KR100765239B1 - Light emitting diode package using single crystal - Google Patents

Abstract

An LED(Light Emitting Diode) package is provided to reduce the size of the package itself and to improve effectively heat radiation characteristics by using a single crystal silicon structure as a housing. An LED package includes a first electrode, a second electrode, a housing and an LED chip. The first electrode(20) is made of a first conductive material. The first electrode has a first predetermined thickness. The first electrode is supplied with a power source through a first lower surface. The second electrode(30) is spaced apart from the first electrode. The second electrode has a second predetermined thickness. The second electrode is made of a second conductive material. The second electrode is supplied with the power source through a second lower surface. The housing(10) is used for isolating electrically the first and second electrodes from each other. The housing is made of a single crystal silicon material. The LED chip(40) is mounted on the second electrode. The LED chip is connected with the first electrode using wire bonding. The housing is composed of a first electrode installing portion, a second electrode installing portion and a reflective surface for reflecting the light emitted from the LED chip.

Description

LIGHT EMITTING DIODE PACKAGE USING SINGLE CRYSTAL}

1 is a perspective view of a light emitting diode package according to an embodiment of the present invention.

2 is a plan view of a light emitting diode package according to an embodiment of the present invention;

Figure 3 is a cross-sectional view A-A of the LED package according to an embodiment of the present invention.

4 is a bottom view of the LED package according to the embodiment of the present invention.

5 is a combined perspective view of a light emitting diode package according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10 housing 11 first electrode mounting portion

12: mounting portion of the second electrode mounting portion 13: through hole of the second electrode mounting portion

14 reflection surface 20 first electrode

30 second electrode 31 pillar

40: LED chip 50: bonding wire

The present invention relates to a light emitting diode package, and more particularly, to a light emitting diode package in which the material of the housing is made of single crystal silicon, thereby improving workability by etching and improving heat dissipation efficiency.

In general, a light source system using a light emitting diode (LED) chip is formed by mounting an LED chip in various types of packages according to the intended use.

The LED package employs a power LED structure capable of applying a driving current to obtain a large amount of light. In this case, it is necessary to quickly release heat generated by the high current applied thereto.

However, the conventional LED package has a problem that the reliability is lowered and the amount of light is lowered because it does not effectively discharge the heat generated from the LED chip.

In addition, conventionally, when the light emitting diode package is manufactured, the material of the housing is PPA (polyphthalamide) or ceramic, so that the package becomes larger than the size of the LED chip.

In particular, PPA (polyphthalamide) is yellowish discoloration at high temperature and foreign matters are also attached, there is a problem in appearance.

In addition, ceramics are not discolored, but the reflection function is weak, so that it does not reflect the light well, if it is made small, the hardness is weak because it is well broken and the shrinkage at the baking (bak) is very difficult to manufacture the product.

In addition, the LED chip mounted on various LED packages is generally mounted on the slug to dissipate heat emitted from the LED chip. In this case, since the LED chip is open to the left and right in the slug, there is a problem that light loss occurs due to light leakage from both sides.

The present invention has been made in an effort to provide a light emitting diode package capable of minimizing the amount of light leaking from both sides of the LED chip while manufacturing various light emitting devices mounting the LED chip.

In order to achieve the above technical problem, the present invention provides a first electrode to which power is supplied to a bottom surface of a conductive material having a constant thickness, and a second side of which power is supplied to a bottom surface of a conductive material having a predetermined thickness apart from the first electrode. A housing made of a single crystal silicon material mounted on the second electrode to expose an upper surface of each electrode by separating an electrode, the first electrode and the second electrode to be electrically separated from each other, and mounted on the second electrode, and the first electrode and the wire And an LED chip to be bonded, wherein the housing reflects a first electrode mounting portion for fitting the first electrode, a second electrode mounting portion for fitting the second electrode, and light emitted from the LED chip. To provide a light emitting diode package having a reflective surface formed around the upper portion of the housing.

Preferably, the second electrode has an upper portion having a constant thickness, and a plurality of pillars branched from the upper portion are integrally formed, and the second electrode mounting portion includes a mounting portion on which the upper portion of the second electrode is mounted, and each of the pillars A through hole to be fitted is formed.

Preferably, the first electrode mounting portion, the second electrode mounting portion, and the reflective surface are formed through an etching process.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a light emitting diode package according to an embodiment of the present invention, Figure 2 is a plan view, Figure 3 is a cross-sectional view, Figure 4 is a bottom view.

1 to 4, a light emitting diode package according to an embodiment of the present invention includes a housing 10 made of a single crystal silicon material.

The upper surface of the housing 10 is formed with a reflective surface concave inwardly.

The housing 10 includes a first electrode 20 and a second electrode 30 whose surfaces are exposed to an upper surface of the housing 10.

The first electrode 20 and the second electrode 30 are spaced apart from each other so as to be electrically separated from each other and installed in the housing 10.

The first electrode 20 and the second electrode 30 are made of a conductive material while conducting heat well to supply power to the LED chip 40 while functioning as a slug that emits heat generated from the LED chip 40. Is done. For example, it may be a metal.

The first and second electrodes 20 and 30 are formed relatively thick for effective heat dissipation, and their surfaces are exposed through the upper surface of the housing 10, respectively.

When heat is generated from the LED chip 40 seated on the second electrode 30, the heat is effectively discharged to the outside of the housing 10 through the second electrode 30.

As the first and second electrodes 20 and 30 have a relatively thick thickness, the surface area capable of dissipating heat increases, so that heat dissipation can be effectively performed.

The second electrode 30 may be integrally formed with an upper portion having a constant thickness and a plurality of pillars 31 branched from the upper portion to efficiently heat dissipation. The top of the second electrode 30 has its surface exposed to the top of the housing 10 for effective heat dissipation.

The first electrode 20 and the second electrode 30 may be manufactured by using a metal, and then fitted into the housing 10, or may be formed by pouring a liquid metal into the housing 10 and firing the same. .

The LED chip 40 is mounted on the second electrode 30. The LED chip 40 may be attached and mounted on the second electrode 30 using a conductive adhesive. The LED chip 40 mounted on the second electrode 30 and the first electrode 20 are electrically connected by wire bonding using the bonding wire 50.

The upper part of the housing 10 having the reflective surface formed thereon is electrically connected through the wire bonding using the bonding wire 50 between the LED chip 40 and the first electrode 20, and then a translucent resin such as an epoxy resin or silicon. Can be filled with The translucent resin may contain a phosphor that wavelength-converts the light emitted from the LED chip 40. A phosphor for converting light emitted from the LED chip 40, for example, blue light into yellow light may be contained in the translucent resin, and thus a light emitting diode package may be provided that emits white light.

5 is a combined perspective view of a light emitting diode package according to an embodiment of the present invention.

Referring to FIG. 5, the housing 10 has a first electrode mounting portion 11 for fitting the first electrode 20 and a second electrode mounting portion 12, 13 for fitting the second electrode 30. ) Is formed.

Reflecting surfaces 14 for reflecting light emitted from the LED chip 40 are formed around the first electrode mounting portion 11 and the second electrode mounting portions 12 and 13.

The second electrode 30 is integrally formed with an upper portion having a constant thickness and a plurality of pillars 31 branched from the upper portion.

Accordingly, the second electrode mounting portions 12 and 13 have a plurality of mounting portions 12 recessed so that the upper portion of the second electrode 30 is mounted, and each pillar 31 of the second electrode 30 is fitted therein. The through hole 13 is formed.

The first electrode mounting portion 11, the second electrode mounting portions 12 and 13, and the reflective surface 14 are formed through an etching process.

Here, the shape of the first electrode mounting portion 11 is a quadrangular shape, but the shape can be modified as much as possible.

Accordingly, the housing 10 is prepared for fabrication of the LED package after the first electrode installation part 11, the second electrode installation parts 12 and 13, and the reflective surface 14 are formed through the etching process of various steps. do.

When the housing 10 is prepared, the first electrode 20 and the second electrode 30 are installed in the housing 10.

The LED chip 40 is mounted on the second electrode 30. After the LED chip 40 is mounted on the second electrode 30, the LED chip 40 and the first electrode 20 are wire bonded through a bonding wire.

The present invention is not limited to the above described embodiments, and various modifications and changes can be made by those skilled in the art, which are included in the spirit and scope of the present invention as defined in the appended claims.

The light emitting diode package according to the present invention includes a housing made of single crystal silicon. The single crystal silicon material has excellent processability in the desired shape through etching, so that the electrode mounting portion, mounting portion, through hole, reflecting surface, etc. can be easily formed in the housing. Can be reduced even more. For example, a light emitting diode package having a size of 2 mm x 2 mm can be manufactured.

Accordingly, the present invention can be used as a useful light source in orthodox communication devices requiring various small light sources.

In addition, due to the excellent processability of the single crystal silicon material, the overall size of the light emitting device package is not significantly different from that of the LED chip mounted on the slug alone in various light emitting diode packages. The light emitting diode package itself according to the invention can be mounted.

When the light emitting diode package according to the present invention is mounted, the reflection surface is formed around the LED chip even though the overall size is small, thereby preventing the loss of the amount of light leaking from side to side.

In addition, according to the present invention, when forming the electrode on which the LED chip is mounted in the LED package, the electrode is formed relatively thick so as to perform the function of slug for heat dissipation, thereby effectively dissipating heat generated from the LED chip to the outside of the package. have.

In addition, the single crystal silicon material is excellent in thermal conductivity as well as workability by etching. Therefore, heat generated through the LED chip can be effectively released through the housing as well as each electrode that performs the slug function for heat dissipation.

As such, since the heat generated from the LED chip can be effectively discharged to the outside of the package, a high current light emitting diode package can be manufactured, and the reliability and light quantity degradation caused by the failure to effectively discharge the heat generated from the LED chip in the past can be reduced. By preventing it can improve the reliability of the LED package, it is possible to improve the amount of light.

Claims (3)

A first electrode to which power is supplied to a lower surface of the conductive material having a predetermined thickness; A second electrode supplied with power to a lower surface of the conductive material spaced apart from the first electrode; A housing made of a single crystal silicon material spaced apart from the first electrode and the second electrode to be electrically separated so as to expose the upper surface of each electrode; An LED chip mounted on the second electrode and wire-bonded with the first electrode, The housing has a first electrode mounting portion for fitting the first electrode, a second electrode mounting portion for fitting the second electrode, and a peripheral portion formed around the housing to reflect light emitted from the LED chip. A light emitting diode package having a reflective surface. The method according to claim 1, The second electrode is integrally formed with an upper portion having a constant thickness and a plurality of pillars branched from the upper portion, The second electrode mounting portion is a light emitting diode package formed with a mounting portion to which the upper portion of the second electrode is mounted, and through holes through which the pillars are fitted. The method according to claim 1, The first electrode mounting portion, the second electrode mounting portion, the reflective surface is a light emitting diode package formed through an etching process.

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