KR100777097B1 - Composite of dielectric ceramic-polyphenylene sulfide - Google Patents

Abstract

A dielectric ceramic-polyphenylene sulfide composite is provided to allow injection molding, have easy processability, and be capable of mass-producing electronic part materials. A dielectric ceramic-polyphenylene sulfide composite includes 20-50 parts by weight of polyphenylene sulfide resins, 80-50 parts by weight of at least one dielectric ceramic selected from BaTiO3, SrTiO3, CaTiO3, and Mg2TiO3, 0.1-30 parts by weight of at least one dielectric aiding and flexural strength improver selected from MgO, ZnO, Al2O3, and TiO2, and 0.01-5 parts by weight of at least one dispersant selected from carbon black, graphite, calcium carbonate, unsaturated polyolefinic resins, and polysiloxanes. An average molecular weight of the polyphenylene sulfide resins is 20000 - 50000.

Description

Composite of dielectric ceramic-polyphenylene sulfide

The present invention relates to a composite of a dielectric ceramic and a polyphenylene sulfide resin, and more particularly, to a composite of a dielectric ceramic and a polyphenylene sulfide resin, which is capable of injection molding complex structural products and is easy to process.

Titanate based on BaTiO ₃ has been mainly used as a dielectric ceramic material currently used as an antenna, a ceramic condenser, a printed circuit board, and the like. These ceramic materials require high sintering above 1000 ° C., are fragile and have no elasticity, making it difficult to form a complex shape.

In order to overcome these problems of ceramic materials, there are attempts to introduce advantages such as ease of molding and dimensional precision of organic polymers by mixing high dielectric constant ceramics and organic polymer materials with high dielectric properties of ceramics.

In Japanese Patent Application Laid-Open No. 9-36650, there is an example of manufacturing a ceramic-polymer composite using TiO ₂ and a polymer resin as a ceramic material. However, the dielectric constant of the final product is not sufficiently high because the dielectric constant of the TiO ₂ dielectric used is low. There is a problem that it is difficult to form a fine dispersion structure because there is no bonding force between the polymer resin and the ceramic.

As another example, U.S. Pat. I have a problem.

An object of the present invention is to provide a composite of a dielectric ceramic and polyphenylene sulfide resin, which is capable of injection molding of a complicated structure and is easy to process.

Technical problems to be achieved by the present invention are not limited to the above-mentioned technical problems, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

The composite of the dielectric ceramic and the polyphenylene sulfide resin according to an embodiment of the present invention for solving the above technical problem is 20 to 50 parts by weight of polyphenylene sulfide resin; 80 to 50 parts by weight of at least one dielectric ceramic selected from BaTiO ₃ , SrTiO ₃ , CaTiO ₃ , and Mg ₂ TiO ₃ ; 0.1 to 30 parts by weight of at least one dielectric aid and flexural strength enhancer selected from MgO, ZnO, Al ₂ O ₃ , and TiO ₂ ; And 0.01 to 5 parts by weight of at least one dispersant selected from carbon black, graphite, calcium carbonate, unsaturated polyolefin resins, and polysiloxanes.

The composite of the dielectric ceramic and polyphenylene sulfide resin prepared as described above may be variously applied to electronic component materials such as antennas, ceramic capacitors, and printed circuit boards.

Specific details of other embodiments are included in the detailed description and the accompanying drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, only the present embodiments to make the disclosure of the present invention complete, and common knowledge in the art to which the present invention pertains. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims.

In the composite of the dielectric ceramic-polymer resin of the present invention, the total dielectric constant? Is mainly determined by the dielectric ceramic, and the dielectric constant can be controlled by adjusting the type and content of the dielectric ceramic. A dielectric ceramic used in the present invention, _{BaTiO 3, SrTiO 3, CaTiO 3} , the dielectric ceramics on one or two selected from the group consisting of Mg ₂ TiO ₃ is used.

The content of the dielectric ceramic is 50 to 80 parts by weight, preferably 60 to 80 parts by weight is advantageous in terms of dielectric constant and processing viscosity.

Polyphenylene sulfide resin (PPS resin) used in the present invention is a crystalline polymer having a tetragonal crystal structure and is a high functional resin having properties such as high mechanical strength, excellent chemical resistance, and excellent heat resistance.

Since the polyphenylene sulfide resin used in the present invention is a crystalline resin, the properties may vary depending on the degree of crystallinity, and the degree of crystallinity is higher than the glass transition temperature (Tg) after the selection of the mold temperature in the injection molding and the molding. Adjustable by annealing with.

The polyphenylene sulfide resin used in the present invention is preferably a polyphenylene sulfide resin containing at least 70 mol% or more of the structural unit represented by the following formula (1).

The content of 70 mol% or more of this repeating unit is excellent in terms of crystallinity, heat resistance, chemical resistance and strength, which are characteristic of crystalline polymers, and the structure of polyphenylene sulfide resin (PPS) is linear or branched. And both can be used.

The polyphenylene sulfide resin may contain less than 50 mol%, preferably less than 30 mol% of other copolymerized structural units represented by the following formula (2).

(Wherein R is one of an alkyl group, a nitro group, a phenyl group, an alkoxy group, a carboxyl group and a metal carboxylate group)

The polyphenylene sulfide resin composition includes all polyphenylene sulfide resin compositions in which viscosity and crystallization rate are controlled to enable extrusion and injection molding processes using the polyphenylene sulfide resin.

The molecular weight of the polyphenylene sulfide resin is preferably in the range of 20,000 to 50,000 based on the weight average molecular weight in view of the physical properties, the extrudability, and the molding viscosity after processing.

Dielectric aids and flexural strength enhancers are added to increase the flexural strength of the final product while simultaneously improving the dielectric constant of the composite according to the present invention.

As dielectric aid and flexural strength enhancer, one or two or more selected from MgO, ZnO, Al ₂ O ₃ , and TiO ₂ may be used, and the content is preferably 0.1 to 30 parts by weight in consideration of impact resistance and extrusion processability. More preferably, 5-20 parts by weight is suitable for dielectric constant preservation and physical property improvement.

Dispersants are used to prevent entanglement between dielectric ceramics added to polyphenylene sulfide resins and the dielectric aid and flexural strength enhancer.

In the present invention, since a large amount of the dielectric ceramic and the dielectric aid and the bending strength enhancer are added as the polymer resin, the dielectric ceramics may not be entangled with each other or dispersed in the polymer resin. .

Therefore, in order to solve this problem, a dispersant is added, and one or two or more selected from carbon black, graphite, calcium carbonate, unsaturated polyolefin resin, and polysiloxane may be used, and the content of the dispersant may be In consideration of the electrical properties of the composite to be produced, it is preferable to add 0.01 to 5 parts by weight.

However, a silane coupling agent in which an epoxy or an amine group is present may be further added to the composite of the present invention in order to improve dispersibility between the polyphenylene sulfide resin and the dielectric ceramic and to increase the mutual bonding force. The ring agent may be used in an amount of 0.01 to 3 parts by weight. As for the said silane coupling agent, it is more preferable to use it at 0.1-1 weight part.

The resin-ceramic composite composition may further use inorganic additives, heat stabilizers, antioxidants, light stabilizers, pigments and / or dyes and the additives added are in the range of 0 to 60 parts by weight, preferably 1 to 40 parts by weight. Can be used in

The resin-ceramic composite composition of the present invention can be produced by a known method for producing a resin composition. For example, the components of the present invention and other additives may be mixed simultaneously, then melt extruded in an extruder and prepared in pellet form.

The composition of the present invention can be used in the molding of various products, in particular can be used in molded articles such as RFID antenna and various electrical and electronic components or precision parts.

Hereinafter will be described with reference to specific embodiments that the various mechanical properties and dielectric constant is excellent when the composite of the dielectric ceramic and polyphenylene sulfide resin according to the embodiments of the present invention. Details not described herein are omitted because they can be sufficiently inferred by those skilled in the art.

< Example >

The components used to prepare the dielectric ceramic-polyphenylene sulfide composite of the present invention are as follows.

(1) polyphenylene sulfide resin

A high molecular weight (average molecular weight 50,000) PPS-HC polyphenylene sulfide resin of Deokyang, China was used.

(2) dielectric ceramic

BaTiO ₃ was used by Samsung Fine Chemical and SrTiO ₃ was manufactured by Fuji Titanate of Japan, HST-1 (particle size: 1.1㎛).

(3) Oilfield supplement and flexural strength improver

TiO 2 (TI-PURE R-106) from Dupont, USA was used.

(4) dispersant

Omya BSH calcium carbonate from Omya Gmbh was used.

(5) Silane coupling agent

KBM 403 from ShinEtsu, Japan, was used.

Dielectric ceramics and polyphenylene sulfide resin composites were prepared by controlling the contents according to the weighing table shown in Table 1 below.

After mixing each component in the composition content ratio shown in Table 1, after mixing using a mixer (mixer) generally used for complex blending, it was put into an extraction compressor of L / D = 36, ￠ = 45mm.

The mixture thus prepared was made into a resin composition in pellet form through an extruder, and specimens for mechanical and dielectric evaluation were prepared at a injection temperature of 310 ° C. using a 10 oz injection machine. Tensile strength, flexural strength, flexural modulus, and dielectric constant for the fields were tested. Notched Izod impact strength was measured by ASTM D256 (1/4 ", 1/8", 23 ° C) and unit is kgf. Cm / cm. Tensile strength was evaluated at 5 mm / min by ASTM D638 test method, unit was kgf / cm2, and flexural strength was evaluated at 2.8 mm / min condition by ASTM D790 test method, and unit is kgf / cm2.

In the dielectric constant measurement, each obtained composite dielectric was injected into a 10 × 10 cm specimen and the dielectric constant was measured by an impedance analyzer.

As in the comparative example, as the content of the dielectric ceramic increases, the dielectric constant tends to increase. However, even when the content of the dielectric ceramic is increased to 70 parts by weight, it is difficult to obtain a dielectric constant of 15 or more. However, when titanium dioxide was added as a dielectric aid and flexural strength enhancer in addition to the dielectric ceramic as in Example, the dielectric constant was higher than that in the non-addition, and the flexural modulus and the flexural modulus were higher than in the physical properties.

In addition, the addition of the coupling agent at the same content showed an improved permittivity.

That is, when a mixture of dielectric ceramic, dielectric aid, flexural strength enhancer, and dispersant is used in the polyphenylene sulfide resin as in the present invention, ceramic-polymer composite exhibiting high dielectric properties while maintaining physical properties such as flexural strength and flexural modulus is obtained. Could be manufactured.

While the embodiments of the present invention have been described with reference to the accompanying tables, the present invention is not limited to the above embodiments, but may be manufactured in various forms, and having ordinary skill in the art to which the present invention pertains. It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

According to the composite of the dielectric ceramic and the polyphenylene sulfide resin according to the embodiment of the present invention, the injection molding of a complicated structure is possible by using the ceramic-polymer composite material exhibiting high dielectric properties, thereby allowing a large amount of electronic component materials such as antennas. Production is possible.

Claims (5)

20 to 50 parts by weight of polyphenylene sulfide resin; 80 to 50 parts by weight of at least one dielectric ceramic selected from BaTiO ₃ , SrTiO ₃ , CaTiO ₃ , and Mg ₂ TiO ₃ ; 0.1 to 30 parts by weight of one or more dielectric aids and flexural strength enhancers selected from MgO, ZnO, Al ₂ O ₃ and TiO ₂ ; And 0.01 to 5 parts by weight of at least one dispersant selected from carbon black, graphite, calcium carbonate, unsaturated polyolefin resin, and polysiloxane; Composite of the dielectric ceramic and polyphenylene sulfide resin comprising a. The method of claim 1, The weight average molecular weight of the polyphenylene sulfide resin is a composite of a dielectric ceramic and polyphenylene sulfide resin, characterized in that 20,000 ~ 50,000. The method of claim 1, The composite of the dielectric ceramic and the polyphenylene sulfide resin further comprises 0.01 to 3 parts by weight of a silane coupling agent in which an epoxy or amine functional group is present, and the composite of the dielectric ceramic and the polyphenylene sulfide resin. The method of claim 1, The composite of the dielectric ceramic and the polyphenylene sulfide resin is a composite of the dielectric ceramic and the polyphenylene sulfide resin further comprising an inorganic additive, a heat stabilizer, an antioxidant, a light stabilizer, a pigment, and / or a dye. A pellet extruded from the composite of the dielectric ceramic of claim 1 and a polyphenylene sulfide resin.