JP2015032759A - Capacitor module, and manufacturing method of capacitor module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a capacitor module capable of preventing noise generated from an "electronic apparatus that may become a noise generation source" from being propagated to another electronic apparatus which is easily affected by noise, thereby preventing a malfunction from occurring in the other electronic apparatus, as a result even in the case where the "electronic apparatus that may become the noise generation source" is disposed at one side of the capacitor module and the other electronic apparatus is disposed at another side.SOLUTION: A capacitor module 1 comprises: a case 10 including a bottom face part 12 and a side face part 14 erected from the bottom face part 12; a resin 20 filling the inside of the case 10; a capacitor element 30 embedded in the resin 20; a connection electrode 60 for connecting the capacitor element 30 with an external electric circuit; and an electromagnetic wave shield member 40 which is embedded in the resin 20 while being isolated from both the capacitor element 30 and the connection electrode 60.

Description

  The present invention relates to a capacitor module and a method for manufacturing a capacitor module.

  Conventionally, a capacitor module 900 in which a case is filled with a resin and a capacitor element is embedded in the resin is known (see, for example, Patent Document 1).

  FIG. 10 is a view for explaining a conventional capacitor module 900. In FIG. 10, reference numeral 932 indicates an electrode terminal of the capacitor element 930.

  As shown in FIG. 10, the conventional capacitor module 900 includes a bottom surface portion 912 and a case 910 having a side surface portion 914 erected from the bottom surface portion 912, a resin 920 filled in the case 910, and a resin 920 The capacitor element 930 is embedded, and a connection electrode for connecting the capacitor element 930 and an external electric circuit is provided. In the conventional capacitor module 900, the capacitor element 930 is a film capacitor element. The conventional capacitor module 900 includes a bus bar 960 as a connection electrode.

  According to the conventional capacitor module 900, since the case 910 is provided and the capacitor element 930 is embedded in the resin 920, the capacitor is resistant to external impacts, and moisture does not easily enter the capacitor element 930. The module is a capacitor module that can be used in harsh environments.

  Further, according to the conventional capacitor module 900, since the capacitor element 930 is a film capacitor having a high withstand voltage, low loss, and a long life, the capacitor module has a high withstand voltage, low loss, and a long life.

JP 2012-222313 A

  In recent years, with the demand for miniaturization of electrical equipment, the degree of freedom of the placement positions of capacitor modules and electronic equipment (for example, electronic components and motors) placed in electrical equipment has been narrowed. There is a case where “an electronic device that can be a noise generation source” is disposed on the side, and another electronic device that is susceptible to noise is disposed on the other side opposite to the one side. In this case, noise (electromagnetic wave noise) generated from “an electronic device that can be a noise generation source” passes through the capacitor module and propagates to the other electronic device (see FIG. 2B described later), and the other electronic device. There is a problem that an adverse effect such as malfunction of the device may occur.

  Accordingly, the present invention has been made to solve such a problem, and “an electronic device that can be a noise generation source” is disposed on one side of the capacitor module, and noise is present on the other side opposite to the one side. Even when other electronic devices that are easily affected by the noise are arranged, it is possible to prevent noise generated from the “electronic device that can be a noise generation source” from propagating to the other electronic devices, and as a result, It is an object of the present invention to provide a capacitor module capable of preventing adverse effects such as malfunctions occurring in the other electronic devices. Moreover, it aims at providing the manufacturing method of the capacitor module for manufacturing such a capacitor module.

[1] A capacitor module of the present invention includes a case having a bottom surface and a side surface erected from the bottom surface, a resin filled in the case, a capacitor element embedded in the resin, A connection electrode for connecting the capacitor element and an external electric circuit, and an electromagnetic wave shielding member embedded in the resin in a state of being isolated from both the capacitor element and the connection electrode. .

  According to the capacitor module of the present invention, since the electromagnetic wave shielding member is provided, an “electronic device that can be a noise generation source” is disposed on one side of the capacitor module (one side in a direction perpendicular to the electromagnetic wave shielding member). Even when another electronic device that is susceptible to noise is disposed on the other side opposite to the other side, noise generated from the “electronic device that can be a noise generation source” is affected by the other electronic device. As a result, it is possible to prevent adverse effects such as malfunctions occurring in other electronic devices (see FIG. 2A described later).

  In addition, according to the capacitor module of the present invention, it is possible to prevent noise generated from the “electronic device that can be a noise generation source” from being propagated to the other electronic device by the electromagnetic wave shielding member. When the capacitor module is attached to the electric device, it is not necessary to attach another device for suppressing the propagation of noise in the electric device. As a result, it is not necessary to secure a space for mounting the other device in the electric device, and the capacitor module is suitable for the demand for downsizing of the electric device.

  Further, according to the capacitor module of the present invention, since the electromagnetic wave shielding member is disposed in a state of being separated from both the capacitor element and the connection electrode, it is possible to prevent the electromagnetic wave shielding member and the capacitor element from being short-circuited. It becomes.

  Furthermore, according to the capacitor module of the present invention, since the electromagnetic shielding member is embedded in the resin, the electromagnetic shielding member and the external electronic circuit are prevented from being short-circuited, and the mechanical stability of the electromagnetic shielding member. Can be secured.

[2] The capacitor module of the present invention includes a resin cured in a predetermined shape, a capacitor element embedded in the resin, a connection electrode for connecting the capacitor element and an external electric circuit, An electromagnetic wave shielding member embedded in the resin in a state of being isolated from both the capacitor element and the connection electrode.

  According to the capacitor module of the present invention, since the electromagnetic wave shielding member is provided, one side of the capacitor module (one side in a direction perpendicular to the electromagnetic wave shielding member) is provided in the same manner as the capacitor module of the present invention described in [1] above. Even if there is an electronic device that can be a noise source and another electronic device that is susceptible to noise on the other side opposite to one side, It is possible to prevent noise generated from the “electronic device that can be a source” from propagating to the other electronic device, and as a result, to prevent adverse effects such as malfunctions occurring in the other electronic device.

  Further, according to the capacitor module of the present invention, it is possible to prevent noise generated from “an electronic device that can be a noise generation source” from being propagated to the other electronic device by the electromagnetic wave shielding member. In the same manner as the capacitor module of the present invention described in the above, when the capacitor module of the present invention is attached to an electric device, it is not necessary to install another device for suppressing the propagation of noise in the electric device. As a result, it is not necessary to secure a space for mounting the other device in the electric device, and the capacitor module is suitable for the demand for downsizing of the electric device.

  Further, according to the capacitor module of the present invention, since the electromagnetic wave shielding member is disposed in a state of being separated from both the capacitor element and the connection electrode, similarly to the capacitor module of the present invention described in [1] above. It is possible to prevent the electromagnetic wave shielding member and the capacitor element from being short-circuited.

  In addition, according to the capacitor module of the present invention, the electromagnetic wave shielding member and the external electronic circuit are separated from each other because the electromagnetic wave shielding member is embedded in the resin as in the case of the capacitor module of the present invention described in [1] above. While preventing a short circuit, it becomes possible to ensure the mechanical stability of the electromagnetic wave shielding member.

  Furthermore, according to the capacitor module of the present invention, a capacitor module having a desired shape is obtained by curing the resin in a desired shape.

[3] In the capacitor module of the present invention, the electromagnetic wave shielding member is preferably made of a magnetic material or a conductive material.

  By setting it as such a structure, it becomes possible to prevent the electromagnetic wave noise which generate | occur | produces from the "electronic device which can become a noise generation source" by an electromagnetic wave shielding member from propagating to another electronic device. As a result, it is possible to prevent a malfunction from occurring in the other electronic device.

  In the present invention, the electromagnetic wave shielding member is made of a magnetic material or a conductive material because the magnetic material has a property of absorbing electromagnetic waves when the electromagnetic wave shielding member is made of a magnetic material. This is because when the electromagnetic wave shielding member is made of a conductive material, the conductive material has a property of reflecting electromagnetic waves. From this viewpoint, it is more preferable that the electromagnetic wave shielding member is made of a material that is a magnetic material and a conductive material.

[4] In the capacitor module of the present invention, one end is connected to the electromagnetic wave shielding member and the other end is led out to the outside, and is isolated from both the capacitor element and the connection electrode. It is preferable to further include a conductor member embedded in the resin in the state of being made.

  With such a configuration, when the other end of the conductor member is grounded, it is possible to release charges that may accumulate in the electromagnetic wave shielding member to the outside through the conductor member. As a result, it is possible to prevent electric discharge from occurring between the capacitor element and the electromagnetic wave shielding member.

[5] The capacitor module according to the present invention preferably further includes an insulating member disposed between the capacitor element and the electromagnetic wave shielding member.

  By setting it as such a structure, it becomes possible to prevent reliably that an electromagnetic wave shielding member and a capacitor | condenser element short-circuit.

[6] A capacitor module manufacturing method according to the present invention is a capacitor module manufacturing method for manufacturing the capacitor module according to [1], and includes a bottom surface portion and a side surface portion erected from the bottom surface portion. A case preparing step for preparing a case, an electromagnetic shielding member disposing step for disposing an electromagnetic shielding member along the bottom surface portion, and filling the resin into the case until the electromagnetic shielding member is embedded. After the first resin filling step, after the first resin filling step, a capacitor element disposing step of disposing a capacitor element to which a connection electrode for connecting to an external electric circuit is connected in the case; And a second resin filling step of filling the case with resin until the capacitor element is embedded.

  According to the method for manufacturing a capacitor module of the present invention, the capacitor module of the present invention described in [1] above can be manufactured.

[7] A method for manufacturing a capacitor module according to the present invention is a method for manufacturing a capacitor module according to [2], wherein the molding space is formed in a molding die having a molding space of a predetermined shape. A first resin filling step of filling the resin until the bottom surface of the first resin filling step, an electromagnetic wave shielding member disposing step of disposing an electromagnetic wave shielding member in the molding space after the first resin filling step, After the second resin filling step of filling the resin until the electromagnetic wave shielding member is embedded, and after the second resin filling step, a connection electrode for connecting to an external electric circuit is formed in the molding space. A capacitor element disposing step of disposing a connected capacitor element; and a third resin filling step of filling the mold with a resin until the capacitor element is embedded. Characterized in that it comprises in that order.

  According to the method for manufacturing a capacitor module of the present invention, the capacitor module of the present invention described in [2] above can be manufactured.

  Further, according to the method for manufacturing a capacitor module of the present invention, in the first resin filling step, the second resin filling step, and the third resin filling step, the resin is filled into the mold having a molding space of a desired shape. It is possible to manufacture a capacitor module having a desired shape.

  In addition, according to the method for manufacturing a capacitor module of the present invention, since the first resin filling step is included, the electromagnetic wave shielding member is not exposed on the surface of the manufactured capacitor module, and the electromagnetic wave shielding member, an external electronic circuit, It is possible to manufacture a capacitor module that can prevent a short circuit.

[8] In the method for manufacturing a capacitor module of the present invention, the insulating member disposing step of disposing an insulating member along the electromagnetic wave shielding member between the electromagnetic wave shielding member disposing step and the capacitor element disposing step. It is preferable that it is further included.

  By setting it as such a method, it becomes possible to manufacture the capacitor | condenser module which can prevent reliably that a capacitor | condenser element and an electromagnetic wave shield member short-circuit.

FIG. 3 is a diagram for explaining the capacitor module 1 according to the first embodiment. It is a figure shown in order to demonstrate the noise shielding effect of the capacitor module. 3 is a flowchart for explaining a method for manufacturing the capacitor module according to the first embodiment. FIG. 4 is a diagram for explaining the method for manufacturing the capacitor module according to the first embodiment. It is a figure shown in order to demonstrate the capacitor | condenser module 2 which concerns on Embodiment 2. FIG. 10 is a flowchart for explaining a method for manufacturing a capacitor module according to the second embodiment. 6 is a view for explaining a method for manufacturing a capacitor module according to Embodiment 2. FIG. 6 is a view for explaining a method for manufacturing a capacitor module according to Embodiment 2. FIG. It is a figure shown in order to demonstrate the capacitor | condenser module 3 which concerns on a modification. It is a figure shown in order to demonstrate the conventional capacitor | condenser module 900. FIG.

  Hereinafter, a capacitor module and a method for manufacturing the capacitor module of the present invention will be described based on the embodiments shown in the drawings.

[Embodiment 1]
1. Configuration of Capacitor Module 1 According to Embodiment 1 FIG. 1 is a view for explaining the capacitor module 1 according to the first embodiment. FIG. 1A is a perspective view of the capacitor module 1, and FIG. 1B is a cross-sectional view of the capacitor module 1.

  As shown in FIG. 1, the capacitor module 1 according to the first embodiment includes a case 10, a resin 20, a capacitor element 30, an electromagnetic wave shielding member 40, an insulating member 50, and a bus bar 60 as a connection electrode. .

  The case 10 is a bottomed rectangular parallelepiped case having a bottom surface portion 12, a side surface portion 14 erected from the bottom surface portion 12, and an opening formed at an end portion of the side surface portion 14. The case 10 is a resin case, and for example, a case made of PPS (polyphenylene sulfide) or a case made of PBT (polybutylene terephthalate) can be used.

  The resin 20 is filled in the case 10 to a position where the surface of the resin 20 reaches the end of the side surface portion 14. As the resin 20, an appropriate one can be used. For example, an epoxy resin can be used.

  Capacitor element 30 has an electrode terminal 32 for connection to a bus bar 60 described later. The capacitor element 30 is embedded in the resin 20 while being separated from the bottom surface portion 12 and the side surface portion 14 of the case 10. The capacitor module 1 includes a plurality (two in the first embodiment) of capacitor elements as the capacitor elements 30 and is arranged in parallel. An appropriate capacitor element can be used as the capacitor element 30. In the first embodiment, a film capacitor element having high withstand voltage, low loss, and long life characteristics is used.

The capacitor element 30 can be manufactured as follows.
First, a metallized film having a dielectric film made of a resin (for example, polypropylene or polyester) and a metal deposition electrode formed by depositing a metal (for example, aluminum) on one or both surfaces of the dielectric film is prepared. . Next, the metallized film is wound so that the metal vapor-deposited electrodes face each other through the dielectric film. Next, the wound metallized film is pressed (flattened) so that the cross section of the metallized film becomes elliptical, and the electrode terminal 32 is provided on the wound surface of the metallized film. In this way, the capacitor element 30 can be manufactured.

  In addition, you may produce the capacitor | condenser element 30 by laminating | stacking a metallized film alternately.

  The electromagnetic wave shielding member 40 is a flat plate made of a magnetic material or a conductive material. In the first embodiment, the electromagnetic wave shielding member 40 is made of iron which is a magnetic material and a conductive material. The electromagnetic wave shielding member 40 is preferably a flat plate having no holes. This is to prevent noise (electromagnetic wave noise) from passing through the hole.

  The electromagnetic wave shielding member 40 is preferably disposed along at least one of the bottom surface portion 12 and the side surface portion 14 in order to effectively utilize the space in the case 10. In the first embodiment, the case 10 is disposed along the bottom surface portion 12. The electromagnetic wave shielding member 40 is disposed so as to cover the entire inner bottom surface of the bottom surface portion 12.

  The electromagnetic wave shielding member 40 is embedded in the resin 20 in a state of being separated from the capacitor element 30 at a predetermined interval (that is, in a state isolated from the capacitor element 30). The electromagnetic wave shielding member 40 is also isolated from a bus bar 60 (described later) connected to the capacitor element 30. Therefore, the electromagnetic wave shielding member 40 is in a state of being insulated from both the capacitor element 30 and the bus bar 60.

  The insulating member 50 is disposed between the capacitor element 30 and the electromagnetic wave shielding member 40. The insulating member 50 is disposed along the electromagnetic wave shielding member 40 and is disposed in a state of being separated from the capacitor element 30. As the insulating member 50, an appropriate insulating member can be used. In the first embodiment, a PP (polypropylene) sheet is used.

  The bus bar 60 is provided to connect the capacitor element 30 and an external electric circuit, and is composed of two metal flat plates. The two flat plates of the bus bar 60 are disposed so as to face each other with the capacitor element 30 interposed therebetween, and are electrically connected to the anode and cathode electrode terminals 32 of the capacitor element 30, respectively. A part of the bus bar 60 is drawn upward from the capacitor element 30 to a position protruding from the surface of the resin 20 and constitutes an external terminal 62 for connection to an external electronic circuit (not shown).

2. Noise Shielding (Shielding) Effect of Capacitor Module 1 According to Embodiment 1 FIG. 2 is a diagram for explaining the noise shielding effect of the capacitor module 1. FIG. 2A is a diagram for explaining how the capacitor module 1 shields noise, and FIG. 2B is a diagram for explaining a problem of the conventional capacitor module 900.

  “Electronic equipment that can be a noise generation source” is disposed on one side (lower side) of the conventional capacitor module 900, and the other side (upper side) opposite to one side of the capacitor module 900 is susceptible to noise. When another electronic device is provided, noise generated from the “electronic device that can be a noise generation source” may pass through the capacitor module 900 and propagate to the other electronic device (see FIG. 2B). ).

  On the other hand, in the capacitor module 1 according to the first embodiment, even when the capacitor module 1, the “electronic device that can be a noise generation source” and the other electronic devices are arranged as described above, Since the capacitor module 1 includes the electromagnetic wave shielding member 40, noise generated from the “electronic device that can be a noise generation source” can be shielded (shielded) by the electromagnetic wave shielding member 40. Can be prevented from propagating to other electronic devices (see FIG. 2A).

3. Manufacturing Method of Capacitor Module According to First Embodiment FIG. 3 is a flowchart shown for explaining a manufacturing method of the capacitor module according to the first embodiment. FIG. 4 is a view for explaining the method of manufacturing the capacitor module according to the first embodiment. 4A to 4F are process diagrams.

  As shown in FIG. 3, the method for manufacturing a capacitor module according to the first embodiment includes a case preparation step S1, an electromagnetic wave shielding member placement step S2, an insulating member placement step S3, a first resin filling step S4, The capacitor element disposing step S5 and the second resin filling step S6 are included in this order. Hereinafter, the manufacturing method of the capacitor module according to Embodiment 1 will be described along each step.

(1) Case preparation process S1
First, a case 10 having a bottom surface portion 12 and a side surface portion 14 erected from the bottom surface portion 12 is prepared (see FIG. 4A). The case 10 is a resin case, for example, a case made of PPS (polyphenylene sulfide) or a case made of PBT (polybutylene terephthalate).

(2) Electromagnetic wave shielding member arrangement process S2
Next, the electromagnetic wave shielding member 40 is disposed along the bottom surface portion 12 so as to cover the bottom surface portion 12 (see FIG. 4B). The electromagnetic wave shielding member 40 is a flat plate made of, for example, iron.

(3) Insulating member disposing step S3
Next, the insulating member 50 is disposed along the electromagnetic wave shielding member 40 (see FIG. 4C). As the insulating member 50, an appropriate insulating member can be used. In the first embodiment, a PP (polypropylene) sheet is used.

(4) First resin filling step S4
Next, the resin 20 ′ is filled in the case 10 until the electromagnetic wave shielding member 40 and the insulating member 50 are embedded (see FIG. 4D). At this time, the resin 20 ′ has entered between the electromagnetic shielding member 40 and the insulating member 50, between the electromagnetic shielding member 40 and the case 10, and between the insulating member 50 and the case 10.

  Next, the resin 20 ′ filled in the case 10 is cured, and the electromagnetic wave shielding member 40 and the insulating member 50 are fixed.

(5) Capacitor element placement step S5
Next, a capacitor element 30 to which a bus bar 60 for connecting to an external electric circuit is connected in advance is disposed in the case 10 (see FIG. 4E). At this time, the capacitor element 30 is disposed in the case 10 so that a part of the bus bar 60 is pulled out above the capacitor element 30.

(6) Second resin filling step S6
Next, the resin 20 is filled in the case 10 until the capacitor element 30 is embedded (see FIG. 4F). Specifically, the resin 20 is filled until the surface of the resin 20 reaches the end of the side surface portion 14. Thereafter, the resin 20 is cured.
In this way, the capacitor module 1 according to Embodiment 1 can be manufactured.

4). Effect of Capacitor Module 1 According to Embodiment 1 According to the capacitor module 1 according to Embodiment 1, since the electromagnetic wave shielding member 40 is provided, one side of the capacitor module 1 (one side in a direction perpendicular to the electromagnetic wave shielding member 40). Even if there is an electronic device that can be a noise source and another electronic device that is susceptible to noise on the other side opposite to one side, It is possible to prevent noise generated from the “electronic device that can be a source” from propagating to the other electronic device, and as a result, to prevent adverse effects such as malfunctions occurring in the other electronic device.

  In addition, according to the capacitor module 1 according to the first embodiment, the electromagnetic wave shielding member 40 can prevent noise generated from “an electronic device that can be a noise generation source” from propagating to the other electronic device. When the capacitor module 1 is attached to an electric device, it is not necessary to attach another device for suppressing noise propagation in the electric device. As a result, it is not necessary to secure a space for mounting the other device in the electric device, and the capacitor module is suitable for the demand for downsizing of the electric device.

  Further, according to the capacitor module 1 according to the first embodiment, since the electromagnetic wave shielding member 40 is disposed in a state of being separated from both the capacitor element 30 and the bus bar 60, the capacitor element 30 and the electromagnetic wave shielding member 40 are short-circuited. Can be prevented.

  Further, according to the capacitor module 1 according to the first embodiment, since the electromagnetic wave shielding member 40 is embedded in the resin 20, the electromagnetic wave shielding member 40 and an external electronic circuit are prevented from being short-circuited, and the electromagnetic wave shielding member. It is possible to ensure a mechanical stability of 40.

  Further, according to the capacitor module 1 according to the first embodiment, since the electromagnetic wave shielding member 40 is made of iron which is a magnetic material and a conductive material, electromagnetic waves generated from “an electronic device that can be a noise generation source” by the electromagnetic wave shielding member. It is possible to prevent noise from propagating to other electronic devices. As a result, it is possible to prevent a malfunction from occurring in the other electronic device.

  Further, according to the capacitor module 1 according to the first embodiment, since the insulating member 50 disposed between the capacitor element 30 and the electromagnetic wave shielding member 40 is provided, the electromagnetic wave shielding member 40 and the capacitor element 30 are short-circuited. Can be reliably prevented.

5. Effects of Capacitor Module Manufacturing Method According to Embodiment 1 According to the capacitor module manufacturing method according to Embodiment 1, the capacitor module 1 according to Embodiment 1 can be manufactured.

[Embodiment 2]
FIG. 5 is a cross-sectional view for explaining the capacitor module 2 according to the second embodiment. FIG. 5A is a perspective view of the capacitor module 2, and FIG. 5B is a cross-sectional view of FIG. FIG. 6 is a flowchart for explaining the method for manufacturing the capacitor module according to the second embodiment. 7 and 8 are views for explaining the method of manufacturing the capacitor module according to the second embodiment. FIG. 7A to FIG. 7D and FIG. 8A to FIG. 8D are process diagrams.

  The capacitor module 2 according to the second embodiment basically has the same configuration as the capacitor module 1 according to the first embodiment, but is different from the capacitor module 1 according to the first embodiment in that the case is not provided. . That is, as shown in FIG. 5, the capacitor module 2 according to the second embodiment includes a resin 20a cured in a desired shape (a rectangular parallelepiped in the second embodiment), and a capacitor element 30 embedded in the resin 20a. And a connection electrode for connecting the capacitor element 30 and an external electric circuit, and an electromagnetic wave shielding member 40 embedded in the resin 20a in a state of being isolated from both the capacitor element 30 and the bus bar 60. In the second embodiment, as in the case of the first embodiment, the bus bar 60 is provided as a connection electrode.

  The electromagnetic wave shielding member 40 is embedded in the resin 20a in a state of being separated from the outer edge of the resin 20a at a predetermined interval. The electromagnetic wave shielding member 40a is disposed along at least a part of the outer edge of the resin 20a. The electromagnetic wave shielding member 40 a is provided so that the end of the electromagnetic wave shielding member 40 a is not exposed to the outside of the resin 20. For this reason, the size of the surface of the electromagnetic wave shielding member 40a is slightly smaller than the bottom surface of the resin 20a.

  The insulating member 50a and the capacitor element 30 are also provided so that the end portions are not exposed to the outside of the resin 20 as in the case of the electromagnetic wave shielding member 40a.

  The capacitor module 2 according to Embodiment 2 can be manufactured by the following manufacturing method (capacitor module manufacturing method according to Embodiment 2).

  As shown in FIG. 6, the manufacturing method of the capacitor module according to the second embodiment includes a first resin filling step S11, an electromagnetic wave shielding member placement step S12, an insulating member placement step S13, and a second resin filling step S14. And capacitor element arrangement | positioning process S15, 3rd resin filling process S16, and taking-out process S17 are included in this order.

First, prepare the mold 100 having a mold cavity 110 with a predetermined shape (see FIG. 7 (a).), To fill the resin 20a ₁ to a state where the bottom surface 112 of the molding space 110 is covered (No. 1 resin filling step S11, see FIG. 7B). Next, the electromagnetic shielding member 40a is disposed in the molding space 110 (see the electromagnetic shielding member disposing step S12, FIG. 7C). Next, the insulating member 50a is disposed along the electromagnetic wave shielding member 40a (see the insulating member disposing step S13, FIG. 7D).

Then, the electromagnetic wave shielding member 40a is filled with a resin 20a ₂ until the state of being buried (second resin filling step S14, see FIG. 8 (a).). Next, the capacitor element 30 to which the bus bar 60 for connecting to an external electric circuit is connected is disposed in the molding space 110 so as to be isolated from the electromagnetic wave shielding member 40a (capacitor element disposing step). (See S15, FIG. 8 (b).) Next, by filling the resin 20a ₃ into the molding space 110 having a predetermined shape of the mold 100 until the state of the capacitor element 30 is embedded (third resin filling step S16, see FIG. 8 (c).) Curing Thus, a molded body is produced. At this time, the resin 20a is composed of a resin _20a 1, 20a ₂ and 20a _3. Next, the said molded object is taken out from the shaping | molding space 110 of the shaping | molding die 100 (takeout process S17).
In this way, the capacitor module 2 according to Embodiment 2 can be manufactured (see FIG. 8D).

  As described above, the capacitor module 2 according to the second embodiment is different from the capacitor module 1 according to the first embodiment in that the case does not include a case, but as in the case of the capacitor module 1 according to the first embodiment, An “electronic device that can be a noise generation source” is disposed on one side of the capacitor module 2 (one side perpendicular to the electromagnetic wave shielding member 40a), and the other side opposite to the one side is affected by noise. Even when other electronic devices that are easy to install are arranged, noise generated from the “electronic device that can be a noise generation source” is prevented from propagating to the other electronic devices. It is possible to prevent malfunction of the device.

  In addition, according to the capacitor module 2 according to the second embodiment, the resin module 20a is cured in a desired shape, thereby obtaining a capacitor module having a desired shape.

  According to the method for manufacturing a capacitor module according to the second embodiment, in the first resin filling step S11, the second resin filling step S14, and the third resin filling step S16, the resin is applied to the mold 100 having the molding space 110 having a desired shape. Therefore, it is possible to manufacture a capacitor module having a desired shape.

  Further, according to the method for manufacturing a capacitor module according to the second embodiment, since the first resin filling step S11 is included, the electromagnetic wave shielding member 40a is not exposed on the surface of the manufactured capacitor module, and the electromagnetic wave shielding member 40a and It is possible to manufacture a capacitor module that can prevent a short circuit with an external electronic circuit.

  The capacitor module 2 according to the second embodiment has the same configuration as that of the capacitor module 1 according to the first embodiment except that the capacitor module 2 according to the second embodiment does not include a case. Have the corresponding effect.

  As mentioned above, although this invention was demonstrated based on said embodiment, this invention is not limited to said embodiment. The present invention can be implemented in various modes without departing from the spirit thereof, and for example, the following modifications are possible.

 (1) In each of the above embodiments, the present invention has been described by taking the case where the electromagnetic wave shielding member is electrically isolated from the outside as an example, but the present invention is not limited to this. FIG. 9 is a view for explaining a capacitor module 3 according to a modification. For example, as shown in FIG. 9, one end is connected to the electromagnetic wave shielding member 40b and the other end is led to the outside, and both the capacitor element 30 and the connection electrode (bus bar 60) The present invention can be applied even when the conductor member 70 embedded in the resin 20 is provided in an isolated state.

  By adopting such a configuration, when the other end of the conductor member 70 is grounded, it is possible to release charges that may accumulate in the electromagnetic wave shield member 40b to the outside through the conductor member 70. Become. As a result, it is possible to prevent discharge from occurring between the capacitor element 30 and the electromagnetic wave shielding member 40.

(2) In each of the above embodiments, the present invention has been described by taking as an example the case where two capacitor elements 30 are arranged in parallel. However, the present invention is not limited to this. For example, the present invention can be applied even when one capacitor element 30 is disposed or when three or more capacitor elements 30 are disposed in parallel.

(3) In each of the above embodiments, the present invention has been described taking the case of a capacitor module having an insulating member as an example, but the present invention is not limited to this. Even in the case of a capacitor module that does not include an insulating member, the present invention can be applied.

(4) In each of the above embodiments, the present invention has been described by taking the case where the insulating member is disposed in a state of being separated from the capacitor element 30 as an example, but the present invention is not limited to this. The present invention can be applied even when the insulating member is disposed in contact with the capacitor element 30. Even in this case, since the insulating member is disposed between the capacitor element 30 and the electromagnetic wave shielding member, the capacitor element 30 and the electromagnetic wave shielding member are in a separated state.

(5) In the first embodiment, the present invention has been described by taking the case where the electromagnetic wave shielding member 40 is disposed along the bottom surface portion 12 as an example, but the present invention is not limited to this. For example, the present invention can be applied even when the electromagnetic wave shielding member is disposed along the side surface portion 14 or when the electromagnetic wave shielding member is disposed along both the bottom surface portion 12 and the side surface portion 14. It is.

(6) In the first embodiment, the present invention has been described by taking as an example the case where the electromagnetic wave shielding member 40 is disposed on the lower side of the capacitor element 30 (the bottom surface portion 12 side of the case 10). It is not limited to this. For example, the present invention can be applied even when the electromagnetic wave shielding member is disposed on the upper side of the capacitor element 30 (opening side of the case 10).

(7) In each of the above embodiments, the present invention has been described by taking the case where the bus bar 60 is provided as a connection electrode as an example, but the present invention is not limited to this. For example, the present invention can be applied even when a lead wire, a lead frame, or other conductors are provided as connection electrodes.

(8) In the above embodiments, the present invention has been described by taking the case where the capacitor element 30 is a film capacitor element as an example, but the present invention is not limited to this. The present invention can be applied even when the capacitor element is, for example, an electrolytic capacitor element, an electric double layer capacitor element, or another capacitor element.

  1, 2, 3, 900: Capacitor module, 10, 910: Case, 12, 912: Bottom portion, 14, 914 ... Side surface portion, 20, 20a, 920 ... Resin, 30, 930 ... Capacitor element, 32, 932 ... Electrode terminal, 40, 40a, 40b ... electromagnetic shielding member, 50, 50a, 50b ... insulating member, 60, 960 ... bus bar, 62 ... external terminal, 100 ... molding die, 110 ... molding space, 112 ... (of molding space) Bottom

Claims (8)

A case having a bottom surface and a side surface erected from the bottom surface;
A resin filled in the case;
A capacitor element embedded in the resin;
A connection electrode for connecting the capacitor element and an external electric circuit;
A capacitor module comprising: an electromagnetic wave shielding member embedded in the resin in a state of being isolated from both the capacitor element and the connection electrode. A resin cured in a predetermined shape;
A capacitor element embedded in the resin;
A connection electrode for connecting the capacitor element and an external electric circuit;
A capacitor module comprising: an electromagnetic wave shielding member embedded in the resin in a state of being isolated from both the capacitor element and the connection electrode. The capacitor module according to claim 1 or 2,
The capacitor module, wherein the electromagnetic shielding member is made of a magnetic material or a conductive material. In the capacitor module according to any one of claims 1 to 3,
Conductive material embedded in the resin with one end connected to the electromagnetic wave shielding member and the other end led out to the outside and isolated from both the capacitor element and the connection electrode A capacitor module further comprising a body member. In the capacitor module according to any one of claims 1 to 4,
A capacitor module, further comprising an insulating member disposed between the capacitor element and the electromagnetic shielding member. A capacitor module manufacturing method for manufacturing the capacitor module according to claim 1, comprising:
A case preparing step of preparing a case having a bottom surface and a side surface erected from the bottom surface;
An electromagnetic shielding member disposing step of disposing an electromagnetic shielding member along the bottom surface portion;
A first resin filling step of filling the case with resin until the electromagnetic wave shielding member is embedded;
After the first resin filling step, a capacitor element disposing step of disposing a capacitor element connected to a connection electrode for connecting to an external electric circuit in the case;
A method of manufacturing a capacitor module comprising: a second resin filling step of filling the case with a resin until the capacitor element is embedded. A capacitor module manufacturing method for manufacturing the capacitor module according to claim 2, comprising:
A first resin filling step of filling a mold having a molding space of a predetermined shape with a resin until the bottom surface of the molding space is covered;
After the first resin filling step, an electromagnetic wave shielding member disposing step of disposing an electromagnetic wave shielding member in the molding space;
A second resin filling step of filling the resin until the electromagnetic wave shielding member is embedded;
After the second resin filling step, in the molding space, a capacitor element disposing step of disposing a capacitor element connected to a connection electrode for connecting to an external electric circuit;
A method of manufacturing a capacitor module, comprising: a third resin filling step of filling the mold with resin until the capacitor element is embedded. A method of manufacturing a capacitor module according to claim 6 or 7,
A method for manufacturing a capacitor module, further comprising an insulating member disposing step of disposing an insulating member along the electromagnetic wave shielding member between the electromagnetic wave shielding member disposing step and the capacitor element disposing step. .

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