grinding because the inner diameter machining using a grindstone. In addition, there is a problem that the maintenance cost increases because the grinding wheel must be replaced frequently.

U.S. Patent No. 5,441,439 discloses a method of honing a workpiece surface using a laser. U.S. Patent No. 5,441,439 describes a honing process in which a first step of honing is performed to form a minimum roughness on a workpiece surface, and a second step is to form grooves at regular intervals using a laser on a surface of a workpiece on which a minimum roughness is formed. Is starting.

However, U. S. Patent No. 5,441, 439 only introduces a process for performing honing processing using a laser, and does not disclose any specific configuration of a laser apparatus capable of efficiently performing such honing processing.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and a technical object of the present invention is to provide a laser processing apparatus capable of forming a certain high quality processing pattern on the inner surface of a processing object using a laser beam.

Another object of the present invention is to provide a dual laser processing apparatus that can reduce production costs and shorten the pattern forming work time.

As a technical means for achieving the above object, according to the first aspect of the present invention, in a dual laser processing apparatus, the apparatus includes a laser light source unit, a beam splitter, a first reflective mirror, a first lens and a second lens. The laser light source unit generates a laser beam, and the beam splitter separates the generated laser beam into a first laser beam and a second laser beam, and the first laser beam travels to the first lens, and The second laser beam is directed to the reflective mirror, the first reflective mirror reflects the second laser beam to the second lens, and the first lens and the second lens are the first laser beam and the first lens. Provided is a dual laser processing apparatus for performing pattern processing by injecting two laser beams into the inner surface of a workpiece, respectively.

According to a second aspect of the present invention, in a dual laser processing apparatus, the apparatus includes a laser light source unit, a beam splitter, a first reflecting mirror, a second reflecting mirror, a third reflecting mirror, a first lens, and a second lens. The laser light source unit generates a laser beam, and the beam splitter separates the generated laser beam into a first laser beam and a second laser beam, and the first laser beam proceeds to the first reflection mirror, The second laser beam proceeds to the third reflecting mirror, the first reflecting mirror reflects the first laser beam to the second reflecting mirror, and the second reflecting mirror is reflected by the first reflecting mirror Reflects a first laser beam to the first lens, the third reflecting mirror reflects the second laser beam to the second lens, and the first lens and the second lens are the first lens Provided is a dual laser processing apparatus for performing pattern processing by injecting a laser beam and the second laser beam into the inner surface of a workpiece, respectively.

According to a third aspect of the present invention, there is provided a method of honing an inner surface of a cylindrical workpiece, comprising: a first step of performing a rough honing process, a second step of performing an intermediate finish honing process, and dual laser processing A honing machining method is provided, comprising a third step of performing laser microgrooves using an apparatus and a fourth step of performing a final finishing honing process.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a part is "connected" to another part, this includes not only "directly connected" but also "electrically connected" with another element in between. . In addition, when a part is said to "include" a certain component, which means that it may further include other components, except to exclude other components unless otherwise stated.

Laser processing apparatus according to an embodiment of the present invention is preferably used for processing the inner surface of the object having a cylindrical shape, but is not necessarily limited to this, if necessary, the inner surface of the object having a shape other than the cylindrical. It can also be used for processing.

4 is a diagram showing the configuration of the laser processing apparatus 100 for forming a fine pattern on the inner surface of the object to be processed according to the first embodiment of the present invention.

The laser processing apparatus 100 according to the first embodiment of the present invention includes a laser light source unit 110, a first reflection mirror 120, a focusing lens 130, and a second reflection mirror 140.

The laser light source unit 110 generates and supplies a laser beam. For example, an Nd: YAG or Nd: YVO 4 laser source is provided to generate a CW wave laser beam having a wavelength of 1064 nm, and further includes a Q switch element to generate a pulse wave. wave) may be generated. The laser beam generated by the laser light source unit 110 is incident to the first reflection mirror 120.

The first reflection mirror 120 may be installed at a position for changing the traveling direction of the laser beam to control the traveling direction change angle. The first reflection mirror 120 changes the traveling direction of the laser beam supplied from the laser light source unit 110 to the focusing lens 130.

The focusing lens 130 is installed to control the path length X + Y until the laser beam is scanned on the object to be processed. In this case, an auto focusing function through motor control may adjust a path length X + Y until the laser beam is scanned from the focusing lens 130 to the processing object. The laser beam passes through the focusing lens 130 and enters the second reflection mirror 140.

The second reflection mirror 140 is installed so that the laser beam passing through the focusing lens 130 is scanned on the surface of the object to be processed. The laser beam incident on the second reflection mirror 140 is scanned on the inner surface of the cylinder to perform fine pattern processing.

In order to perform a predetermined pattern processing on the entire inner surface of the cylinder, the cylinder itself, which is the object to be processed, may be moved up and down, or the moving part R including the focusing lens 130 and the second reflection mirror 140 may be vertically moved. And rotational movement. If the range of the movement is not large and the path length error of the laser beam to be scanned is acceptable, the moving part R may include only the second reflection mirror 140. Alternatively, the cylindrical inner surface and the moving part R may select one of the vertical movement and the rotational movement, respectively.

5 is a view for explaining the rotational movement of the laser processing apparatus 100 for forming a fine pattern on the inner surface of the object to be processed according to the first embodiment of the present invention.

  When the moving part R of the laser processing apparatus 100 rotates 360 degrees with respect to the axis in the cylinder, the laser beam 111 whose direction of travel is changed by the second reflection mirror 140 rotates the moving part R. Because of this, because it is scanned on the inner surface of the workpiece 12 while rotating 360 ° around the axis, it is possible to form a fine pattern on the entire circumference of the cylindrical inner surface of a certain height.

In addition, the same effect can also be acquired by fixing the moving part R and rotating the object 12 by 360 degree as mentioned above.

6 is a diagram illustrating a vertical movement of the laser processing apparatus 100 that forms a fine pattern on the inner surface of the object to be processed according to the first embodiment of the present invention.

In FIG. 6, the moving part R is illustrated to include only the second reflective mirror 140, but may also include the focusing lens 130 as described above.

The moving part R moves up and down in the cylinder to adjust the height of the spot SP of the laser beam 111 to a constant height of the inner surface of the cylinder to be subjected to the fine pattern processing. Since the laser beam 111 to be scanned also moves up and down due to the vertical movement of the moving part R, pattern processing using the laser beam 111 may be performed on the entire height of the inner surface of the cylinder.

 The moving unit R performs a fine pattern processing while rotating the entire circumference of a predetermined height 360 degrees with respect to the axis within the cylindrical inner surface, and then moves up and down to a higher or lower height than the predetermined height. In other words, after the laser beam 111 performs the fine pattern processing on the entire unprocessed circumference of the predetermined height of the inner surface of the cylinder, the laser beam 111 moves up and down to the unprocessed height higher or lower than the predetermined height.

The laser processing apparatus 100 may perform fine pattern processing on the entire inner surface of the object to be processed 12 through stepwise repetitive operations of the rotational movement and the vertical movement of the moving part R. FIG.

In addition, by performing the combination of the above-described rotational movement and vertical movement of the cylinder, fine pattern processing may be performed on the entire inner surface of the cylinder.

7 is a diagram illustrating a dual laser processing apparatus 200 according to a second embodiment of the present invention.

The dual laser processing apparatus 200 according to the second exemplary embodiment of the present invention may include a laser light source unit 210, a second reflection mirror 220, a beam expander 230, a beam splitter 240, a first lens 250, The first reflection mirror 260 and the second lens 270 are included.

The moving part R1 of the dual laser processing apparatus 200 may include a beam splitter 240, a first lens 250, a first reflection mirror 260, and a second lens 270.

In addition, the dual laser processing apparatus 200 may include a driving unit (not shown) for rotating the moving unit R1 and a driving unit (not shown) for vertically moving the moving unit R1.

The laser light source unit 210 performs a function of supplying a laser beam for laser processing. For example, an Nd: YAG or Nd: YVO 4 laser source is provided to generate a continuous wave laser beam having a wavelength of 1064 nm, and further includes a Q switch element to generate a pulse wave. wave) may be generated. The laser beam generated from the laser light source unit 210 is incident on the second reflection mirror 220.

The second reflection mirror 220 preferably uses a mirror having a reflectance of 100%, and is installed at a position to change the traveling direction of the laser beam to control the angle of changing the traveling direction of the laser beam. The second reflection mirror 220 changes the traveling direction of the laser beam generated from the laser light source unit 210 to the beam expander 230.

The beam expander 230 may control the spot size of the laser beam finally incident on the object by controlling the diameter of the laser beam. The beam expander 230 adjusts the diameter of the laser beam incident from the second reflection mirror 220 to an appropriate size and enters the beam splitter 240 into the beam splitter 240.

The beam splitter 240 reflects a portion of the incident laser beam and transmits the remaining portion, thereby separating the incident laser beam. In the present embodiment, it is preferable that the laser beam is separated at a ratio of 50:50 by using a member having a reflectance and a transmittance of 50% as the beam splitter 240, respectively. The laser beam, the diameter of which is expanded by the beam expander 230, is partially reflected by the beam splitter 240 and proceeds as the first laser beam LS1, and the remaining part of the laser beam passes through the beam splitter 240 to form a first beam. It proceeds as two laser beams LS2. The first laser beam LS1 travels in the direction toward the first lens 250, and the second laser beam LS2 travels in the direction of the first reflection mirror 260.

The first lens 250 is a focusing lens and performs a function of collecting the first laser beam LS1 incident from the beam splitter 240 at the pattern forming portion of the object to be processed. In this way, the portion where the laser beam collected by the focusing lens is formed on the object to be processed is called a spot.

Fine pattern processing is performed on the inner surface of the object 12 using the first laser beam LS1 collected at the first spot SP1 by the first lens 250.

Preferably, the first reflection mirror 260 uses a mirror having a reflectance of 100%, and the traveling direction of the second laser beam LS2 transmitted through the beam splitter 240 is directed toward the second lens 270. Change it.

The second lens 270 is a focusing lens and performs a function of collecting the second laser beam LS2 transmitted through the beam splitter 240 at the pattern forming portion of the object to be processed. Fine pattern processing is performed on the inner surface of the object to be processed 12 by using the second laser beam LS2 collected at the second spot SP2 by the second lens 270.

The drive part (not shown) rotates the moving part R1 360 degrees with respect to the central axis of the object 12 in the object 12. Accordingly, the first laser beam LS1 and the second laser beam LS2 are also rotated 360 ° at a predetermined height in the object 12.

After the laser fine pattern is formed in the entire circumference of the predetermined height of the object 12, the driver (not shown) moves the moving part (not shown) to form the fine pattern around the height higher or lower than the predetermined height of the object 12. Move R1) in the vertical direction. As the moving part R1 moves in the vertical direction, the first laser beam LS1 and the second laser beam LS2 move in the vertical direction, and then, when the moving part R1 is rotated again by 360 °. Due to the lagging, fine pattern processing can be performed around the unprocessed circumference of the object 12.

The dual laser apparatus 200 performs fine precision pattern processing on the entire inner surface of the object 12 while repeatedly rotating and vertically moving as described above.

Meanwhile, as shown in FIG. 7, the first spot SP1 of the first laser beam LS1 and the second spot SP2 of the second laser beam LS2 have different heights in the object 12. Is formed. The height difference h between the first spot SP1 and the second spot SP2 in which the first laser beam LS1 and the second laser beam LS2 perform fine pattern processing is determined by the first lens 250 and the first lens 250. It is equal to the height difference h of the two lenses 270. Therefore, in order to perform fine pattern processing over the entire height of the object 12, it is preferable that the height of the object 12 is 2 * n * h (n is a natural number).

Since the dual laser processing apparatus 200 according to the second exemplary embodiment may simultaneously process circumferences having different heights in the object 12, the machining time may be shortened.

      8 is a diagram illustrating a detailed structure of the beam expander 230 according to the second embodiment of the present invention.

The beam expander 230 includes a first expander lens 231, a second expander lens 232, and a third expander lens 233.

The laser beam reflected by the second reflection mirror 220 includes a first expander lens 231 having a negative refractive index, a second expander lens 232 having a positive refractive index and a negative (-). The light is incident on the beam splitter 240 after passing through the third expander lens 233 having a refractive index of The beam expander 230 moves the first expander lens 231, the second expander lens 232, and the third expander lens 233 up and down to move the distance between the beam expander lenses 231, 232, and 233. By controlling, the diameter of the laser beam incident on the beam expander 231 is controlled.

Up to now, the laser processing apparatus 200 according to the second embodiment of the present invention has been described as including the second reflection mirror 220 and the beam expander 230, but this is only an example and is not necessarily limited thereto. It will be readily understood by those skilled in the art that the second reflective mirror 220 and the beam expander 230 may be omitted in the second embodiment and may be replaced by other components.

In addition, although the driving unit (not shown) has been described as only rotating and moving the moving unit R1 within the object 12, this is only an example and is not necessarily limited thereto, and the driving unit (not shown) is the object to be processed. Direct rotation and vertical movement of 12 are also possible.

9 is a diagram illustrating a dual laser processing apparatus 300 according to a third embodiment of the present invention.

The dual laser processing apparatus 300 of FIG. 9 includes a laser light source unit 310, a fourth reflection mirror 320, a beam expander 330, a beam splitter 340, a first reflection mirror 350, and a second reflection mirror ( 360, a first lens 370, a third reflection mirror 380, and a second lens 390.

The moving part R2 of the dual laser processing apparatus 300 includes a beam splitter 340, a first reflection mirror 350, a second reflection mirror 360, a first lens 370, and a third reflection mirror 380. It may include a second lens 390.

In addition, the dual laser processing apparatus 300 may include a driving unit (not shown) for rotating the moving unit R2 and a driving unit (not shown) for vertically moving the moving unit R2.

The laser light source unit 310 generates and supplies a laser beam. For example, an Nd: YAG or Nd: YVO4 laser source is provided to generate a CW wave laser beam having a wavelength λ of 1064 nm, and further includes a Q switch element to provide a pulse wave. wave) may be generated. The laser beam generated from the laser light source unit 310 is incident to the fourth reflection mirror 320.

The fourth reflection mirror 320 preferably uses a mirror having a reflectance of 100%, and is installed at a position to change the traveling direction of the laser beam to control the angle of change of the traveling direction of the laser beam. Therefore, the traveling direction of the laser beam generated from the laser light source unit 310 is changed to the beam expander 330.

The beam expander 330 may control the spot size of the laser beam finally incident on the object by controlling the diameter of the laser beam. The beam expander 330 adjusts the diameter of the laser beam incident from the fourth reflection mirror 320 to an appropriate size and enters it into the beam splitter 340.

The beam splitter 340 performs a function of separating the incident laser beam by reflecting a portion of the incident laser beam and transmitting a portion of the incident laser beam. In the present embodiment, it is preferable to separate the laser beam at a ratio of 50:50 by using a member having a reflectance and a transmittance of 50% as the beam splitter 340, respectively. The laser beam whose diameter is enlarged by the beam expander 330 is partially reflected by the beam splitter 340 and proceeds as the first laser beam LS11, and the remaining part of the laser beam penetrates the beam splitter 340 to be formed. It proceeds as two laser beams LS12. The first laser beam LS11 proceeds in a direction toward the first reflection mirror 350.

The first reflection mirror 350 preferably uses a mirror having a reflectance of 100%, and directs the traveling direction of the first laser beam LS11 to the second reflection mirror 360.

Preferably, the second reflection mirror 360 also uses a mirror having a reflectance of 100%, and directs the traveling direction of the first laser beam LS11 reflected from the first reflection mirror 350 toward the first lens 370. do.

The first lens 370 serves as a focusing lens and collects the first laser beam LS11 incident from the second reflection mirror 360 at a pattern forming portion of the object to be processed.

Fine pattern processing is performed on the inner surface of the object to be processed 12 using the first laser beam LS11 collected at the first spot SP11 by the first lens 370.

On the other hand, the third reflecting mirror 380 is preferably a mirror having a reflectance of 100%, so that the traveling direction of the second laser beam LS12 transmitted through the beam splitter 340 is directed to the second lens 390. do.

The second lens 390 serves as a focusing lens and collects the second laser beam LS12 incident from the third reflection mirror 380 at a pattern forming portion of the object to be processed.

Fine pattern processing is performed on the inner surface of the object 12 by using the second laser beam LS12 collected at the second spot SP11 by the second lens 390.

The driving unit (not shown) rotates the moving unit R2 in the object 12 with respect to the central axis of the object 12. Accordingly, the first laser beam LS11 and the second laser beam LS12 are also rotated at a predetermined height in the object to be processed 12.

After the laser fine pattern is formed in the entire circumference of the predetermined height of the object 12, the driver (not shown) moves the moving part (not shown) to form the fine pattern around the height higher or lower than the predetermined height of the object 12. R2) is moved in the vertical direction. Due to the movement of the moving part R2 in the up and down direction, the first laser beam LS11 and the second laser beam LS12 move in the up and down direction, and thereafter, the moving object R2 is rotated again so as to be processed. Fine pattern processing can be performed in the raw circumference of (12).

The dual laser processing apparatus 300 performs precision fine pattern processing on the entire inner surface of the object 12 while repeatedly rotating and vertically moving as described above.

Meanwhile, as shown in FIG. 9, the first spot SP11 of the first laser beam LS11 and the second spot SP12 of the second laser beam LS12 according to the third embodiment are the second embodiment. Unlike in, it is formed at substantially the same height within the object 12. Therefore, unlike the second embodiment, the moving part R2 does not need to rotate 360 °, and it is sufficient to rotate 180 °.

Since the dual laser processing apparatus 300 according to the third exemplary embodiment may simultaneously process the same height in the object 12, the laser cutting device 300 may reduce the processing time as well as the height of the object 12. It has an effect.

Up to now, the dual laser processing apparatus 300 according to the third embodiment of the present invention has been described as including the fourth reflection mirror 320 and the beam expander 330, but this is only an example and is not necessarily limited thereto. . It will be readily understood by those skilled in the art that the fourth reflective mirror 320 and the beam expander 330 may be omitted in the third embodiment and may be replaced by other components.

In addition, although the driving unit (not shown) has been described as only rotating and moving the moving unit R2 within the object 12, this is only an example and is not necessarily limited thereto, and the driving unit (not shown) is the object to be processed. Direct rotation and vertical movement of 12 are also possible.

FIG. 10 illustrates a process for generating a laser honing pattern on a cylinder block bore surface in accordance with one embodiment of the present invention.

R _z was used as a parameter indicating the roughness of the cylinder block bore surface. R _z can be expressed, for example, as the distance between two lines parallel to the centerline, passing from the highest peak of the roughness curve to the third peak and from the lowest to the third valley. have.

In step S10, rough honing processing using a grindstone or the like is primarily performed. R _z of the surface of the cylinder block bore after passing through the first step is, for example, 8 to 12 μm.

In step S20, the intermediate finishing honing process is performed secondarily. It can be seen that R _z of the surface of the cylinder block bore after passing through the second step is further refined to, for example, 2 to 15 µm.

In step S30, fine pattern processing is performed on the surface of the silicon block bore, which is the object to be processed 12, using the laser device according to one of the first to third embodiments. The laser processing apparatus can process fine oil grooves on the surface of the cylinder block bore, which is the object to be processed 12, to form a constant oil groove pattern. It is preferable that the width | variety of an oil groove is 40-80 micrometers, and the depth is about 5-25 micrometers, for example.

In step S40, the final finishing honing process is performed. R _z of the surface of the cylinder block bore after passing through the fourth step is, for example, 1 to 2 μm.

Thus, the roughness of the silicon block bore surface is optimized by performing the honing process step by step, and by forming an oil groove on the silicon block bore surface using a laser processing apparatus, it is possible to provide an oil dish having a predetermined shape.

Those skilled in the art will appreciate that the present invention may be embodied in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. The scope of the present invention is indicated by the scope of the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and the equivalent concept are included in the scope of the present invention. Should be interpreted.

As described above, according to the laser processing apparatus according to the present invention, by forming a high-quality processing pattern on the inner surface of the object to be processed using a laser beam, it is possible to facilitate precision fine pattern processing and honing processing Of course, there is an effect that can reduce the production cost.

In addition, there is an effect that the pattern forming operation time can be shortened by using the laser beam in duplicate.

Claims (20)

In the dual laser processing apparatus, The apparatus comprises a laser light source, a beam splitter, a first reflective mirror, a first lens and a second lens, The laser light source unit generates a laser beam, The beam splitter separates the generated laser beam into a first laser beam and a second laser beam, the first laser beam goes to the first lens, and the second laser beam goes to the reflective mirror, The first reflection mirror reflects the second laser beam to the second lens, The first lens and the second lens are located in one interior of the object to be processed, and the laser beam is incident to the first laser beam and the second laser beam on one inner surface of the object to perform pattern processing. Device. The method of claim 1, And a driving unit configured to rotate the beam splitter, the first reflection mirror, the first lens, and the second lens in the processing object with respect to the central axis of the processing object. The method of claim 1, And a driving unit configured to vertically move the beam splitter, the reflection mirror, the first lens, and the second lens in the object to be processed. The method of claim 1, Located between the laser light source and the beam splitter, And a beam expander which controls the diameter of the laser beam generated by the laser light source unit and enters the beam splitter. The method of claim 1, And wherein the first laser beam and the second laser beam are separated by 50:50 by the beam splitter. The method of claim 1, And a second reflecting mirror disposed between the laser light source unit and the beam splitter to reflect the laser beam generated by the laser light source unit to advance to the beam splitter. The method of claim 4, wherein The beam expander includes a first expander lens, a second expander lens, and a third expander lens, and the beam expander controls the diameter of the laser beam, thereby controlling the laser beam incident on the inner surface of the object. Dual laser processing device to control the spot size. The method of claim 1, The dual laser processing apparatus further comprising a drive unit for rotating the object to be processed. The method of claim 1, The dual laser processing apparatus further comprising a drive unit for vertically moving the processing object. The method of claim 1, The first lens and the second lens have a height difference of h, A dual laser processing apparatus, wherein the height of the object is 2 * n * h (n is a natural number). In the dual laser processing apparatus, The apparatus comprises a laser light source, a beam splitter, a first reflective mirror, a second reflective mirror, a third reflective mirror, a first lens and a second lens, The laser light source unit generates a laser beam, The beam splitter separates the generated laser beam into a first laser beam and a second laser beam, the first laser beam goes to the first reflection mirror and the second laser beam goes to the third reflection mirror. , The first reflection mirror reflects the first laser beam to the second reflection mirror, The second reflection mirror reflects the first laser beam reflected by the first reflection mirror to the first lens, The third reflecting mirror reflects the second laser beam to the second lens, The first lens and the second lens are located in one interior of the object to be processed, and the laser beam is incident to the first laser beam and the second laser beam on one inner surface of the object to perform pattern processing. Device. The method of claim 11, A drive unit for rotating the beam splitter, the first reflection mirror, the second reflection mirror, the third reflection mirror, the first lens and the second lens in the object to be processed relative to the central axis of the object to be processed Dual laser processing device included. The method of claim 11, And a driving unit for vertically moving the beam splitter, the first reflection mirror, the second reflection mirror, the third reflection mirror, the first lens, and the second lens in the object to be processed. The method of claim 11, Located between the laser light source and the beam splitter, And a beam expander for controlling the diameter of the laser beam generated by the laser light source unit to enter the beam splatter. The method of claim 11, And wherein the first laser beam and the second laser beam are separated by 50:50 by the beam splitter. The method of claim 11, And a fourth reflection mirror disposed between the laser light source unit and the beam splitter to reflect the laser beam generated by the laser light source unit and to proceed to the beam splitter. The method of claim 11, The dual laser processing apparatus further comprising a drive unit for rotating the object to be processed. The method of claim 11, The dual laser processing apparatus further comprising a drive unit for vertically moving the processing object. The method of claim 1, And the first lens and the second lens are disposed at substantially the same height in the object to be processed. In the method of honing the inner surface of a cylindrical workpiece, The first step of performing rough honing, A second step of performing an intermediate finishing honing process, A third step of performing laser microgroove using the dual laser processing apparatus according to any one of claims 1 to 19; and 4th step of final finishing honing Honing processing method comprising a.

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