KR20130080299A - Light emitting device package, back light unit and display unit - Google Patents

Abstract

PURPOSE: A light emitting device package, a backlight unit, and an image display device are provided to prevent the discoloration and corrosion of an electrode layer by minimizing a contact area between the electrode layer and a molding unit. CONSTITUTION: A plurality of concave parts are located on one side of a package body (210). An electrode layer (220) passes through the side of the package body. The electrode layer includes a first electrode (221) and a second electrode (222). A light emitting device (230) is arranged on the concave parts of the package body. The electrode layer is connected to the light emitting device by a wire (240). A molding unit (250) fills the concave parts on the light emitting device.

Description

Light emitting device package, backlight unit and image display device {LIGHT EMITTING DEVICE PACKAGE, BACK LIGHT UNIT AND DISPLAY UNIT}

The embodiment relates to a light emitting device package, a backlight unit, and an image display device.

A light emitting device (LED) is a semiconductor device that converts electrical energy into light energy. By controlling the composition of a compound semiconductor, a light emitting device (LED) can realize light of various wavelengths (colors) such as red, green, blue, and ultraviolet rays. By combining this, white light with high efficiency can be realized.

The light emitting device has advantages such as low power consumption, semi-permanent lifespan, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent and incandescent lamps. Therefore, a light emitting diode backlight that replaces a Cold Cathode Fluorescence Lamp (CCFL) that constitutes a backlight of a liquid crystal display (LCD) display, a white light emitting diode lighting device that can replace a fluorescent lamp or an incandescent bulb, and an automobile headlight. And the application range is extended to the traffic light.

In the light emitting device package according to the related art, a light emitting device is mounted on a package body, and an electrode layer is formed on the package body to be electrically connected to the light emitting device. In addition, a molding part including a phosphor is formed on the light emitting device.

However, in the light emitting device package according to the prior art, reliability problems are pointed out at high temperature and high humidity operation. For example, in the prior art, silicon (silicone) exhibits high heat resistance and is suitable as a molding material for a high output light emitting device. It causes discoloration and corrosion of the surface, causing a decrease in the light efficiency of the light emitting device package.

In addition, according to the prior art, the elastic modulus of the molding part is different from the elastic modulus of the electrode layer, so that peeling due to thermal stress stress occurs and sealing quality is lowered, thereby causing a problem of reliability due to moisture penetration.

The embodiment provides a light emitting device package, a backlight unit, and an image display device having improved reliability.

The light emitting device package according to the embodiment includes a package body including a recess; An electrode layer partially penetrating the side surface of the package body and partially exposed to the recess; A light emitting element on the recess of the package body; A wire connecting the light emitting element and the electrode layer; And a molding part on the light emitting device.

In addition, the light emitting device package according to the embodiment includes a package body; A plurality of recesses positioned on one surface of the package body; At least a part may be disposed in the package body, and may include an electrode layer partially exposed to correspond to the recess, and may include a light emitting device electrically connected to the exposed electrode layer.

In addition, the backlight unit according to the embodiment includes a bottom cover; A light emitting module on the bottom cover; And an optical member on the light emitting module, wherein the light emitting module includes a substrate on the bottom cover and the light emitting device package disposed on the substrate.

In addition, the video display device according to the embodiment includes a bottom cover; A light emitting module on the bottom cover; An optical member on the light emitting module; And a display panel on the optical member, wherein the light emitting module includes a substrate on the bottom cover and the light emitting device package disposed on the substrate.

According to the embodiment, it is possible to provide a light emitting device package, a backlight unit, and an image display device having improved reliability by improving reliability.

1 is a cross-sectional view of a light emitting device package according to the first embodiment.
2 is a plan view of a light emitting device package according to the first embodiment;
3 is a cross-sectional view of a light emitting device package according to a second embodiment.
4 is a cross-sectional view of a backlight unit and an image display apparatus including the same according to an embodiment.

In the description of the embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under" the substrate, each layer Quot; on "and" under "are intended to include both" directly "or" indirectly " do. Also, the criteria for top, bottom, or bottom of each layer will be described with reference to the drawings.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. In addition, the size of each component does not necessarily reflect the actual size.

(Example)

1 is a cross-sectional view of a light emitting device package 200 according to the first embodiment, and FIG. 2 is a plan view of the light emitting device package according to the first embodiment. FIG. 2 is a plan view in a state in which the molding part 250 is removed in FIG. 1.

The light emitting device package 200 according to the embodiment includes a package body 210 including a recess C, an electrode layer 220 partially penetrating the side surface of the package body 210, and partially exposed to the recess, The light emitting device 230 disposed on the concave portion of the package body 210, the wire 240 connecting the electrode layer 220 and the light emitting device 230, and the light emitting device 230. It may include a molding part 250 to fill the recess.

In addition, the light emitting device package 200 according to the embodiment is a package body 210, a plurality of recesses (C) and at least a portion of which is located on one surface of the package body 210 is located in the package body 210 The electrode layer 220 may be partially exposed to correspond to the recess C, and may include a light emitting device 230 electrically connected to the exposed electrode layer 220.

The light emitting device 230 in FIG. 1 may be a vertical light emitting device, but is not limited thereto.

The package body 210 may be formed of a material having high reflectance. For example, the package body 210 may have a reflectance of 95% or more, and thus, a separate reflective layer may not be formed in the recess of the package body 210.

The package body 210 may be any one or more of polyphthalamide (PPA), poly-cyclo-hecylene dimethyl terephthalate (PCT), white silicone, and white epoxy molding compound (EMC), but is not limited thereto. It is not.

The shape of the package body 210 may have various shapes, such as a shape having a square, a triangle, a polygon, a circle, and a curved surface when viewed from above. The package body 210 may include a plurality of side parts, and at least one of the plurality of side parts may be disposed perpendicularly or inclined with respect to a bottom surface of the package body 210.

The package body 210 may include a cavity wall part which protrudes upward from one surface where the recess C is located.

The package body 210 may be open at an upper portion thereof and may include a recess C formed at a side and a bottom thereof. The recess C may be formed in a shape such as a cup structure, a cavity structure, or a recess structure recessed from an upper surface of the package body 210, but is not limited thereto. . The peripheral surface of the recess C may be perpendicular to or inclined with respect to the floor. The shape of the concave portion C viewed from above may be a circular, elliptical, polygonal (eg, rectangular), polygonal shape having a curved edge, but is not limited thereto.

As shown in FIG. 1, when the light emitting device 230 is a vertical light emitting device, in the first embodiment, the electrode layer 220 includes the first electrode 221 and the light emitting device 230 in which the light emitting device 230 is disposed. ) And a second electrode 222 connected to the wire 240 and electrically separated from the first electrode 221.

The electrode layer 220 is a highly conductive metal, such as titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), It may include at least one of tin (Sn), silver (Ag), and phosphorus (P), and may be formed of a single metal layer or a multilayer metal layer. In addition, the electrode layer 220 may be plated by Ag, but is not limited thereto.

The first electrode 221 and the second electrode 222 may be formed to have the same thickness, but is not limited thereto.

The electrode layer 220 may include a concave shape, for example, a cup structure or a recess shape, from the bottom of the concave portion C toward the lower surface of the package body 210.

The first electrode 221 and the second electrode 222 may be edge types disposed on side surfaces of the package body 210. For example, the first electrode 221 and the second electrode 222 include a lower electrode portion disposed below the package body 210 and a protruding electrode portion protruding to the side portion of the package body 210. It may be, but is not limited to such.

The light emitting device 230 may be disposed in contact with the first electrode 221, and the first electrode 221 may be electrically connected to a lower portion of the light emitting device 230.

The light emitting device 230 may selectively emit light in a range of visible light to ultraviolet light, and may be selected from, for example, a red LED chip, a blue LED chip, a green LED chip, and a yellow green LED chip.

For example, the light emitting device 230 may include a light emitting structure (not shown) disposed on a conductive substrate (not shown), and the light emitting structure may include a first conductivity type semiconductor layer, an active layer, and a second conductivity type. It may include a semiconductor layer.

The light emitting device 230 may include a compound semiconductor of a group III-V element or a compound semiconductor light emitting element of a Group II-VI element.

For example, the light emitting structure may be formed of any one or more of GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, InGaAs, AlInGaAs, GaP, AlGaP, InGaP, AlInGaP, InP, but is not limited thereto. .

The conductive substrate may be made of a metal, a metal alloy, or a conductive semiconductor material having excellent electrical conductivity to efficiently inject carriers. For example, the conductive substrate may be copper (Cu), gold (Au), copper alloy (Cu Alloy), nickel (Ni-nickel), copper-tungsten (Cu-W), carrier wafers (eg, GaN, Si, Ge, GaAs, ZnO, SiGe, SiC, etc.) may be optionally included.

In an embodiment, the recess C may be filled to form a molding part 250 on the light emitting device 230.

The molding part 250 may include a light transmissive resin layer such as silicon or epoxy, and may be formed in a single layer or multiple layers. For example, the molding part 250 may include dimethyl (di-methyl) -based silicon, but is not limited thereto.

The surface of the molding part 250 may be formed in a flat shape, concave shape, convex shape, etc. For example, the surface of the molding part 250 may be formed in a concave curved surface, the concave curved surface is light It may be an exit surface, but is not limited thereto.

The molding part 250 may include a phosphor for converting a wavelength of light emitted from the light emitting device 230. The phosphor excites a part of the light emitted from the light emitting device 230 to emit light of different wavelengths. The phosphor may be selectively formed among YAG, TAG, silicate, nitride, oxygen-nitride-based materials. The phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor, but the present invention is not limited thereto.

In an embodiment, a protection device (not shown) may be disposed on a portion of the electrode layer 220. The protection device may be implemented with a thyristor, zener diode, or transient voltage suppression (TVS), and the protection device protects the light emitting device 230 from electro static discharge (ESD). The protection device may be connected to the connection circuit of the light emitting device 230 in parallel, thereby protecting the light emitting device 230.

The light emitting device package according to the related art has a reliability problem in high temperature and high humidity operation. For example, in the prior art, silicon (silicone) exhibits high heat resistance and is suitable as a molding material for a high output light emitting device. It causes discoloration and corrosion of the surface, causing a decrease in the light efficiency of the light emitting device package.

Accordingly, by minimizing the contact area between the electrode layer 220 and the molding part 250, discoloration and corrosion of the electrode serving as the lead frame can be prevented.

For example, in the embodiment, the second electrode 222 may expose a wire bonding region, and the remaining region of the second electrode 222 may not be exposed by the package body 210.

For example, the second electrode 222 may expose the wire bonding region by the second hole H2, and the remaining region may not be exposed by the recess of the package body 210. The area of the electrode layer 220 in contact with the 250 may be minimized to prevent corrosion and discoloration of the electrode layer.

The wire bonding region may have a tolerance of about ± 20 μm, but is not limited thereto.

For example, the wire bonding pad may be about 100 μm × 100 μm, but is not limited thereto. The wire bonding pad may have a tolerance of about ± 20 μm to the size of one surface of the wire bonding pad, but is not limited thereto.

In addition, in the embodiment, the region in which the light emitting device 230 is mounted is exposed by the first hole H1, and the remaining region of the first electrode 221 except the mounting region is the package. By not being exposed by the recesses of the body 210, the area of the electrode layer 220 contacting the molding part 250 may be minimized in a subsequent process to prevent corrosion and discoloration of the electrode layer.

The mounting area of the light emitting device 230 may have a tolerance of about ± 20 μm, but is not limited thereto.

In addition, according to the embodiment, the contact area between the molding part 250 and the electrode layer 220 is minimized, thereby minimizing the thermal stress stress caused by the difference in the elastic modulus of the molding part and the electrode layer and the electrode layer. It can improve reliability by preventing air tightness.

According to the embodiment, it is possible to provide a light emitting device package, a backlight unit, and an image display device having improved reliability by improving reliability.

3 is a cross-sectional view of the light emitting device package 202 according to the second embodiment.

The second embodiment can employ the technical features of the first embodiment.

The light emitting device package 202 according to the second embodiment is an example in which the horizontal light emitting device 232 goes to the light emitting device 232.

In the second embodiment, the electrode layer 220 is connected to the third electrode 223 and the light emitting element 232 and the second wire 242 electrically connected by the light emitting element 232 and the first wire 241. It may include a fourth electrode 224 electrically connected by.

In the second embodiment, the light emitting device 232 may be disposed on the recess C of the package body 210 without being in contact with the electrode layer.

Alternatively, unlike the illustrated in FIG. 3, the light emitting device 232 may be disposed on the recess C of the package body 210 while contacting the electrode layer. For example, the light emitting element 232 may be disposed on and in contact with the third electrode 223.

According to the embodiment, discoloration and corrosion of the electrode serving as the lead frame can be prevented by minimizing the contact area between the electrode layer 220 and the molding part 250.

For example, in the second embodiment, the third electrode 223 and the fourth electrode 224 are exposed to the wire bonding region, and the remaining regions of the third electrode 223 and the fourth electrode 224 are the package body. May not be exposed by 210.

For example, the third electrode 223 may be exposed to the wire bonding region by the third hole H3, and the remaining region may not be exposed to the package body 210, and the fourth electrode 224 may be exposed. The wire bonding area may be exposed by the fourth hole H4, and the remaining area may not be exposed by the package body 210.

Through this, the area of the electrode layer 220 in contact with the molding part 250 may be minimized to prevent corrosion and discoloration of the electrode layer.

According to the embodiment, it is possible to provide a light emitting device package, a backlight unit, and an image display device having improved reliability by improving reliability.

4 is a diagram illustrating a backlight unit and an image display device 1100 including the same according to an exemplary embodiment.

Referring to FIG. 4, the display device 1100 according to the embodiment includes a bottom cover 1152, a substrate 1020 on which the light emitting device package 200 described above is arrayed, an optical member 1154, and a display panel 1155. ).

The substrate 1020 and the light emitting device package 200 may be defined as a light emitting module 1060. The bottom cover 1152, at least one light emitting module 1060, and the optical member 1154 may be defined as a light unit 1150.

The bottom cover 1152 may include a receiving portion 1153, but the present invention is not limited thereto.

Here, the optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The light guide plate may be made of a PC material or a PMMA (poly methy methacrylate) material, and such a light guide plate may be removed. The diffusion sheet diffuses incident light, and the horizontal and vertical prism sheets condense incident light into a display area. The brightness enhancing sheet enhances brightness by reusing the lost light.

The optical member 1154 is disposed on the light emitting module 1060, and the light emitted from the light emitting module 1060 may be a surface light source, or diffused or collected.

According to the embodiment, it is possible to provide a light emitting device package, a backlight unit, and an image display device having improved reliability by improving reliability.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Accordingly, the contents of such combinations and modifications should be construed as being included in the scope of the embodiments.

In addition, the above description has been made with reference to the embodiments, which are merely examples and are not intended to limit the embodiments, and those skilled in the art to which the embodiments belong may not be exemplified above without departing from the essential characteristics of the embodiments. It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

200: light emitting device package, 210: package body
220: electrode layer, 230: light emitting element
240: wire, 250: molding part

Claims (12)

A package body;
A plurality of recesses positioned on one surface of the package body; And
At least a part of the electrode layer is located in the package body and partially exposed to correspond to the recess;
A light emitting device package comprising a light emitting device electrically connected to the exposed electrode layer. The method according to claim 1,
The electrode layer
A first electrode on which the light emitting element is disposed; And
And a second electrode connected by the light emitting element and the wire and electrically separated from the first electrode. The method of claim 2,
The first electrode is a light emitting device package is exposed by the first hole is a mounting area in which the light emitting device is mounted, the remaining area of the first electrode except the mounting area is not exposed by the recess of the package body. The method according to claim 1,
The light emitting device is electrically connected to the electrode layer by a first wire, a second wire,
Wherein,
A first electrode connected by the light emitting element and the first wire; And
And a second electrode connected by the light emitting element and the second wire. 5. The method of claim 4,
The light emitting device
A light emitting device package disposed on and in contact with the first electrode. The method according to any one of claims 2 to 5,
The wire bonding region is exposed in the second electrode, and the remaining region of the second electrode is not exposed by the recess of the package body. 6. The method according to any one of claims 1 to 5,
The package body,
Light emitting device package with reflectance of 95% or more. The method of claim 7, wherein
The package body,
A light emitting device package comprising any one or more of polyphthalamide (PPA), poly-cyclo-hecylene dimethyl terephthalate (PCT), white silicone, and white epoxy molding compound (EMC). The method according to claim 1,
The package body includes a cavity wall portion protruding upward from one surface where the recess is located. The method of claim 6,
The wire bonding pad has a size of 100 μm × 100 μm in the wire bonding area,
Light emitting device package having a tolerance of ± 20 ㎛ with respect to the size of the wire bonding pad. Bottom cover;
A light emitting module on the bottom cover; And
An optical member on the light emitting module;
The light emitting module includes:
A substrate on the bottom cover; and
And a light emitting device package according to any one of claims 1 to 5 disposed on the substrate. Bottom cover;
A light emitting module on the bottom cover;
An optical member on the light emitting module; And
A display panel on the optical member;
The light emitting module includes:
A substrate on the bottom cover; and
The light emitting device package of any one of claims 1 to 5 disposed on the substrate.

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