KR100773940B1 - Organic Light Emitting Diode - Google Patents

Abstract

The present invention can minimize the problem that the driver integrated circuit is not electrically connected to the wiring pattern on the pad portion when mounting the driver integrated circuit to the pad portion, and the organic light emitting device that can simplify the inspection process It is about. Such an organic light emitting device of the present invention comprises a substrate defined by the display area and the non-display area of the image; A plurality of positive electrode layers and negative electrode layers formed in the display area to cross each other to define pixels; An organic thin film layer formed between the plurality of positive electrode layers and the negative electrode layers in the pixel; And a pad portion disposed in the non-display area, the pad portion configured to apply an electrical signal to the positive electrode layer and the negative electrode layer, the organic light emitting element being formed at both ends of the pad portion to accurately align and mount the driver integrated circuit on the pad portion. 1 sort key; And a second alignment key formed to be spaced apart from one side of the first alignment key such that the wiring pattern on the pad portion and each electrical pattern on the driver integrated circuit overlap each other by a predetermined ratio or more.

Organic light emitting device, alignment key, driver integrated circuit, pad part

Description

Organic Light Emitting Diode

1 is a plan view schematically showing the structure of an organic light emitting device according to the prior art.

2 is an enlarged plan view illustrating a state in which a driver integrated circuit is mounted on a pad part in an organic light emitting diode according to the related art.

3 is a plan view schematically illustrating a structure of an organic light emitting diode according to an exemplary embodiment of the present invention.

4 is an enlarged plan view illustrating a state in which a driver integrated circuit is mounted on a pad part in an organic light emitting diode according to an exemplary embodiment of the present invention.

   -Explanation of symbols for the main parts of the drawings-

10 substrate 12 display area

14 non-display area 16 positive electrode layer

18: negative electrode layer 20: pixel

22: pad portion 24: (first) alignment key

26: driver integrated circuit 28: alignment key

30: second alignment key

The present invention can minimize the problem that the driver integrated circuit is not electrically connected to the wiring pattern on the pad portion when mounting the driver integrated circuit to the pad portion, and the organic light emitting device that can simplify the inspection process It is about.

In general, the organic light emitting device is one of the flat panel display devices, and is formed between the positive electrode layer and the negative electrode layer on the transparent substrate through an organic thin film layer including the organic light emitting layer, and forms a very thin matrix.

The organic light emitting device is a display device using an electroluminescence phenomenon in which light is generated when a predetermined electric field is applied to a phosphor. When a predetermined electric field is applied to the positive electrode layer and the negative electrode layer, holes and electrons are respectively formed from the positive electrode layer and the negative electrode layer. Moves to the organic light-emitting layer, and these holes and electrons meet each other in the organic light-emitting layer to form an electron-hole pair to generate high energy excitons, and light is generated on the principle that these excitons fall to the ground state to generate light energy. Let's go.

Such an organic light emitting device can be driven at a low voltage of 15V or less, and exhibits excellent characteristics in brightness, viewing angle, power consumption, and the like, compared to other display devices, for example, TFT-LCD. In addition, the organic light emitting device has a fast response speed of 1 kHz compared to other display devices, and thus is suitable for a next-generation multimedia display, in which video is essential.

Hereinafter, a structure and a problem thereof according to the related art organic light emitting device will be described in detail with reference to the accompanying drawings.

1 is a plan view schematically illustrating a structure of an organic light emitting device according to the prior art, and FIG. 2 is an enlarged plan view illustrating a state in which a driver integrated circuit is mounted in a pad part in the organic light emitting device according to the prior art.

Referring to FIG. 1, in the conventional organic light emitting diode, first, the display area 12 and the non-display area 14 are arranged in parallel on the display area 12 of the transparent substrate 10. A plurality of positive electrode layers 16 are formed. Further, on the plurality of positive electrode layers 16, a plurality of negative electrode layers 18 arranged orthogonally to the plurality of positive electrode layers 16 are formed. Each pixel 20 of the organic light emitting diode is defined at a portion where the plurality of positive electrode layers 16 and the negative electrode layers 18 which are orthogonal to each other meet each other. In the pixel 20, an organic thin film layer (not shown) including an organic light emitting layer and the like is formed between the plurality of positive electrode layers 16 and the negative electrode layers 18.

According to the configuration of the pixel 20 of the display area 12, when an electric field is applied to the positive electrode layer 16 and the negative electrode layer 18, holes and electrons are induced from the positive electrode layer 16 and the negative electrode layer 18, respectively. Each pixel 20 of the organic light emitting element emits light by moving to an organic light emitting layer in the thin film layer and forming holes of electrons and electrons in the organic light emitting layer.

Meanwhile, a pad portion 22 is formed on the non-display area 14 of the substrate 10 to be connected to the positive electrode layer 16 and the negative electrode layer 18 to apply electrical signals to the electrode layers. A predetermined wiring pattern (not shown) electrically connected to the positive electrode layer 16 and the negative electrode layer 18 of the display area 12 is formed on the pad part 22. At both ends of the pad portion 22, an alignment key 24 is formed on the pad portion 22 for accurately aligning and mounting the driver integrated circuit.

In addition, the driver integrated circuit 26 for driving the organic light emitting device by electrically connecting the wiring pattern on the pad part 22 and applying an electrical signal to the pad part 22 is illustrated in FIG. 2. Are mounted). Alignment keys 28 are formed at both ends of the driver integrated circuit 26, and the alignment key 28 on the driver integrated circuit 26 and the alignment key 24 on the pad part 22 overlap each other. By confirming that, the driver integrated circuit 26 can be aligned and mounted at the correct position electrically connected to the wiring pattern on the pad portion 22.

However, in the organic light emitting diode according to the related art, although the alignment keys 24 and 28 are formed on the pad portion 22 and the driver integrated circuit 26, the driver integrated circuit 26 may be formed by the pad portion ( It is true that there was a problem that the wire pattern was not properly connected to the wiring pattern on the wire.

Referring to FIG. 2, the problems of the prior art will be described in more detail as follows.

As shown in FIG. 2, in the related art, the driver integrated circuit 26 is padded by observing whether the alignment keys 24 and 28 formed in the driver integrated circuit 26 and the pad unit 22 overlap each other. It was aligned and mounted in the correct position electrically connected with the wiring pattern on the part 22. However, even if the wiring pattern on the pad unit 22 and the driver integrated circuit 26 do not overlap completely, if only a predetermined ratio, for example, 50% or more overlaps, the wiring pattern on the pad unit 22 in the driver integrated circuit 26 is overlapped. Since there is no problem in that an electrical signal is applied, the alignment keys 24 and 28 respectively formed in the driver integrated circuit 26 and the pad unit 22 also generally overlap at a rate of 50% or more. The driver integrated circuit 26 was mounted at the correct position on the pad portion 22 because the driver integrated circuit 26 was aligned at the correct position.

However, since the driver integrated circuit 26 is in the form of a thin film-shaped tape carrier package (TCP) or a flexible printed circuit (FPC), it has some degree of elasticity (elongation) by itself, and thus, mounting The length of the driver integrated circuit 26 itself or the pitch between each electrical pattern on the driver integrated circuit 26 to be connected to the wiring pattern may vary depending on temperature, pressure, or device conditions during the process.

For this reason, conventionally, the driver integrated circuit 26 is positioned at a position where the alignment keys 24 and 28 respectively formed on the driver integrated circuit 26 and the pad portion 22 overlap each other at a rate of 50% or more. Even if it is mounted, a large number of problems that the wiring pattern on the driver integrated circuit 26 and the pad unit 22 do not overlap properly and thus cannot be electrically connected. As a result, a number of defects in which the final manufactured organic light emitting device is not properly driven have occurred.

In addition, conventionally, in order to confirm such defects, all parts where the electrical connection of the wiring pattern on the driver integrated circuit 26 and the pad unit 22 are questioned are separately examined using a separate inspection device such as an optical microscope. Since the observation was inevitable, the defect inspection process of the organic light emitting device was also extremely troublesome and complicated.

Due to the problems of the prior art, it is possible to minimize the problem that the driver integrated circuit 26 is not properly connected to the wiring pattern on the pad portion 22, and the process of checking whether the organic light emitting device is defective according to the problem is also simplified. There is an urgent need for a novel organic light emitting device related technology.

Accordingly, the present invention can minimize the problem that the driver integrated circuit is not electrically connected to the wiring pattern on the pad portion, in order to solve the problems of the prior art as described above, and to check whether the organic light emitting device according to this problem is defective It is also to provide an organic light emitting device that can simplify the process.

In order to achieve the above object, the present invention is to provide a substrate comprising a display area and a non-display area of the image; A plurality of positive electrode layers and negative electrode layers formed in the display area to cross each other to define pixels; An organic thin film layer formed between the plurality of positive electrode layers and negative electrode layers in the pixel; And a pad part disposed in the non-display area and configured to apply an electrical signal to the positive electrode layer and the negative electrode layer, wherein both ends of the pad part are arranged to accurately align and mount a driver integrated circuit on the pad part. A first alignment key formed in the; And a second alignment key formed to be spaced apart from one side of the first alignment key such that a wiring pattern on the pad part and each electrical pattern on the driver integrated circuit overlap each other by a predetermined ratio or more. to provide.

In the organic light emitting device according to the present invention, the first alignment key and the second alignment key may be formed of a metal material such as chromium. The metal material such as chromium is used to form a negative electrode layer of the organic light emitting device, an auxiliary electrode for lowering the resistance of the positive electrode layer, and the like, and in the process of patterning the auxiliary electrode or the negative electrode layer using the metal material. Since the first and second alignment keys can be formed by patterning together, a separate process for forming the first and second alignment keys need not be added.

The first alignment key and the second alignment key may be formed in a cross shape (+), an asterisk (*), a circle (○), a subtraction type (-), or a straight shape (l). The two alignment keys can be of the same shape or of different shapes.

Hereinafter, a structure and an operation of an organic light emitting diode according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. In addition, the same reference numerals are attached to similar parts throughout the present specification.

3 is a plan view schematically illustrating a structure of an organic light emitting diode according to an embodiment of the present invention, and FIG. 4 is a view illustrating a state in which a driver integrated circuit is mounted on a pad part in an organic light emitting diode according to an embodiment of the present invention. It is an enlarged plan view.

Referring to FIG. 3, in the organic light emitting diode according to the present embodiment, first, the transparent substrate 10 made of transparent glass or transparent plastic is divided into the display region 12 and the non-display region 14. A plurality of positive electrode layers 16 are arranged on the display area 12 of 10 in parallel in the form of stripes. The positive electrode layer 16 may be a transparent electrode made of indium tin oxide (ITO), indium-doped zinc oxide or IXO (IZO), or the like.

Further, on the plurality of positive electrode layers 16, a plurality of negative electrode layers 18 arranged orthogonally to the plurality of positive electrode layers 16 are formed. The negative electrode layer 18 may be formed using a low resistance metal material having good electrical conductivity, such as Al, Li / Al, Mg, Ag, or Ca.

Meanwhile, each pixel 20 of the organic light emitting diode is defined at a portion where the plurality of positive electrode layers 16 and the negative electrode layers 18 which are orthogonal to each other meet each other. In the pixel 20, an organic thin film layer (not shown) including an organic light emitting layer and the like is formed between the plurality of positive electrode layers 16 and the negative electrode layers 18.

The organic light emitting layer in the organic thin film layer may be, for example, a low molecular fluorescent and phosphorescent organic light emitting material such as Alq ₃ , Anthrancene Ir (ppy) ₃ or a polymer organic material such as p-phenylenevinylene (PPV), polythiophene (PT) and derivatives thereof. It can be formed using a light emitting material and the like.

In addition to the organic light emitting layer, the organic thin film layer is formed between the organic light emitting layer and the positive electrode layer 16 to assist hole transfer from the positive electrode layer 16, and the hole injection layer and the hole transport layer, and the organic light emitting layer and the negative electrode layer ( 18 may further include an organic thin film, such as an electron injection layer and an electron transport layer, formed between the two to assist electron transfer from the negative electrode layer 18.

In the organic light emitting device of the present embodiment, according to the configuration of the pixel 20 of the display region 12, when the electric field is applied to the positive electrode layer 16 and the negative electrode layer 18, as in the prior art, a hole injection layer and With the aid of the hole transport layer, the electron injection layer, and the electron transport layer, holes and electrons move from the positive electrode layer 16 and the negative electrode layer 18 to the organic light emitting layer in the organic thin film layer, respectively. By forming a hole pair, each pixel 20 of the organic light emitting element emits light.

However, as described above, the configuration of the pixel 20 of the display region 12 of the organic light emitting diode is according to a known configuration known to those skilled in the art and does not correspond to the technical features of the present embodiment. Further description will be omitted.

Meanwhile, in the organic light emitting diode according to the present exemplary embodiment, a pad is connected to the positive electrode layer 16 and the negative electrode layer 18 on the non-display area 14 of the substrate 10 to transmit electrical signals to the electrode layers. The part 22 is formed. A predetermined wiring pattern (not shown) electrically connected to the positive electrode layer 16 and the negative electrode layer 18 of the display area 12 is formed on the pad part 22. At both ends of the pad portion 22, first alignment keys 24 are formed on the pad portion 22 for accurately aligning and mounting the driver integrated circuit.

In this embodiment, the second alignment key 30 is formed at a side of the first alignment key 24 at a predetermined distance. The second alignment key 30 is formed at a predetermined position on the pad portion 22 at a predetermined distance from one side of the first alignment key 24 in consideration of the following three conditions:

(One). Temperature, pressure and device conditions in the process of mounting the driver integrated circuit on the pad portion 22,

(2). Maximum elongation under the condition of (1) of the driver integrated circuit in the form of a thin film TCP or FPC,

(3). The pitch between the wiring pattern on the pad portion 22 and the pitch between each electrical pattern on the driver integrated circuit to be electrically connected thereto.

That is, the second alignment key 30 is also used to align and mount the driver integrated circuit at the correct position electrically connected to the wiring pattern on the pad portion 22 under the conditions of (1) in this embodiment. Considering the maximum elongation of the driver integrated circuit in the form of a thin film, even if the length of the driver integrated circuit and the pitch between each electrical pattern on the driver integrated circuit change during the mounting process, the wiring pattern on the pad portion 22 and the pattern on the driver integrated circuit are changed. The minimum process margin, i.e., the predetermined distance, that allows each electrical pattern to be overlapped by at least a predetermined ratio or more, for example 50% or more, to be well electrically connected, is predetermined. Then, the second alignment key 30 is formed at one side of the first alignment key 24 on the pad part 22 at the minimum process margin, that is, at a predetermined distance.

Hereinafter, referring to FIG. 4, the driver integrated circuit 26 is mounted on the pad part 22 of the organic light emitting diode according to the present exemplary embodiment by using the first alignment key 24 and the second alignment key 30. How to do this.

Referring to FIG. 4, unlike the prior art of aligning and mounting a driver integrated circuit using only one alignment key on the pad part, in the present embodiment, the first alignment key 24 and the second alignment key 30 are used. By using the first alignment key 24 on the pad portion 22 and the alignment key 28 on the driver integrated circuit 26 by 50% or more, and at the same time, the alignment key 28 on the driver integrated circuit 26. Aligns the driver integrated circuit 26 at least in contact with the second alignment key 30, and mounts the driver integrated circuit 26 thus aligned on the pad portion 22.

According to this configuration, even if the length of the thin film-shaped driver integrated circuit 26 or the pitch between the respective electrical patterns on the driver integrated circuit 26 changes depending on the conditions of (1) or the like, the second alignment key 30 ) Is formed in consideration of these factors, so that the driver integrated circuit 26 is aligned at a position where the second alignment key 30 and the alignment key 28 on the driver integrated circuit 26 are in contact with each other. Once mounted on 22, there is no fear that such driver integrated circuit 26 may not be properly electrically connected to the wiring pattern on the pad portion 22. FIG. For this reason, the driver integrated circuit 26 may not be electrically connected to the pad unit 22, thereby minimizing a conventional problem in that the organic light emitting device is not properly driven.

Further, if only the second alignment key 30 and the alignment key 28 on the driver integrated circuit 26 are in contact with each other, the wiring pattern on the pad part 22 and the respective electrical patterns on the driver integrated circuit 26 may be used. Since the driver integrated circuit 26 is electrically connected well to the pad unit 22 because the 50% or more overlaps with each other, it is not possible to electrically connect the driver integrated circuit 26 using a separate inspection device such as an optical microscope. In-process defect inspections can also be greatly simplified because you do not have to observe every question.

Meanwhile, in the present embodiment, the first alignment key 28 and the second alignment key 30 may be formed of a metal material such as chromium. Such a metal material such as chromium is used to form a negative electrode layer 18 of the organic light emitting device, an auxiliary electrode (not shown) for lowering the resistance of the positive electrode layer 16, and the like. Since the first alignment key 28 and the second alignment key 30 may be formed together in the process of patterning the auxiliary electrode or the negative electrode layer 18, the first alignment key 28 and the second alignment key may be formed. No separate process for the formation of 30 need be added.

In the present embodiment and the drawing, the first alignment key 28 has a cross (+) and the second alignment key 30 has a straight (|), but the present invention is not limited thereto. Not only the alignment key 28 and the second alignment key 30 may be the same or different, but also cross-shaped (+), asterisk (*), circular (○), subtracted (-) or straight (|) It can be formed as.

Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

For example, in the above-described embodiment, the configuration of the present invention using the first alignment key and the second alignment key is applied to connect the pad portion of the organic light emitting element and the driver integrated circuit, but another flat panel such as an LCD or a PDP is used. In the case of connecting the pad unit of the display panel with the driver integrated circuit, the configuration of the present invention using the first alignment key and the second alignment key can be applied. In addition, such a configuration can also be interpreted as being interpreted within the scope of the present invention within the equivalent scope of the present invention.

As described above, according to the present invention, the driver IC may not be electrically connected to the wiring pattern on the pad part, thereby minimizing the defect that the organic light emitting device is not properly driven.

In addition, since the inspection process for such defects can also be minimized, the reliability of the organic light emitting device can be improved and the economic efficiency of the manufacturing process can be greatly contributed.

Claims (3)

A substrate defined by a display area and a non-display area of an image; A plurality of positive electrode layers and negative electrode layers formed in the display area to cross each other to define pixels; An organic thin film layer formed between the plurality of positive electrode layers and negative electrode layers in the pixel; And a pad part disposed in the non-display area to apply an electrical signal to the positive electrode layer and the negative electrode layer. First alignment keys formed at both ends of the pad portion to align and mount a driver integrated circuit on the pad portion accurately; And And a second alignment key formed to be spaced apart from one side of the first alignment key such that a wiring pattern on the pad portion and each electrical pattern on the driver integrated circuit overlap each other by a predetermined ratio or more.  The organic light emitting device of claim 1, wherein the first and second alignment keys are formed of chromium. The method according to claim 1 or 2, The first alignment key and the second alignment key are cross-shaped (+), asterisk (*), circular (○), subtracted (-) or straight (l), the first alignment key and the second alignment An organic light emitting device in which the keys are formed in the same shape or in different shapes.

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