KR100770784B1 - Array type feedthru filter. - Google Patents

Abstract

A feed-through type filter is provided to prevent deformation of the filter due to an external impact by fixing inner elements using an epoxy resin. An element and a lead pin are inserted into a condensing through-hole(120). An upper substrate coupling through-hole(130) is mounted on a shielding wall on a circuit network. An upper substrate(100) is formed on an upper substrate metal film(140), which is formed on front and rear surfaces thereof. At least one lead pin through-hole(220) penetrates an insulation board. A nut coupling through-hole(230) is mounted on a shielded surface of a circuit. A lower substrate includes a lower substrate front metal film(240) and is arranged to be apart from the lead pin through-hole by a predetermined distance. A capacitor(160) is formed around the lead pin, which is inserted into the condensing through-hole. A condensing epoxy resin(150) fixes the capacitor, the lead pin and the substrate.

Description

Multiple Through Filters {array type Feedthru Filter. }

1 is a perspective view showing an example of a conventional multi-pass filter.

2 is a perspective view showing another example of a conventional multi-pass filter.

Figure 3a is a view showing the front surface of the lower substrate according to an embodiment of the present invention the multiple through-type filter.

Figure 3b is a view showing the lower substrate front portion according to another embodiment of the present invention the multiple through-type filter.

Figure 3c is a view showing the lower substrate rear portion according to an embodiment of the present invention the multiple through-type filter.

4 is a view showing an upper substrate front part according to an embodiment of the present invention.

Figure 5 is a perspective view showing the external appearance according to an embodiment of the present invention the multiple through-type filter.

6 is a plan view according to an embodiment of the present invention.

FIG. 7 is a cross-sectional view taken along line AA ′ of FIG. 6.

FIG. 8 is a cross-sectional view taken along line AA ′ of FIG. 6.

FIG. 9 is a view illustrating various shapes of a capacitor device according to an embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

100: upper substrate 110: insulating substrate

120: through hole for filling 130: through hole for screwing the upper substrate

140: upper substrate metal film 150: filling epoxy resin

160: capacitor element 170: ferrite element

200: lower substrate 210: insulating substrate

220: lead pin through hole 230: through hole for screwing the lower substrate

240: lower substrate front metal film 250: electrode

260: metal film

The present invention relates to a plurality of through-type filter, and more particularly, it is located on the signal or the power line to effectively remove the noise contained in the power source and the signal, and has a shape that does not protrude outside the substrate other than the lead It has a symmetrical structure with a symmetrical structure, and it is easy to attach to any apparatus and protects the core elements with epoxy.

Figure 1 shows the form of a multi-pass type filter through the prior art. This conventional technique forms a metal plate 10 by forming a desired number of through holes 14 in the metal plate 10, and a unit element having a relatively long cylindrical capacitor element 12 and a lead element inserted therein. It is inserted into the through-hole and soldered to have a completed shape.

In the case of such a product, the cylindrical capacitor element 12 having a long length is inconvenient in mounting because the element has a structure protruding to the outside compared to the portion to be mounted. In addition, if the lead pin is bent at the request of the user, the protruding element may be damaged, resulting in structural defects.

Figure 2 shows the form of a multi-pass filter of another type according to the prior art. Compared to the technique shown in FIG. 1, a substrate is used as an insulating substrate 20, such as a PCB, and a ground is formed by forming a conductive film under the insulating substrate. In addition, cost reduction was induced by using commercially available rectangular surface mount multilayer capacitors instead of cylindrical elements. However, the use of such a surface-mounted stacked device may cause problems in the processing of grounding and fixing of the lead pins 21. In order to alleviate this side effect, the cover of the upper part of the substrate is covered using an injection molding 22 having a lead pin hole for fixing the pin, and the fixing is made by using silicon therebetween.

In the case of the through-hole filter having such a structure, the mounting conditions are limited because the overall shape is asymmetrical. That is, since one side of the substrate is protruded by the injection molding, the user has a disadvantage of forming a through hole in the shielding wall according to the size of the protrusion. In addition, because the silicon used as a buffer flows between the plastic injection molding and the substrate, incomplete adhesion occurs during mounting, so that a gap is generated between the case of the equipment which is an external ground or the shielding wall of the equipment, and high-frequency noise is transferred to the unwanted portion through the gap. Is likely to be.

Accordingly, the present invention has been made to solve the above conventional problems,

SUMMARY OF THE INVENTION An object of the present invention is to construct a ground plate of a through-type device by using an insulating substrate and a metal plate having a predetermined thickness and an insulating substrate having two metal films, and a multilayer or single-layer capacitor and a signal having a through hole in the middle thereof. By fixing the substrate and the pin using a lead pin and an epoxy resin to deliver the, to provide a multiple through-hole filter resistant to external impact.

Another object of the present invention is that since there is no protruding portion beyond the thickness of the substrate used except for the lead pin has a symmetrical structure, usability that can be mounted on any device made in the form that the pin can pass through We want to provide high quality products.

Still another object of the present invention is to provide a product having improved high frequency filter characteristics by using a composite material in which ferrite powder is mixed with epoxy resin used to improve the appearance and stability of the product.

The multiple through-hole filter of the present invention for achieving the above object,

On an insulating substrate composed of either ceramic or polymer or glass-polymer composites,

Filling through hole for inserting the element and the lead pin mounted on the lower substrate,

A through hole for screwing the upper board for fastening the screw to the same position as the lower board so that it can be mounted on the shield wall on the equipment or circuit;

An upper substrate comprising an upper substrate metal film formed over the entire front and rear surfaces;

On an insulating substrate composed of either ceramic or polymer or glass-polymer composites,

One or more lead pin through holes penetrating from front to back,

A through hole for screwing the lower board for fastening the screw to the same position as the upper board so that it can be mounted on a shield wall on equipment or circuits;

A lower substrate formed over the entire surface and including a lower substrate front metal film formed to be spaced apart from the lead pin through hole by a predetermined distance for electrical insulation;

A capacitor element formed around a lead pin inserted into the through hole for filling the upper substrate;

Filled in the filling through-hole to fix the capacitor element, the lead pin, the substrate, etc., characterized in that it comprises a filling epoxy resin for protection from external impact.

At this time, the upper substrate,

It is characterized in that it further comprises a conductive metal film formed inside the screwing through hole and the filling through hole electrically connected to the rear surface.

The capacitor device,

The through-hole is formed in the center, the outer shell is characterized in that it has a washer shape made in a variety of forms other than circular.

In addition, the upper substrate,

Due to the filling through-hole, the filling epoxy resin has a certain shape.

The filling epoxy resin,

Epoxy resin for insulation or a composite material combined with a ferrite powder.

The upper substrate,

Characterized in that it further comprises a ferrite element formed around the lead pin inserted into the filling through-hole.

Filling through-hole for inserting the element and the lead pin mounted on the lower substrate according to another aspect of the present invention,

An upper substrate made of a metal having a through hole for screwing an upper substrate for fastening a screw at the same position as the lower substrate so that the lower substrate can be mounted on a shield wall on a device or a circuit;

On an insulating substrate composed of either ceramic or polymer or glass-polymer composites,

One or more lead pin through holes penetrating from front to back,

A through hole for screwing the lower board for fastening the screw to the same position as the upper board so that it can be mounted on a shield wall on equipment or circuits;

A lower substrate formed over the entire surface, the lower substrate including a lower substrate front surface metal film 240 formed to be spaced apart from the lead pin through hole by a predetermined distance;

A capacitor element formed around a lead pin inserted into the through hole for filling the upper substrate;

Filled in the filling through-hole to fix the capacitor element, the lead pin, the substrate, etc., characterized in that it comprises a filling epoxy resin for protection from external impact.

At this time, the filling epoxy resin,

Epoxy resin for insulation or a composite material combined with a ferrite powder.

The upper substrate,

Characterized in that it further comprises a ferrite element formed around the lead pin inserted into the filling through-hole.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the multiple through-type filter of the present invention.

Figure 3a is a view showing the front surface of the lower substrate according to an embodiment of the present invention the multiple through-type filter.

As shown in FIG. 3A, one or more lead pin through-holes 220 are formed on an insulating substrate 210 composed of ceramic, polymer, or glass-polymer composites, and both ends are equipped with screws. Alternatively, the through hole 230 for fastening the lower board is installed to be mounted on the shield wall on the circuit.

In addition, a ground plane is formed by forming the lower substrate front surface metal film 240 at an appropriate distance around the lead pin through hole provided in the lower substrate so as to be electrically insulated from the lead pin.

Figure 3b is a view showing the lower substrate front portion according to another embodiment of the present invention the multiple through-type filter.

As shown in FIG. 3B, one or more lead pin through holes are formed on an insulating substrate composed of one of ceramic, polymer, or glass-polymer composites, and both ends of which are connected to shields on equipment or circuits using screws. Install a threaded through hole for mounting.

In addition, an electrode 250 having an appropriate size may be formed around the lead pin through hole provided in the front surface of the lower substrate, and the lower substrate front metal film may be formed outside the larger concentric circles to form a ground plane.

Forming the electrode as described above is for structural stabilization.

Figure 3c is a view showing the lower substrate rear portion according to an embodiment of the present invention the multiple through-type filter.

As shown in FIG. 3C, a lead pin through hole penetrating the front surface and a screw fastening hole are provided on the rear surface of the lower substrate.

4 is a view showing an upper substrate front part according to an embodiment of the present invention.

As shown in FIG. 4, the upper substrate 100 is made of an insulating material of a ceramic, polymer, or glass-polymer composite, and is filled in the center to be filled with devices and lead pins mounted on the lower substrate. The through hole 120 is formed.

In addition, the through-hole 130 for screwing the upper substrate that can be screwed in the same position as the lower substrate is configured.

In addition, the upper substrate metal film 140 is formed over the entire surface of the upper substrate, and a conductive metal film is also formed inside the upper substrate screwing through hole 130 and the filling through hole 120 to electrically connect with the rear surface. Can be connected.

The rear part of the upper substrate shown in FIG. 4 also has a metal film in the same form as the front part of the upper substrate.

As another example of the present invention, the upper substrate has a shape as shown in FIG. 4 and may have an upper substrate made of a metal material.

That is, the filling through-hole for inserting the element and the lead pin mounted on the lower substrate according to another aspect of the present invention,

The upper substrate may be made of a metal having a through hole for screwing the upper substrate for fastening the screw to the same position as the lower substrate so that it can be mounted on the shield wall on the equipment or circuit.

Hereinafter, the configuration of the lower substrate, the capacitor element, and the filling epoxy resin are the same as those of the present invention.

Figure 5 is a perspective view showing the external appearance according to an embodiment of the present invention the multiple through-type filter.

As shown in Figure 5, the present invention is a multiple through-type filter

On an insulating substrate 110 composed of either ceramic or polymer or glass-polymer composites,

Filling through hole 120 to insert the element and the lead pin mounted on the lower substrate,

An upper board screwing through-hole 130 for fastening a screw at the same position as the lower board so that the lower board can be mounted on a shield wall on a device or a circuit;

An upper substrate 100 including an upper substrate metal film 140 formed over the entire front and rear surfaces thereof;

On an insulating substrate 210 composed of either ceramic or polymer or glass-polymer composites,

One or more lead pin through holes 220 penetrating from the front to the back,

A lower board screwing through hole 230 for fastening a screw to the same position as the upper board so that it can be mounted on a shield wall on equipment or a circuit;

A lower substrate 200 formed over the entire surface and including a lower substrate front surface metal film 240 formed to be spaced a predetermined distance for electrical insulation from the lead pin through hole;

A capacitor element 160 formed around a lead pin inserted into the filling through hole of the upper substrate;

Filled in the filling through-hole to fix the capacitor element, the lead pin, the substrate, etc., characterized in that it comprises a filling epoxy resin 150 to protect from external impact.

The upper substrate,

Due to the filling through-hole, the filling epoxy resin has a certain shape.

The filling epoxy resin,

Epoxy resin for insulation or a composite material combined with a ferrite powder.

When a signal is input to one end of the lead pin 21, the signal of the frequency band used is output through the other end of the lead pin, and the high frequency noise inputted as the signal passes through the capacitor and the metal film formed on the front surface of the lower substrate and the upper substrate. The conductive metal film formed on the side of the filling through hole and the through hole for screwing through the metal film passes through the metal film formed on the front surface of the upper substrate and finally exits to the ground of the device through the screw fastened to remove noise. .

6 is a plan view according to an embodiment of the present invention.

5 is a plan view of the through filter shown in FIG. 5. It shows the shape of the upper substrate and the filling epoxy, lead pins and through holes for screwing.

FIG. 7 is a cross-sectional view taken along line AA ′ of FIG. 6.

As shown in FIG. 7, a capacitor device having an electrical and mechanical connection state by a method such as a lower substrate 200 having a metal film 240 having a predetermined shape on its front surface and soldering 30 on the front surface of the lower substrate ( 160, a lead pin 21 penetrating through the center through hole of the capacitor and the lead pin through hole 220 of the lower substrate, and the plurality of lead pins are formed by soldering or the like with an electrode inside the capacitor element 160. It has electrical and mechanical connection.

In the upper substrate 100 installed on the lower substrate 200, the lower substrate screw fastening through hole 230 and the upper substrate screw fastening through hole 130 are disposed to coincide with each other, and are formed on the surface of the upper substrate 100. The bonding between the metal film 140 and the metal film 240 formed on the lower substrate is in a mechanical and electrical connection state by soldering or the like.

Thereafter, an appropriate amount of epoxy resin 150 is filled in the filling through-hole of the upper substrate and cured.

Under the influence of the epoxy resin 150, it improves the bonding strength of the lower substrate and the upper substrate, the capacitor element 160, the lead pins, and the like, and has a reliable device structure that can withstand external shocks and environmental changes. Will have

In addition, the multiple through-hole filter structured in this way has a symmetrical structure so that the user can install it without any confusion, and it can be installed regardless of the type of equipment to be installed. Since there is no protruding part, it has a structure that prevents noise from propagating through the gap by making perfect contact with the mechanism when screwing.

In another embodiment of the present invention, all of the structures shown in FIG. 7 are the same, but the filled epoxy resin may be a composite epoxy mixed with ferrite powder other than the aforementioned general epoxy resin. In this case, the inductance of the lead pin is increased by the effect of the ferrite composite epoxy surrounding the lead pin, thereby realizing an L-type filter. Therefore, the frequency characteristic of the filter can be improved as compared to the T-type filter provided with only a capacitor.

FIG. 8 is a cross-sectional view taken along line AA ′ of FIG. 6.

That is, the ferrite element formed around the lead pin inserted into the filling through hole in FIG. 7 is further configured, and the inductance of the lead pin can be increased.

FIG. 9 is a view illustrating various shapes of a capacitor device according to an embodiment of the present invention.

 As shown in Figure 9, the capacitor element,

An inner electrode 160a electrically connected to the lead pins;

It is composed of an outer electrode 160b electrically connected to the substrate metal film to filter the signal transmitted along the lead pin and the high frequency signal included in the power source.

The first drawing shows a circular washer capacitor element, which forms a dielectric green sheet by tape casting of dielectric powder, and prints an internal electrode using a paste composed of Ag or Ag / Pd on the green sheet. A ceramic green body is produced by forming a through hole by using a general thick film lamination process of lamination and punching process.

The ceramic green body thus manufactured is a circular washer having a ceramic 160c, an inner electrode 160a, and an outer electrode 160b by dipping the sintered body using Ag paste and polishing the upper and lower parts after the sintering process. Capacitor devices can be fabricated.

The second drawing is a capacitor device having an octagonal shape, and has a structure that can produce more devices per unit area than a circular washer device.

The third drawing is a washer-type device with a rectangular shape, which is manufactured by punching or drilling the inner through-hole on the ceramic green body on which printing lamination is completed, and cutting it according to the product dimensions. . This type of washer-type element is the most economical shape to utilize all parts of the ceramic body except the central circular hole.

As described above, the shape can be easily changed according to the needs of the user, and thus, it is apparent that the shape change other than the above can be easily realized through the present invention.

Those skilled in the art to which the present invention pertains as described above may understand that the present invention may be implemented in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, the above-described embodiments are to be understood as illustrative in all respects and not restrictive.

The scope of the invention is indicated by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the invention. do.

As described above, the multiple through-type filter of the present invention,

It is easy to install, and the device that realizes the characteristics is fixed with epoxy, thereby preventing the deterioration of the characteristics of the product due to external impact and external environment, thereby providing a reliable multiple through-type filter.

In addition, since there is no part protruding out of the substrate other than the lead necessary for mounting, there is an effect of providing a multiple through-type filter that can be easily inspected even if the mechanism to be mounted has any shape.

In addition, by using a composite device in which the epoxy resin used in the flow-through filter is mixed with ferrite powder, the inductance of the lead is increased to provide an L-type multiple through-flow filter with enhanced filter characteristics.

In addition, by using a washer-type through-type capacitor having an octagonal or square appearance as well as a circular shape, it is effective to provide a cheap multi-pass filter by providing a cheaper device than a conventional circular or cylindrical device.

Claims (9)

On an insulating substrate composed of either ceramic or polymer or glass-polymer composites, Filling through hole for inserting the element and the lead pin mounted on the lower substrate, A through hole for screwing the upper board for fastening the screw to the same position as the lower board so that it can be mounted on the shield wall on the equipment or circuit; An upper substrate comprising an upper substrate metal film formed over the entire front and rear surfaces; On an insulating substrate composed of either ceramic or polymer or glass-polymer composites, One or more lead pin through holes penetrating from front to back, A through hole for screwing the lower board for fastening the screw to the same position as the upper board so that it can be mounted on a shield wall on equipment or circuits; A lower substrate formed over the entire surface and including a lower substrate front metal film formed to be spaced apart from the lead pin through hole by a predetermined distance for electrical insulation; A capacitor element formed around a lead pin inserted into the through hole for filling the upper substrate; Filled in the filling through hole to fix the capacitor element, lead pin, substrate, etc., and comprises a filling epoxy resin for protection from external impact, The upper substrate, And a ferrite element formed around a lead pin inserted into the filling through hole, a screwing through hole, and a conductive metal film formed inside the filling through hole and electrically connected to the rear surface. The capacitor device, A through hole is formed in the center, and the outer shell has a washer shape manufactured in the form of an octagon or a rectangle other than a circular shape. The filling epoxy resin, A multiple through-type filter, characterized in that the composite epoxy mixed with ferrite powder. delete delete delete delete delete delete delete delete

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