KR100772310B1 - 고도의 열전달 기판 및 그 제조공정 - Google Patents
고도의 열전달 기판 및 그 제조공정 Download PDFInfo
- Publication number
- KR100772310B1 KR100772310B1 KR1020040111754A KR20040111754A KR100772310B1 KR 100772310 B1 KR100772310 B1 KR 100772310B1 KR 1020040111754 A KR1020040111754 A KR 1020040111754A KR 20040111754 A KR20040111754 A KR 20040111754A KR 100772310 B1 KR100772310 B1 KR 100772310B1
- Authority
- KR
- South Korea
- Prior art keywords
- heat transfer
- metal material
- copper foil
- gum
- foil layer
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000007769 metal material Substances 0.000 claims abstract description 71
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 53
- 239000011889 copper foil Substances 0.000 claims abstract description 51
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000003825 pressing Methods 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract 2
- 239000002184 metal Substances 0.000 claims abstract 2
- 239000007787 solid Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 6
- 238000005553 drilling Methods 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 238000003754 machining Methods 0.000 claims description 2
- 238000005488 sandblasting Methods 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 25
- 239000011248 coating agent Substances 0.000 abstract description 8
- 238000000576 coating method Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 description 5
- 239000000155 melt Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/06—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (15)
- (a) 목적하는 금속물질을 준비하여 그것을 거친 표면을 나타내게 하고;(b) 드릴링 머신을 사용하여 거친 금속물질에 미리정해진 직경의 구멍을 드릴하고;(c) 열에너지가 구리박(copper foil) 층으로부터 금속물질로 빠르게 전달되고 방산되도록 두 구리박층 사이에 높은 열전도성을 갖는 금속을 갖는 열전달 검(heat-transferring gum)을 금속물질의 각 표면과 구리박층사이의 공간에 채우고,(d) 금속물질과 구리박 층을 함께 단단히 프레싱하는 단계를 포함하는 고도의 열전달 기판의 제조공정.
- 제1항에 있어서, 금속물질은 기계가공에 의해 단계(a)에서 거칠게 되는 것인 제조공정.
- 제1항에 있어서, 금속물질은 샌드블라스팅에 의해 단계(a)에서 거칠게 되는 것인 제조공정.
- 제1항에 있어서, 단계(b)에서 금속물질에 드릴된 구멍의 직경은 구리박 층에 형성된 구멍의 직경보다 약간 더 큰 것인 제조공정.
- 제1항에 있어서, 단계(c)에서 사용된 고도의 열전달 검은 고체상태의 것인 제조공정.
- 제1항에 있어서, 단계(c)에서 사용된 고도의 열전달 검은 액체상태의 것인 제조공정.
- 제1항에 있어서, 단계(c)에서 사용된 고도의 열전달 검은 프린팅에 의해 금속물질에 채워지는 것인 제조공정.
- 금속물질;절연 및 결합 매체로서 제공하기 위해 각 금속물질의 표면에 놓인 고도의 열전달 검의 층; 및고도의 열전달 검의 각 층 위에 형성된 구리박 층을 포함하는 고도의 열전달 기판.
- 제8항에 있어서, 금속물질은 미리 정해진 직경을 가지는 다수의 구멍을 형성하기 위해 미리 드릴되는 것인 열전달 기판.
- 제8항에 있어서, 금속물질은 알루미늄인 것인 열전달 기판.
- 제8항에 있어서, 금속물질은 구리인 것인 열전달 기판.
- 제8항에 있어서, 금속물질은 철인 것인 열전달 기판.
- 제8항에 있어서, 금속물질은 알루미늄 합금인 것인 열전달 기판.
- 제8항에 있어서, 고도의 열전달 검은 고체상태의 것인 열전달 기판.
- 제8항에 있어서, 고도의 열전달 검은 액체상태의 것인 열전달 기판.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040111754A KR100772310B1 (ko) | 2004-12-24 | 2004-12-24 | 고도의 열전달 기판 및 그 제조공정 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040111754A KR100772310B1 (ko) | 2004-12-24 | 2004-12-24 | 고도의 열전달 기판 및 그 제조공정 |
Publications (2)
Publication Number | Publication Date |
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KR20060072954A KR20060072954A (ko) | 2006-06-28 |
KR100772310B1 true KR100772310B1 (ko) | 2007-10-31 |
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KR1020040111754A KR100772310B1 (ko) | 2004-12-24 | 2004-12-24 | 고도의 열전달 기판 및 그 제조공정 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101148127B1 (ko) * | 2006-12-09 | 2012-05-23 | 엘지이노텍 주식회사 | 방열회로기판 및 그 제조방법 |
CN114867191A (zh) * | 2022-05-17 | 2022-08-05 | 高德(江苏)电子科技股份有限公司 | 双面基板选择性镀铜块的印刷电路板及其制造方法 |
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- 2004-12-24 KR KR1020040111754A patent/KR100772310B1/ko active IP Right Grant
Non-Patent Citations (1)
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신규사항 추가에 의한 거절 |
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KR20060072954A (ko) | 2006-06-28 |
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