JPS5954485A - Laser working device for cutting tubular product - Google Patents
Laser working device for cutting tubular productInfo
- Publication number
- JPS5954485A JPS5954485A JP57163928A JP16392882A JPS5954485A JP S5954485 A JPS5954485 A JP S5954485A JP 57163928 A JP57163928 A JP 57163928A JP 16392882 A JP16392882 A JP 16392882A JP S5954485 A JPS5954485 A JP S5954485A
- Authority
- JP
- Japan
- Prior art keywords
- pipe
- housing
- beams
- laser
- rotation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
- B23K26/103—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam the laser beam rotating around the fixed workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0619—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams with spots located on opposed surfaces of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/06—Tubes
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔う15明の利用分野J
本帖明は高出力レーザカ旧11 m +m−に・係り
I”hに・心状製品を切191するのに好Jl愉な外周
加工ヘッド区二関−する。[Detailed description of the invention] [15 Fields of Application of Light J This chapter is concerned with high-power lasers (formerly 11 m + m-).
The peripheral machining head is suitable for cutting core-shaped products.
従来のα状製品切断用レーザ加工装置では、・a状製品
の外周に固定された加工ヘッドをviifえ、・1?状
製品自体の回+(i、iによってレーザビーム栄νM品
外)zIIIに照射、\、1−!で一1111ノIL7
ていた。このだめ、トit仄4す品が白線JへりさJl
、ている流れ工程中でンよ、a状製品自体の回転が小「
jJ i1ヒとなるので、レーザl;IJt仇が適用さ
れなし)という欠点があった。In the conventional laser processing device for cutting α-shaped products, a processing head fixed to the outer periphery of the α-shaped product is viifed, and 1? Irradiate the product itself times + (i, i by laser beam Sakae νM product outside) zIII, \, 1-! Deichi1111noIL7
was. This is useless, it's 4 items are white line J Herisa Jl
During the flow process, the rotation of the a-shaped product itself is small.
Therefore, there was a drawback that the laser was not applied.
〔発明の目的コ
本発明の目的は、・a状製品が回転できないような流れ
工程において、この・rt状状製奮り)断することがで
きるレーザ加工装置fを提υ(することである。[Purpose of the Invention] The purpose of the present invention is to provide a laser processing device f that can cut this rt-shaped product in a flow process in which an a-shaped product cannot be rotated. .
本発明は、レーザ源からのレーザビームをし1状製品の
外周方向に回転するi+’Q dのビームに変換するビ
ーム分割装置と、これら7M tt3ビームの回転に同
期して・l’−f状羨品の外周方向に回転し、かつ流れ
工程中の゛1?状製品の直線送りに追従−する加工ヘッ
ドとによってレーザ加工装動全構成することによって上
記目的を達成するものである。The present invention provides a beam splitting device that converts a laser beam from a laser source into a beam of i+'Q d that rotates in the direction of the outer circumference of a monolithic product, and a beam splitting device that converts a laser beam from a laser source into a beam of i+'Q d that rotates in the direction of the outer circumference of a monolithic product, and It rotates in the direction of the outer circumference of the shaped product and is in the flow process. The above object is achieved by completely configuring the laser processing device with a processing head that follows the linear feed of the shaped product.
以下、本発明の一実施例を図囲により説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the figures.
レーザ(原である炭を孜ガスレーザ装置1からレーザビ
ーム2分発牛する。このレーザビーム2はビーム分割装
(I93に入射する。ビーム分割、装置3ば、固定函体
31、べ−γリング32を介して回転可能な回転筐体3
3、この回転筐体33を11弧動するモータ34、回転
筐体に、14y、a付けらIしたビームスプリッタ35
、及び弔面反射税36.:)7,3Bとから+I“9成
される。レーザビーム2は、ビーム分割装置3によって
ビーム2]と22に分割され、管状製品であるパイプ4
の外周に沿って外周加工ヘッド5に入射する。外周加工
ヘッド5は、パイプ4の外周に配置′2Xれ/ζ移動筐
体51、この移動函体5J金、駆!助するモータ52、
ベアリング53を介して回転口J能な回転筐体54、こ
の回転函体54金、駆動するモータ55、及び回転!R
体54に取り付けら!Lだ集束456.57とから(1
り成される。Laser (coal, which is the raw material, is emitted with two laser beams from the Kogas laser device 1. This laser beam 2 enters the beam splitting device (I93). Rotating housing 3 rotatable via 32
3. A motor 34 that moves this rotating housing 33 by 11 degrees, and a beam splitter 35 with 14y and a attached to the rotating housing.
, and funeral reflection tax 36. :) 7, 3B and +I"9 are formed. The laser beam 2 is split into beams 2] and 22 by the beam splitter 3, and the pipe 4, which is a tubular product, is split into beams 2 and 22.
The light enters the outer circumferential processing head 5 along the outer circumference. The outer circumferential processing head 5 is arranged on the outer periphery of the pipe 4 in a moving housing 51 and a moving housing 51. assisting motor 52,
A rotating case 54 that can be rotated through a bearing 53, a motor 55 that drives this rotating case 54, and a rotating case 54 that rotates! R
Attached to body 54! L convergence 456.57 and (1
will be completed.
次に、以−上の借既によって、矢印6方向に一戻の速さ
で直線送りされているパイプ4をレーサ切Iす「できる
理由を述べる。ビームスグリツタ35と反射鏡36,3
7.38によって分割されたビーム21と22は、モー
タ34によって協動されるは体330回転に伴い、パイ
プ4の外周方向に回転する。このとき、筐体33の回転
に同量させて筐体54全モータ55で回転さ亡ると、回
転ビーム21と22は、常にそれぞれ集束・繰56と5
7に照射され、パイプ4の外周表面−Hにビームスポッ
トが生じる。一方、筐体540回転に伴い、モータ52
によつで筐体51をパイプ4の直線送り方向に4゛6動
いせると、巣東鈍56と57によって生じたスボッBよ
パイプ4の外周方向の回転移動と直勝送9方向の直線移
動との合成された移jbhをする。ここで、415束@
56と57をほぼ18(ml川の角度で配b’i: し
ておけば、集束鏡のはI5゛5回転によって、パイプ4
を外周切断できる。本図中に点線にて、切断が終rした
時点のモータ52と集束鏡56,57のイI’装置をそ
れぞれ52’ 、56’ 。Next, we will explain why it is possible to cut the pipe 4, which is being fed linearly in the direction of the arrow 6 at a speed of one return, using the laser beam.
The beams 21 and 22 divided by 7.38 rotate in the direction of the outer circumference of the pipe 4 as the beam body 330 rotates in cooperation with the motor 34. At this time, when the housing 54 is rotated by the same amount as the rotation of the housing 33 and all the motors 55 are used, the rotating beams 21 and 22 are always focused and rotated 56 and 55, respectively.
7, and a beam spot is generated on the outer peripheral surface -H of the pipe 4. On the other hand, as the housing 540 rotates, the motor 52
When the housing 51 is moved 4゛6 in the linear feed direction of the pipe 4, the rotational movement in the outer circumferential direction of the pipe 4 and the straight line in the direction of the direct feed 9 occur due to the rotational movement of the stub B caused by the feed holes 56 and 57. Make a combined movement with movement jbh. Here, 415 bundles @
56 and 57 are arranged at an angle of approximately 18 (ml), the focusing mirror can be rotated by I5゛5 rotations to turn pipe 4.
The outer circumference can be cut. The dotted lines in this figure indicate the motor 52 and focusing mirrors 56, 57 at 52' and 56', respectively, at the time when cutting is completed.
及び57′で示す。す[V〒が終了すれば、レーザ装置
l飴1の兄」辰全停市し、モータ52によってL二″体
51を元のfI′l@ K戻し、上述の過程を繰シ返す
ことによりさらに仄のレーザ切断を行うことができる。and 57'. When V is completed, the laser device 1 is completely stopped, the motor 52 returns the L 2" body 51 to its original value, and the above process is repeated. Furthermore, further laser cutting can be performed.
本発明の一実施例によれば、直線送りされているパイプ
の流れ工程を停止させずにレーザ切断全行うことができ
るという効果がある。According to one embodiment of the present invention, there is an advantage that laser cutting can be performed completely without stopping the flow process of a pipe that is being fed linearly.
本発明では、ビーム分割装置3によってビーム2を、一
般にn本に分割し、これに対応して外周加工ヘッド5の
n個の集束鏡をパイプ4の外周方向にほぼ等間隔に配置
することができる。この場合、年東鏡の1回転でレーザ
ζ’JllJiを行うことかできるので、nを増せば高
速レーザ切断を行うことができるという効果がある。In the present invention, the beam 2 is generally divided into n beams by the beam splitter 3, and correspondingly, the n focusing mirrors of the peripheral processing head 5 are arranged at approximately equal intervals in the outer circumferential direction of the pipe 4. can. In this case, since laser ζ'JllJi can be performed in one rotation of the Tokyo mirror, there is an effect that high-speed laser cutting can be performed by increasing n.
本発明によれば、直線送りされている管状製品示(Ar
、れ工程を停止させずにレーザ切断することができるの
で、流れ工程の効率を向上させる効果がある。According to the present invention, the tubular product display (Ar
Since laser cutting can be performed without stopping the flow process, it has the effect of improving the efficiency of the flow process.
図は本発明の一実施例である炭酸ガスレーザ装+i′7
:*用いたパイプ切断用レーザ加工装置の1till断
面図である。
1・・・炭酸ガスレーザ装置、2・・・レーザビーム、
21.22・・冒・シ故のレーザビーム、3・・・ビー
ム分割装置、4・・・パイプ、5・・・外周加工ヘッド
。
第1頁の続き
@発 明 者 白倉利治
日立市幸町3丁目1番1号株式
%式%
日立市幸町3丁目1番1号株式
会社日立製作所日立研究所内
433The figure shows a carbon dioxide laser device +i'7 which is an embodiment of the present invention.
:*This is a 1-till sectional view of the pipe cutting laser processing device used. 1... Carbon dioxide laser device, 2... Laser beam,
21.22...Laser beam due to damage, 3...Beam splitting device, 4...Pipe, 5...Perimeter processing head. Continuing from page 1 @ Inventor Toshiharu Shirakura 3-1-1 Saiwai-cho, Hitachi City Stock% formula 433 Hitachi Research Institute, Hitachi, Ltd. 3-1-1 Saiwai-cho, Hitachi City
Claims (1)
レーザビームを集束さ什で加工物に照射する加工ヘッド
からなるレーザ加工装置Y1(において、!1!I ’
A己加−王′吻が+Jit、れ工程中で直re呆送りδ
れているθ状製品で、AiJ記レーしビーム金′−状製
品の外周方向に回転する+YQ数のビームに変換するビ
ーム分割装置97と、前sv in 、dビームの回転
に同)υ」して酊状喪品のり(周方向に回転し、かつ青
火製品の直)爾ノ5、幻に追+1rt=する外周加−[
−\ラドと2設けたことを11J徴とする・U状製品切
断11ル−リ”加工装置。1. In front of the laser source where all laser beams are generated 1; L”I
Laser processing device Y1 (in !1!I'
A self-adjustment is +Jit, direct re-send δ during the process.
In the θ-shaped product, the beam splitting device 97 converts it into +YQ number of beams rotating in the outer circumferential direction of the AiJ beam gold-shaped product, and the rotation of the front sv in and d beams is the same as υ. Then add the outer periphery (rotating in the circumferential direction and directing the product) 5, add to the illusion +1rt=
-\U-shaped product cutting 11 Lure processing device with 11J feature of having 2 rads.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57163928A JPS5954485A (en) | 1982-09-22 | 1982-09-22 | Laser working device for cutting tubular product |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57163928A JPS5954485A (en) | 1982-09-22 | 1982-09-22 | Laser working device for cutting tubular product |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5954485A true JPS5954485A (en) | 1984-03-29 |
Family
ID=15783483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57163928A Pending JPS5954485A (en) | 1982-09-22 | 1982-09-22 | Laser working device for cutting tubular product |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5954485A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0222537A2 (en) * | 1985-10-22 | 1987-05-20 | Kenneth K. York | Systems for creating rounded work surfaces by photoablation |
EP0464213A1 (en) * | 1990-01-19 | 1992-01-08 | Fanuc Ltd. | Method of laser cutting work |
US5285669A (en) * | 1993-01-27 | 1994-02-15 | Kabushiki Kaisha Itaya Seisaku Sho | Spring manufacturing apparatus and spring cutting mechanism |
US5852277A (en) * | 1996-10-24 | 1998-12-22 | Spectralytics, Inc. | Laser cutting tool for cutting elongated hollow workpieces |
KR100598878B1 (en) * | 2004-06-21 | 2006-07-10 | 현대자동차주식회사 | Welding apparatus using laser beam spot |
KR100777649B1 (en) | 2007-03-12 | 2007-11-21 | 주식회사 쿠키혼 | Laser apparatus for forming pattern on inside of workpiece |
KR100777652B1 (en) | 2007-03-19 | 2007-11-21 | 주식회사 쿠키혼 | Laser apparatus for forming pattern on inside of workpiece |
DE102019127973A1 (en) * | 2019-10-16 | 2021-04-22 | Evekinger Rohr- Und Profilwerke Gmbh | Device for processing a substrate by means of a laser processing head |
DE102021110446A1 (en) | 2021-04-23 | 2022-10-27 | Evekinger Rohr- Und Profilwerke Gmbh | Device for processing a substrate using a laser processing head |
DE102021110490A1 (en) | 2021-04-23 | 2022-10-27 | Evekinger Rohr- Und Profilwerke Gmbh | Device for processing a substrate using a laser processing head |
-
1982
- 1982-09-22 JP JP57163928A patent/JPS5954485A/en active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0222537A2 (en) * | 1985-10-22 | 1987-05-20 | Kenneth K. York | Systems for creating rounded work surfaces by photoablation |
EP0464213A1 (en) * | 1990-01-19 | 1992-01-08 | Fanuc Ltd. | Method of laser cutting work |
US5285669A (en) * | 1993-01-27 | 1994-02-15 | Kabushiki Kaisha Itaya Seisaku Sho | Spring manufacturing apparatus and spring cutting mechanism |
US5852277A (en) * | 1996-10-24 | 1998-12-22 | Spectralytics, Inc. | Laser cutting tool for cutting elongated hollow workpieces |
KR100598878B1 (en) * | 2004-06-21 | 2006-07-10 | 현대자동차주식회사 | Welding apparatus using laser beam spot |
KR100777649B1 (en) | 2007-03-12 | 2007-11-21 | 주식회사 쿠키혼 | Laser apparatus for forming pattern on inside of workpiece |
KR100777652B1 (en) | 2007-03-19 | 2007-11-21 | 주식회사 쿠키혼 | Laser apparatus for forming pattern on inside of workpiece |
DE102019127973A1 (en) * | 2019-10-16 | 2021-04-22 | Evekinger Rohr- Und Profilwerke Gmbh | Device for processing a substrate by means of a laser processing head |
DE102021110446A1 (en) | 2021-04-23 | 2022-10-27 | Evekinger Rohr- Und Profilwerke Gmbh | Device for processing a substrate using a laser processing head |
DE102021110490A1 (en) | 2021-04-23 | 2022-10-27 | Evekinger Rohr- Und Profilwerke Gmbh | Device for processing a substrate using a laser processing head |
DE102021110446B4 (en) | 2021-04-23 | 2022-12-29 | Evekinger Rohr- Und Profilwerke Gmbh | Device for processing a substrate using a laser processing head |
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